CN114025513A - Novel PCB and preparation method thereof - Google Patents

Novel PCB and preparation method thereof Download PDF

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Publication number
CN114025513A
CN114025513A CN202210003663.3A CN202210003663A CN114025513A CN 114025513 A CN114025513 A CN 114025513A CN 202210003663 A CN202210003663 A CN 202210003663A CN 114025513 A CN114025513 A CN 114025513A
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CN
China
Prior art keywords
copper
pcb
dry film
board
golden finger
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Granted
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CN202210003663.3A
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Chinese (zh)
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CN114025513B (en
Inventor
陈文龙
牛润泽
马志丰
潘伟仁
王震
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Kunshan Longyu Intelligent Technology Co ltd
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Kunshan Longyu Intelligent Technology Co ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

The invention discloses a novel PCB and a preparation method thereof, the novel PCB comprises a PCB, the PCB comprises two groups of inner core boards, the outer sides of the two groups of inner core boards are both fixed with a first base copper foil, the inner sides of the two groups of inner core boards are both fixed with a second base copper foil, prepregs are both fixed between the two groups of inner core boards and one side of the first base copper foil, one side of the prepreg is fixed with thickened copper, the surface of the PCB is provided with a hole, one side of the PCB is fixed with a golden finger, the golden finger processing comprises a golden finger processing system, the golden finger processing system comprises a detection module and a control module, the detection module comprises a distance sensor and a thickness detection submodule, the control module comprises a recording submodule and an adjusting submodule, the distance sensor is used for detecting the distance between the processing center and the PCB, and the PCB processing device has the characteristics of strong practicability and improvement on the plane flatness of the PCB.

Description

Novel PCB and preparation method thereof
Technical Field
The invention relates to the technical field of PCB (printed circuit board), in particular to a novel PCB and a preparation method thereof.
Background
Almost every kind of electronic equipment, little electronic watch, calculator, computer, communication electronic equipment all can use the PCB board, and current PCB board has the problem of unified production warpage, and current golden finger highly has the difference condition to can influence the stable and PCR's of test life, consequently, it is very necessary to design a novel PCB board that the practicality is strong and improve PCB board plane roughness and preparation method.
Disclosure of Invention
The present invention is directed to a novel PCB and a method for manufacturing the same, so as to solve the problems of the related art.
In order to solve the technical problems, the invention provides the following technical scheme: the novel PCB comprises a PCB, wherein the PCB comprises two groups of inner-layer core plates, a first base copper foil is fixed on the outer sides of the inner-layer core plates, a second base copper foil is fixed on the inner sides of the inner-layer core plates, a prepreg is fixed between the inner-layer core plates and one side of the first base copper foil, thickened copper is fixed on one side of the prepreg, holes are formed in the surface of the PCB, and golden fingers are fixed on one side of the PCB.
According to the technical scheme, the PCB manufacturing process comprises an inner layer manufacturing process, an outer layer manufacturing process and an appearance forming process, wherein the inner layer manufacturing process comprises the following steps:
s1, cutting the board: cutting the inner core plate 4 into corresponding sizes;
s2, inner layer dry film: covering the surface of the inner core plate with the first base copper foil, polishing the dry film to be flat, pressing the dry film on the surface of the first base copper foil, exposing, covering a negative film on one side of a pressed film, and dividing the negative film into a light-transmitting area and a light-blocking area;
s3, etching copper;
s4, AOI inspection;
s5, stacking plates;
s6, pressing: melting the epoxy resin at a high temperature for two hours, and bonding at a high pressure; cooling in a cold pressing mode for forty minutes, and finely grinding plate edges by using an edge grinding machine;
s7, drilling: and drilling the pressed PCB by using a machining center.
According to the above technical solution, the S3 includes the following specific operation steps:
s31, washing the unpolymerized dry film with weak alkali to expose the dry film which is not polymerized to the copper surface, increasing the thickness of the copper surface and the hole copper by electroplating, and plating tin as an etching resist;
s32, removing the polymerized dry film;
and S33, etching the copper surface by using an alkaline etching solution in a heating spraying mode, and chemically removing tin by using a tin removing liquid medicine to expose the copper surface with the required pattern.
According to the above technical solution, the S5 includes the following specific operation steps:
s51, carrying out copper surface treatment in a chemical mode to generate copper oxide fluff, and carrying out epoxy resin melting at a high temperature for two hours to form a prepreg;
and S52, placing prepregs on the inner side and the outer side of the inner core plate, and then placing thickened copper on the outer side of the prepregs.
According to the technical scheme, the outer layer manufacturing comprises the following process steps:
a1, copper deposition: polishing the PCB with drilled holes, polishing burrs, removing glue residues generated by drilling holes by potassium permanganate, metalizing the hole walls in a chemical copper deposition mode, wherein the thickness is 3-5 microns, and continuously depositing copper on the surface of thickened copper;
a2, full-plate electroplating: increasing the thickness of the hole copper in an electrolytic copper plating way;
a3, outer dry film: cleaning with low-concentration sulfuric acid, cleaning the surface of the board in a scrubbing mode, coating a dry film on the surface of the thickened copper, pressing the film, coating a negative film on the dry film again, dividing the negative film into a light blocking area and a light transmitting area, putting a developing solution into the negative film, performing photopolymerization, and performing anti-plating under the action of the dry film left after development;
a4, electrochemical copper tin;
a5, etching copper; removing the dry film to expose the copper layer, namely removing the dry film, further etching, keeping the copper under tin protected by tin, etching the copper, and finally removing the tin;
and A6, checking.
According to the technical scheme, the A4 comprises the following specific operation steps:
a41, patterning the copper except the dry film, wherein the copper deposition thickening and the patterning copper are both for the purpose of in-hole metallization;
a42, and then patterning tin on the surface of the patterned copper.
According to the technical scheme, the appearance forming process comprises the following steps:
b1, processing a golden finger;
b2, solder resist;
b3, printed characters: printing out characters on the PCB surface in a screen printing mode;
b4, tin spraying: the surface of the circuit is treated, so that the welding pad is protected from being oxidized, the welding performance of the welding pad is improved, and the connection wear resistance is met;
b5, molding: the numerical control machine tool processes the appearance of the printed board according to the given coordinate movement;
b6, electrical measurement: testing the open circuit and the short circuit of the circuit board to check whether the network state of the finished board meets the design requirements of the original printed circuit board;
b7, appearance inspection: inspecting the appearance of the product;
b8, check before shipment: detecting the solderability of the PCB, the peeling strength of the printing ink, the copper thickness and the impedance requirements;
b9, packaging and shipping: and packaging the PCB by using a vacuum packaging machine.
According to the technical scheme, the golden finger processing in B1 comprises a golden finger processing system, the golden finger processing system comprises a detection module and a control module, the detection module comprises a distance sensor and a thickness detection submodule, and the control module comprises a recording submodule and an adjusting submodule;
the distance sensor is used for detecting the distance between the machining center and the PCB, and the thickness detection submodule is used for detecting the thickness of the PCB.
According to the technical scheme, the detection module and the control module comprise the following specific operation steps:
b11, placing the PCB with the etched copper on a machining center, and mounting the PCB on a mounting seat of the machining center;
b12, when in processing, because the distance sensor is arranged on the main shaft of the clamping tool, when in processing, the distance between the main shaft and the golden finger processed on the PCB is detected in real time, the recorded numerical value is transmitted to the recording submodule, and the flatness of the surface of the processed PCB is analyzed;
b13, the thickness detection submodule is positioned on one side of the mounting seat, detects the thickness change of the processed golden finger in real time and transmits a signal to the recording submodule;
b14, when the flatness of the PCB surface of the processing golden finger is not consistent, transmitting a signal to the adjusting submodule so as to control the distance of the main shaft.
According to the technical scheme, the B2 comprises the following specific operation steps:
b21, cleaning the board surface in a grinding mode, removing oxidation, roughening the board surface, and enhancing the adhesive force of the green oil;
b22, covering the ink on the board surface by scraping to protect the circuit and resist welding, prebaking to dry the solvent of the liquid ink at 70-80 ℃ for exposure, and exposing to lightNa 2 Co 3 Dissolving and removing the non-exposed polymerized ink;
and B23, utilizing high-temperature treatment.
Compared with the prior art, the invention has the following beneficial effects: by arranging the pattern copper, the pattern copper is arranged at the position except the dry film, and then the pattern tin is arranged on the surface of the pattern copper, the copper deposition thickening and the pattern copper are both used for in-hole metallization, so that the interlayer conduction is realized.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic diagram of an overall three-dimensional structure of a PCB board according to the present invention;
FIG. 2 is a schematic side view of the region A according to the present invention;
FIG. 3 is a schematic diagram of a manufacturing process of the present invention;
FIG. 4 is a schematic view of the appearance manufacturing process of the present invention;
FIG. 5 is a schematic view of the appearance forming process of the present invention;
FIG. 6 is a schematic view of a golden finger processing system of the present invention;
in the figure: 1. a PCB board; 2. an aperture; 3. a golden finger; 4. an inner core board; 5. a base copper foil I; 6. a prepreg; 7. thickening copper; 8. and a second base copper foil.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-6, the present invention provides the following technical solutions: a novel PCB and a preparation method thereof comprise a PCB 1, wherein the PCB 1 comprises two groups of inner core plates 4, base copper foils I5 are fixed on the outer sides of the two groups of inner core plates 4, base copper foils II 8 are fixed on the inner sides of the two groups of inner core plates 4, prepregs 6 are fixed between the two groups of inner core plates 4 and on one side of the base copper foils I5, thickened copper 7 is fixed on one side of each prepreg 6, holes 2 are formed in the surface of the PCB 1, and golden fingers 3 are fixed on one side of the PCB 1;
the manufacturing process of the PCB 1 comprises an inner layer manufacturing process, an outer layer manufacturing process and an appearance forming process, wherein the inner layer manufacturing process comprises the following steps:
s1, cutting the board: cutting the inner core plate 4 into corresponding sizes;
s2, inner layer dry film: covering a base copper foil I5 on the surface of an inner core plate 4, polishing a dry film to be flat, pressing the dry film on the surface of the base copper foil I5, exposing, covering a negative film on one side of a pressed film, and dividing the negative film into a light transmitting area and a light blocking area;
s3, etching copper;
s4, AOI inspection;
s5, stacking plates;
s6, pressing: melting the epoxy resin at a high temperature for two hours, and bonding at a high pressure; cooling in a cold pressing mode for forty minutes to avoid bending and warping of the plate, and finely grinding the plate edges by an edge grinding machine according to the required size by a forming machine to avoid scratching in the subsequent process;
s7, drilling: drilling the pressed film PCB board 1 by using a machining center;
s3 comprises the following specific operation steps:
s31, washing the unpolymerized dry film with weak alkali to expose the dry film which is not polymerized to the copper surface, increasing the thickness of the copper surface and the hole copper by electroplating, and plating tin as an etching resist;
s32, washing the polymer film by strong base NaOH at high pressure, and removing the polymer dry film;
s33, etching the copper surface by using an alkaline etching solution in a heating spraying mode, and chemically removing tin by using a tin removing liquid medicine to expose the copper surface of the required pattern;
s5 comprises the following specific operation steps:
s51, performing copper surface treatment in a chemical mode to generate copper oxide fluff so as to increase the bonding area and improve the pressing bonding force, and performing epoxy resin melting at a high temperature for two hours to form a prepreg 6, wherein the high temperature is consistent with the high temperature;
s52, placing prepregs 6 on the inner side and the outer side of the inner core board 4, and then placing thickened copper 7 on the outer side of the prepregs 6;
the outer layer manufacturing comprises the following process steps:
a1, copper deposition: polishing the PCB 1 with the drilled hole 2, polishing burrs, removing glue residues generated by drilling by potassium permanganate, metalizing the hole wall in a chemical copper deposition mode, wherein the thickness is 3-5 microns, and continuously depositing copper on the surface of the thickened copper 7;
a2, full-plate electroplating: increasing the thickness of the hole copper in an electrolytic copper plating way;
a3, outer dry film: cleaning with low-concentration sulfuric acid, cleaning the board surface in a scrubbing mode, coating a dry film on the surface of thickened copper 7, pressing a film, coating a negative film on the dry film again, dividing the negative film into a light-blocking area and a light-transmitting area, putting a developing solution into the negative film, performing photopolymerization, and performing anti-plating under the action of the dry film left after development instead of the anti-corrosion action of inner layer processing;
a4, electrochemical copper tin;
a5, etching copper; the anti-plating mission is finished, the copper layer under the tin is required to be removed to expose, namely, the dry film is removed, the etching can be carried out, the copper under the tin is protected by the tin and is preserved, the copper is etched, and finally the tin is removed;
a6, checking;
a4 comprises the following specific operation steps:
a41, pattern copper except the dry film, the copper deposition thickening and pattern copper are all for the metallization in the hole 2;
a42, patterning tin on the surface of the patterned copper, wherein the copper is required to be of a certain thickness because hole copper fracture caused by heating during welding is prevented, and the patterned copper plating is selected because only basic copper and thickened copper need to be etched during etching, so that the etching is easy, and the copper plating cost is low;
the appearance forming process comprises the following steps:
b1, processing a golden finger 3;
b2, solder resist;
b3, printed characters: publishing the surface characters in a screen printing mode;
b4, tin spraying: the surface of the circuit is treated, so that the welding pad is protected from being oxidized, the welding performance of the welding pad is improved, and the connection wear resistance is met;
b5, molding: the numerical control machine tool processes the appearance of the printed board according to the given coordinate movement;
b6, electrical measurement: testing the open circuit and the short circuit of the circuit board to check whether the network state of the finished board meets the design requirements of the original printed circuit board;
b7, appearance inspection: inspecting the product;
b8, check before shipment: the solderability of the PCB 1, the peeling strength of the ink, the copper thickness and the impedance requirements are detected;
b9, packaging and shipping: packaging the PCB board 1 by using a vacuum packaging machine so as to facilitate the storage and transportation of the PCB board 1;
b1, the golden finger 3 processing comprises a golden finger processing system, the golden finger processing system comprises a detection module and a control module, the detection module comprises a distance sensor and a thickness detection submodule, and the control module comprises a recording submodule and an adjusting submodule;
the distance sensor is used for detecting the distance between the machining center and the PCB 1, and the thickness detection submodule is used for detecting the thickness of the PCB 1;
the detection module and the control module comprise the following specific operation steps:
b11, placing the PCB 1 with the etched copper on a processing center, installing the PCB 1 on an installation seat of the processing center, programming by a worker, inputting the program into the processing center, and starting the processing center to process the PCB 1;
b12, when in processing, because the distance sensor is arranged on the main shaft of the clamping cutter, when in processing, the distance between the main shaft and the golden finger 3 processed on the PCB board 1 is detected in real time, the recorded numerical value is transmitted to the recording submodule, and the flatness of the surface of the processed PCB board 1 is analyzed;
b13, the thickness detection submodule is positioned on one side of the mounting seat, can detect the thickness change of the processing golden finger 3 in real time and transmits a signal to the recording submodule;
b14, when the flatness of the surface of the PCB board 1 for processing the golden finger is inconsistent, transmitting a signal to the adjusting submodule so as to control the distance of the main shaft and ensure that the height of the plane for processing the golden finger 3 is consistent;
b2 comprises the following specific operation steps:
b21, cleaning the board surface in a grinding mode, removing oxidation, roughening the board surface, and enhancing the adhesive force of the green oil;
B22. covering the plate with ink by scraping to protect the circuit and resist welding, pre-baking at 70-80 deg.C to dry the solvent of the liquid ink for exposure, and exposingNa 2 Co 3 Dissolving and removing the non-exposed polymerized ink;
b23, use of ink at high temperature, complete hardening and perfect polymerization.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (9)

1. A novel PCB board, includes PCB board (1), its characterized in that: PCB board (1) is including two sets of inlayer core (4), and is two sets of the outside of inlayer core (4) all is fixed with basic copper foil (5), and is two sets of the inboard of inlayer core (4) all is fixed with basic copper foil two (8), and is two sets of all be fixed with prepreg (6) with one side of basic copper foil (5) between inlayer core (4), one side of prepreg (6) is fixed with thickening copper (7), porose (2) are seted up on the surface of PCB board (1), one side of PCB board (1) is fixed with golden finger (3).
2. A novel PCB preparation method is characterized in that: the manufacturing process of the PCB (1) comprises an inner layer manufacturing process, an outer layer manufacturing process and an appearance forming process, wherein the inner layer manufacturing process comprises the following steps:
s1, cutting the board: cutting the inner core plate (4) to corresponding sizes;
s2, inner layer dry film: covering a base copper foil I (5) on the surface of the inner core board (4), polishing the dry film to be flat, pressing the dry film on the surface of the base copper foil I (5), exposing, covering a negative film on one side of a pressed film, and dividing the negative film into a light transmitting area and a light blocking area;
s3, etching copper;
s4, AOI inspection;
s5, stacking plates;
s6, pressing: melting the epoxy resin at a high temperature for two hours, and bonding at a high pressure; cooling in a cold pressing mode for forty minutes, and finely grinding plate edges by using an edge grinding machine;
s7, drilling: and drilling the pressed film PCB (1) by using a machining center.
3. The method for preparing a novel PCB board according to claim 2, wherein the method comprises the following steps: the S3 comprises the following specific operation steps:
s31, washing the unpolymerized dry film with weak alkali to expose the dry film which is not polymerized to the copper surface, increasing the thickness of the copper surface and the hole copper by electroplating, and plating tin as an etching resist;
s32, removing the polymerized dry film;
and S33, etching the copper surface by using an alkaline etching solution in a heating spraying mode, and chemically removing tin by using a tin removing liquid medicine to expose the copper surface with the required pattern.
4. The method for preparing a novel PCB board according to claim 3, wherein the method comprises the following steps: the S5 comprises the following specific operation steps:
s51, carrying out copper surface treatment in a chemical mode to generate copper oxide fluff, and carrying out epoxy resin melting at a high temperature for two hours to form a prepreg (6);
s52, placing the prepreg (6) on the inner side and the outer side of the inner core board (4), and then placing the thickened copper (7) on the outer side of the prepreg (6).
5. The method for preparing a novel PCB board according to claim 4, wherein the method comprises the following steps: the outer layer manufacturing comprises the following process steps:
a1, copper deposition: polishing the PCB (1) with the drilled hole (2), polishing burrs, removing glue residues generated by drilling by potassium permanganate, metalizing the hole wall in a chemical copper deposition mode, wherein the thickness is 3-5 microns, and continuously depositing copper on the surface of thickened copper (7);
a2, full-plate electroplating: increasing the thickness of the hole copper in an electrolytic copper plating way;
a3, outer dry film: cleaning with low-concentration sulfuric acid, cleaning the board surface in a grinding and brushing way, coating a dry film on the surface of the thickened copper (7), pressing a film, coating a negative film on the dry film again, dividing the negative film into a light blocking area and a light transmitting area, putting a developing solution into the negative film, performing photopolymerization, and performing plating resistance under the action of the dry film left after development;
a4, electrochemical copper tin;
a5, copper etching: removing the dry film to expose the copper layer, namely removing the dry film, further etching, keeping the copper under tin protected by tin, etching the copper, and finally removing the tin;
and A6, checking.
6. The method for preparing a novel PCB board according to claim 5, wherein the method comprises the following steps: the A4 comprises the following specific operation steps:
a41, pattern copper at the place except dry film, the copper deposition thickening and pattern copper are both for the metallization in the hole (2);
a42, and then patterning tin on the surface of the patterned copper.
7. The method for preparing a novel PCB board according to claim 6, wherein the method comprises the following steps: the appearance forming process comprises the following steps:
b1, processing a golden finger (3);
b2, solder resist;
b3, printed characters: printing out characters on the PCB surface in a screen printing mode;
b4, tin spraying: the surface of the circuit is treated, so that the welding pad is protected from being oxidized, the welding performance of the welding pad is improved, and the connection wear resistance is met;
b5, molding: the numerical control machine tool processes the appearance of the printed board according to the given coordinate movement;
b6, electrical measurement: testing the open circuit and the short circuit of the circuit board to check whether the network state of the finished board meets the design requirements of the original printed circuit board;
b7, appearance inspection: inspecting the appearance of the product;
b8, check before shipment: the solderability of the PCB (1), the peeling strength of ink, copper thickness and impedance requirements are detected;
b9, packaging and shipping: and packaging the PCB (1) by using a vacuum packaging machine.
8. The method for preparing a novel PCB board according to claim 7, wherein the method comprises the following steps: the golden finger (3) processing in the B1 comprises a golden finger processing system, the golden finger processing system comprises a detection module and a control module, the detection module comprises a distance sensor and a thickness detection submodule, and the control module comprises a recording submodule and an adjusting submodule;
the distance sensor is used for detecting the distance between the machining center and the PCB (1), and the thickness detection submodule is used for detecting the thickness of the PCB (1);
the detection module and the control module comprise the following specific operation steps:
b11, placing the PCB (1) with the etched copper on a machining center, and mounting the PCB (1) on a mounting seat of the machining center;
b12, during processing, because the distance sensor is arranged on the main shaft of the clamping cutter, during processing, the distance between the main shaft and the golden finger (3) processed on the PCB (1) is detected in real time, the recorded numerical value is transmitted to the recording submodule, and the flatness of the surface of the processed PCB (1) is analyzed;
b13, the thickness detection submodule is positioned on one side of the mounting seat, detects the thickness change of the processing golden finger (3) in real time and transmits a signal to the recording submodule;
b14, when the flatness of the surface of the PCB (1) for processing the golden finger is inconsistent, transmitting a signal to the adjusting submodule so as to control the distance of the main shaft.
9. The method for preparing a novel PCB board according to claim 8, wherein the method comprises the following steps: the B2 comprises the following specific operation steps:
b21, cleaning the board surface in a grinding mode, removing oxidation, roughening the board surface, and enhancing the adhesive force of the green oil;
b22, covering the ink on the board surface by scraping to protect the circuit and resist welding, prebaking to dry the solvent of the liquid ink at 70-80 ℃ for exposure, and exposing to lightNa 2 Co 3 Dissolving and removing the non-exposed polymerized ink;
and B23, utilizing high-temperature treatment.
CN202210003663.3A 2022-01-05 2022-01-05 PCB and preparation method thereof Active CN114025513B (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103249264A (en) * 2013-04-01 2013-08-14 深圳崇达多层线路板有限公司 Method for manufacturing multi-layer circuit board with internal connecting finger
CN104768332A (en) * 2014-01-08 2015-07-08 深圳崇达多层线路板有限公司 Printed circuit board with long and short metal pins, and manufacture method of printed circuit board
CN108718480A (en) * 2018-06-07 2018-10-30 江门荣信电路板有限公司 A kind of ectonexine 6OZ super-thick copper pcb boards and preparation method thereof
CN109246942A (en) * 2018-10-19 2019-01-18 高德（江苏）电子科技有限公司 A kind of processing technology of dry film cap bore removal printed wiring board surface layer copper thickness
CN112752443A (en) * 2020-12-05 2021-05-04 深圳市强达电路有限公司 Processing method of printed circuit board with step position containing bonding structure

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103249264A (en) * 2013-04-01 2013-08-14 深圳崇达多层线路板有限公司 Method for manufacturing multi-layer circuit board with internal connecting finger
CN104768332A (en) * 2014-01-08 2015-07-08 深圳崇达多层线路板有限公司 Printed circuit board with long and short metal pins, and manufacture method of printed circuit board
CN108718480A (en) * 2018-06-07 2018-10-30 江门荣信电路板有限公司 A kind of ectonexine 6OZ super-thick copper pcb boards and preparation method thereof
CN109246942A (en) * 2018-10-19 2019-01-18 高德（江苏）电子科技有限公司 A kind of processing technology of dry film cap bore removal printed wiring board surface layer copper thickness
CN112752443A (en) * 2020-12-05 2021-05-04 深圳市强达电路有限公司 Processing method of printed circuit board with step position containing bonding structure

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