CN113543484B

CN113543484B - Circuit board and manufacturing method thereof

Info

Publication number: CN113543484B
Application number: CN202110727966.5A
Authority: CN
Inventors: 焦其正; 王小平; 王洪府; 纪成光
Original assignee: Shengyi Electronics Co Ltd
Current assignee: Shengyi Electronics Co Ltd
Priority date: 2021-06-29
Filing date: 2021-06-29
Publication date: 2022-12-30
Anticipated expiration: 2041-06-29
Also published as: CN113543484A; WO2023273202A1

Abstract

The invention discloses a circuit board and a manufacturing method thereof, wherein the manufacturing method of the circuit board comprises the following steps: sticking the bonding piece to the daughter board; the bonding part comprises a slotting reserved area and a first connecting area surrounding the slotting reserved area, the slotting reserved area comprises a pattern reserved area without viscosity, and the orthographic projection of the pattern reserved area towards the daughter board completely covers the target line pattern of the daughter board; stacking the sub-boards on the sub-boards by adopting a laminating process to form a circuit board; milling a groove on the circuit board by adopting a depth-controlled plate milling process until the groove reserved area of the bonding piece is completely exposed; and removing the part of the adhesive piece positioned in the slotting reserved area. The circuit board is manufactured by the manufacturing method of the circuit board in any embodiment, so that the circuit board is high in efficiency in the manufacturing process, is suitable for large-scale production, and can avoid the phenomenon that the target circuit pattern of the daughter board is polluted by adhesive falling and residual caused by multiple times of pressing.

Description

Circuit board and manufacturing method thereof

Technical Field

The invention relates to the technical field of circuit boards, in particular to a circuit board and a manufacturing method thereof.

Background

With the upgrading of market demands, the Printed Circuit Board (PCB) is developed toward the design direction of thinning, densification, three-dimensional structure and the like on the premise of satisfying the good electrical and thermal properties of electronic products. The PCB with the stepped groove becomes an important development direction, and has wide applications in three-dimensional assembly, reduction of the assembly volume of electrical equipment, special electrical performance and the like.

The conventional PCB with the stepped groove is generally manufactured by an isolation film protection method, however, when the PCB is manufactured by the isolation film protection method, the problem of difficulty in opening the cover often occurs, and the preparation efficiency is influenced.

Disclosure of Invention

Based on this, the problem that the traditional PCB with the stepped groove is difficult to open the cover and affects the preparation efficiency is solved.

The specific technical scheme is as follows:

in one aspect, the present application relates to a method for manufacturing a circuit board, comprising the steps of:

attaching the bonding piece to the daughter board; the bonding part comprises a slotting reserved area and a first connecting area surrounding the slotting reserved area, the slotting reserved area comprises a pattern reserved area without viscosity, and the orthographic projection of the pattern reserved area towards the daughter board completely covers the target circuit pattern of the daughter board;

stacking the sub-boards on the sub-boards by adopting a laminating process to form a circuit board;

milling a groove on the circuit board by adopting a depth-controlled plate milling process until the groove reserved area of the bonding part is completely exposed;

and removing the part of the adhesive piece positioned in the slotting reserved area.

When the manufacturing method of the circuit board is used, the bonding piece is attached to the daughter board, the pattern reserved area without viscosity completely covers the target circuit pattern of the daughter board, and the first connecting area is located on the periphery of the target circuit pattern of the daughter board; and then, adopting a laminating process to stack the daughter board to form a circuit board, adopting a depth-controlled board milling process to mill the groove on the circuit board until the groove reserved area of the bonding piece is completely exposed, removing the part of the bonding piece, which is positioned in the groove reserved area, so as to form the circuit board with a stepped groove, wherein the target circuit pattern of the daughter board is just positioned at the groove bottom of the stepped groove. Because the figure reservation district does not have viscidity, can be lighter when getting rid of the part of bonding member in fluting reservation district, so can promote the preparation efficiency to the circuit board, and then be convenient for circuit board large-scale production. Meanwhile, the phenomenon that the target circuit pattern of the daughter board is polluted by the residual adhesive falling caused by multiple times of pressing can be avoided.

The following further describes the technical scheme

In one embodiment, before the step of attaching the adhesive member to the sub-board, the method further includes:

and removing the viscosity of the bonding surface of the bonding piece in the reserved area of the graph.

In one embodiment, the removing the stickiness of the sticky surface of the sticky member in the reserved area of the figure specifically comprises:

attaching the adhesive member and the protective film to each other;

removing the part of the protective film corresponding to the reserved graph area to expose the adhesive of the adhesive piece, wherein the adhesive surface of the adhesive piece is positioned in the reserved graph area;

removing the adhesive of the bonding surface of the bonding piece positioned in the reserved pattern area;

and removing the rest part of the protective film.

In one embodiment, the removing the adhesive of the adhesive surface of the adhesive member in the reserved area of the pattern specifically includes:

and dissolving the binder of the binder, wherein the binder is positioned in the pattern reserved area on the binding surface of the binder by acid washing.

In one embodiment, the step of removing the portion of the protective film corresponding to the reserved pattern area specifically includes:

cutting the protective film corresponding to the pattern reserved area by adopting a laser ablation process;

and tearing off the part of the protective film corresponding to the pattern reserved area.

In one embodiment, the slotted reservation further comprises a second connection zone surrounding the pattern reservation;

the adhesive on the adhesive surface of the adhesive member completely covers the first and second attachment areas.

the adhesive part on the adhesive surface of the adhesive member covers the first connection area and the second connection area.

In one embodiment, the adhesive piece further comprises a partition area, and the partition area is divided into a first partition area and a second partition area which are connected with each other by the boundary of the slotting reserved area;

the first connection region comprises the first partition region and a first bond region surrounding the first partition region; the second connection region comprises a second bond region surrounding the graphic reservation region and the second partition region surrounding the second bond region;

before the step of attaching the adhesive member to the daughter board, the method further comprises:

and removing the viscosity of the adhesive surface of the adhesive member in the partition area.

In one embodiment, the adhesive member is a polyimide tape.

On the other hand, the application also relates to a circuit board which is manufactured by the manufacturing method of the circuit board in any embodiment.

The circuit board is manufactured by the manufacturing method of the circuit board in any embodiment, so that the circuit board is high in efficiency in the manufacturing process, is suitable for large-scale production, and can avoid the phenomenon that the target circuit pattern of the daughter board is polluted by adhesive falling and residual caused by multiple times of pressing.

Drawings

The accompanying drawings, which are included to provide a further understanding of the invention, are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the invention without limiting the invention.

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained based on these drawings without inventive labor.

Furthermore, the drawings are not to scale of 1.

Fig. 1 is a schematic flow chart illustrating a method for manufacturing a circuit board according to an embodiment;

FIG. 2 is a schematic view of an embodiment of an adhesive member attached to a daughter board;

FIG. 3 is a schematic diagram of stacking daughter boards to form a circuit board in one embodiment;

FIG. 4 is a schematic diagram of a circuit board according to an embodiment;

FIG. 5 is a schematic diagram illustrating an embodiment of milling a groove in the circuit board by a depth-controlled milling process to completely expose the groove reserved area of the adhesive member;

FIG. 6 is a schematic diagram of the circuit board after removing a portion of the adhesive located in the reserved area of the slot in one embodiment;

FIG. 7 is a schematic view of an embodiment of an adhesive member;

FIG. 8 is a schematic view illustrating a structure of an adhesive member attached to a protective film according to an embodiment;

FIG. 9 is a schematic view of an adhesive member and a protective film after removing the protective film in the exclusion area and the pattern reserved area according to an embodiment;

FIG. 10 is a schematic view of an adhesive member and a protective film after removing the adhesive in the partition and the reserved pattern area in one embodiment;

FIG. 11 is a schematic diagram of the adhesive member after the protective film is removed according to an embodiment.

Description of reference numerals:

10. a circuit board; 100. a bonding member; 110. a pattern reserved area; 120. a first connection region; 130. a second attachment zone; 140. a partition region; 142. a first partition area; 144. a second partition region; 150. a first bonding region; 160. a second bonding region; 170. slotting a reserved area; 200. a protective film; 300. a daughter board; 310. a target line pattern of the daughter board; 400. a stepped groove.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, as those skilled in the art will recognize without departing from the spirit and scope of the present invention.

In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless explicitly specified otherwise.

The manufacturing process of the step plate with the depth controlled to the designated layer mainly comprises a controlled depth milling method, a laser ablation method, a filling/embedding pad method and an isolation film protection method, wherein the isolation film protection method has the strongest universality, but the characteristic selection of the isolation film is more critical, particularly the selection of an adhesive at the bottom of the isolation film. When the viscosity of the binder at the bottom of the isolating membrane is weak, the bottom wall graph of the stepped groove has poor sealing performance, and further the problems of gummosis, liquid medicine pollution, residual gas bubbling and the like are caused. If the viscosity of the bottom adhesive of the isolating membrane is too strong, although the bottom wall graph of the stepped groove is good in sealing performance, the cover opening is difficult, manual cover opening is needed, and the manufacturing efficiency is low.

Therefore, it is necessary to provide a circuit board 10 and a manufacturing method thereof, the manufacturing method of the circuit board 10 is suitable for manufacturing a step board, and the manufacturing method of the circuit board 10 can easily open a cover in the process of manufacturing the circuit board 10, so as to improve the manufacturing efficiency of the circuit board 10.

Referring to fig. 1, a method for manufacturing a circuit board 10 in an embodiment includes the following steps:

s100: referring to fig. 2 and 7, the adhesive member 100 is attached to the sub-board 300; the adhesive member 100 includes a slot reservation region 170 and a first connection region 120 surrounding the slot reservation region 170, the slot reservation region 170 includes a non-adhesive pattern reservation region 110, and an orthographic projection of the pattern reservation region 110 toward the daughter board 300 completely covers a target circuit pattern 310 of the daughter board.

Specifically, referring to fig. 2, in the pasting process, the adhesive member 100 and the daughter board 300 may be pressed to be completely adhered together, and the pattern reserved area 110 covers the target circuit pattern 310 of the daughter board. As a preferred embodiment, the projected area of the pattern reserve 110 toward the daughter board 300 may be greater than or equal to the area of the target wiring pattern 310 of the daughter board. In this way, it is ensured that the adhesive member 100 is prevented from pulling the target circuit pattern 310 of the daughter board and causing difficulty in opening the cover when the adhesive member 100 is subsequently removed.

S200: referring to fig. 3 and 4, the circuit board 10 is formed by stacking the sub-board 300 using a lamination process.

The lamination process is a conventional process of the circuit board 10 in the prior art, and a detailed description thereof is omitted here.

S300: referring to fig. 4 and 5, a depth-controlled board milling process is used to mill a groove on the circuit board 10 until the groove reservation area 170 of the adhesive member 100 is completely exposed.

Specifically, referring to fig. 4, in the process of depth-controlled milling of the board, a slot body matched with the slot reserved area 170 may be milled on the circuit board 10 by using the boundary of the slot reserved area 170 as a reference, so that the slot reserved area 170 of the adhesive member 100 may be completely exposed. Referring to fig. 4 and 5, based on the boundary dimension (see dimension M in fig. 7) of the slot reservation region 170, a depth-controlled board milling process is used to mill the slot on the circuit board 10 until the slot reservation region 170 of the adhesive member 100 is completely exposed.

S400: the adhesive 100 is removed from the portion of the slot reservation 170.

Referring to fig. 6, the circuit board 10 with the step groove 400 can be formed by removing the portion of the adhesive 100 located in the groove reserved area 170, and the target circuit pattern 310 of the daughter board is located at the bottom of the step groove 400, so as to be adapted to the target circuit pattern 310 of the daughter board in the following parts.

When the manufacturing method of the circuit board 10 is used, the adhesive member 100 is attached to the daughter board 300, the pattern reserved area 110 completely covers the target circuit pattern 310 of the daughter board, and the first connection area 120 covers the periphery of the target circuit pattern 310 of the daughter board; then, a lamination process is adopted to stack the circuit boards on the daughter boards 300 to form a circuit board 10, a depth-controlled board milling process is adopted to mill grooves on the circuit board 10 until the groove reserved area 170 of the adhesive part 100 is completely exposed, the part, located in the groove reserved area 170, of the adhesive part 100 is removed, and then the circuit board 10 with the stepped groove 400 is formed, and the target circuit pattern 310 of the daughter boards is just located at the bottom of the stepped groove 400; since the pattern reserved area 110 has no viscosity, it is easier to remove the part of the adhesive member 100 in the slot reserved area 170, so as to improve the manufacturing efficiency of the circuit board, thereby facilitating the mass production of the circuit board 10. Meanwhile, the phenomenon that the target circuit pattern 310 of the daughter board is polluted by the residual adhesive falling caused by multiple times of pressing can be avoided.

It should be noted that the adhesive member 100 may be an existing tape product, which itself has the first attachment region 120 and the pattern reservation region 110.

In other embodiments, the adhesive member 100 may also be prepared during the manufacturing process of the circuit board 10; specifically, the preparation may be performed before the S100 step.

In one embodiment, the adhesive member 100 is prepared by:

t100: the tackiness of the adhesive surface of the adhesive member 100 at the pattern reserved area 110 is removed.

In some embodiments, step T100 specifically includes:

t110: referring to fig. 8, the adhesive member 100 and the protective film 200 are attached to each other.

Specifically, referring to fig. 8, the bonding surface of the bonding member 100 and the protective film 200 are attached together, and then the bonding member 100 and the protective film 200 are pressed together to be bonded together, and the peripheral outer edge of the whole formed by the bonding member 100 and the protective film 200 is fused and sealed by heating. It should be noted that, in fig. 8, in order to show the protective film 200 and the adhesive member 100, the protective film 200 is reduced to expose the adhesive member 100, and in the actual manufacturing process, the protective film 200 may completely cover the adhesive member 100.

Alternatively, the protective film 200 may be made of a separator material. The adhesive member 100 may be a polyimide tape (PI tape). In other embodiments, the adhesive member 100 may be an adhesive tape made of other materials, and it is only necessary to have adhesiveness, which is not described herein again.

T120: referring to fig. 9, a portion of the protection film 200 corresponding to the reserved pattern area 110 is removed to expose the adhesive of the adhesive member 100 on the reserved pattern area 110.

In some embodiments, the T120 step specifically includes:

cutting the protective film 200 corresponding to the pattern reserved area 110 by adopting a laser ablation process;

the portion of the protection film 200 corresponding to the reserved pattern area 110 is removed.

Specifically, referring to fig. 9, after the protective film 200 corresponding to the reserved pattern area 110 is cut by laser ablation, the corresponding protective film 200 is removed, so that the adhesive of the adhesive member 100 in the reserved pattern area 110 can be exposed.

T130: referring to fig. 10, the adhesive on the bonding surface of the adhesive member 100 in the reserved pattern area 110 is removed.

In one embodiment, the adhesive on the adhesive surface of the adhesive member 100 in the pattern reserved area 110 can be dissolved by acid washing.

Specifically, referring to fig. 10, the bonding member 100 processed in step T120 may be soaked in an acidic solution with a certain concentration, and the bonding agent in the reserved pattern area 110 may be removed by dissolving with an acid washing solution.

T140: referring to fig. 11, the remaining portion of the protection film 200 is removed.

Specifically, similar to the T120 step, the remaining portion of the protective film 200 may be cut through a process of laser ablation, and the remaining portion of the protective film 200 may be torn off.

In one embodiment, the slotted reservation 170 further includes a second attachment zone 130 surrounding the graphic reservation 110, and the adhesive on the adhesive side of the adhesive 100 completely covers the first attachment zone 120 and the second attachment zone 130. Thus, the first connection region 120 and the second connection region 130 are both provided with adhesives, and the first connection region 120 and the second connection region 130 are both adhered to the periphery of the target circuit pattern 310 of the sub board through the adhesives, so that the sealability to the target circuit pattern 310 of the sub board can be ensured.

In other embodiments, the slotted reservation 170 further includes a second attachment zone 130 surrounding the graphic reservation 110, and the adhesive portion on the adhesive side of the adhesive 100 covers the first attachment zone 120 and the second attachment zone 130. As such, the first connection region 120 or the second connection region 130 does not completely cover the adhesive, and thus, it may be more convenient when removing a portion of the adhesive 100 located at the slot reservation region 170.

Specifically, referring to fig. 11, in one embodiment, the adhesive member 100 further includes a partition area 140, and the partition area 140 is divided into a first partition area 142 and a second partition area 144 connected to each other by a boundary of the slot reservation area 170. At this time, the first connection region 120 includes the first partition region 142 and the first bonding region 150 surrounding the first partition region 142. The second connection region 130 includes a second bond region 160 surrounding the graphic reservation region 110 and a second partition region 144 surrounding the second bond region 160. Wherein the first and

second bonding regions

150 and 160 have tackiness and the first and

second partition regions

142 and 144 have no tackiness. The first bonding area 150 and the second bonding area 160 are bonded to the sub-board 300, so that the pattern reserved area 110 is stably covered on the target circuit pattern 310 of the sub-board, thereby ensuring the sealability of the target circuit pattern 310 area of the sub-board. In addition, when the grooving is performed with the boundary size of the grooving allowance area 170, the boundary between the first partition area 142 and the second partition area 144 may be milled right up to, and since the boundary has no viscosity, it may be easier to remove the portion of the adhesive member 100 located in the grooving allowance area 170.

In order to make the first partition area 142 and the second partition area 144 non-adhesive, before the step of attaching the adhesive member 100 to the sub-board 300, the method further comprises:

the adhesive in the bonded surface of the adhesive 100 at the exclusion area 140 is removed.

Specifically, the adhesive of the partition regions 140 may be removed in a manner of removing the adhesive of the pattern reservation regions 110 in the steps of T110 to T140, which will not be described in detail herein.

It should be noted that, the distance between the partition area 140 and the pattern reserved area 110 may be set as required, and the arrangement of the pattern reserved area 110 in the area surrounded by the partition area 140 may improve the sealing performance of the target line pattern 310 of the daughter board. The number of the partition areas 140 can be designed as required, and a plurality of partition areas 140 can be manufactured on the premise of ensuring the sealing performance of the target circuit pattern 310 of the daughter board, so that the preparation efficiency can be improved.

In addition, an embodiment further relates to a circuit board 10, and the circuit board 10 is manufactured by the manufacturing method of the circuit board 10 in any embodiment.

The circuit board 10 is manufactured by the manufacturing method of the circuit board 10 in any of the embodiments, so that the efficiency of the circuit board 10 in the manufacturing process is high, the circuit board is suitable for large-scale production, and meanwhile, the phenomenon that the target circuit pattern 310 of the daughter board is polluted by adhesive falling and residue caused by multiple times of pressing can be avoided.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.

The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above examples only show several embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the invention. It should be noted that various changes and modifications can be made by those skilled in the art without departing from the spirit of the invention, and these changes and modifications are all within the scope of the invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. A method for manufacturing a circuit board is characterized by comprising the following steps:

bonding the adhesive member and the protective film to each other; the adhesive piece comprises a groove reserved area and a first connecting area surrounding the groove reserved area, the groove reserved area comprises a pattern reserved area without viscosity, the orthographic projection of the pattern reserved area towards the daughter board completely covers the target circuit pattern of the daughter board, and the part, corresponding to the pattern reserved area, of the protective film is removed, so that the adhesive of the adhesive piece, of which the adhesive surface is located in the pattern reserved area, is exposed;

removing the rest part of the protective film;

attaching the bonding piece to the daughter board;

milling a groove on the circuit board by adopting a depth-controlled plate milling process until the groove reserved area of the bonding piece is completely exposed;

2. The method for manufacturing a circuit board according to claim 1, wherein the removing the adhesive on the bonding surface of the adhesive member in the reserved pattern area specifically comprises:

3. The method for manufacturing a circuit board according to claim 1, wherein the step of removing the portion of the protective film corresponding to the reserved pattern area specifically comprises:

4. The method of manufacturing a circuit board according to any one of claims 1 to 3, wherein the slot reservation zone further comprises a second connection zone surrounding the pattern reservation zone;

5. The method for manufacturing a circuit board according to any one of claims 1 to 3, wherein the slot reservation section further includes a second connection section surrounding the pattern reservation section;

the adhesive part on the adhesive surface of the adhesive member covers the first and second attachment areas.

6. The method for manufacturing a circuit board according to claim 5, wherein the adhesive member further comprises a partition region, and the partition region is divided into a first partition region and a second partition region connected to each other by a boundary of the slot reservation region;

7. The method of manufacturing a circuit board according to claim 1, wherein the adhesive member is a polyimide tape.

8. The method of manufacturing a circuit board according to claim 1, wherein the protective film is made of a separator material.

9. A circuit board manufactured by the method for manufacturing a circuit board according to any one of claims 1 to 8.