CN217849758U - High-speed printed circuit board and electronic device - Google Patents
High-speed printed circuit board and electronic device Download PDFInfo
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- CN217849758U CN217849758U CN202220576106.6U CN202220576106U CN217849758U CN 217849758 U CN217849758 U CN 217849758U CN 202220576106 U CN202220576106 U CN 202220576106U CN 217849758 U CN217849758 U CN 217849758U
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Abstract
The utility model discloses a high-speed printed circuit board and electron device, wherein, high-speed printed circuit board includes: at least one high-speed signal layer; the first bonding layer is attached to one side of the at least one high-speed signal layer; the first shielding piece is attached to one side, away from the at least one high-speed signal layer, of the first bonding layer; the second bonding layer is attached to the other side of the at least one high-speed signal layer; and the second shielding piece is attached to one side of the second bonding layer, which is far away from the at least one high-speed signal layer. Through the structure, the utility model discloses can carry out the enclosure shielding to the high-speed signal layer to reduce the high-speed signal layer and produce signal loss in signal transmission process, improve validity and the stability that the signal carries out the transmission along the direction of transmission on high-speed signal layer.
Description
Technical Field
The utility model discloses be applied to printed circuit board's technical field, especially high-speed printed circuit board and electron device.
Background
A Printed Circuit Board (PCB), also known as a Printed Circuit Board or Printed Circuit Board, is an important electronic component used in a wide range of applications, is a support for electronic components, and is also a carrier for electrical connection of electronic components.
With the increasing expansion of communication systems, servers, etc., the progress of electronic design technology is continuous, and interconnection of signals with higher speed is required. High-speed design and low transmission loss of Printed Circuit Boards (PCBs) are also continuously required to be realized by electronic products.
At present, the transmission loss of the high-speed printed circuit board is larger in the using process.
SUMMERY OF THE UTILITY MODEL
The utility model provides a high-speed printed circuit board and electron device to solve the great problem of high-speed printed circuit board transmission loss who exists among the prior art.
In order to solve the technical problem, the utility model provides a high-speed printed circuit board, include: at least one high-speed signal layer; the first bonding layer is attached to one side of the at least one high-speed signal layer; the first shielding piece is attached to one side, away from the at least one high-speed signal layer, of the first bonding layer; the second bonding layer is attached to the other side of the at least one high-speed signal layer; and the second shielding piece is attached to one side, far away from the at least one high-speed signal layer, of the second bonding layer.
The high-speed signal layer comprises a base layer and a signal wire which are stacked and attached.
Wherein the number of the high-speed signal layers is one layer; one side of basic unit with the second tie coat is close to the laminating of one side on high-speed signal layer sets up, the opposite side of basic unit with the laminating of signal conductor sets up.
The number of the high-speed signal layers is multiple, and the multiple high-speed signal layers are sequentially stacked; and an intermediate shielding layer is arranged between every two adjacent high-speed signal layers.
Wherein the base layer comprises a polyimide layer.
Wherein the thickness of the base layer ranges from 1mil to 4 mils.
Wherein the first bonding layer comprises a polytetrafluoroethylene layer and the second bonding layer comprises a polytetrafluoroethylene layer.
Wherein, first shielding part is including first protective layer and the first shielding layer of laminating setting, first shielding layer laminating set up in first tie coat is kept away from one side on high-speed signal layer, first protective layer laminating set up in first shielding layer is kept away from one side on high-speed signal layer.
The second shielding part comprises a second protective layer and a second shielding layer, the second protective layer and the second shielding layer are arranged in a laminating mode, the second shielding layer is arranged in a laminating mode, the second bonding layer is far away from one side of the high-speed signal layer, and the second protective layer is arranged in a laminating mode, the second shielding layer is far away from one side of the high-speed signal layer.
The utility model has the advantages that: be different from prior art's condition, the utility model discloses a fixed first shielding piece and the second shielding piece of setting respectively in at least one high-speed signal layer both sides to can carry out the enclosure shielding to at least one high-speed signal layer, thereby reduce the high-speed signal layer and produce signal loss in signal transmission process, improve the validity and the stability that the signal carries out the transmission along the direction of transmission on high-speed signal layer.
Drawings
Fig. 1 is a schematic structural diagram of an embodiment of a high-speed printed circuit board of the present invention;
fig. 2 is a schematic structural diagram of another embodiment of the high-speed printed circuit board of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work all belong to the protection scope of the present invention.
It should be noted that, if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description relating to "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
Referring to fig. 1, fig. 1 is a schematic structural diagram of an embodiment of a high-speed printed circuit board of the present invention.
The high-speed printed circuit board 100 of the present embodiment includes at least one high-speed signal layer 110, a first adhesive layer 104, a first shield 170, a second adhesive layer 103, and a second shield 150. The first adhesive layer 104 is attached to one side of the at least one high-speed signal layer 110, and the first shielding member 170 is attached to one side of the first adhesive layer 104 away from the at least one high-speed signal layer 110. That is, the first shield 170 is fixedly disposed on one side of the at least one high-speed signal layer 110 by the first adhesive layer 104.
The second adhesive layer 103 is attached to the other side of the at least one high-speed signal layer 110, and the second shielding member 150 is attached to the side of the second adhesive layer 103 away from the at least one high-speed signal layer 110. That is, the second shield 150 is fixedly disposed on the other side of the at least one high speed signal layer 110 by the second adhesive layer 103.
The second shielding part 150 and the first shielding part 170 are respectively disposed on two opposite sides of the at least one high-speed signal layer 110, so that the at least one high-speed signal layer 110 can be shielded in an enclosing manner, thereby reducing signal loss generated by the at least one high-speed signal layer 110 in a signal transmission process, and improving effectiveness and stability of transmission of signals along a transmission direction of the corresponding high-speed signal layer 110.
The second shielding member 150 and the first shielding member 170 may include a shielding material such as a metal shielding layer, a conductive rubber layer, an organic conductive material, etc. to shield signals.
That is, the first shield 170, the first adhesive layer 104, the high-speed signal layer 110, the second adhesive layer 103, and the second shield 150 are laminated and attached in this order.
Through above-mentioned structure, the high-speed printed circuit board of this embodiment is through fixed first shield and the second shield that sets up respectively in high-speed signal layer both sides to can carry out the enclosed shielding to high-speed signal layer, thereby reduce high-speed signal layer and produce signal loss in signal transmission process, improve validity and the stability that the signal carries out the transmission along the direction of transmission on high-speed signal layer.
In other embodiments, high-speed signal layer 110 includes base layer 102 and signal conductors 101;
one side of the base layer 102 is attached to one side of the second adhesive layer 103 adjacent to the high-speed signal layer 110, and the other side of the base layer 102 is attached to the signal conductor 101. The base layer 102 is used to carry the signal conductors 101. The embodiment is described with the number of the high-speed signal layers 110 in the high-speed printed circuit board 100 being 1, but in other embodiments, the number of the high-speed signal layers 110 in the high-speed printed circuit board 100 may be plural, for example, 2, 3, 5, etc.
In a specific application scenario, after the signal conductor is prepared by etching the copper layer of the single-sided copper-clad plate, the high-speed signal layer 110 is obtained by combining the copper layer of the single-sided copper-clad plate and the base layer.
The specific line direction and function of the signal conductor 101 may be set based on actual conditions, and are not limited herein.
The base layer 102 may include a rigid material, so that the base layer 102 can support the signal wires 101 by using the rigidity thereof, so as to ensure the stability and reliability of the signal wires 101 and reduce the loosening and displacement of the signal wires 101.
In other embodiments, when the number of the high-speed signal layers 110 is multiple, the multiple high-speed signal layers 110 are sequentially stacked; wherein, an intermediate shielding layer is arranged between every two adjacent high-speed signal layers 110 for signal shielding.
In other embodiments, base layer 102 comprises a polyimide layer. The polyimide layer has high stability and good machining performance, so that the printed circuit board 100 has good machining performance and excellent electrical performance, the bending performance of the printed circuit board 100 is also improved, the high-speed printed circuit board 100 of the embodiment can be applied to high-speed flexible boards or high-speed rigid-flex PCB products, and the application range of the printed circuit board 100 is further improved.
In other embodiments, the thickness of the base layer 102 ranges from 1mil to 4 mils, and may specifically be 1mil, 2 mils, 3 mils, or 4 mils, and is not limited herein. The base layer 102 within this range can not only provide enough supporting force for the signal conductor 101 to ensure the stability of the signal conductor 101, but also prevent the base layer 102 from being too thick to affect the miniaturization and lightness of the printed circuit board 100.
In other embodiments, the first bonding layer 104 comprises a Polytetrafluoroethylene (PTFE) layer and the second bonding layer 103 comprises a PTFE layer.
The polytetrafluoroethylene layer has low water absorption, and the polytetrafluoroethylene layers are respectively arranged on the two opposite sides of the high-speed signal layer 110, so that the shielding parts can be bonded, the base layer 102 of the high-speed signal layer 110 can be protected from being prevented from increasing signal loss caused by water absorption of the base layer 102 from two sides, the stability and the quality of the base layer 102 are guaranteed, and the stability and the integrity of high-speed signal transmission are further guaranteed.
In other embodiments, the first shielding member 170 includes a first protection layer 108 and a first shielding layer 107, the first shielding layer 107 is attached to the side of the first adhesive layer 104 away from the at least one high-speed signal layer 110, and the first protection layer 108 is attached to the side of the first shielding layer 107 away from the at least one high-speed signal layer 110.
That is, the first protective layer 108 is formed on one side surface of the entire high-speed printed circuit board 100, and the first protective layer 108 protects the high-speed printed circuit board 100 from one side of the high-speed printed circuit board 100.
The first shielding layer 107 includes a shielding material such as a metal shielding layer, a conductive rubber layer, or an organic conductive material to shield signals.
The first protective layer 108 comprises a coverlay film (CVL) or other protective layer.
In other embodiments, the first shield 170 comprises a single-sided copper clad laminate. The single-sided copper-clad plate comprises a copper layer and a polyimide layer which are attached, wherein the first shielding piece 170 is prepared through the single-sided copper-clad plate, the copper layer can be directly set to be the first shielding layer 107, and the polyimide layer is set to be the first protective layer 108, so that the function of the first shielding layer 107 is achieved ingeniously through the original structure of the single-sided copper-clad plate. In addition, the side of the single-sided copper-clad plate with the copper layer is fixed through the first bonding layer 104, so that the layer adding steps of the high-speed printed circuit board 100 can be reduced, the preparation process of the high-speed printed circuit board 100 is simplified, and the preparation efficiency of the high-speed printed circuit board 100 is improved.
In other embodiments, the second shielding element 150 includes a second protection layer 106 and a second shielding layer 105, the second shielding layer 105 is attached to the side of the second adhesive layer 103 away from the high-speed signal layer 110, and the second protection layer 106 is attached to the side of the second shielding layer 105 away from the high-speed signal layer 110.
That is, the second protective layer 106 is formed on the other side surface of the entire high-speed printed circuit board 100, and the second protective layer 106 protects the high-speed printed circuit board 100 from one side of the high-speed printed circuit board 100.
The second shielding layer 105 includes a shielding material such as a metal shielding layer, a conductive rubber layer, or an organic conductive material to shield signals.
The second protective layer 106 includes a coverlay film (CVL) or other protective layer.
In other embodiments, the second shield 150 comprises a single-sided copper clad laminate. The single-sided copper-clad plate comprises a copper layer and a polyimide layer which are attached, wherein the first shielding piece 170 is prepared through the single-sided copper-clad plate, the copper layer can be directly set to be the second shielding layer 105, and the polyimide layer is set to be the second protective layer 106, so that the function of the second shielding layer 105 is ingeniously achieved by utilizing the original structure of the single-sided copper-clad plate. In addition, the side of the single-sided copper-clad plate with the copper layer is fixed through the first bonding layer 104, so that the layer adding steps of the high-speed printed circuit board 100 can be reduced, the preparation process of the high-speed printed circuit board 100 is simplified, and the preparation efficiency of the high-speed printed circuit board 100 is improved.
In a specific application scenario, the high-speed printed circuit board 100 of this embodiment can be obtained by laminating three single-sided copper-clad plates and two side bonding layers, specifically, etching a copper layer of one of the single-sided copper-clad plates to form a signal conductor, then sequentially arranging the bonding layer and the other single-sided copper-clad plate on two sides of the single-sided copper-clad plate, respectively, and laminating to obtain the high-speed printed circuit board 100, wherein the copper layer of the other single-sided copper-clad plate is laminated toward the bonding layer.
Through above-mentioned structure, this embodiment is through fixed first shield and the second shield that sets up respectively in at least one high-speed signal layer both sides to can carry out the enclosed shielding to whole high-speed signal layer, thereby reduce high-speed signal layer and produce signal loss in signal transmission process, improve the validity and the stability that the signal transmitted along the direction of transmission on high-speed signal layer. In the embodiment, the base layer including the polyimide layer is used to enable the printed circuit board to have good processing performance and excellent electrical performance, and the bending performance of the printed circuit board is also improved, so that the high-speed printed circuit board of the embodiment can be applied to high-speed flexible printed circuit boards or high-speed rigid-flex printed circuit board products, and the application range of the printed circuit board is further improved. In addition, the polytetrafluoroethylene layers are respectively arranged on the two opposite sides of the high-speed signal layer, so that the base layer of the high-speed signal layer can be protected from being increased in signal loss caused by water absorption of the base layer from the two sides, and the stability and the integrity of high-speed signal transmission are further guaranteed. Furthermore, the first shielding part is prepared by the single-sided copper-clad plate, the copper layer can be directly set as the first shielding layer, and the polyimide layer is set as the first protective layer, so that the function of each shielding layer is skillfully realized by utilizing the original structure of the single-sided copper-clad plate. And one side of the single-sided copper-clad plate, on which the copper layer is formed, is fixed through the bonding layer, so that the layer adding step of the high-speed printed circuit board can be reduced, the preparation flow of the high-speed printed circuit board is simplified, and the preparation efficiency of the high-speed printed circuit board is improved.
Referring to fig. 2, fig. 2 is a schematic structural diagram of another embodiment of the high-speed printed circuit board of the present invention. In the present embodiment, the number of the high-speed signal layers in the high-speed printed circuit board is 2, wherein when the number of the high-speed signal layers in the high-speed printed circuit board is multiple, the structure is similar to that of the present embodiment, and the description thereof is omitted.
The high-speed printed circuit board 200 of the present embodiment includes a first high-speed signal layer 210, a second high-speed signal layer 230, a first adhesive layer 204, a first shield 270, a second adhesive layer 203, a second shield 250, and an intermediate shield layer 220.
The first shielding member 270, the first adhesive layer 204, the first high-speed signal layer 210, the middle shielding layer 220, the second high-speed signal layer 230, the second adhesive layer 203, and the second shielding member 250 are sequentially stacked and overlapped.
The arrangement of the middle shielding layer 220 can respectively and independently perform signal transmission between the first high-speed signal layer 210 and the second high-speed signal layer 230, so that signals between the first high-speed signal layer 210 and the second high-speed signal layer 230 are not interfered with each other, and the integrity of signal transmission between the high-speed signal layers can be ensured.
In some embodiments, the first high-speed signal layer 210 includes a first base layer 202 and a first signal conductor 201, which are disposed in a laminated manner, and the second high-speed signal layer 230 includes a second base layer 221 and a second signal conductor 222, which are disposed in a laminated manner.
One side of the middle shielding layer 220 is attached to one side of the first base layer 202 away from the first signal wire 201, and the other side of the middle shielding layer 220 is attached to one side of the second base layer 221 away from the first signal wire 222.
In some embodiments, the first shield 270 includes a first protective layer 208 and a first shield layer 207 in a conforming arrangement, and the second shield 250 includes a second protective layer 206 and a second shield layer 205 in a conforming arrangement.
The side of the first shielding layer 207 away from the first protection layer 208 is fixed to the side of the first signal wire 201 away from the first base layer 202 by the first adhesive layer 204, and the side of the second shielding member 250 away from the second protection layer 206 is fixed to the side of the second signal wire 222 away from the second base layer 221 by the second adhesive layer 203.
In a specific application scenario, the intermediate shielding layer 220 may be fixedly attached between the first base layer 202 and the second base layer 221 by an adhesive or a bonding layer, and the fixing manner is not limited herein.
Through above-mentioned structure, this embodiment through at high-speed signal layer both sides fixed first shield and the second shield of setting respectively to can carry out the enclosed shielding to high-speed signal layer, thereby reduce high-speed signal layer and produce signal loss in signal transmission process, improve the validity and the stability that the signal carries out the transmission along the direction of transmission on high-speed signal layer. And this embodiment is provided with middle shielding layer between every adjacent two-layer high-speed signal layer to make the signal mutual noninterference between each high-speed signal layer, can guarantee the integrality of signal transmission between each high-speed signal layer.
The application also provides an electronic device, which comprises the high-speed printed circuit board in any one of the embodiments, so that signal loss generated in a signal transmission process of the high-speed signal layer is reduced, and effectiveness and stability of signal transmission along the transmission direction of the high-speed signal layer are improved.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only represent several embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (8)
1. A high speed printed circuit board, comprising:
at least one high-speed signal layer;
the first bonding layer is attached to one side of the at least one high-speed signal layer;
the first shielding piece is attached to one side, away from the at least one high-speed signal layer, of the first bonding layer; the first shielding piece comprises a first protective layer and a first shielding layer which are arranged in a laminating mode, the first shielding layer is arranged on one side, away from the high-speed signal layer, of the first bonding layer in a laminating mode, and the first protective layer is arranged on one side, away from the high-speed signal layer, of the first shielding layer in a laminating mode;
the second bonding layer is attached to the other side of the at least one high-speed signal layer;
the second shielding piece, the second shielding piece laminating set up in the second tie coat is kept away from one side on at least one high-speed signal layer, the second shielding piece is including second protective layer and the second shielding layer that the laminating set up, the laminating of second shielding layer set up in the second tie coat is kept away from one side on high-speed signal layer, the laminating of second protective layer set up in the second shielding layer is kept away from one side on high-speed signal layer.
2. The high speed printed circuit board of claim 1, wherein the high speed signal layer comprises a base layer and signal conductors arranged in a stacked and bonded arrangement.
3. The high speed printed circuit board of claim 2, wherein the number of high speed signal layers is one;
one side of basic unit with the second tie coat is close to the laminating of one side on high-speed signal layer sets up, the opposite side of basic unit with the laminating of signal conductor sets up.
4. The high-speed printed circuit board according to claim 1 or 2, wherein the number of the high-speed signal layers is a plurality of layers, and the plurality of high-speed signal layers are sequentially stacked;
and an intermediate shielding layer is arranged between every two adjacent high-speed signal layers.
5. The high speed printed circuit board of claim 2, wherein the base layer comprises a polyimide layer.
6. A high speed printed circuit board according to claim 2,
the thickness of the base layer ranges from 1mil to 4 mils.
7. A high speed printed circuit board according to claim 1, wherein the first adhesive layer comprises a polytetrafluoroethylene layer and the second adhesive layer comprises a polytetrafluoroethylene layer.
8. An electronic device, characterized in that it comprises a high-speed printed circuit board according to any one of claims 1-7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220576106.6U CN217849758U (en) | 2022-03-15 | 2022-03-15 | High-speed printed circuit board and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220576106.6U CN217849758U (en) | 2022-03-15 | 2022-03-15 | High-speed printed circuit board and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217849758U true CN217849758U (en) | 2022-11-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220576106.6U Active CN217849758U (en) | 2022-03-15 | 2022-03-15 | High-speed printed circuit board and electronic device |
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| CN (1) | CN217849758U (en) |
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- 2022-03-15 CN CN202220576106.6U patent/CN217849758U/en active Active
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