CN110809357A - High-temperature-resistant PCB and manufacturing method thereof - Google Patents
High-temperature-resistant PCB and manufacturing method thereof Download PDFInfo
- Publication number
- CN110809357A CN110809357A CN201910997912.3A CN201910997912A CN110809357A CN 110809357 A CN110809357 A CN 110809357A CN 201910997912 A CN201910997912 A CN 201910997912A CN 110809357 A CN110809357 A CN 110809357A
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- layers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
Abstract
The invention discloses a high-temperature resistant PCB and a manufacturing method thereof, wherein the manufacturing method comprises the following steps: the substrate layer is made of high-temperature-resistant materials; the two bottom copper layers are used for generating a line conductor and are respectively stacked on two side surfaces of the base material layer; the two copper plating layers are used for thickening the thickness of the line conductor and generating an in-hole conductor, and are respectively stacked on the side surfaces of the two bottom copper layers; the two chemical gold layers are used for performing full-plate gold immersion on the surfaces of the line conductor and the hole conductor, and are respectively arranged on the side surfaces of the two copper plating layers in a laminated mode; the two layers of cover films are made of high-temperature-resistant solder resist materials and are respectively arranged on the side surfaces of the two chemical gold layers in a stacking mode; the gold finger positions arranged on the side surfaces of the two covering films are covered by the two gold layers respectively. The invention can ensure that the PCB can continuously work in a high-temperature environment and ensure the electrical reliability.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a high-temperature-resistant PCB and a manufacturing method thereof.
Background
At present, when the PCB is continuously operated at a high temperature of over 240 ℃ for more than 30 minutes, or at a high temperature of 150-240 ℃ for more than 30 minutes, the electrical performance of the PCB is greatly influenced.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention provides a high-temperature-resistant PCB and a manufacturing method thereof, which can ensure that the PCB can continuously work in a high-temperature environment and ensure the electrical reliability of the PCB.
According to the embodiment of the first aspect of the invention, the high temperature resistant PCB comprises:
the substrate layer is made of high-temperature-resistant materials;
the two bottom copper layers are used for generating a line conductor and are respectively stacked on two side surfaces of the base material layer;
the two copper plating layers are used for thickening the thickness of the line conductor and generating an in-hole conductor, and are respectively stacked on the side surfaces of the two bottom copper layers;
the two chemical gold layers are used for performing full-plate gold immersion on the surfaces of the line conductor and the hole conductor, and are respectively arranged on the side surfaces of the two copper plating layers in a laminated mode;
the two layers of cover films are made of high-temperature-resistant solder resist materials and are respectively arranged on the side surfaces of the two chemical gold layers in a stacking mode;
the gold finger positions arranged on the side surfaces of the two covering films are covered by the two gold layers respectively.
The high-temperature-resistant PCB provided by the embodiment of the invention at least has the following beneficial effects: firstly, the substrate layer is made of high-temperature resistant materials, so that the PCB can be ensured to stably work for a long time in a high-temperature working environment of over 240 ℃; secondly, the copper plating layer can thicken the thickness of the line conductor and generate an inner conductor, so that the reliability and the conductivity are greatly improved; in addition, the chemical gold layer can prevent the line conductor and the hole conductor from being oxidized in a high-temperature working environment; in addition, the covering film is made of a high-temperature-resistant solder-resisting material, so that the PCB can stably work for a long time in a high-temperature working environment of over 240 ℃; finally, the electric gold layer in the invention can enhance the plugging times of the gold finger and enhance the wear resistance.
According to some embodiments of the invention, the substrate layer has a thickness of 0.254 mm.
According to some embodiments of the invention, the thickness of the bottom copper layer is 0.015 mm.
According to some embodiments of the invention, the copper plating layer has a thickness of 0.020 mm.
According to some embodiments of the invention, the chemical gold layer has a thickness of 0.005 mm.
According to some embodiments of the invention, the cover film has a thickness of 0.075 mm.
According to some embodiments of the invention, the thickness of the gold-plating layer is 0.001 mm.
The manufacturing method of the high temperature resistant PCB board according to the embodiment of the second aspect of the invention comprises the following steps:
covering and arranging bottom copper layers for generating line conductors on two side surfaces of a base material layer made of high-temperature-resistant materials respectively;
covering and arranging a copper plating layer for thickening the thickness of the line conductor and generating an inner conductor on the side surface of the bottom copper layer;
covering and arranging a chemical gold layer for performing full-plate gold immersion on the surfaces of the circuit conductor and the hole conductor on the side surface of the copper plating layer;
pressing a covering film made of a high-temperature-resistant solder resist material on the side face of the chemical gold layer, wherein the pressing melting temperature is 310 ℃ and the pressure is 350psi during pressing;
and covering and arranging an electric gold layer on the golden finger part on the side surface of the covering film.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic cross-sectional structure view of a high temperature resistant PCB according to an embodiment of the present invention;
FIG. 2 is a flow chart of a method for manufacturing a high temperature resistant PCB board according to an embodiment of the invention;
fig. 3 is a high temperature stitching curve chart adopted by the manufacturing method of the high temperature resistant PCB board according to the embodiment of the invention.
Reference numerals:
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
In the description of the present invention, it should be understood that the orientation or positional relationship referred to in the description of the orientation, such as the upper, lower, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, the meaning of a plurality of means is one or more, the meaning of a plurality of means is two or more, and larger, smaller, larger, etc. are understood as excluding the number, and larger, smaller, inner, etc. are understood as including the number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present invention, unless otherwise explicitly limited, terms such as arrangement, installation, connection and the like should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific contents of the technical solutions.
Referring to fig. 1, a high temperature resistant PCB according to an embodiment of a first aspect of the present invention includes:
the substrate layer 110 is made of a high-temperature resistant material; the substrate layer 110 can be a Rogers high-temperature resistant plate;
two bottom copper layers 120 for generating a line conductor, wherein the two bottom copper layers 120 are respectively stacked on two side surfaces of the substrate layer 110;
two copper plating layers 130 for thickening the thickness of the line conductor and generating an in-hole conductor, wherein the two copper plating layers 130 are respectively stacked on the side surfaces of the two bottom copper layers 120;
two layers of chemical gold layers 140, which are used for performing full-plate gold immersion on the surfaces of the line conductor and the hole conductor, wherein the two layers of chemical gold layers 140 are respectively stacked on the side surfaces of the two copper plating layers 130;
two layers of cover films 150 made of high-temperature-resistant solder resist materials, wherein the two layers of cover films 150 are respectively stacked on the sides of the two layers of chemical gold layers 140; the cover film 150 can be made of DuPont cover film 150 instead of green oil for solder mask;
and the two gold layers 160 respectively cover the gold finger positions arranged on the side surfaces of the two cover films 150.
According to the high-temperature-resistant PCB disclosed by the embodiment of the invention, firstly, the substrate layer 110 is made of a high-temperature-resistant material, so that the PCB can be ensured to stably work for a long time in a high-temperature working environment of more than 240 ℃; secondly, the copper plating layer 130 in the invention can thicken the thickness of the line conductor and generate the conductor in the hole, thereby greatly increasing the reliability and the conductivity; in addition, the chemical gold layer 140 in the invention can prevent the line conductor and the hole conductor from being oxidized in a high-temperature working environment; in addition, the cover film 150 in the invention is made of high temperature resistant solder resist material, which can ensure that the PCB can stably work for a long time in a high temperature working environment above 240 ℃; finally, the gold layer 160 of the present invention can enhance the insertion and extraction times of the gold finger and enhance the anti-wear capability.
According to some embodiments of the invention, the substrate layer 110 has a thickness of 0.254 mm.
According to some embodiments of the present invention, the thickness of the underlying copper layer 120 is 0.015 mm.
According to some embodiments of the present invention, the thickness of the copper plating layer 130 is 0.020 mm.
According to some embodiments of the present invention, the thickness of the electroless gold layer 140 is 0.005 mm.
According to some embodiments of the invention, the cover film 150 has a thickness of 0.075 millimeters.
According to some embodiments of the present invention, the thickness of the gold layer 160 is 0.001 mm.
Referring to fig. 2 to 3, a method for manufacturing a high temperature resistant PCB panel according to an embodiment of the second aspect of the present invention includes the steps of:
s1: a bottom copper layer 120 for generating a line conductor is respectively covered and arranged on two side surfaces of the base material layer 110 made of a high-temperature resistant material; the substrate layer 110 can be a Rogers high-temperature resistant plate;
s2: covering and arranging a copper plating layer 130 for thickening the thickness of the circuit conductor and generating an inner conductor on the side surface of the bottom copper layer 120;
s3: covering a chemical gold layer 140 for performing full-plate gold immersion on the surfaces of the circuit conductor and the hole conductor on the side surface of the copper plating layer 130;
s4: laminating a cover film 150 made of a high-temperature-resistant solder resist material on the side surface of the chemical gold layer 140, wherein the lamination melting temperature is 310 ℃ and the pressure is 350psi during lamination; the cover film 150 can be made of DuPont cover film 150 instead of green oil for solder mask; when the cover film 150 is pressed, a special high-temperature pressing program (the pressing melting temperature is 310 ℃, the pressing temperature of the traditional PCB is about 200 ℃) and a special pressing curve are adopted, as shown in fig. 3, the surface bonding force of the cover film 150 and the chemical gold layer 140 is ensured;
s5: an electric gold layer 160 is covered on the gold finger portion on the side surface of the cover film 150.
According to the manufacturing method of the high-temperature-resistant PCB, firstly, the substrate layer 110 is made of the high-temperature-resistant material, so that the PCB can be ensured to stably work for a long time in a high-temperature working environment of over 240 ℃; secondly, the copper plating layer 130 in the invention can thicken the thickness of the line conductor and generate the conductor in the hole, thereby greatly increasing the reliability and the conductivity; in addition, the chemical gold layer 140 in the invention can prevent the line conductor and the hole conductor from being oxidized in a high-temperature working environment; in addition, the cover film 150 in the invention is made of high temperature resistant solder material, which can ensure the PCB can stably work in high temperature working environment above 240 ℃ for a long time, and the special high temperature pressing program and special pressing curve are adopted to ensure the surface binding force of the cover film 150 and the chemical gold layer 140; finally, the gold layer 160 of the present invention can enhance the insertion and extraction times of the gold finger and enhance the anti-wear capability.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the gist of the present invention.
Claims (8)
1. A high temperature resistant PCB board, characterized by, includes:
the substrate layer is made of high-temperature-resistant materials;
the two bottom copper layers are used for generating a line conductor and are respectively stacked on two side surfaces of the base material layer;
the two copper plating layers are used for thickening the thickness of the line conductor and generating an in-hole conductor, and are respectively stacked on the side surfaces of the two bottom copper layers;
the two chemical gold layers are used for performing full-plate gold immersion on the surfaces of the line conductor and the hole conductor, and are respectively arranged on the side surfaces of the two copper plating layers in a laminated mode;
the two layers of cover films are made of high-temperature-resistant solder resist materials and are respectively arranged on the side surfaces of the two chemical gold layers in a stacking mode;
the gold finger positions arranged on the side surfaces of the two covering films are covered by the two gold layers respectively.
2. The high temperature resistant PCB board of claim 1, wherein: the thickness of the substrate layer is 0.254 millimeter.
3. The high temperature resistant PCB board of claim 1, wherein: the thickness of the bottom copper layer is 0.015 mm.
4. The high temperature resistant PCB board of claim 1, wherein: the thickness of the copper plating layer is 0.020 mm.
5. The high temperature resistant PCB board of claim 1, wherein: the thickness of the chemical gold layer is 0.005 mm.
6. The high temperature resistant PCB board of claim 1, wherein: the thickness of the cover film was 0.075 mm.
7. The high temperature resistant PCB board of claim 1, wherein: the thickness of the electro-gold layer is 0.001 mm.
8. A manufacturing method of a high-temperature-resistant PCB is characterized by comprising the following steps:
covering and arranging bottom copper layers for generating line conductors on two side surfaces of a base material layer made of high-temperature-resistant materials respectively;
covering and arranging a copper plating layer for thickening the thickness of the line conductor and generating an inner conductor on the side surface of the bottom copper layer;
covering and arranging a chemical gold layer for performing full-plate gold immersion on the surfaces of the circuit conductor and the hole conductor on the side surface of the copper plating layer;
pressing a covering film made of a high-temperature-resistant solder resist material on the side face of the chemical gold layer, wherein the pressing melting temperature is 310 ℃ and the pressure is 350psi during pressing;
and covering and arranging an electric gold layer on the golden finger part on the side surface of the covering film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910997912.3A CN110809357A (en) | 2019-10-21 | 2019-10-21 | High-temperature-resistant PCB and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910997912.3A CN110809357A (en) | 2019-10-21 | 2019-10-21 | High-temperature-resistant PCB and manufacturing method thereof |
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| CN110809357A true CN110809357A (en) | 2020-02-18 |
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| CN201910997912.3A Pending CN110809357A (en) | 2019-10-21 | 2019-10-21 | High-temperature-resistant PCB and manufacturing method thereof |
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Citations (12)
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| JP2002094203A (en) * | 2000-09-11 | 2002-03-29 | Nec Yonezawa Ltd | Flexible circuit board and connector therefor |
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| US20140090767A1 (en) * | 2006-08-08 | 2014-04-03 | Rogers Corporation | Dielectric materials, methods of forming subassemblies therefrom, and the subassemblies formed therewith |
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2019
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| CN104892904A (en) * | 2015-05-18 | 2015-09-09 | 兴宁市精维进电子有限公司 | Interlayer insulation material for multilayer printed circuit board and preparation process thereof |
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| CN110168670A (en) * | 2017-11-07 | 2019-08-23 | 罗杰斯公司 | Dielectric layer with improved thermal conductivity |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200218 |
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| RJ01 | Rejection of invention patent application after publication |