CN202005067U - Multilayer flexible circuit board gold finger installing structure - Google Patents
Multilayer flexible circuit board gold finger installing structure Download PDFInfo
- Publication number
- CN202005067U CN202005067U CN2011201056311U CN201120105631U CN202005067U CN 202005067 U CN202005067 U CN 202005067U CN 2011201056311 U CN2011201056311 U CN 2011201056311U CN 201120105631 U CN201120105631 U CN 201120105631U CN 202005067 U CN202005067 U CN 202005067U
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- CN
- China
- Prior art keywords
- printed circuit
- flexible printed
- layer
- flexible circuit
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
The utility model discloses a multilayer flexible circuit board gold finger installing structure and relates to a flexible circuit board. The multilayer flexible circuit board gold finger installing structure is characterized in that a first layer flexible circuit board and a second layer flexible circuit board have the same shape and size; a third layer flexible circuit board is shorter than the first layer flexible circuit board and the second layer flexible circuit board; the first layer flexible circuit board, the second layer flexible circuit board and the third layer flexible circuit board are laminated and arranged sequentially in a mode that one ends of the first layer flexible circuit board, the second layer flexible circuit board and the third layer flexible circuit board are aligned; the corresponding positions of the first layer flexible circuit board, the second layer flexible circuit board and the third layer flexible circuit board are provided with through holes; the through holes are covered with bonding copper; a gold finger is arranged on one surface of the second layer flexible circuit board relative to the third layer flexible circuit board and at the end of the second layer flexible circuit board, which is not covered by the third layer flexible circuit board; connecting wires are welded with the through holes; and one ends of the connecting wires are welded on the gold finger. The multilayer flexible circuit board gold finger installing structure has the beneficial effect that the structure realizes that the flexible circuit boards between interlayers of a plurality of layers of flexible circuit boards can have the switchover effects.
Description
Technical field
The utility model relates to Flexible Printed Circuit, relates in particular to the mounting structure of multi-layer soft circuit board gold finger.
Background technology
At present, multi-layer soft wiring board, its golden finger generally are installed on ground floor Flexible Printed Circuit or the last one deck Flexible Printed Circuit, and ground floor wiring board or last layer wiring board by structure like this play the switching effect, like this, Zhong Jian Flexible Printed Circuit generally is difficult to play the switching effect.
The utility model content
The utility model aims to provide the multi-layer soft circuit board structure that Flexible Printed Circuit middle in a kind of multi-layer soft wiring board interlayer can play the switching effect at the deficiency of above-mentioned technical problem.
The utility model is achieved through the following technical solutions: a kind of mounting structure of multi-layer soft circuit board gold finger comprises ground floor Flexible Printed Circuit, second layer Flexible Printed Circuit, the 3rd layer of Flexible Printed Circuit, connecting line and golden finger; The shape size of ground floor Flexible Printed Circuit and second layer Flexible Printed Circuit is identical, the 3rd layer of Flexible Printed Circuit is shorter than ground floor Flexible Printed Circuit and second layer Flexible Printed Circuit, an end stacked setting of aliging successively of ground floor Flexible Printed Circuit, second layer Flexible Printed Circuit and the 3rd layer of Flexible Printed Circuit; Ground floor Flexible Printed Circuit, second layer Flexible Printed Circuit and the 3rd layer of Flexible Printed Circuit corresponding position are provided with via, and described via is coated with copper; Golden finger is arranged on the second layer Flexible Printed Circuit with respect to the one side of the 3rd layer of Flexible Printed Circuit and the end that do not covered by the 3rd layer of Flexible Printed Circuit, and connecting line welds with via and an end is welded in golden finger.
The beneficial effects of the utility model are: multi-layer soft wiring board of the present utility model comprises ground floor Flexible Printed Circuit, second layer Flexible Printed Circuit and the 3rd layer of Flexible Printed Circuit, the shape size of ground floor Flexible Printed Circuit and second layer Flexible Printed Circuit is identical, the 3rd layer of Flexible Printed Circuit is shorter than ground floor Flexible Printed Circuit and second layer Flexible Printed Circuit, an end stacked setting of aliging successively of ground floor Flexible Printed Circuit, second layer Flexible Printed Circuit and the 3rd layer of Flexible Printed Circuit; Golden finger is arranged on the second layer Flexible Printed Circuit with respect to the one side of the 3rd layer of Flexible Printed Circuit and not by an end of the 3rd layer of Flexible Printed Circuit covering, like this, just realized and to have realized that in the structure of golden finger being installed Flexible Printed Circuit middle in the multi-layer soft wiring board interlayer can play the switching effect as the second layer Flexible Printed Circuit of intermediate course.
Description of drawings
Fig. 1 is an overall structure schematic diagram of the present utility model.
Among the figure: 1, ground floor Flexible Printed Circuit; 2, second layer Flexible Printed Circuit; 3, the 3rd layer of Flexible Printed Circuit; 4, connecting line; 5, golden finger; 6, via.
Embodiment
The utility model is described in further detail below in conjunction with drawings and Examples:
With reference to shown in Figure 1, the multi-layer soft wiring board that the utility model discloses comprises ground floor Flexible Printed Circuit 1, second layer Flexible Printed Circuit 2, the 3rd layer of Flexible Printed Circuit 3, connecting line 4 and golden finger 5; The shape size of ground floor Flexible Printed Circuit 1 and second layer Flexible Printed Circuit 2 is identical, the 3rd layer of Flexible Printed Circuit 3 is shorter than ground floor Flexible Printed Circuit 1 and second layer Flexible Printed Circuit 2, an end stacked setting of aliging successively of ground floor Flexible Printed Circuit 2, second layer Flexible Printed Circuit 2 and the 3rd layer of Flexible Printed Circuit 3; Ground floor Flexible Printed Circuit 1, second layer Flexible Printed Circuit 2 and the 3rd layer of Flexible Printed Circuit 3 corresponding position are provided with via 6, and via 6 is coated with copper; Golden finger 5 is arranged on the second layer Flexible Printed Circuit 2 with respect to the one side of the 3rd layer of Flexible Printed Circuit 3 and the end that do not covered by the 3rd layer of Flexible Printed Circuit 3, and connecting line 4 is welded in golden finger 5 with via 6 welding and an end.
Multi-layer soft wiring board of the present utility model comprises ground floor Flexible Printed Circuit 1, second layer Flexible Printed Circuit 2 and the 3rd layer of Flexible Printed Circuit 3, the shape size of ground floor Flexible Printed Circuit 1 and second layer Flexible Printed Circuit 2 is identical, the 3rd layer of Flexible Printed Circuit 3 is shorter than ground floor Flexible Printed Circuit 1 and second layer Flexible Printed Circuit 2, an end stacked setting of aliging successively of ground floor Flexible Printed Circuit 1, second layer Flexible Printed Circuit 2 and the 3rd layer of Flexible Printed Circuit 3; Golden finger 5 is arranged on the second layer Flexible Printed Circuit 2 with respect to the one side of the 3rd layer of Flexible Printed Circuit 3 and not by an end of the 3rd layer of Flexible Printed Circuit 3 coverings, like this, just realized and to have realized that in the structure of golden finger 5 being installed Flexible Printed Circuit middle in the multi-layer soft wiring board interlayer can play the switching effect as the second layer Flexible Printed Circuit 2 of intermediate course.
The announcement of book and instruction according to the above description, the utility model those skilled in the art can also carry out suitable change and modification to above-mentioned execution mode.Therefore, the embodiment that discloses and describe above the utility model is not limited to also should fall in the protection range of claim of the present utility model modifications and changes more of the present utility model.In addition, although used some specific terms in this specification, these terms do not constitute any restriction to the utility model just for convenience of description.
Claims (1)
1. the mounting structure of a multi-layer soft circuit board gold finger is characterized in that: comprise ground floor Flexible Printed Circuit, second layer Flexible Printed Circuit, the 3rd layer of Flexible Printed Circuit, connecting line and golden finger;
The shape size of ground floor Flexible Printed Circuit and second layer Flexible Printed Circuit is identical, the 3rd layer of Flexible Printed Circuit is shorter than ground floor Flexible Printed Circuit and second layer Flexible Printed Circuit, an end stacked setting of aliging successively of ground floor Flexible Printed Circuit, second layer Flexible Printed Circuit and the 3rd layer of Flexible Printed Circuit;
Ground floor Flexible Printed Circuit, second layer Flexible Printed Circuit and the 3rd layer of Flexible Printed Circuit corresponding position are provided with via, and described via is coated with copper; Golden finger is arranged on the second layer Flexible Printed Circuit with respect to the one side of the 3rd layer of Flexible Printed Circuit and the end that do not covered by the 3rd layer of Flexible Printed Circuit, and connecting line welds with via and an end is welded in golden finger.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201056311U CN202005067U (en) | 2011-04-11 | 2011-04-11 | Multilayer flexible circuit board gold finger installing structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201056311U CN202005067U (en) | 2011-04-11 | 2011-04-11 | Multilayer flexible circuit board gold finger installing structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202005067U true CN202005067U (en) | 2011-10-05 |
Family
ID=44707791
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011201056311U Expired - Lifetime CN202005067U (en) | 2011-04-11 | 2011-04-11 | Multilayer flexible circuit board gold finger installing structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202005067U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103249264A (en) * | 2013-04-01 | 2013-08-14 | 深圳崇达多层线路板有限公司 | Method for manufacturing multi-layer circuit board with internal connecting finger |
-
2011
- 2011-04-11 CN CN2011201056311U patent/CN202005067U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103249264A (en) * | 2013-04-01 | 2013-08-14 | 深圳崇达多层线路板有限公司 | Method for manufacturing multi-layer circuit board with internal connecting finger |
| CN103249264B (en) * | 2013-04-01 | 2015-08-19 | 深圳崇达多层线路板有限公司 | A kind of manufacturing method of multi-layer circuit board of built-in golden finger |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20111005 |