CN112739005B

CN112739005B - Golden finger circuit board processing method and golden finger circuit board

Info

Publication number: CN112739005B
Application number: CN202011280462.5A
Authority: CN
Inventors: 许校彬
Original assignee: Huai'an Techuang Technology Co ltd
Current assignee: Huai'an Techuang Technology Co ltd
Priority date: 2020-11-16
Filing date: 2020-11-16
Publication date: 2022-06-17
Anticipated expiration: 2040-11-16
Also published as: CN112739005A

Abstract

The application provides a golden finger circuit board and a processing method thereof. The processing method of the gold finger circuit board comprises the following steps: manufacturing a golden finger on the first substrate, and windowing on the curing sheet according to the position of the golden finger; stacking the first substrate, the curing sheet and the second substrate in sequence; pressing the first substrate, the curing sheet and the second substrate to fixedly connect the first substrate, the curing sheet and the second substrate; and carrying out depth control milling on the second substrate for multiple times according to the positions of the golden fingers so as to form a plurality of communicating grooves penetrating through the second substrate on the second substrate. Through carrying out the accuse deep milling many times to the second base plate for a plurality of strip metal strip one-to-ones are exposed in a plurality of intercommunication grooves, when external equipment or staff are about to contact with the golden finger, will block the notch department by the intercommunication groove, can prevent that the surface of golden finger is impaired in the course of working, and then lead to the condition that information transmission efficiency is influenced.

Description

Golden finger circuit board processing method and golden finger circuit board

Technical Field

The invention relates to the technical field of circuit boards, in particular to a golden finger circuit board and a processing method thereof.

Background

The gold finger is a pad which is used for being inserted into the clamping groove and is in contact conduction with the metal spring piece in the clamping groove and arranged like a finger, and because the design has higher requirements on the wear resistance and the conductivity of the surface of the pad, a layer of nickel and a layer of gold are plated on the surface of the pad, so the gold finger is commonly called as a gold finger.

The traditional multilayer circuit board golden finger processing mode is that a golden finger contact piece is manufactured on the surface of an inner layer board, then the inner layer board, a curing piece and an outer layer board are stacked and are pressed into a whole in a pressing machine, and finally, a groove is formed in the outer layer board, so that the golden finger of the inner layer board can be connected with the outside through a groove body of the outer layer board. . Because the golden finger is directly exposed outside, in the processing process, the processed equipment or the hand easily directly touches the contact piece of the golden finger, so that the surface of the contact piece of the golden finger is damaged, and further the processing of the golden finger is influenced. In addition, in daily use, the contact piece is easy to collide with or scrape and rub against an external object, so that the contact piece of the golden finger is easy to damage, the information transmission efficiency is further influenced, and even the golden finger fails, so that the service life of the traditional circuit board golden finger in a traditional multilayer circuit board golden finger processing mode is usually short.

Disclosure of Invention

The invention aims to overcome the defects in the prior art and provides a golden finger circuit board and a processing method thereof, wherein the surface of a golden finger can be prevented from being damaged in the processing process, the golden finger can be effectively prevented from colliding with an external object, and the service life of the golden finger is prolonged.

The purpose of the invention is realized by the following technical scheme:

a processing method of a golden finger circuit board comprises the following steps:

manufacturing a golden finger on a first substrate, and windowing on a curing sheet according to the position of the golden finger;

sequentially stacking the first substrate, the curing sheet and a second substrate;

pressing the first substrate, the curing sheet and the second substrate to fixedly connect the first substrate, the curing sheet and the second substrate to obtain a semi-finished product of the golden finger structure;

sequentially carrying out depth control milling processing on a second substrate of the semi-finished product of the golden finger structure according to the positions of a plurality of strip-shaped metal sheet bodies of the golden finger so as to form a plurality of communicating grooves penetrating through the second substrate on the second substrate, wherein the plurality of strip-shaped metal sheet bodies in the golden finger are exposed in the plurality of communicating grooves in a one-to-one correspondence manner;

and electroplating the semi-finished product of the golden finger structure so as to cover the surfaces of the strip-shaped metal sheets of the golden finger with gold plating layers.

In one embodiment, before the step of sequentially stacking the first substrate, the curing sheet and the second substrate, the method for processing the golden finger circuit board further comprises the following steps:

and a plurality of high-temperature-resistant protective adhesive tapes are stuck on the plurality of strip-shaped metal sheet bodies of the golden finger in a one-to-one correspondence manner, so that the surface of each strip-shaped metal sheet body is covered with the corresponding high-temperature-resistant protective adhesive tape.

In one embodiment, the area of each high temperature resistant protective tape is larger than that of the strip-shaped metal sheet body.

In one embodiment, the step of sequentially performing depth-control milling on the second substrate of the gold finger structure semi-finished product according to the positions of the plurality of strip-shaped metal sheets of the gold finger includes:

performing a first milling operation on the second substrate according to the position of each strip-shaped metal sheet of the golden finger to mill a communicating groove penetrating through the second substrate;

and carrying out second milling operation on the second substrate according to the position of the corresponding strip-shaped metal sheet body of the golden finger so as to finely mill the groove wall of the communicating groove.

In one embodiment, the horizontal feeding speed of the milling cutter for performing the first milling operation according to the position of each strip-shaped metal sheet body of the golden finger on the second substrate is 2cm/s-4cm/s, and the horizontal feeding speed of the milling cutter for performing the second milling operation according to the position of the corresponding strip-shaped metal sheet body of the golden finger on the second substrate is 1cm/s-2 cm/s.

In one embodiment, during a first milling operation performed on a second substrate of the gold finger structure semi-finished product according to a position of each strip-shaped metal sheet of the gold finger, when a depth to be milled of the second substrate is greater than 0.5mm, the second substrate is milled by using a mechanical depth control milling machine, and when the depth to be milled of the second substrate is less than 0.5mm, the second substrate is cut by using laser cutting.

In one embodiment, during the first milling operation on the second substrate according to the position of each strip-shaped metal sheet body of the golden finger, the vertical feeding amount of the milling cutter is 0.5mm-1mm per time.

In one embodiment, after the step of sequentially performing depth control milling on the second substrate according to the positions of the plurality of strip-shaped metal sheets of the gold finger, the method further includes the following steps:

and cutting the notch position of each communication groove to form a chamfer of 45 degrees on the notch of each communication groove.

In one embodiment, after the step of sequentially performing depth-control milling on the second substrate of the gold finger structure semi-finished product according to the positions of the plurality of strip-shaped metal sheets of the gold finger, the method further includes the following steps:

the golden finger circuit board is processed by adopting the method for processing the golden finger circuit board in any embodiment.

Compared with the prior art, the invention has at least the following advantages:

1. through carrying out the deep milling of accuse a plurality of times to the second base plate for golden finger top forms a plurality of intercommunication grooves, a plurality of strip metal lamellar bodies of golden finger pass through one by one and the position correspondence in intercommunication groove, and then make a plurality of strip metal lamellar bodies one-to-one expose in a plurality of intercommunication grooves, so, in follow-up processing, when external equipment or staff are about to contact with the golden finger, will be blockked the notch department in intercommunication groove, and then unable and the direct touching of strip metal lamellar body of golden finger, can prevent that the surface of golden finger is impaired in the course of working, and then lead to the condition that information transmission efficiency receives the influence, the processingquality of effectual improvement golden finger.

2. The golden finger circuit board after processing through this processing method is when daily use, because a plurality of strip metal lamellar bodies of golden finger are located the inside of intercommunication groove one by one, when the golden finger collides with external object, constrictive intercommunication groove notch can be with most external object separation in the notch department of intercommunication groove, most external object only can carry out direct collision with the second base plate promptly, and can't get into and contact with strip metal lamellar body from the notch of intercommunication groove, consequently can effectually reduce the possibility that the golden finger suffers external object collision, and then effectual protection golden finger, the life of the golden finger structure of extension circuit board.

3. The step of electroplating the golden finger is positioned after the step of grooving the second substrate, namely the golden plating layer on the surface of the golden finger is obtained by reprocessing the grooved second substrate, so that the condition that the golden finger plating layer is milled due to inaccurate milling depth can be avoided in the process of grooving the second substrate, and the conditions that the surface of the golden finger plating layer is scratched and damaged and signal transmission is influenced can be effectively prevented.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

FIG. 1 is a schematic flow chart illustrating a method for processing a gold finger circuit board according to an embodiment;

FIGS. 2 to 5 are schematic views illustrating a processing procedure of the gold finger circuit board shown in FIG. 1;

FIG. 6 is a schematic diagram illustrating a gold finger interface structure according to an embodiment;

FIG. 7 is a schematic view of the golden finger interface mechanism shown in FIG. 6 from another perspective;

FIG. 8 is a schematic diagram of a gold finger plug structure according to an embodiment;

FIG. 9 is a schematic view of the gold finger plug mechanism of FIG. 8 from another perspective;

Detailed Description

To facilitate an understanding of the invention, the invention will now be described more fully hereinafter with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

The method for processing the golden finger circuit board comprises the following steps: as shown in fig. 1 and 2, a gold finger 400 is formed on the first substrate 100, and a window is formed on the curing sheet 300 according to the position of the gold finger 400; sequentially stacking the first substrate 100, the curing sheet 300, and the second substrate 200; as shown in fig. 1 and fig. 3, the first substrate 100, the curing sheet 300 and the second substrate 200 are pressed to fixedly connect the first substrate 100, the curing sheet 300 and the second substrate 200, so as to obtain a semi-finished product of the gold finger structure; as shown in fig. 1 and 4, depth-control milling is sequentially performed on the second substrate 200 of the semi-finished gold finger structure according to the positions of the strip-shaped metal sheets 410 of the gold finger 400, so that a plurality of communicating grooves 210 penetrating through the second substrate 200 are formed on the second substrate 200, and the positions of the depth-control milling for a plurality of times correspond to the positions of the strip-shaped metal sheets 410 of the gold finger 400 one by one, so that the strip-shaped metal sheets 410 in the gold finger 400 are exposed in the communicating grooves 210 one by one; as shown in fig. 1 and 5, the gold finger structure semi-finished product is electroplated, so that the surfaces of the plurality of strip-shaped metal sheets 410 of the gold finger 400 are covered with gold plating layers 420.

In order to better understand the method for processing the golden finger circuit board of the present invention, the method for processing the golden finger circuit board of the present invention is further explained below, and the method for processing the golden finger circuit board of an embodiment is used for processing a circuit board including a golden finger interface. The processing method of the golden finger circuit board comprises the following steps:

s100: the gold finger 400 is fabricated on the first substrate 100, and a window is opened on the cured sheet 300 according to the position of the gold finger 400. In this step, the first substrate 100 and the second substrate 200 are part of a multilayer circuit board, and the first substrate 100 and the second substrate 200 may be a single layer or a multilayer laminated structure. In this step, firstly, through the processes of electroplating, film pasting, exposure, development, etching and film removing on the surface of the first substrate 100, a copper circuit and a gold finger 400 are manufactured on the surface of the first substrate 100, the gold finger 400 is connected with the copper circuit for information transmission, after the gold finger 400 is manufactured on the first substrate 100, the first substrate 100 and the second substrate 200 are required to be fixedly stacked and connected, the first substrate 100 and the second substrate 200 are tightly combined through the bonding effect of the curing sheet 300, and since the gold finger 400 on the first substrate 100 is required to be connected with an external circuit, a window is required to be opened at a corresponding position on the curing sheet 300 with the position, i.e., the size, of the gold finger 400, so that the cured sheet 300 after being pressed does not shield the gold finger 400.

S200: as shown in fig. 2, the first substrate 100, the cured sheet 300, and the second substrate 200 are sequentially stacked. In this step, the first substrate 100, the curing sheet 300, and the second substrate 200 are sequentially placed in the laminating machine, and it should be noted that one surface of the first substrate 100 on which the gold finger 400 is printed is opposite to the curing sheet 300, and the three of the first substrate 100, the curing sheet 300, and the second substrate 200 are positioned, so that the windowing position of the curing sheet 300 is just above the gold finger 400, and the curing sheet 300 does not shield the gold finger 400, and the corners of the three are aligned with each other, so as to reduce the bonding gap between the first substrate 100 and the second substrate 200, and increase the bonding stability of the first substrate 100 and the second substrate 200.

S300: as shown in fig. 3, the first substrate 100, the curing sheet 300 and the second substrate 200 are pressed to fixedly connect the first substrate 100, the curing sheet 300 and the second substrate 200. In this step, after the first substrate 100, the cured sheet 300, and the second substrate 200 are positioned, the first substrate 100, the cured sheet 300, and the second substrate 200 are bonded by a bonding machine, the cured sheet 300 in the semi-cured state is converted into a fully cured state by high-temperature bonding, and the first substrate 100 and the second substrate 200 are firmly bonded.

S400: as shown in fig. 4, multiple depth-control milling is performed on the second substrate 200 according to the position of the gold finger 400, so that a plurality of communicating grooves 210 penetrating through the second substrate 200 are formed on the second substrate 200, and the positions of the multiple depth-control milling correspond to the positions of the strip-shaped metal sheets 410 of the gold finger 400 one by one, so that the strip-shaped metal sheets 410 in the gold finger 400 are exposed in the communicating grooves 210 one by one. In this step, the plate edge of the second substrate 200 needs to be subjected to depth-control milling for multiple times, so that the plate edge of the second substrate 200 forms a plurality of communicating grooves 210 penetrating through the second substrate 200, the gold finger 400 includes a plurality of strip-shaped metal sheet bodies 410, and the position of the depth-control milling each time is located right above one of the strip-shaped metal sheet bodies 410, so that after the milling is completed, each strip-shaped metal sheet body 410 is exposed in the corresponding communicating groove 210.

S500: as shown in fig. 5, the gold fingers 400 are plated such that the surfaces of the plurality of gold fingers 400 are covered with a gold plating layer 420. After the depth-controlled milling is performed on the second substrate 200, the plurality of strip-shaped metal sheet bodies 410 of the gold finger 400 are exposed in the communicating groove 210, and the strip-shaped metal sheet bodies 410 can be communicated with the outside through the communicating groove 210.

Further, through carrying out the deep milling of accuse to second base plate 200 many times for golden finger 400 top forms a plurality of intercommunication grooves 210, a plurality of strip metal lamellar bodies 410 of golden finger 400 correspond with the position of intercommunication groove 210 one by one, and then make a plurality of strip metal lamellar bodies one-to-one expose in a plurality of intercommunication grooves 210, so, in subsequent processing, when external equipment or staff are about to contact with golden finger 400, will be by the notch department of intercommunication groove 210, and then unable and the direct touching of strip metal lamellar body 410 of golden finger 400, can prevent that the surface of golden finger 400 is impaired in the course of working, and then lead to the condition that information transmission efficiency receives the influence, effectual improvement golden finger 400's processingquality. The golden finger circuit board processed by the processing method is used daily, because the strip-shaped metal sheet bodies 410 of the golden finger 400 are located inside the communication groove 210 one by one, when the golden finger 400 collides with an external object, the narrow communication groove 210 can obstruct most of the external object at the notch of the communication groove 210, namely, most of the external object can only directly collide with the second substrate 200, and cannot enter from the notch of the communication groove 210 and contact with the strip-shaped metal sheet bodies 410, so that the possibility that the golden finger 400 is collided by the external object can be effectively reduced, the golden finger 400 is effectively protected, and the service life of the golden finger 400 structure of the circuit board is prolonged. In the processing process of the circuit board, since the step of electroplating the gold finger 400 is located after the step of grooving the second substrate 200, that is, the gold plating layer 420 on the surface of the gold finger 400 is obtained by reprocessing after grooving the second substrate 200, in the process of grooving the second substrate 200, the situation that the gold finger 400 plating layer is milled due to the fact that the milling depth is not accurate enough can be avoided, and the situations that the surface of the gold finger 400 plating layer is scratched and damaged and signal transmission is affected can be effectively prevented.

In one embodiment, before the step of sequentially stacking the first substrate, the cured sheet, and the second substrate, the method further comprises the steps of: and sticking a plurality of high-temperature-resistant protective adhesive tapes on the plurality of strip-shaped metal sheet bodies of the golden finger so that the surface of each strip-shaped metal sheet body is covered with the corresponding high-temperature-resistant protective adhesive tape. When the first substrate, the curing sheet and the second substrate are pressed, the curing sheet is in a semi-curing state before pressing, so that the curing sheet is stressed and deformed in the pressing process, the curing sheet in the stressed and deformed state is opened towards the horizontal direction, the curing sheet can be extruded onto the strip-shaped metal sheet body of the golden finger, the strip-shaped metal sheet body attached with residual glue of the curing sheet can generate incomplete electroplating during subsequent electroplating, and the information transmission efficiency of the golden finger is seriously influenced. In this embodiment, the surface of each strip metal lamellar body all is stamped high temperature resistant protection sticky tape, this high temperature resistant protection sticky tape specifically is the polyimide sticky tape, the imide sticky tape has excellent insulating nature, the wearability, acid and alkali resistance, can be high temperature resistant 300 degrees/10 minutes, 180 degrees can be used for a long time, at first base plate, the high temperature pressfitting in-process of curing piece and second base plate, because high temperature resistant protection sticky tape has good high temperature resistance, consequently can firmly cover directly over the strip metal lamellar body, when the curing piece cull will be attached to strip metal lamellar body top, high temperature resistant protection sticky tape can separation curing piece cull, prevent by the adhesion of curing piece on the strip metal lamellar body, avoid the follow-up incomplete condition of electroplating of strip metal lamellar body to take place. After the pressing is completed, the second substrate is grooved, the high-temperature-resistant protective tape is exposed in the communicating groove, and the high-temperature-resistant protective film can be torn off to electroplate the strip-shaped metal sheet body.

In one embodiment, the area of each high temperature resistant protective tape is larger than that of the strip-shaped metal sheet body. In order to further increase the guard action of high temperature resistant protection sticky tape to strip metal lamellar body, in this embodiment, the area of high temperature resistant protection sticky tape all is greater than strip metal lamellar body, consequently, high temperature resistant protection sticky tape can cover strip metal lamellar body comprehensively, make the surface of strip metal lamellar body completely isolated with external, when the solidification piece is heated extrusion deformation, high temperature resistant protection sticky tape can more effectually carry out the separation to the solidification piece cull, make the solidification piece cull not have any angle that can permeate to strip metal lamellar body surface, reach the protective effect that further promotes strip metal lamellar body, ensure that the cladding material can completely cover the surface of strip metal lamellar body in the electroplating process.

In one embodiment, the step of sequentially performing depth control milling processing on the second substrate of the gold finger structure semi-finished product according to the positions of the plurality of strip-shaped metal sheets of the gold finger comprises: performing first milling operation on the second substrate according to the position of each strip-shaped metal sheet of the golden finger to mill a communicating groove penetrating through the second substrate; and carrying out second milling operation on the second substrate according to the position of the corresponding strip-shaped metal sheet body of the golden finger so as to finely mill the wall of the communicating groove. In order to reduce the groove wall roughness of the communicating groove, improve the groove wall surface quality of the communicating groove and reduce the processing burrs, and simultaneously, in order to ensure the processing efficiency of the communicating groove, in the embodiment, the process of controlling the deep milling at each time comprises a first milling process and a second milling process, the milling cutter feeding speed of the first milling process is greater than that of the second milling process, so that the effect of rapidly milling the communicating groove on the second substrate is achieved, the processing speed of the communicating groove is further improved, the processing efficiency is ensured, the second milling process is to finely mill the surface of the communicating groove obtained by the first milling process, the milling cutter feeding speed of the second milling process is slower, the quality of the surface of the communicating groove is improved, and the surface roughness of the communicating groove is reduced.

In one embodiment, the horizontal feeding speed of the milling cutter for performing the first milling operation according to the position of each strip-shaped metal sheet body of the golden finger on the second substrate is 2cm/s-4cm/s, and the horizontal feeding speed of the milling cutter for performing the second milling operation according to the position of the corresponding strip-shaped metal sheet body of the golden finger on the second substrate is 1cm/s-2 cm/s. The horizontal feeding speed of the milling cutter in the milling process plays an important role in the processing efficiency and the processing quality of the communicating groove, when the horizontal feeding speed of the milling cutter is high, the processing speed is improved, but the surface roughness of the groove wall of the communicating groove is high, burrs are correspondingly increased, when the horizontal feeding speed of the milling cutter is low, the processing quality is improved, and the processing efficiency is correspondingly reduced at that time, in the embodiment, the feeding speed of the milling cutter in the first milling process is 2cm/s-4cm/s, within the feeding speed range, the forming speed of the communicating groove is high, the surface roughness is convenient for subsequent further moderate finish milling, the feeding speed of the milling cutter in the second milling process is 1cm/s-2cm/s, within the feeding speed range, the burrs generated in the milling process can be basically eliminated, and the roughness of the groove wall of the communicating groove is lower, which is beneficial to facilitating the subsequent further processing of the groove wall.

In one embodiment, in the process of performing the first milling operation on the second substrate of the gold finger structure semi-finished product according to the position of each strip-shaped metal sheet body of the gold finger, when the depth to be milled of the second substrate is greater than 0.5mm, the second substrate is milled by using a mechanical depth control milling machine, and when the depth to be milled of the second substrate is less than 0.5mm, the second substrate is cut by using laser cutting. The depth control milling processing of the second substrate needs to process a communicating groove penetrating through the second substrate on the second substrate, the communicating groove is milled layer by a milling cutter, and the milling cutter is difficult to fully contact with the groove wall at the lowest part of the communicating groove, so burrs or flashes are easy to generate, the forming quality of the communicating groove is seriously influenced, the cutting depth of the milling cutter is not easy to control, and the conditions that the cutting depth is insufficient, the communicating groove is not completely cut, or the strip-shaped metal sheet of a golden finger is damaged due to too deep cutting are very easy to generate. In this embodiment, the first in-process that mills, milling cutter mills the shape of intercommunication groove in the surface successive layer decurrent milling of second base plate, when the degree of depth of waiting to mill is less than 0.5mm, adopt laser cutting to cut remaining second base plate thin slice, make the intercommunication groove run through the second base plate, because the laser facula is little, energy density is high, cutting speed is fast, laser cutting can obtain better cutting quality, consequently, the incision of the deepest position of intercommunication groove is smooth level and smooth, and then the effectual burring that reaches, the effect of improvement intercommunication groove milling quality.

In one embodiment, after the step of sequentially performing depth-control milling processing on the second substrate according to the positions of the plurality of strip-shaped metal sheets of the gold finger, the method further includes the following steps: the notch position of each communicating groove is cut so that the notch of the communicating groove forms a chamfer of 45 degrees. External circuit connecting piece, need just can carry out the contact with the strip metal sheet body of golden finger through getting into the intercommunication inslot and be connected, and because the notch of intercommunication groove is less, be difficult to counterpoint, consequently circuit connecting piece's contact piece is comparatively inconvenient when stretching into the intercommunication inslot, in addition, because outside circuit connecting piece is difficult to counterpoint insert in the intercommunication groove consequently circuit connecting piece's link easily with the marginal lateral wall clash of second base plate, lead to the edge lateral wall damage of inserting the end of circuit connecting piece and second base plate after long-term the use easily. In order to solve the above problems, in this embodiment, after the second substrate is subjected to multiple depth-control milling and a plurality of communicating grooves are formed, the notch position of each communicating groove needs to be cut, so that the notch of each communicating groove forms a 45-degree chamfer, the notch of each communicating groove can be enlarged after the chamfer is formed, the insertion end of each circuit connecting piece is positioned more easily when entering the communicating groove, the connection operation is more convenient and faster, meanwhile, because the positioning difficulty is reduced, the collision frequency of the circuit connecting pieces and the edge side wall of the second substrate can be obviously reduced, and the effect of protecting the circuit board and the external circuit connecting pieces is further achieved.

In one embodiment, during the first milling operation on the second substrate according to the position of each strip-shaped metal sheet body of the golden finger, the vertical feed amount of the milling cutter is 0.5mm-1mm per time. The first milling process is to mill a communicating groove penetrating through the second substrate on the second substrate, and the specific cutting mode is as follows: the milling cutter enters from one side of the second substrate, the milling cutter moves along the direction parallel to the second substrate plate surface, the milling cutter retracts to one side of the second substrate after milling the plane in the shape of the communicating groove, then the milling cutter feeds along the direction perpendicular to the second substrate plate surface and moves along the direction parallel to the second substrate plate surface again, and the second substrate is milled, namely the milling cutter mills the communicating groove penetrating through the second substrate on the second substrate layer by layer, each time the feeding amount of the milling cutter along the direction perpendicular to the second substrate plate surface has important influence on the processing efficiency and the processing quality, when the vertical feeding amount is small, the processing efficiency is low, the economic benefit is influenced, and when the vertical feeding amount is large, the large processing residual stress can be caused on the second substrate, and the circuit board is deformed, therefore, in the embodiment, the vertical feeding amount of the milling cutter for depth control milling is 0.5mm-1mm each time, in this mill vertical feed volume scope, milling process has very fast process velocity, can guarantee the machining efficiency of intercommunication groove, and the processing residual stress that causes the second base plate simultaneously is lower, and the difficult deformation that produces of second base plate has then guaranteed the processingquality of intercommunication groove and second base plate.

In one embodiment, after the step of sequentially performing depth-control milling processing on the second substrate of the gold finger structure semi-finished product according to the positions of the plurality of strip-shaped metal sheets of the gold finger, the method further includes the following steps: and cleaning the milled semi-finished product of the golden finger structure. After the second base plate is deeply milled, because the milling process can produce a lot of processing fragments, the processing fragments can be attached to the communicating groove and the plate surface, so that the whole plate body after milling needs to be cleaned, and the cleaning process is as follows: the plate body is soaked in the cleaning liquid of the cleaning tank, the cleaning liquid is vibrated through the ultrasonic cleaning agent, the cleaning temperature is 30-40 ℃, the cleaning time is 3-4 minutes, and after the plate body is cleaned, machining chips in the communicating tank and the plate surface can be effectively removed, and impurities or dust attached to the surface of the plate body can be removed, so that the cleanliness of the plate body is improved, and further subsequent further processing of the plate body is facilitated.

The application further provides a golden finger circuit board which is processed by the golden finger circuit board processing method in any one of the embodiments. The circuit board golden finger connecting structure comprises a golden finger interface mechanism 100 and a golden finger plug mechanism 200. As shown in fig. 6 and 7, the gold finger interface mechanism 100 includes a first substrate 110, a gold finger contact sheet assembly 130 and a second substrate 120, the first substrate 110, the gold finger contact sheet assembly 130 and the second substrate 120 are sequentially stacked, the gold finger contact sheet assembly 130 includes a plurality of strip-shaped metal sheets 131, the second substrate 120 is provided with a plurality of communicating grooves 121, each communicating groove 121 penetrates through the second substrate 120, and the plurality of communicating grooves 121 are provided with a plurality of strip-shaped metal sheets 131 in a one-to-one correspondence manner, so that the plurality of strip-shaped metal sheets 131 are exposed in the plurality of communicating grooves 121 in a one-to-one correspondence manner. As shown in fig. 7 and 8, the gold finger plug mechanism 200 includes an insertion portion 210 and a plug contact piece assembly 220, the insertion portion 210 includes a plug substrate 211 and a plurality of strip-shaped connection blocks 212, the plurality of strip-shaped connection blocks 212 are all connected with the plug substrate 211, the plug contact piece assembly 220 includes a plurality of strip-shaped conductive piece bodies 221, the plurality of strip-shaped conductive piece bodies 221 are connected with the plurality of strip-shaped connection blocks 212 in a one-to-one correspondence manner, the plurality of strip-shaped connection blocks 212 are inserted into the plurality of communication grooves 121 in a one-to-one correspondence manner, and the plurality of strip-shaped conductive piece bodies 221 are abutted against the plurality of strip-shaped metal piece bodies 131 in a one-to-one correspondence manner.

As shown in fig. 6 and 7, in the present embodiment, the gold finger contact piece assembly 130 is located between the first substrate 110 and the second substrate 120, a circuit is printed on the first substrate 110, the gold finger contact piece assembly 130 is connected to the circuit printed on the first substrate 110, so that the gold finger contact piece assembly 130 can perform information transmission with the circuit printed on the first substrate 110, and the gold finger contact piece assembly 130 is used for connecting to an external circuit, so as to connect the external circuit to a circuit board where the gold finger is located, so that the external circuit and the circuit board where the gold finger is located can perform information transmission. The gold finger contact assembly 130 includes a plurality of strip-shaped metal sheets 131, and the strip-shaped metal sheets 131 are used for connecting with a circuit printed by a circuit board.

Further, in the present embodiment, as shown in fig. 6 and 7, the strip-shaped metal sheet bodies 131 are disposed in parallel to each other and the strip-shaped metal sheet bodies 131 are linearly arranged to facilitate alignment and connection with an external circuit, the strip-shaped metal sheets are disposed between the first substrate 110 and the second substrate 120, the first substrate 110 and the second substrate 120 are parallel to each other, the first substrate 110 and the second substrate 120 are fixedly connected by pressing each other, the second substrate 120 is disposed with a plurality of communicating grooves 121, each communicating groove 121 penetrates through the second substrate 120, the communicating grooves 121 are linearly arranged, distances between two adjacent communicating grooves 121 are equal, and a distance between center points of two adjacent communicating grooves 121 is equal to a distance between center points of two adjacent strip-shaped metal sheet bodies 131, so that the communicating grooves 121 can be disposed at opposite positions of the strip-shaped metal sheet bodies 131 one to one, thereby, the strip-shaped metal sheet 131 in each communication groove 121 can contact with the outside, that is, an external circuit can be connected with the strip-shaped metal sheet 131 by entering the communication groove 121.

Further, as shown in fig. 6 and 7, each strip-shaped metal sheet 131 of the gold finger contact sheet assembly 130 is connected to the outside through one communication groove 121, that is, each strip-shaped metal sheet 131 is located inside the communication groove 121 in a one-to-one correspondence manner, and two adjacent strip-shaped metal sheets 131 are separated by the second substrate 120. This golden finger interface mechanism 100 is when daily use, because a plurality of strip metal lamellar bodies 131 of golden finger contact piece subassembly 130 are located the inside of intercommunication groove 121 one by one, when golden finger interface mechanism 100 collides with external object, narrow intercommunication groove 121 notch can be with most external object separation in the notch department of intercommunication groove 121, most external object just can carry out direct collision with second base plate 120 promptly, and can't get into and contact with strip metal lamellar body 131 from the notch of intercommunication groove 121, consequently, can effectually reduce golden finger contact piece subassembly 130 and suffer the possibility that external object collided, and then effectual protection golden finger contact piece subassembly 130, extension golden finger interface mechanism 100's life.

Further, when the golden finger interface mechanism 100 is connected with an external circuit, the external circuit needs to be connected through the golden finger interface mechanism 100 paired with the application, and then connected with the golden finger contact piece assembly 130 to complete information transmission, the golden finger plug mechanism 200 includes an insertion portion 210 and a plug contact piece assembly 220, the insertion portion 210 includes a plug substrate 211 and a plurality of strip-shaped connection blocks 212, the strip-shaped connection blocks 212 are all connected with the plug substrate 211, the plug contact piece assembly 220 is used for being connected with the external circuit, the plug contact piece assembly 220 includes a plurality of strip-shaped conductive piece bodies 221, and the strip-shaped conductive piece bodies 221 are connected with the strip-shaped connection blocks 212 in a one-to-one correspondence manner. The connecting process of the golden finger interface mechanism 100 and the golden finger plug mechanism 200 is as follows, because the shape of each strip-shaped connecting block 212 is matched with the shape of the communicating groove 121, a plurality of strip-shaped connecting blocks 212 of the golden finger plug mechanism 200 can be inserted into the communicating grooves 121 in a one-to-one correspondence manner, so that the strip-shaped conductive sheet body 221 positioned on the strip-shaped connecting blocks 212 is in contact with the strip-shaped metal sheet body 131 in the communicating grooves 121, the golden finger can be connected with an external circuit, and then the information transmission is completed.

Further, since the shape of each of the strip-shaped connection blocks 212 matches the shape of the communication groove 121, therefore, after the golden finger plug is inserted into the golden finger interface, each communicating groove 121 can limit the corresponding strip-shaped connecting block 212, can effectively limit the degree of freedom of the strip-shaped connecting block 212, namely the bar-shaped connecting block 212 can only make the movement of sliding out of the communication groove 121 in the communication groove 121, therefore, when the gold finger interface shell and the gold finger jack shell are loosened, the strip-shaped connecting block 212 and the communicating groove 121 can be matched with each other to keep stable, the strip-shaped conductive sheet body 221 and the strip-shaped metal sheet body 131 are prevented from being separated from each other due to the looseness, and then the conditions of accidental disconnection and information loss of the strip-shaped conductive sheet body 221 and the strip-shaped metal sheet body 131 in the signal transmission process are prevented, and the insertion stability of the golden finger interface and the golden finger plug is effectively improved.

In one embodiment, as shown in fig. 7, the second substrate 120 is provided with a plurality of sliding slots 123, and the plurality of sliding slots 123 are in one-to-one correspondence with the plurality of communicating grooves 121; as shown in fig. 8 and 9, the gold finger plug mechanism 200 further includes a plurality of sliding connection portions 230, the sliding connection portions 230 are connected to the strip connection blocks 212 in a one-to-one correspondence, and each sliding connection portion 230 is located in the sliding groove 123 and is connected to the second substrate 120 in a sliding manner. In the embodiment, during connection, the strip-shaped connecting block 212 is inserted into the communicating groove 121, and the sliding connection part 230 of the strip-shaped connecting block 212 is connected to the sliding groove 123 of the communicating groove 121, and the mutual connection between the sliding connection part 230 and the sliding groove 123 can play a role in limiting the strip-shaped connecting block 212, the freedom of movement of the bar-shaped connection block 212 in the connection groove is restricted, so that when the interface housing and the plug housing are not tightly fitted, the sliding part 230 and the sliding groove 123 enable the bar-shaped connection block 212 to be stably inserted into the communication groove 121, and the bar-shaped connection block 212 is prevented from loosening in the communication groove 121 and further from being disconnected. The mutual connection of the sliding part 230 and the sliding groove 123 can also increase the total static friction force between the golden finger interface mechanism 100 and the golden finger plug mechanism 200, so that the golden finger plug mechanism 200 and the golden finger interface mechanism 100 are not easy to loosen after being inserted, and the connection reliability is further improved.

In one embodiment, as shown in fig. 8, each sliding slot 123 is equal to the corresponding sliding portion 230. After the strip-shaped connecting block 212 is inserted into the communicating groove 121, the sliding connection part 230 and the sliding groove 123 are in a sliding connection state, the strip-shaped connecting block 212 is stably inserted into the communicating groove 121 by the limiting action of the sliding connection part 230 and the sliding groove 123, in order to enhance the stability of the bar-shaped connection block 212 inserted in the communication groove 121, the bar-shaped connection block 212 is less likely to be loosened in the communication groove 121, in this embodiment, each sliding slot 123 is equal to the corresponding sliding connection portion 230, that is, the sliding portion 230 can be provided over the entire section of the bar-shaped connecting block 212, and similarly, the sliding groove 123 can be provided over the entire section of the communication groove 121, and thus, when the strip-shaped connection block 212 is inserted into the communication groove 121, the sliding portion 230 and the sliding groove 123 are connected to each other to limit the whole section of the strip-shaped connection block 212, and each point in the length direction of the strip-shaped connection block 212 is not easily loosened in the communication groove 121, so that the stability of inserting the strip-shaped connection block 212 into the communication groove 121 is enhanced. In addition, the structure can increase the contact area between the sliding part 230 and the sliding groove 123, and further increase the static friction force between the strip-shaped connecting block 212 and the communicating groove 121, so that the golden finger plug is less prone to being separated from the golden finger interface under the condition of non-manual operation, and further the connection stability of the golden finger plug and the golden finger interface is increased.

In one embodiment, as shown in fig. 6, a plurality of strip-shaped metal strips are connected to the edge of the first substrate 110, a plurality of communication grooves 121 are disposed at the edge of the second substrate 120, and the plurality of communication grooves 121 extend to the edge side wall of the second substrate 120. When the golden finger plug mechanism 200 is connected to the golden finger interface mechanism 100, the strip-shaped connecting block 212 of the golden finger plug mechanism 200 may be inserted into the communicating groove 121 from a direction perpendicular to the second substrate 120 to make the plug contact piece assembly 220 contact and connect with the golden finger contact piece assembly 130, or the strip-shaped connecting block 212 of the golden finger plug mechanism 200 may be inserted into the communicating groove 121 from a direction parallel to the second substrate 120 to make the plug contact piece assembly 220 contact and connect with the golden finger contact piece assembly 130. Considering that the gold finger plugging position in the market is generally arranged at the edge position of the circuit board at present, the circuit layout and design of the circuit board basically follow the principle, in order to adapt to the current industrial production manner and the usage habit of the consumer, the plurality of strip-shaped metal sheets 131 of the present embodiment are all connected to the edge of the first substrate 110, the plurality of communication grooves 121 are all disposed at the edge of the second substrate 120 and extend to the edge sidewall of the second substrate 120, when the plurality of strip-shaped metal sheets 131 of the gold finger contact pad assembly 130 are located at the edge of the first substrate 110, the strip-shaped connection block 212 of the gold finger plug mechanism 200 can be directly inserted into the communication groove 121 on the edge of the second substrate 120 in a direction parallel to the second substrate 120 at the edge of the second substrate 120, the convenience of the insertion operation of the golden finger interface mechanism 100 and the golden finger plug mechanism 200 is ensured. The gold finger contact pad assembly 130 is not limited to be located at the edge of the first substrate 110, but may be located at the center of the first substrate 110.

In one embodiment, as shown in fig. 6 and 7, the inner wall of the opening of each of the communication grooves 121 is provided with a first chamfer 122. In the process of inserting the strip-shaped connection block 212 of the golden finger plug mechanism 200 into the communication groove 121 of the golden finger interface mechanism 100, since the notch of the communication groove 121 is small, it is difficult to align the insertion end of the strip-shaped connection block 212 with the notch of the communication groove 121, which causes great inconvenience in inserting the strip-shaped connection block 212, and in addition, in the process of inserting, since the strip-shaped connection block 212 is difficult to align and insert into the communication groove 121, the insertion end of the strip-shaped connection block 212 is very likely to collide with the edge side wall of the second substrate 120, which may cause damage to the insertion end of the strip-shaped connection block 212 and the edge side wall of the second substrate 120 after long-term use. In order to solve the above problem, in the present embodiment, each communication groove 121 is formed with a first chamfer 122, the first chamfer 122 is disposed at the notch of the communication groove 121, since the first chamfer 122 is formed at the notch of the communication groove 121, the notch of the communication groove 121 is enlarged, and therefore, when the insertion end of the bar-shaped connection block 212 is not accurately aligned with the communication groove 121 during the insertion process, the first chamfer 122 at the notch of the communication groove 121 can guide the insertion end of the bar-shaped connection block 212 to be gradually moved to a correct insertion position, namely, the positioning difficulty of the strip-shaped connecting block 212 when being connected with the communicating groove 121 can be reduced, so that the insertion operation of the strip-shaped connecting block 212 and the communicating groove 121 is more convenient, meanwhile, the collision between the insertion end of the strip-shaped connecting block 212 and the edge sidewall of the second substrate 120 can be reduced, so that the damage to the golden finger interface mechanism 100 in the insertion process is reduced, and the service life of the golden finger interface mechanism 100 is prolonged.

In one embodiment, as shown in fig. 6 and 7, the golden finger interface mechanism 100 further includes a plurality of first magnetic blocks 150, the plurality of first magnetic blocks 150 are disposed on the plurality of communicating grooves 121 in a one-to-one correspondence manner, as shown in fig. 8 and 9, the golden finger plug mechanism 200 further includes a plurality of second magnetic blocks 240, the plurality of second magnetic blocks 240 are connected to the plurality of bar-shaped connecting blocks 212 in a one-to-one correspondence manner, and the plurality of first magnetic blocks 150 and the plurality of second magnetic blocks 240 are magnetically connected in a one-to-one correspondence manner. Due to frequent plugging in daily life, after long-term use, the connection between the shell of the golden finger interface and the shell of the golden finger plug is loosened, and then the connection is disconnected, so that the use is inconvenient. In order to increase the connection strength between the golden finger interface and the golden finger plug, so that the golden finger plug is not easily separated from the golden finger interface under the condition of non-manual operation, in the embodiment, in the communication groove 121 and the strip-shaped connection block 212 which are correspondingly connected, the first magnetic block 150 is arranged in the communication groove 121, the strip-shaped connection block 212 is connected with the second magnetic block 240, when the golden finger plug is connected with the golden finger interface, the strip-shaped connection block 212 drives the second magnetic block 240 to be inserted into the communication groove 121, when the strip-shaped conductive sheet body 221 on the strip-shaped connection block 212 is in contact connection with the strip-shaped metal sheet body 131 in the communication groove 121, the first magnetic block 150 is also in contact connection with the second magnetic block 240, the first magnetic block 150 and the second magnetic block 240 are mutually attracted by magnetic field force, because the first magnetic block 150 and the second magnetic block 240 are respectively connected with the groove wall of the communication groove 121 and the strip-shaped connection block 212, the strip-shaped connection block 212 and the communication groove 121 can maintain the contact connection state by magnetic field force, under the condition of non-manual operation, the strip-shaped connecting block 212 can be stably inserted into the communicating groove 121, so that the connecting strength of the golden finger interface and the golden finger plug is increased, and the effect of preventing the golden finger plug from loosening and separating from the golden finger interface is achieved.

In one embodiment, as shown in fig. 7, the gold finger interface mechanism 100 further includes a curing sheet 160, the curing sheet 160 is located between the first substrate 110 and the second substrate 120, the first substrate 110, the curing sheet 160, and the second substrate 120 are sequentially stacked, and the curing sheet 160 and the gold finger contact sheet assembly 130 are correspondingly notched. The first substrate 110 and the second substrate 120 are stacked and connected with each other, in order to enable the first substrate 110 and the second substrate 120 to be tightly and fixedly attached, a curing sheet 160 is arranged between the first substrate 110 and the second substrate 120, the curing sheet 160 is a semi-cured PP sheet before processing, the first substrate 110, the semi-cured PP sheet and the second substrate 120 are sequentially stacked and pressed, the semi-cured PP sheet is changed into the curing sheet 160 in a full-cured state in the pressing process, and two sides of the curing sheet 160 are respectively and tightly bonded with the first substrate 110 and the second substrate 120, so that the three form a stable whole, namely, the effect of tightly and fixedly attaching the first substrate 110 and the second substrate 120 is achieved. The curing sheet 160 is provided with a notch, and the notch is opposite to the golden finger contact piece assembly 130, so that the curing sheet 160 does not shield the golden finger contact piece assembly 130.

In one embodiment, as shown in fig. 8 and 9, the end of each strip-shaped connecting block 212 inserted into the communication groove 121 is provided with a second chamfer 212 a. In the process of inserting the strip-shaped connection block 212 of the golden finger plug mechanism 200 into the communication groove 121 of the golden finger interface mechanism 100, since the notch of the communication groove 121 is small, it is difficult to align the insertion end of the strip-shaped connection block 212 with the notch of the communication groove 121, which causes great inconvenience in inserting the strip-shaped connection block 212, and in addition, in the process of inserting, since the strip-shaped connection block 212 is difficult to align and insert into the communication groove 121, the insertion end of the strip-shaped connection block 212 is very likely to collide with the edge side wall of the second substrate 120, which may cause damage to the insertion end of the strip-shaped connection block 212 and the edge side wall of the second substrate 120 after long-term use. In order to solve the above problem, the insertion end of each of the strip-shaped connection blocks 212 is provided with a second chamfer 212a, since the insertion end of the bar-shaped connection block 212 is provided with the second chamfer 212a so that the cross-sectional area of the insertion end of the bar-shaped connection block 212 is reduced, therefore, when the insertion end of the bar-shaped connection block 212 is not accurately aligned with the communication groove 121 during the insertion process, the second chamfer 212a at the insertion end of the bar-shaped connection block 212 can guide the insertion end of the bar-shaped connection block 212 to gradually move to a correct insertion position, namely, the positioning difficulty of the strip-shaped connecting block 212 when being connected with the communicating groove 121 can be reduced, so that the insertion operation of the strip-shaped connecting block 212 and the communicating groove 121 is more convenient, meanwhile, the collision between the insertion end of the strip-shaped connecting block 212 and the edge sidewall of the second substrate 120 can be reduced, so that the effects of reducing the damage to the golden finger interface mechanism 100 in the insertion process and prolonging the service life of the golden finger interface mechanism 100 are achieved.

In one embodiment, as shown in fig. 8, the cross-sectional area of each of the bar-shaped connection blocks 212 is gradually increased in a direction of being inserted into the corresponding communication groove 121, and as shown in fig. 9, each of the communication grooves 121 is shaped to fit the corresponding bar-shaped connection block 212. In order to facilitate the positioning of the golden finger plug and the golden finger interface connection and reduce the collision between the insertion end of each strip-shaped connection block 212 and the edge side wall of the second substrate 120, in this embodiment, the cross-sectional area from the insertion end to the tail end of each strip-shaped connection block 212 is gradually increased, and the cross-sectional area from the connection end of each communication groove 121 is gradually reduced The effect of increasing the service life of the gold finger interface mechanism 100.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that various changes and modifications can be made by those skilled in the art without departing from the spirit of the invention, and these changes and modifications are all within the scope of the invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. The golden finger circuit board processing method is characterized in that a circuit board manufactured by the golden finger circuit board processing method comprises a circuit board golden finger connecting structure, the circuit board golden finger connecting structure comprises a golden finger interface mechanism and a golden finger plug mechanism, the golden finger interface mechanism comprises a first substrate, a golden finger contact piece assembly and a second substrate, the first substrate, the golden finger contact piece assembly and the second substrate are sequentially stacked, the golden finger contact piece assembly comprises a plurality of strip-shaped metal pieces, the second substrate is provided with a plurality of communicating grooves, each communicating groove penetrates through the second substrate, and the plurality of communicating grooves are provided with a plurality of strip-shaped metal pieces in a one-to-one correspondence manner so that the plurality of strip-shaped metal pieces are exposed in the plurality of communicating grooves in a one-to-one correspondence manner; the golden finger plug mechanism comprises an inserting part and a plug contact piece assembly, the inserting part comprises a plug substrate and a plurality of strip-shaped connecting blocks, the strip-shaped connecting blocks are all connected with the plug substrate, the plug contact piece assembly comprises a plurality of strip-shaped conductive piece bodies, the strip-shaped conductive piece bodies are connected with the strip-shaped connecting blocks in a one-to-one correspondence manner, the strip-shaped connecting blocks are inserted into the communicating grooves in a one-to-one correspondence manner, and the strip-shaped conductive piece bodies are abutted to the strip-shaped metal piece bodies in a one-to-one correspondence manner; the second substrate is provided with a plurality of sliding grooves, the sliding grooves are communicated with the communicating grooves in a one-to-one correspondence manner, the golden finger plug mechanism further comprises a plurality of sliding connection parts, the sliding connection parts are connected with the strip-shaped connecting blocks in a one-to-one correspondence manner, and each sliding connection part is positioned in the sliding groove and is in sliding connection with the second substrate;

the processing method of the golden finger circuit board comprises the following steps:

sequentially carrying out depth-controlled milling processing on a second substrate of the semi-finished product of the golden finger structure according to the positions of a plurality of strip-shaped metal sheet bodies of the golden finger so as to form a plurality of communicating grooves which penetrate through the second substrate on the second substrate, wherein the plurality of strip-shaped metal sheet bodies in the golden finger are exposed in the plurality of communicating grooves in a one-to-one correspondence manner;

2. The gold finger circuit board processing method according to claim 1, wherein before the step of sequentially stacking the first substrate, the cured sheet, and the second substrate, the gold finger circuit board processing method further comprises the steps of:

3. The processing method of the gold finger circuit board according to claim 2, wherein the area of each high temperature resistant protective tape is larger than the area of the strip-shaped metal sheet body.

4. The method for processing the gold finger circuit board according to claim 1, wherein the step of sequentially performing depth control milling processing on the second substrate of the gold finger structure semi-finished product according to the positions of the plurality of strip-shaped metal sheets of the gold finger comprises:

5. The method for processing a gold finger circuit board according to claim 4, wherein a horizontal feed speed of a milling cutter for performing a first milling operation according to the position of each strip-shaped metal sheet body of the gold finger on the second substrate is 2cm/s to 4cm/s, and a horizontal feed speed of a milling cutter for performing a second milling operation according to the position of the corresponding strip-shaped metal sheet body of the gold finger on the second substrate is 1cm/s to 2 cm/s.

6. The method for processing the golden finger circuit board according to claim 4, wherein each sliding groove is equal to the corresponding sliding connection part, so that the sliding connection part can be arranged on the whole section of the strip-shaped connecting block, and the sliding groove can also be arranged on the whole section of the communication groove.

7. The method for processing a gold finger circuit board according to claim 4, wherein the vertical feed amount of the milling cutter per time during the first milling operation on the second substrate according to the position of each strip-shaped metal sheet body of the gold finger is 0.5mm to 1 mm.

8. The method for processing the gold finger circuit board according to claim 1, wherein after the step of sequentially performing depth control milling processing on the second substrate according to the positions of the plurality of strip-shaped metal sheets of the gold finger, the method further comprises the following steps:

9. The processing method of the gold finger circuit board according to claim 1, wherein after the step of sequentially performing depth control milling processing on the second substrate of the semi-finished gold finger structure according to the positions of the plurality of strip-shaped metal sheets of the gold finger, the processing method further comprises the following steps:

and cleaning the milled semi-finished product of the golden finger structure.

10. A golden finger circuit board, characterized in that the golden finger circuit board is processed by the method for processing a golden finger circuit board according to any one of claims 1 to 9.