CN221409237U - Double-sided gong hollow semi-flexible board - Google Patents
Double-sided gong hollow semi-flexible board Download PDFInfo
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- CN221409237U CN221409237U CN202322770490.0U CN202322770490U CN221409237U CN 221409237 U CN221409237 U CN 221409237U CN 202322770490 U CN202322770490 U CN 202322770490U CN 221409237 U CN221409237 U CN 221409237U
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- 239000000758 substrate Substances 0.000 claims abstract description 59
- 239000000463 material Substances 0.000 claims abstract description 10
- 239000003822 epoxy resin Substances 0.000 claims abstract description 7
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 7
- 238000005452 bending Methods 0.000 abstract description 15
- 238000004519 manufacturing process Methods 0.000 abstract description 14
- 238000000034 method Methods 0.000 abstract description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract description 4
- 229910052799 carbon Inorganic materials 0.000 abstract description 4
- 239000010410 layer Substances 0.000 description 34
- 238000010586 diagram Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 238000003801 milling Methods 0.000 description 4
- 238000003475 lamination Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
The utility model is suitable for the technical field of rigid-flexible boards, and provides a double-sided gong hollow semi-flexible board which comprises a top substrate and a bottom substrate, wherein a bendable substrate is arranged between the top substrate and the bottom substrate, prepregs are arranged between the top substrate and the bendable substrate and between the bottom substrate and the bendable substrate, one side of the bendable substrate is provided with a top gong hollow region on the top substrate, and the other side of the bendable substrate is provided with a bottom gong hollow region on the bottom substrate; the prepreg is made of an epoxy resin material; the top layer gong hollow area and the bottom layer gong hollow area are corresponding and the same in size. Compared with the traditional single-sided semi-flexible board, the utility model can realize double-sided bending by 180 degrees, the fatigue resistance can reach more than 300 times, and compared with a rigid-flexible combination board, the utility model has simple process flow, greatly reduced cost, short period and low carbon emission manufacturing process.
Description
Technical Field
The utility model belongs to the technical field of rigid-flexible boards, and particularly relates to a double-sided gong hollow semi-flexible board.
Background
The rigid-flexible printed circuit board is generally used in the industrial fields of automobiles, medical treatment, military, aerospace and the like, the manufacturing of the rigid-flexible printed circuit board is a complex process, the expansion and contraction control and the press fit uncovering technology between the rigid FR4 material and the flexible PI substrate are difficult, a plurality of special devices are required to be added, and the conditions of complex manufacturing process, high cost, long period and the like exist.
With the development of new energy automobiles, more and more vehicle-mounted direction-changing control systems, camera modules and other narrow modules select flexible PCB boards, so that the consumption is high, and the demand for semi-flexible boards is suddenly increased based on cost reduction and efficiency consideration. The existing semi-flexible board can only realize a single-sided deep turning control technology, the bending times are generally in the level of 30-100 times, the welding-resistant layer is easy to wrinkle or break after exceeding the limit bending times, and the bending times of the rigid-flexible combination board are more than 1000 times. In order to improve the bending performance of the semi-soft board and the diversity of the laminated structure, the product shape and the function can approach or even exceed those of the rigid-flexible combination board, the product has wide application market, the high cost performance and the high reliability are realized, the product has ultrahigh commercial value, the new generation of products are led, and the carbon emission in the manufacturing process can be reduced.
Aiming at a common single-sided blank-milling semi-flexible board, a flexible board layer can be designed only on a top layer and a bottom layer, and the flexible board cannot be realized on any layer, and in order to realize signal transmission and wiring density on a rigid-flexible combination board, a flexible board is generally arranged on a laminated central layer, so that the application range of replacing the rigid-flexible combination board is limited in the aspect; on the other hand, the half soft plate has less bending times and insufficient bending strength, and the use of products with high-frequency bending is affected. Therefore, in view of the above situation, there is an urgent need to develop a double-sided gong hollow semi-flexible board to overcome the shortcomings in the current practical application.
Disclosure of utility model
The embodiment of the utility model aims to provide a double-sided gong hollow semi-flexible board, which aims to solve the problems in the background art.
The embodiment of the utility model is realized in such a way that the double-sided gong hollow semi-flexible board comprises a top layer substrate and a bottom layer substrate, wherein a bendable substrate is arranged between the top layer substrate and the bottom layer substrate, prepregs are arranged between the top layer substrate and the bendable substrate and between the bottom layer substrate and the bendable substrate, one side of the bendable substrate is provided with a top layer gong hollow region on the top layer substrate, and the other side of the bendable substrate is provided with a bottom layer gong hollow region on the bottom layer substrate; the prepreg is made of an epoxy resin material; the top layer gong hollow area and the bottom layer gong hollow area are corresponding and the same in size.
According to the double-sided blank routing semi-flexible board provided by the embodiment of the utility model, the laminated structure of the rigid printed circuit is optimized, the material of the bending-resistant core board layer and the epoxy resin prepreg are selected, after the rigid PCB finished product is finished according to the rigid PCB flow, the double-sided depth control routing is performed in a preset area, so that the double-sided blank routing process is realized, the same function as a rigid-flexible combination board is realized, and compared with the traditional single-sided blank routing, the double-sided bending of 180 degrees can be realized, and the fatigue resistance can reach more than 300 times; compared with a rigid-flexible combination plate, the manufacturing process is simple, the cost is greatly reduced, the period is short, and the manufacturing process with low carbon emission is provided.
Drawings
Fig. 1 is a schematic cross-sectional structure diagram of a double-sided gong hollow semi-flexible board provided by an embodiment of the utility model;
Fig. 2 is a schematic top view of a double-sided gong hollow semi-flexible board according to an embodiment of the present utility model;
FIG. 3 is a schematic view of the structure of the auxiliary pad;
fig. 4 is a schematic diagram of a first gong of a double-sided gong hollow semi-flexible board provided by an embodiment of the utility model;
Fig. 5 is a schematic diagram of a first gong effect of a double-sided gong blank semi-flexible board provided by an embodiment of the utility model;
fig. 6 is a schematic diagram of a double-sided gong hollow semi-flexible board fixed on a backing board according to an embodiment of the utility model;
fig. 7 is a schematic diagram of a finished product effect of a double-sided gong hollow semi-flexible board provided by the embodiment of the utility model.
In the figure: 101-top layer substrate, 102-flexible substrate, 103-bottom layer substrate, 110-prepreg, 201-top layer gong hollow area, 202-bottom layer gong hollow area, 301-backing plate, 310-positioning hole and 320-gong hole area.
Description of the embodiments
The present utility model will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present utility model more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.
Specific implementations of the utility model are described in detail below in connection with specific embodiments.
For a rigid-flexible combination board, a coverlayer process (covering protection layer) is manufactured in a flexible area, the rigid FR4 and the flexible material are integrally pressed together in a lamination design, a window of a bondable prepreg (PP) in an area where a cover is required to be opened is removed, PP flows to a window opening position in order to reduce pressing, no PP flows, and the surface of a circuit in the flexible area needs to be pressed together with a PI shielding mill to replace ink protection. Therefore, a PI film (single-sided adhesive) with single-sided adhesive needs to be embedded in the PP windowing position; and then removing the FR4 substrate on the surface layer of the PI film through V-Cut or depth control gong, thereby realizing coverlayer process.
To half soft board of ordinary single face gong, the mesa is hugged closely to the one side when the gong board, can even gong mill FR4 material, guarantees the even excess thickness in soft board position, is favorable to avoiding bending process single-point to thin and lead to stress concentration to appear the fracture, and can not realize two-sided gong and empty, mainly when the one side gong is empty, when turning over the second gong, gong and empty department does not support, leads to the second gong to mill soft board position and takes place to warp, influences gong board precision to influence half soft board's bendability. In the aspect of gong-blank technology, the original double-sided gong-blank is easy to appear gong-blank precision difference, deformation and fracture phenomenon, and the residual thickness at the soft board is uneven to cause incomplete glass cloth, so that the glass cloth is easy to fracture when being bent for use.
Therefore, in order to solve the above problems, the windowing of the sheet material and the prepreg before lamination is optimized.
As shown in fig. 1 and 7, a double-sided gong-hollow semi-flexible board according to an embodiment of the present utility model includes a top substrate 101 and a bottom substrate 103, a flexible substrate 102 is disposed between the top substrate 101 and the bottom substrate 103, prepregs 110 are disposed between the top substrate 101 and the flexible substrate 102 and between the bottom substrate 103 and the flexible substrate 102, a top gong-hollow region 201 is disposed on the top substrate 101 on one side of the flexible substrate 102, and a bottom gong-hollow region 202 is disposed on the bottom substrate 103 on the other side of the flexible substrate 102.
Preferably, the prepreg 110 is made of an epoxy resin material; the top layer gong hollow area 201 corresponds to the bottom layer gong hollow area 202 and has the same size.
In the embodiment of the utility model, the lamination is designed according to the illustration, and at least comprises 6 layers (or false 4 layers; note: false 4 layers correspond to the copper-free secondary outer layer in the figure 1. The top gong hollow area 201 and the bottom gong hollow area 202 are set as wireless circuit patterns, and the other areas retain the circuit patterns.
As shown in fig. 1-7, an embodiment of the present utility model further provides a method for manufacturing a double-sided gong hollow semi-flexible board, including the following steps:
Step 1, manufacturing a rigid PCB, wherein the conventional flow is as follows: cutting, inner layer etching, punching, browning, laminating, drilling, copper deposition, electroplating, outer layer circuit, welding resistance, surface treatment and appearance;
Step 2, manufacturing a double-sided semi-flexible board, wherein the conventional process comprises the following steps: manufacturing an auxiliary base plate 301- > deep gong control on a first surface- > deep gong control on a second surface- > cleaning- > packaging- > warehousing;
The method comprises the following steps:
21 The auxiliary backing plate 301 is manufactured, the thickness of the backing plate 301 is selected to be equal to the thickness (H) of the plate with the depth H1 of the first time, the thickness H of the backing plate 301 meets the accuracy of H1+/-0.025 mm, four positioning holes 310 are drilled in four corners of the backing plate 301, and then the size of a hole milling area 320 is controlled according to the matched pattern and size of a product for standby. In addition, the external dimension of the backing plate 301 is larger than the external dimension of the product, the reserved edge width is larger than 15mm, the hole-milling area 320 of the backing plate 301 is only used for milling holes of the rigid area of the double-sided half-soft board, the dimension of w1 is enlarged to the connecting bridge position of the soft board, the dimension of w2 is enlarged to other areas, the dimension of w1 is more than or equal to 0.1mm and less than or equal to 0.25mm, and the dimension of W2 is more than or equal to 1mm. Positioning holes 310 are designed at four corners of the backing plate 301, and the aperture is 3.2mm; the double-sided semi-flexible board product itself has positioning holes, and the positioning holes 310 and the product positioning holes of the output backing plate are required to be drilled in the same set, so that the product and the backing plate 301 can be well embedded in alignment, and the manufacturing precision is ensured;
22 Fixing the rigid PCB with the gong shape on the first surface according to the positioning holes 310, controlling the depth of the gong for the first time to be h1, and controlling the depth of the first surface according to the set depth h1, wherein h1 is more than or equal to 0.2mm;
23 Fixing a pre-made backing plate 301, then enabling the second surface of the shaped rigid PCB to face upwards, performing secondary depth control gong with depth h2, and performing secondary depth control gong according to the depth h2 of the second surface, wherein h2 is more than or equal to 0.2mm; preferably, h1 and h2 may be equal or unequal. Thus, the double-sided half-flexible board is manufactured.
According to the utility model, on one hand, the cover opening technology is reduced, on the other hand, the situation that the bendable part of the traditional rigid-flexible combination board is required to be adhered to the surface, one side is epoxy resin, and the other side is an ink (solder resist) covering layer, so that the bending resistance and crease resistance of the ink are considered, the bending resistance of the residual thickness of the substrate and the PP is considered, and the depth of the substrate can be controlled from one side only is overcome.
The utility model optimizes the laminated structure of the rigid Printed Circuit (PCB), selects the material of the bending-resistant core board layer and the epoxy resin (PP sheet) prepreg 110, and performs double-sided deep-turning control in a preset area after finishing the rigid PCB finished product according to the rigid PCB flow, thereby realizing the double-sided semi-flexible board manufacturing process, realizing the same function of replacing a rigid-Flexible Printed Circuit (FPC), realizing double-sided bending 180 degrees and achieving more than 300 times of fatigue resistance compared with the traditional single-sided semi-flexible printed circuit; compared with a rigid-flexible combination plate, the manufacturing process is simple, the cost is greatly reduced, the period is short, and the manufacturing process with low carbon emission is provided.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The foregoing examples illustrate only a few embodiments of the utility model and are described in detail herein without thereby limiting the scope of the utility model. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.
Claims (1)
1. The double-sided gong hollow semi-flexible board comprises a top layer substrate and a bottom layer substrate, and is characterized in that a bendable substrate is arranged between the top layer substrate and the bottom layer substrate, and prepregs are arranged between the top layer substrate and the bendable substrate and between the bottom layer substrate and the bendable substrate;
A top layer gong hollow area is arranged on the top layer substrate on one side of the bendable substrate, and a bottom layer gong hollow area is arranged on the bottom layer substrate on the other side of the bendable substrate;
the prepreg is made of an epoxy resin material;
The top layer gong hollow area and the bottom layer gong hollow area are corresponding and the same in size.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322770490.0U CN221409237U (en) | 2023-10-16 | 2023-10-16 | Double-sided gong hollow semi-flexible board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322770490.0U CN221409237U (en) | 2023-10-16 | 2023-10-16 | Double-sided gong hollow semi-flexible board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221409237U true CN221409237U (en) | 2024-07-23 |
Family
ID=91920314
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322770490.0U Active CN221409237U (en) | 2023-10-16 | 2023-10-16 | Double-sided gong hollow semi-flexible board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221409237U (en) |
-
2023
- 2023-10-16 CN CN202322770490.0U patent/CN221409237U/en active Active
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