CN109548271B - Method for manufacturing printed circuit board for signal generator - Google Patents
Method for manufacturing printed circuit board for signal generator Download PDFInfo
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- CN109548271B CN109548271B CN201811354265.6A CN201811354265A CN109548271B CN 109548271 B CN109548271 B CN 109548271B CN 201811354265 A CN201811354265 A CN 201811354265A CN 109548271 B CN109548271 B CN 109548271B
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- board
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- earthworm
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
- H05K1/0222—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
Abstract
The invention discloses a method for manufacturing a printed circuit board for a signal generator, which comprises the following steps: manufacturing an inner layer circuit on a core board, wherein the inner layer circuit manufactured on one surface of the core board comprises a plurality of U-shaped earthworm wires which are continuously bent; then pressing the core board and the outer layer copper foil into a production board through a prepreg; drilling holes at the positions, corresponding to the end parts of the earthworm wires, on the production plate; then, metallizing the hole by copper deposition and full-plate electroplating; and sequentially manufacturing an outer layer circuit, a solder mask layer, surface treatment and molding on the production board to obtain the printed circuit board. The printed circuit board manufactured by the method can effectively reduce the loss of line signals and ensure the transmitting and receiving conversion efficiency of the antenna.
Description
Technical Field
The invention relates to the technical field of printed circuit board manufacturing, in particular to a manufacturing method of a printed circuit board for a signal generator.
Background
The signal generator, also called signal source or oscillator, is a device capable of providing various frequencies, waveforms and output electrical signals, and is used as a signal source or excitation source for testing when measuring amplitude characteristics, frequency characteristics, transmission characteristics and other electrical parameters of various telecommunication systems or telecommunication devices, and when measuring characteristics and parameters of components, and has wide application in production practice and technical fields.
A printed Circuit board (pcb) is an important electronic component, is a support for electronic components, is a provider for electrical connection of electronic components, and is called "mother of electronic product". The conventional manufacturing process flow of the PCB includes: cutting → inner layer pattern → inner layer etching → inner layer AOI → pressing → drilling → copper deposition → whole plate electroplating → pattern electroplating → outer layer etching → outer layer AOI → solder resist, character → surface treatment → molding → electric test → FQC → FQA → packaging.
At present, after the PCB which is generally produced at present is connected and installed with a signal generator, the circuit signal loss is serious, so that the transmitting and receiving conversion efficiency of an antenna in the signal generator is low, and the PCB and the signal generator are small in installation contact area and inconvenient to install.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a method for manufacturing a printed circuit board for a signal generator.
In order to solve the above technical problem, the present invention provides a method for manufacturing a printed circuit board for a signal generator, comprising the steps of:
s1, manufacturing an inner layer circuit on the core board, wherein the inner layer circuit manufactured on one surface of the core board comprises a plurality of U-shaped earthworm wires which are continuously bent;
s2, laminating the core board and the outer layer copper foil through a prepreg to form a production board;
s3, drilling holes at the positions, corresponding to the end parts of the earthworm wires, on the production plate;
s4, metallizing the holes by copper deposition and full-plate electroplating;
and S5, manufacturing an outer layer circuit, manufacturing a solder mask layer, performing surface treatment and molding on the production board in sequence to obtain the printed circuit board.
Preferably, the step S31 is further included between the steps S3 and S4: and (3) carrying out depth control on the periphery of the hole on one surface of the production board far away from the earthworm line, wherein the residual thickness is controlled to be 0.4 +/-0.1 mm.
Preferably, in step S31, a circular ring platform with a width of 2.5mm is gonged out at the position where the hole edge moves outward by 0.3 mm.
Preferably, in step S4, the holes and the circular ring platform are metalized by copper deposition, full plate plating.
Preferably, in step S5, the outer layer circuit is manufactured by using a positive wafer process, after pattern electroplating, the insulating platform is routed on the production board at the periphery of the circular platform in a depth-controlled manner, and the residual thickness is controlled to be 0.45 ± 0.1 mm.
Preferably, after the insulating platform is milled, a hollow groove is milled on the periphery of the insulating platform, and a flange connected with the production board is reserved at the edge of the insulating platform.
Preferably, in step S5, after the surface treatment, the earthworm wire platform is deeply controlled at a position corresponding to the earthworm wire on the side of the production board far from the earthworm wire, and the excess thickness is controlled to be 0.45 ± 0.1 mm.
Preferably, after the earthworm line platform is gonged, hollow-out grooves are gonged on two sides of the earthworm line platform and along the earthworm line platform.
Compared with the prior art, the invention has the following beneficial effects:
in the method, the earthworm wire connected with the antenna of the signal generator is designed when the inner-layer line is manufactured, so that the length of the antenna can be prolonged to the maximum extent, electromagnetic wave signals are matched, the loss of line signals is effectively reduced, and the transmitting and receiving conversion efficiency of the antenna is ensured; the circular ring platform is manufactured on the periphery of the hole, and is matched with the hole after being metalized to serve as a platform for installing and connecting the signal generator, the metalized circular ring platform can effectively increase the connecting contact area between the signal generator and the PCB, and the circular ring platform and the hole have a height difference to form a trepanning, so that the circular ring platform and the PCB can be connected in a sleeving manner, and quick and effective installation is convenient to realize; in order to reduce the loss of the dielectric layer to the line signals, the dielectric layer at the position of the earthworm line is thinned by routing the earthworm line platform at the later stage, so that the loss of the thickness of the dielectric layer to the line signals in the transmission process is reduced, and the transmitting and receiving conversion efficiency of the antenna is further ensured.
Drawings
FIG. 1 is a schematic view of an exemplary embodiment of an earthworm line etched on one side of a core;
FIG. 2 is a schematic view of the production plate after the circular platform is manufactured in the embodiment;
FIG. 3 is a schematic view of the production board after the insulating platform is manufactured in the embodiment;
FIG. 4 is a schematic diagram of the production board after the inner groove is milled for the first time in the embodiment;
FIG. 5 is a schematic diagram of the board after the second routing of the inner grooves in the embodiment.
Detailed Description
In order to more fully understand the technical contents of the present invention, the technical solutions of the present invention will be further described and illustrated with reference to specific embodiments.
Example 1
The embodiment provides a method for manufacturing a printed circuit board for a signal generator, which specifically comprises the following steps:
(1) cutting: the core board is cut according to the size of the jointed board of 520mm multiplied by 620mm, the thickness of the core board is 0.8mm, and the thickness of the outer layer copper foil is 1 OZ.
(2) Inner layer circuit manufacturing (negative film process): transferring inner layer patterns, coating a photosensitive film on a core plate by using a vertical coating machine, controlling the film thickness of the photosensitive film to be 8 mu m, and completing inner layer line exposure on the core plate by using 5-6 exposure rulers (21 exposure rulers) by using a full-automatic exposure machine; etching the inner layer, etching the exposed and developed core board to form an inner layer circuit, wherein the line width of the inner layer is 3mil, and the inner layer circuit formed on one surface of the core board comprises a plurality of U-shaped earthworm lines 1 (shown in figure 1); and (4) inner layer AOI, and then, detecting defects of an inner layer circuit, such as open short circuit, circuit notch, circuit pinhole and the like, and performing defect scrapping treatment, wherein a defect-free product is discharged to the next flow.
(3) And pressing: the core board passes through a vertical blackening process, then the core board and the outer copper foil are pre-laminated together by using prepregs (the copper foil, the prepregs, the core board, the prepregs and the copper foil are arranged from top to bottom in a concrete board arrangement sequence), and then the laminated board is pressed by selecting proper laminating conditions according to the Tg of the board material to form the production board.
(4) And outer layer drilling: according to the drilling data, a through hole 2 (shown in figure 2) is drilled at the position corresponding to the end of the earthworm wire on the production plate by using a mechanical drilling mode, and the aperture of the through hole is 3 +/-0.076 mm.
(5) Go round ring platform: the through hole edge of one surface, far away from the earthworm line, of the production plate moves outwards by 0.3mm to control the depth and form a circular platform 3 with the width of 2.5mm, the residual thickness is controlled to be 0.4 +/-0.1 mm, and the bottom of the circular platform is positioned in a medium layer above the earthworm line.
(6) And copper deposition: a layer of thin copper is deposited on the wall of the through hole and the circular ring platform in a chemical reaction mode to provide a foundation for the subsequent full-plate electroplating, the backlight test is 10-level, the thickness of the copper deposited in the through hole and the circular ring platform is 0.5 mu m, and the copper layer in the through hole is connected with the earthworm wire.
(7) And electroplating the whole plate: according to the principle of electrochemical reaction, a layer of copper is electroplated on the basis of copper deposition, and particularly, the whole plate is electroplated for 30min at the current density of 1.1ASF, so that the thickness of surface copper is more than or equal to 6 microns.
(8) And outer layer pattern transfer: and (3) adopting a full-automatic exposure machine and a positive film circuit film, completing outer layer circuit exposure on the production board by using 5-7 exposure rulers (21 exposure rulers), and forming an outer layer circuit pattern on the production board through development.
(9) And pattern electroplating: then, copper plating and tin plating are respectively carried out on the production plate, wherein the copper plating is carried out for 150min by full-plate electroplating at the current density of 1.0ASD, the surface copper thickness is plated to 1OZ, and the tin plating is carried out for 10min at the current density of 1.2ASD, and the tin thickness is 3-5 mu m.
(10) Gong insulating platform: the periphery of the metallized circular platform is deeply routed to form an insulating platform 4 (shown in figure 3), the residual thickness is controlled to be 0.45 +/-0.1 mm, and the bottom of the insulating platform is positioned in the dielectric layer above the earthworm line.
(11) Routing internal grooves (for the first time): a hollowed-out groove 5a is milled out on the periphery of the insulating platform 4, leaving a flange 6 (shown in fig. 4) in the middle of the edge of the insulating platform 4, which is connected to the production board.
(12) And outer layer etching: then sequentially removing the film, etching and removing tin, and etching an outer layer circuit on the production board; and the outer layer AOI uses an automatic optical detection system to detect whether the outer layer circuit has the defects of open circuit, gap, incomplete etching, short circuit and the like by comparing with CAM data.
(13) Solder resist and silk screen printing of characters: printing solder resist ink and silk-screening characters by adopting a dot screen; specifically, a protective layer for preventing the bridging between the wires during welding, providing a permanent electrical environment and resisting chemical corrosion is coated on the wires and the base material which do not need welding, and the protective layer has the function of beautifying the appearance.
(14) Surface treatment (nickel-gold deposition): the copper surface of the welding pad at the solder stop windowing position is communicated with a chemical principle, a nickel layer and a gold layer with certain required thickness are uniformly deposited, and the thickness of the nickel layer is as follows: 3-5 μm; the thickness of the gold layer is as follows: 0.05-0.1 μm.
(15) The earthworm line platform is milled: the depth of an earthworm line platform 7 (shown in figure 5) is controlled at the position, which is far away from one side of the earthworm line 1 on the production plate and corresponds to the earthworm line, the earthworm line platform is routed along the trend of the earthworm line in the inner-layer line, the residual thickness is controlled to be 0.45 +/-0.1 mm, and the bottom of the earthworm line platform is positioned in a medium layer above the earthworm line; the dielectric layer at the position of the earthworm line is thinned by routing the earthworm line platform, so that the loss of the thickness of the dielectric layer to line signals in the transmission process is reduced, and the transmitting and receiving conversion efficiency of the antenna is further ensured.
(16) And electrical test: testing the electrical conduction performance of the finished board, wherein the board use testing method comprises the following steps: and (5) flying probe testing.
(17) Routing internal grooves (second time): hollowed-out grooves 5b are routed on both sides of the earthworm line platform 7 and along the earthworm line platform (as shown in fig. 5).
(18) And forming: according to the prior art, the shape is milled according to the design requirement, and the tolerance of the shape is +/-0.05mm, so that the printed circuit board is manufactured.
(19) FQC: and (4) inspecting the appearance of the finished board according to the customer acceptance standard and the inspection standard of my department, and timely repairing the finished board if a defect exists so as to ensure that excellent quality control is provided for the customer.
(20) FQA: and measuring whether the appearance, the hole copper thickness, the dielectric layer thickness, the green oil thickness, the inner layer copper thickness and the like of the finished board meet the requirements of customers or not.
(21) And packaging: and hermetically packaging the finished boards according to the packaging mode and the packaging quantity required by the customer, putting a drying agent and a humidity card, and then delivering.
In other embodiments of the present invention, between the steps (5) and (6), a slot for installation, fixation and conduction is milled at a board edge of the production board.
The technical solutions provided by the embodiments of the present invention are described in detail above, and the principles and embodiments of the present invention are explained herein by using specific examples, and the descriptions of the embodiments are only used to help understanding the principles of the embodiments of the present invention; meanwhile, for a person skilled in the art, according to the embodiments of the present invention, there may be variations in the specific implementation manners and application ranges, and in summary, the content of the present description should not be construed as a limitation to the present invention.
Claims (7)
1. A method of making a printed circuit board for a signal generator, comprising the steps of:
s1, manufacturing an inner layer circuit on the core board, wherein the inner layer circuit manufactured on one surface of the core board comprises a plurality of U-shaped earthworm wires which are continuously bent;
s2, laminating the core board and the outer layer copper foil through a prepreg to form a production board;
s3, drilling holes at the positions, corresponding to the end parts of the earthworm wires, on the production plate;
s31: a circular ring platform is deeply milled at the periphery of a hole on one surface of the production plate far away from the earthworm line;
s4, metallizing the holes and the circular ring platform through copper deposition and full-plate electroplating;
s5, manufacturing an outer layer circuit, manufacturing a solder mask layer, performing surface treatment and forming on the production board in sequence to obtain the printed circuit board; after surface treatment, deeply routing the earthworm line platform at the position, which is far away from one surface of the earthworm line and corresponds to the earthworm line, on the production plate.
2. The method of manufacturing a printed circuit board for a signal generator as claimed in claim 1, wherein the excess thickness of the production board at the ring platform is controlled to 0.4 ± 0.1mm in step S31.
3. The method of claim 2, wherein in step S31, a ring platform with a width of 2.5mm is milled at a depth control of 0.3mm from the edge of the hole.
4. The method of claim 3, wherein in step S5, the outer layer circuit is formed by a positive process, after pattern plating, the insulating platform is formed on the production board at the periphery of the circular platform by depth control, and the residual thickness of the production board is controlled to be 0.45 ± 0.1 mm.
5. The method of claim 4, wherein after the insulating platform is milled, a hollowed-out groove is milled on the periphery of the insulating platform, and a flange connected with the production board is reserved on the edge of the insulating platform.
6. The method of claim 1, wherein in the step S5, the excess thickness of the production board at the earthworm wire platform is controlled to 0.45 ± 0.1 mm.
7. The method of manufacturing a printed circuit board for a signal generator as claimed in claim 6, wherein after the earthworm line platform is gonged, hollowed-out grooves are gonged on both sides of the earthworm line platform and along the earthworm line platform.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811354265.6A CN109548271B (en) | 2018-11-14 | 2018-11-14 | Method for manufacturing printed circuit board for signal generator |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811354265.6A CN109548271B (en) | 2018-11-14 | 2018-11-14 | Method for manufacturing printed circuit board for signal generator |
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| Publication Number | Publication Date |
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| CN109548271A CN109548271A (en) | 2019-03-29 |
| CN109548271B true CN109548271B (en) | 2021-04-02 |
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| CN201811354265.6A Active CN109548271B (en) | 2018-11-14 | 2018-11-14 | Method for manufacturing printed circuit board for signal generator |
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Citations (8)
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| KR20010056582A (en) * | 1999-12-16 | 2001-07-04 | 김덕중 | Method for macturing ltcc with the antener |
| CN101043790A (en) * | 2006-03-23 | 2007-09-26 | 日本电气株式会社 | Multilayer printed wiring board and method of measuring characteristic impedance |
| US8671565B1 (en) * | 2006-12-22 | 2014-03-18 | Amkor Technology, Inc. | Blind via capture pad structure fabrication method |
| CN205428702U (en) * | 2013-09-05 | 2016-08-03 | 株式会社村田制作所 | Condenser embeds electron device |
| CN206059655U (en) * | 2016-06-30 | 2017-03-29 | 无锡中感微电子股份有限公司 | The printed circuit board (PCB) of antenna and charging inlet is supported simultaneously |
| CN206674300U (en) * | 2016-08-04 | 2017-11-24 | 磁化电子株式会社 | Printed circuit board (PCB) and the oscillation actuator including the printed circuit board (PCB) |
| CN107924215A (en) * | 2015-09-25 | 2018-04-17 | 英特尔公司 | The method for manufacturing stretchable computing device |
| US20180324960A1 (en) * | 2017-05-05 | 2018-11-08 | Skyworks Solutions, Inc. | Method of making printed circuit board structure including a closed cavity |
-
2018
- 2018-11-14 CN CN201811354265.6A patent/CN109548271B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20010056582A (en) * | 1999-12-16 | 2001-07-04 | 김덕중 | Method for macturing ltcc with the antener |
| CN101043790A (en) * | 2006-03-23 | 2007-09-26 | 日本电气株式会社 | Multilayer printed wiring board and method of measuring characteristic impedance |
| US8671565B1 (en) * | 2006-12-22 | 2014-03-18 | Amkor Technology, Inc. | Blind via capture pad structure fabrication method |
| CN205428702U (en) * | 2013-09-05 | 2016-08-03 | 株式会社村田制作所 | Condenser embeds electron device |
| CN107924215A (en) * | 2015-09-25 | 2018-04-17 | 英特尔公司 | The method for manufacturing stretchable computing device |
| CN206059655U (en) * | 2016-06-30 | 2017-03-29 | 无锡中感微电子股份有限公司 | The printed circuit board (PCB) of antenna and charging inlet is supported simultaneously |
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| US20180324960A1 (en) * | 2017-05-05 | 2018-11-08 | Skyworks Solutions, Inc. | Method of making printed circuit board structure including a closed cavity |
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| CN109548271A (en) | 2019-03-29 |
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