CN116321683A - Semi-rigid-flex circuit board capable of realizing bidirectional and multidirectional bending and processing method thereof - Google Patents
Semi-rigid-flex circuit board capable of realizing bidirectional and multidirectional bending and processing method thereof Download PDFInfo
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- CN116321683A CN116321683A CN202310198689.2A CN202310198689A CN116321683A CN 116321683 A CN116321683 A CN 116321683A CN 202310198689 A CN202310198689 A CN 202310198689A CN 116321683 A CN116321683 A CN 116321683A
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- 238000005452 bending Methods 0.000 title claims abstract description 43
- 230000002457 bidirectional effect Effects 0.000 title claims abstract description 18
- 238000003672 processing method Methods 0.000 title claims abstract description 11
- 238000003825 pressing Methods 0.000 claims abstract description 23
- 238000000034 method Methods 0.000 claims abstract description 18
- 238000013461 design Methods 0.000 claims abstract description 13
- 238000012545 processing Methods 0.000 claims abstract description 8
- 238000011161 development Methods 0.000 claims abstract description 7
- 238000005553 drilling Methods 0.000 claims abstract description 7
- 238000005530 etching Methods 0.000 claims abstract description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 4
- 230000003139 buffering effect Effects 0.000 claims abstract description 4
- 238000010030 laminating Methods 0.000 claims abstract description 4
- 239000000741 silica gel Substances 0.000 claims abstract description 4
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 230000000903 blocking effect Effects 0.000 claims description 6
- 239000011889 copper foil Substances 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 238000007689 inspection Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 238000005259 measurement Methods 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 230000002265 prevention Effects 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 238000004381 surface treatment Methods 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 239000010408 film Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 4
- 239000013039 cover film Substances 0.000 description 2
- 238000003801 milling Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/0278—Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a semi-rigid-flex circuit board capable of realizing bidirectional and multidirectional bending and a processing method thereof. The processing method comprises the following steps of S1, processing a soft board layer: sequentially performing inner layer pretreatment, exposure, development, etching, inner layer AOI, browning and rapid-pressing coverage covering films; s2, windowing a hard plate layer: drilling holes and positioning at corresponding positions, and then windowing to process corresponding bending grooves; s3, laminating: the upper and lower use silica gel pad of pressing, is used for buffering and pressing in the area of opening window of the soft board; s4, subsequent process design. The circuit board can provide the supporting function of the rigid circuit board, can realize the bending of the flexible board, and can simultaneously realize bidirectional bending, and the bending frequency is greatly improved.
Description
Technical Field
The invention relates to the technical field of circuit board processing, in particular to a semi-rigid-flex circuit board capable of realizing bidirectional multi-azimuth bending and a processing method thereof.
Background
The existing Semi-rigid Flexible (Semi-rigid) product combines the advantages of a rigid board and a Flexible board, can not only provide the supporting function of the rigid circuit board, but also realize the bending of the Flexible board, and is widely applied to the three-dimensional assembly of electronic products.
The pure FR4 rigid laminate is controlled in depth and milling to control the bending area to a certain thickness, which can be used as a flexible bending area, as shown in fig. 4. The flexible board area uses a cover film or flexible board ink mode, and the design mode has the following problems:
1. the soft board area can only be designed in the outer layer area;
2. bending can only achieve forward bending but not reverse bending; as shown in particular in fig. 5 below;
3. the limit capacity of the bending times is only 10 times, and the bending times are less.
Disclosure of Invention
The invention aims to solve the problems that: the semi-rigid-flex circuit board capable of realizing bidirectional and multidirectional bending and the processing method thereof are provided, the circuit board can provide a supporting function for a rigid circuit board, bending of a flexible board can be realized, meanwhile, bidirectional bending can be realized, and the bending frequency is greatly improved.
The technical scheme provided by the invention for solving the problems is as follows: the utility model provides a can realize half rigid-flex circuit board of two-way diversified buckling, is in including soft board layer and setting the hard board layer of both sides about the soft board layer, be provided with the bending groove through windowing on the hard board layer.
Preferably, the flexible board layer uses FR4 2.5mils as the substrate material.
Preferably, the hard sheet layer includes copper foil, pp, optical sheet, pp and pp which are sequentially arranged.
Preferably, the pp is a low flow rate pp.
The invention also discloses a processing method of the semi-rigid-flex circuit board capable of realizing bidirectional multi-azimuth bending, which comprises the following steps,
s1, processing a soft board layer: sequentially performing inner layer pretreatment, exposure, development, etching, inner layer AOI, browning and rapid-pressing coverage covering films;
s2, windowing a hard plate layer: drilling holes and positioning at corresponding positions, and then windowing to process corresponding bending grooves;
s3, laminating: the upper and lower use silica gel pad of pressing, is used for buffering and pressing in the area of opening window of the soft board;
s4, subsequent process design.
Preferably, in the step S2, the hard plate layer window is designed according to a window single side +20um.
Preferably, the subsequent process design in S4 includes,
s4.1, drilling, horizontal PTH, and copper plating;
s4.2, outer layer pretreatment, vacuum film pressing, air pressing by an automatic film pressing machine once, exposure, development, etching, outer layer AOI and vacuum film pressing;
s4.3, welding prevention flow: printing by using a blocking point, wherein the blocking point is arranged in the soft board area and is not printed;
s4.4, surface treatment, routing, electrical measurement, inspection and packaging.
Compared with the prior art, the invention has the advantages that: the circuit board can provide the supporting function of the rigid circuit board, can realize the bending of the flexible board, and can simultaneously realize bidirectional bending, and the bending frequency is greatly improved.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and do not constitute a limitation on the invention.
FIG. 1 is a schematic diagram of a circuit board structure of the present invention;
FIG. 2 is a schematic flow chart of the processing method of the present invention;
FIG. 3 is a schematic diagram of the structure of the present invention;
FIG. 4 is a schematic diagram of a prior art circuit board according to the background of the invention;
fig. 5 is a schematic diagram illustrating bending of the circuit board.
Detailed Description
The following detailed description of embodiments of the present invention will be given with reference to the accompanying drawings and examples, by which the implementation process of how the present invention can be applied to solve the technical problems and achieve the technical effects can be fully understood and implemented.
In the description of the present invention, it should be noted that, for the azimuth words such as "center", "lateral", "longitudinal", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., the azimuth and positional relationships are based on the azimuth or positional relationships shown in the drawings, it is merely for convenience of describing the present invention and simplifying the description, and it is not to be construed as limiting the specific scope of protection of the present invention that the device or element referred to must have a specific azimuth configuration and operation.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features. Thus, the definition of "a first", "a second" or "a second" feature may explicitly or implicitly include one or more such feature, and in the description of the invention, the meaning of "a number" is two or more, unless otherwise specifically defined.
In the present invention, unless explicitly stated and limited otherwise, the terms "assembled," "connected," and "connected" are to be construed broadly, e.g., as being either fixedly connected, detachably connected, or integrally connected; or may be a mechanical connection; can be directly connected or connected through an intermediate medium, and can be communicated with the inside of the two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
It should be understood that the terms "comprises" and "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It is also to be understood that the terminology used in the description of the embodiments of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of embodiments of the invention. As used in the specification of the embodiments of the invention and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
Example 1
As shown in FIG. 1, a semi-rigid-flex circuit board capable of realizing bidirectional and multidirectional bending comprises a flexible board layer and hard board layers arranged on the upper side and the lower side of the flexible board layer, wherein bending grooves are formed in the hard board layers through windowing.
Wherein, the soft board layer takes FR4 2.5mils as a substrate material.
In this embodiment, the hard sheet layer includes copper foil, pp, light sheet, pp and pp, which are sequentially disposed.
Still further, the pp is a low flow rate pp.
In this embodiment, a 4L laminate is taken as an example, a 1+2+1 design is adopted, and the middle L2/3 layer is a soft board process, and the structure is shown in fig. 1. Wherein, THE soft board layer Super-THE replaces RA copper foil, which increases bending performance; the cover film uses cover to cover the substitute soft board ink; the stiff plate layer PP uses a low flow rate PP (Low Flow PP) or a medium flow rate PP (Medium Flow PP); the hard plate area window design replaces the subsequent uncovering process.
Example 2
As shown in fig. 2, a processing method of a semi-rigid-flex circuit board capable of realizing bidirectional multi-directional bending as described in embodiment 1, the processing method comprising the steps of,
s1, processing a soft board layer: sequentially performing inner layer pretreatment, exposure, development, etching, inner layer AOI, browning and rapid-pressing coverage covering films;
s2, windowing a hard plate layer: drilling holes and positioning at corresponding positions, and then windowing to process corresponding bending grooves, wherein the hard plate layer windowing is designed according to the unilateral windowing of +20um, so that the PP overflow effluent glue size can be given;
s3, laminating: the upper and lower use silica gel pad of the lamination, is used for buffering and pressing in the area of opening window of the soft board, specifically as shown in figure 3;
s4, subsequent process design, specifically comprising:
s4.1, drilling, horizontal PTH, and copper plating;
s4.2, outer layer pretreatment, vacuum film pressing, air pressing by an automatic film pressing machine once, exposure, development, etching, outer layer AOI and vacuum film pressing;
s4.3, welding prevention flow: printing by using a blocking point, wherein the blocking point is arranged in the soft board area and is not printed;
s4.4, surface treatment, routing, electrical measurement, inspection, packaging and other normal processes.
Specifically, the invention has the following beneficial effects:
1. solves the flow design of a Semi Flex Semi rigid-Flex product and the bending design of a middle soft board;
2. the middle layer design and the bidirectional multi-azimuth bending capacity of the semi-rigid-flexible product in a depth control milling mode are solved;
3. the bending capability is increased from 10 times or less to 25 times or less before.
The foregoing is illustrative of the preferred embodiments of the present invention and is not to be construed as limiting the claims. The present invention is not limited to the above embodiments, and the specific structure thereof is allowed to vary. All changes which come within the meaning and range of equivalency of the claims are to be embraced within their scope.
Claims (7)
1. The utility model provides a can realize half rigid-flex circuit board of two-way diversified buckling which characterized in that: including the hose layer and set up the hard board layer of both sides about the hose layer, be provided with the bending groove through windowing on the hard board layer.
2. The semi-rigid-flex circuit board capable of realizing bidirectional multi-azimuth bending according to claim 1, wherein: the flexible board layer takes FR4 2.5mils as a substrate material.
3. The semi-rigid-flex circuit board capable of realizing bidirectional multi-azimuth bending according to claim 1, wherein: the hard board layer comprises copper foil, pp, a light board, pp and pp which are sequentially arranged.
4. A semi-rigid-flex circuit board capable of realizing bidirectional multi-directional bending according to claim 3, characterized in that: the pp is a low flow rate pp.
5. A method for processing a semi-rigid-flex circuit board capable of realizing bidirectional multi-azimuth bending as set forth in any one of claims 1-4, characterized in that: the processing method comprises the following steps of,
s1, processing a soft board layer: sequentially performing inner layer pretreatment, exposure, development, etching, inner layer AOI, browning and rapid-pressing coverage covering films;
s2, windowing a hard plate layer: drilling holes and positioning at corresponding positions, and then windowing to process corresponding bending grooves;
s3, laminating: pressing the upper and lower silica gel pads; the soft board is used for buffering and pressing in a windowing area of the soft board;
s4, subsequent process design.
6. The method for processing the semi-rigid-flex circuit board capable of realizing bidirectional multi-azimuth bending according to claim 5, wherein the method comprises the following steps: in S2, the hard board layer is windowed according to the unilateral +20um design of windowing.
7. The method for processing the semi-rigid-flex circuit board capable of realizing bidirectional multi-azimuth bending according to claim 5, wherein the method comprises the following steps: the subsequent flow design in S4 includes,
s4.1, drilling, horizontal PTH, and copper plating;
s4.2, outer layer pretreatment, vacuum film pressing, air pressing by an automatic film pressing machine once, exposure, development, etching, outer layer AOI and vacuum film pressing;
s4.3, welding prevention flow: printing by using a blocking point, wherein the blocking point is arranged in the soft board area and is not printed;
s4.4, surface treatment, routing, electrical measurement, inspection and packaging.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310198689.2A CN116321683A (en) | 2023-03-03 | 2023-03-03 | Semi-rigid-flex circuit board capable of realizing bidirectional and multidirectional bending and processing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310198689.2A CN116321683A (en) | 2023-03-03 | 2023-03-03 | Semi-rigid-flex circuit board capable of realizing bidirectional and multidirectional bending and processing method thereof |
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| CN116321683A true CN116321683A (en) | 2023-06-23 |
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| CN202310198689.2A Pending CN116321683A (en) | 2023-03-03 | 2023-03-03 | Semi-rigid-flex circuit board capable of realizing bidirectional and multidirectional bending and processing method thereof |
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Cited By (1)
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| CN117241486A (en) * | 2023-09-08 | 2023-12-15 | 淮安特创科技有限公司 | Depth-control milling process for semi-rigid-flex PCB |
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