CN106793489A - A kind of process for improving Rigid Flex aperture peak - Google Patents
A kind of process for improving Rigid Flex aperture peak Download PDFInfo
- Publication number
- CN106793489A CN106793489A CN201611200062.2A CN201611200062A CN106793489A CN 106793489 A CN106793489 A CN 106793489A CN 201611200062 A CN201611200062 A CN 201611200062A CN 106793489 A CN106793489 A CN 106793489A
- Authority
- CN
- China
- Prior art keywords
- layer
- hardboard
- copper foil
- soft board
- rigid flex
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The present invention relates to a kind of process for improving Rigid Flex aperture peak, prepare hardboard layer and soft board layer first, and the order by the first hardboard layer, soft board layer, the second hardboard layer is stacked successively from top to bottom, then respectively above the upper copper foil layer of the first hardboard layer, the first hardboard layer corresponding need machine drilling position to be respectively provided with circular nonfunctional pad with the lower section of the lower copper foil layer of soft board interlayer, soft board layer and the second hardboard interlayer and the second hardboard layer, the combination of Rigid Flex is carried out, and machine drilling is carried out to Rigid Flex.The inventive method is simple, machine drilling position increase nonfunctional pad is being needed during Rigid Flex is set, gap when reducing mechanical holes drilled through between auxiliary cover plate and Rigid Flex, the auxiliary cover plate for alloing mechanical holes drilled through to retreat knife face time is effectively pressed against plate face, efficiently solves the problems, such as that aperture peak is abnormal.
Description
Technical field
The present invention relates to a kind of process for improving Rigid Flex aperture peak, belong to pcb board processing technique field.
Background technology
As consumption electronic product is lightening, integrated, multifunction development trend, its making to printed circuit board (PCB)
Technological requirement more and more higher.This trend is complied with, soft or hard combination printed substrate can be increasingly becoming the important portion of printed circuit board (PCB)
Point.Rigid Flex is as its name suggests on one or more rigid printed substrate, to include the overall institute of composition essential
One or more flexible printed wiring board, its act on cause electronic product assemble when reduce use connector, considerably increase
The advantages of reliability, signal transmission are faster, finished size is smaller.
Rigid Flex uncapped before typically having and after uncap two kinds of processing technologys, in order to connect the conducting of inside and outside sandwich circuit
Property, typically has mechanical holes drilled through and radium-shine beats blind two kinds of technique.Because the characteristic of Rigid Flex, all can be using buffering during pressing
Auxiliary material increases the extruding of material, so cause center fullness, in mechanical holes drilled through auxiliary cover plate and Rigid Flex it
Between have a gap, the auxiliary cover plate that mechanical holes drilled through retreats knife face time cannot be pressed against plate face, cause aperture to have peak exception,
Client's meeting out-of-flatness when part is welded, causes the risk that part comes off.
The content of the invention
The invention aims to solve the above problems, there is provided a kind of method is simple, it is easy to which the improvement of operation is soft or hard
The process of board aperture peak.
The present invention is adopted the following technical scheme that：A kind of process for improving Rigid Flex aperture peak, including it is as follows
Step：
（1）Respectively prepare hardboard layer and soft board layer, and by the first hardboard layer, soft board layer, the second hardboard layer order from top to bottom
Stack successively, the first hardboard layer and the second hardboard layer are followed successively by from top to bottom including three layers respectively：Upper copper foil layer, substrate
Layer, lower copper foil layer, the soft board layer are followed successively by from top to bottom including three layers：Upper copper foil layer, polyimide layer, lower copper foil layer；
（2）Respectively the first hardboard layer upper copper foil layer above, the first hardboard layer and soft board interlayer, soft board layer and the second hardboard layer
Between and the second hardboard layer lower copper foil layer lower section it is corresponding need machine drilling position to be respectively provided with circular nonfunctional pad,
（3）The upper copper foil layer of the lower copper foil layer of the first hardboard layer, the second hardboard layer is etched away completely；
（4）Nonfunctional pad is exposed with brother's sandwich circuit, etches；
（5）By the first hardboard layer and the corresponding soft board layer bending region windowing of the second hardboard layer；
（6）Prepare four prepregs, and corresponding soft board layer bending region is opened a window；
（7）Prepare two copper foil layers, upper copper foil layer and lower copper foil layer respectively as Rigid Flex；
（8）By upper Copper Foil, the first prepreg, the first hardboard layer, the second prepreg, soft board layer, the 3rd prepreg, second
Hardboard layer, the 4th prepreg, the order of lower Copper Foil are pressed into the Rigid Flex of semi-finished product；
（9）Carry out machine drilling to obtain the through hole of needs in the upper placement auxiliary cover plate of the soft hard board plywood of semi-finished product；
（10）Mechanical brushing is carried out to through hole, the peak of through hole is cut to smooth using brushing wheel.
Further, the diameter of nonfunctional pad 0.2-0.4mm smaller than the diameter dimension of through hole.
Further, the nonfunctional pad is made of Copper Foil material.
The inventive method is simple, and machine drilling position increase nonfunctional pad is being needed during Rigid Flex is set
Piece, gap when reducing mechanical holes drilled through between auxiliary cover plate and Rigid Flex makes mechanical holes drilled through retreat knife face time
Auxiliary cover plate can effectively be pressed against plate face, efficiently solve the problems, such as that aperture peak is abnormal.
Brief description of the drawings
Fig. 1 is structural representation of the invention.
Reference：Upper Copper Foil 1, the first prepreg 2, the first hardboard the 3, second prepreg 4, soft board of layer layer the 5, the 3rd
Prepreg 6, the 7, the 4th prepreg 8 of the second hardboard layer, lower Copper Foil 9.
Specific embodiment
Below in conjunction with accompanying drawing, the invention will be further described.
As shown in figure 1, a kind of process for improving Rigid Flex aperture peak, comprises the following steps：
（1）Respectively prepare hardboard layer and soft board layer, and by the first hardboard layer, soft board layer, the second hardboard layer order from top to bottom
Stack successively, the first hardboard layer and the second hardboard layer are followed successively by from top to bottom including three layers respectively：Upper copper foil layer, substrate
Layer, lower copper foil layer, the soft board layer are followed successively by from top to bottom including three layers：Upper copper foil layer, polyimide layer, lower copper foil layer；
（2）Respectively the first hardboard layer upper copper foil layer above, the first hardboard layer and soft board interlayer, soft board layer and the second hardboard layer
Between and the second hardboard layer lower copper foil layer lower section it is corresponding need machine drilling position to be respectively provided with circular nonfunctional pad,
（3）The upper copper foil layer of the lower copper foil layer of the first hardboard layer, the second hardboard layer is etched away completely；
（4）Nonfunctional pad is exposed with brother's sandwich circuit, etches；
（5）By the first hardboard layer and the corresponding soft board layer bending region windowing of the second hardboard layer；
（6）Prepare four prepregs, and corresponding soft board layer bending region is opened a window；
（7）Prepare two copper foil layers, upper copper foil layer and lower copper foil layer respectively as Rigid Flex；
（8）By upper Copper Foil, the first prepreg, the first hardboard layer, the second prepreg, soft board layer, the 3rd prepreg, second
Hardboard layer, the 4th prepreg, the order of lower Copper Foil are pressed into the Rigid Flex of semi-finished product；
（9）Machine drilling is carried out to obtain the through hole of needs in the upper placement auxiliary cover plate of the soft hard board plywood of semi-finished product, this
Two kinds of apertures in embodiment are respectively 2.4mm and 1.1mm, and corresponding nonfunctional washer diameter is respectively 2.1mm and 0.8mm,
Machine drilling parameter need not do especially adjustment, be set as normal parameter, because increasing nonfunctional pad, than not having originally
Thickness is thick when having increase nonfunctional pad, therefore auxiliary cover plate can push down the position for needing drilling, it is possible to reduce during withdrawing
The peak for taking up；
（10）Mechanical brushing is carried out to through hole, the peak of through hole is cut to smooth using brushing wheel, it is same because increased nothing
Function spacer thickness is thickening so that brushing wheel can effectively machine away the peak in aperture.
Claims (3)
1. a kind of process for improving Rigid Flex aperture peak, it is characterised in that：Comprise the following steps：
（1）Respectively prepare hardboard layer and soft board layer, and by the first hardboard layer, soft board layer, the second hardboard layer order from top to bottom
Stack successively, the first hardboard layer and the second hardboard layer are followed successively by from top to bottom including three layers respectively：Upper copper foil layer, substrate
Layer, lower copper foil layer, the soft board layer are followed successively by from top to bottom including three layers：Upper copper foil layer, polyimide layer, lower copper foil layer；
（2）Respectively the first hardboard layer upper copper foil layer above, the first hardboard layer and soft board interlayer, soft board layer and the second hardboard layer
Between and the second hardboard layer lower copper foil layer lower section it is corresponding need machine drilling position to be respectively provided with circular nonfunctional pad,
（3）The upper copper foil layer of the lower copper foil layer of the first hardboard layer, the second hardboard layer is etched away completely；
（4）Nonfunctional pad is exposed with each sandwich circuit, etches；
（5）By the first hardboard layer and the corresponding soft board layer bending region windowing of the second hardboard layer；
（6）Prepare four prepregs, and corresponding soft board layer bending region is opened a window；
（7）Prepare two copper foil layers, upper copper foil layer and lower copper foil layer respectively as Rigid Flex；
（8）By upper Copper Foil, the first prepreg, the first hardboard layer, the second prepreg, soft board layer, the 3rd prepreg, second
Hardboard layer, the 4th prepreg, the order of lower Copper Foil are pressed into the Rigid Flex of semi-finished product；
（9）Carry out machine drilling to obtain the through hole of needs in the upper placement auxiliary cover plate of the soft hard board plywood of semi-finished product；
（10）Mechanical brushing is carried out to through hole, the peak of through hole is cut to smooth using brushing wheel.
2. the process of Rigid Flex aperture peak is improved as claimed in claim 1, it is characterised in that：The nonfunctional
The diameter of pad 0.2-0.4mm smaller than the diameter dimension of through hole.
3. the process of Rigid Flex aperture peak is improved as claimed in claim 1, it is characterised in that：The nonfunctional
Pad is made of Copper Foil material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611200062.2A CN106793489B (en) | 2016-12-20 | 2016-12-20 | A kind of process improving Rigid Flex aperture peak |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611200062.2A CN106793489B (en) | 2016-12-20 | 2016-12-20 | A kind of process improving Rigid Flex aperture peak |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106793489A true CN106793489A (en) | 2017-05-31 |
| CN106793489B CN106793489B (en) | 2019-04-02 |
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ID=58899559
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611200062.2A Active CN106793489B (en) | 2016-12-20 | 2016-12-20 | A kind of process improving Rigid Flex aperture peak |
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| Country | Link |
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| CN (1) | CN106793489B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112074084A (en) * | 2020-08-06 | 2020-12-11 | 恒赫鼎富(苏州)电子有限公司 | Method for avoiding drilling abnormity of rigid-flex board |
| CN116321683A (en) * | 2023-03-03 | 2023-06-23 | 江西景旺精密电路有限公司 | Semi-rigid-flex circuit board capable of realizing bidirectional and multidirectional bending and processing method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5961255A (en) * | 1996-07-30 | 1999-10-05 | Systems Division Incorporated | Entry overlay sheet and method for drilling holes |
| JP2001232596A (en) * | 2000-02-23 | 2001-08-28 | Mitsubishi Alum Co Ltd | Drilling floor plate for printed board |
| CN1805659A (en) * | 2005-12-30 | 2006-07-19 | 深圳市深南电路有限公司 | Milling and deburring method for PCB board |
| CN101772267A (en) * | 2008-12-30 | 2010-07-07 | 深圳玛斯兰电路科技实业发展有限公司 | Improvement method for wrinkled copper foil in compacting process of high-rise plates |
| CN103369872A (en) * | 2012-03-30 | 2013-10-23 | 北大方正集团有限公司 | Method for laminating multilayer printed circuit board |
-
2016
- 2016-12-20 CN CN201611200062.2A patent/CN106793489B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5961255A (en) * | 1996-07-30 | 1999-10-05 | Systems Division Incorporated | Entry overlay sheet and method for drilling holes |
| JP2001232596A (en) * | 2000-02-23 | 2001-08-28 | Mitsubishi Alum Co Ltd | Drilling floor plate for printed board |
| CN1805659A (en) * | 2005-12-30 | 2006-07-19 | 深圳市深南电路有限公司 | Milling and deburring method for PCB board |
| CN101772267A (en) * | 2008-12-30 | 2010-07-07 | 深圳玛斯兰电路科技实业发展有限公司 | Improvement method for wrinkled copper foil in compacting process of high-rise plates |
| CN103369872A (en) * | 2012-03-30 | 2013-10-23 | 北大方正集团有限公司 | Method for laminating multilayer printed circuit board |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112074084A (en) * | 2020-08-06 | 2020-12-11 | 恒赫鼎富(苏州)电子有限公司 | Method for avoiding drilling abnormity of rigid-flex board |
| CN116321683A (en) * | 2023-03-03 | 2023-06-23 | 江西景旺精密电路有限公司 | Semi-rigid-flex circuit board capable of realizing bidirectional and multidirectional bending and processing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106793489B (en) | 2019-04-02 |
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Address after: Jiangsu province Wuxi Chunhui road 214101 Xishan City Economic Development Zone No. 32 Patentee after: Gaode (Jiangsu) Electronic Technology Co.,Ltd. Address before: Jiangsu province Wuxi Chunhui road 214101 Xishan City Economic Development Zone No. 32 Patentee before: GULTECH (JIANGSU) ELECTRONIC TECHNOLOGIES CO.,LTD. |
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