CN113532336A - Method for testing flatness of copper strip of high-precision lead frame material for etching - Google Patents
Method for testing flatness of copper strip of high-precision lead frame material for etching Download PDFInfo
- Publication number
- CN113532336A CN113532336A CN202010306208.1A CN202010306208A CN113532336A CN 113532336 A CN113532336 A CN 113532336A CN 202010306208 A CN202010306208 A CN 202010306208A CN 113532336 A CN113532336 A CN 113532336A
- Authority
- CN
- China
- Prior art keywords
- etching
- copper strip
- flatness
- edge
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 69
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 69
- 239000010949 copper Substances 0.000 title claims abstract description 69
- 238000005530 etching Methods 0.000 title claims abstract description 62
- 239000000463 material Substances 0.000 title claims abstract description 25
- 238000000034 method Methods 0.000 title claims abstract description 23
- 238000012360 testing method Methods 0.000 title claims abstract description 19
- 238000011156 evaluation Methods 0.000 claims abstract description 11
- 238000005070 sampling Methods 0.000 claims abstract description 8
- 238000005259 measurement Methods 0.000 claims abstract description 7
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 11
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 8
- 238000004140 cleaning Methods 0.000 claims description 8
- 229910017604 nitric acid Inorganic materials 0.000 claims description 8
- 238000005520 cutting process Methods 0.000 claims description 7
- 240000004282 Grewia occidentalis Species 0.000 claims description 4
- 239000002390 adhesive tape Substances 0.000 claims description 4
- 238000005260 corrosion Methods 0.000 claims description 4
- 230000007797 corrosion Effects 0.000 claims description 4
- 238000002791 soaking Methods 0.000 claims description 4
- 238000005406 washing Methods 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000010998 test method Methods 0.000 abstract description 2
- 238000010030 laminating Methods 0.000 abstract 1
- 238000012545 processing Methods 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 1
- 238000003723 Smelting Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B5/00—Measuring arrangements characterised by the use of mechanical techniques
- G01B5/28—Measuring arrangements characterised by the use of mechanical techniques for measuring roughness or irregularity of surfaces
Abstract
A test method for the flatness of a copper strip of a high-precision lead frame material for etching comprises the following process flows: sampling, laminating, edge etching, plate making, full etching or half etching, flatness measurement and flatness evaluation; the method solves the problem of flatness test of the copper strip of the high-precision lead frame material for etching, has simple operation method and flow, accurate flatness test evaluation, and is suitable for the test requirement of the flatness of the copper strip for etching in small-batch copper strip production.
Description
Technical Field
The invention belongs to the field of non-ferrous metal smelting and processing, and particularly relates to a method for testing the flatness of a copper strip of a high-precision lead frame material for etching.
Background
The copper strip of high-precision lead frame material is a key material for frame materials and carriers of mobile phone integrated circuit chips, because of the rapid development of electronic information technology, the miniaturization and integration technology of key electronic components is widely adopted, the subsequent processing is gradually changed from a stamping mode to a finer etching mode, the change of the subsequent processing mode also puts forward higher requirements on the quality of the copper strip of high-precision lead frame material, and the flatness of the etched material is one of the key evaluation indexes of the quality of the copper strip of high-precision lead frame material. If asymmetric dimensional changes such as warping, twisting and the like occur after etching, the copper strip material is scrapped due to the fact that the copper strip material cannot be used on electronic components. At present, the flatness of the high-precision lead frame material for etching is usually pre-judged by directly slitting copper and copper alloy strips and then observing or measuring the flatness, but the flatness of the etched strips cannot be pre-judged by the method. How to use a quick and intuitive method to test the flatness of the copper strip of the high-precision lead frame material after etching, and whether the material can meet the applicability of downstream users is judged in advance, and the method is applied to industrial production and is an industry technical problem which needs to be solved urgently.
In view of the above, a method for testing the flatness of copper strips of high precision leadframe material for etching has been developed.
Disclosure of Invention
The invention aims to overcome the defects in the prior art, provides the method for testing the flatness of the copper strip of the high-precision lead frame material for etching, solves the problem of testing the flatness of the copper strip of the high-precision lead frame material for etching, has simple operation method and flow and accurate flatness test evaluation, and is suitable for the test requirement on the flatness of the copper strip for etching in small-batch copper strip production.
In order to achieve the purpose, the invention adopts the following technical scheme: a test method for the flatness of a copper strip of a high-precision lead frame material for etching comprises the following process flows: sampling, coating film, edge etching, plate making, full etching or half etching, flatness measurement and flatness evaluation.
First step, sampling: taking a copper strip with the length of 30-300mm and the width of 30-300 mm;
step two, film covering: the copper strip of the sample is manually pasted with films on two sides by adopting the corrosion-resistant transparent adhesive tape, and the films are uniform, bubble-free and damage-free;
step three, edge etching: manually cutting the film at the periphery of the copper strip of the sample by using a blade, etching the edge part by using 20-60% sulfuric acid or nitric acid, and cleaning the surface of the sample by using clean water;
fourthly, plate making: designing etched patterns and sizes according to use requirements, carrying out manual single-sided plate making on the copper strip subjected to edge etching, wherein the longitudinal distance between the pattern and the transverse edge of the copper strip is 2-50mm, the transverse distance between the pattern and the longitudinal edge of the copper strip is 2-50mm, manually cutting the edge of the pattern by using a blade, and displaying the surface of the copper strip after demolding;
and a fifth step of full etching or half etching: etching the copper strip after plate making in a container by adopting 10-60% sulfuric acid or nitric acid, soaking for 1-15 minutes, measuring the etching depth after washing with clear water, taking out when the etching depth reaches 5-100% of the thickness of the copper strip, cleaning with clear water, and wiping to dry;
sixthly, flatness measurement: placing the copper strip subjected to full etching or half etching on a standard platform, and measuring and recording the four-corner warping height by adopting a tool microscope, a feeler gauge or a vernier caliper;
seventhly, evaluating flatness: and according to the warping height and the technical requirements, carrying out flatness evaluation.
The invention has the beneficial effects that: the method solves the problem of flatness test of the copper strip of the high-precision lead frame material for etching, has simple operation method and flow, accurate flatness test evaluation, and is suitable for the test requirement of the flatness of the copper strip for etching in small-batch copper strip production.
Detailed Description
The present invention will be described in further detail with reference to the following examples and embodiments:
example 1
The technical requirements of the high-precision lead frame material copper strip used in the IC direction are as follows:
number C19210
The specification of the copper strip is as follows: 0.2X 300mm
The state is as follows: hard state (H)
The method comprises the following steps: after etching, the film is flat and the warping is less than or equal to 0.75mm
The flatness testing process comprises the following steps:
first step, sampling: taking a copper strip with the length of 300mm and the width of 300 mm;
step two, film covering: the copper strip of the sample is manually pasted with films on two sides by adopting the corrosion-resistant transparent adhesive tape, and the films are uniform, bubble-free and damage-free;
step three, edge etching: manually cutting a film of the copper strip of the sample, which is 10mm away from the edge, by a blade, quickly etching the edge by 60% sulfuric acid or nitric acid, and cleaning the surface of the sample by using clean water;
fourthly, plate making: designing etched patterns and sizes according to use requirements, carrying out manual single-sided plate making on the copper strip subjected to edge etching, manually scratching the edges of the patterns by using a blade, and displaying the surface of the copper strip after demolding, wherein the longitudinal distance between the patterns and the transverse edges of the copper strip is 50mm, and the transverse distance between the patterns and the longitudinal edges of the copper strip is 50 mm;
step five, half etching: etching the copper strip after plate making in a container by using 20% sulfuric acid or nitric acid, soaking for 5 minutes, sampling in the middle, measuring the etching depth after washing with clear water, taking out when the etching depth reaches about 20% of the thickness of the copper strip, cleaning with clear water, and wiping to dry;
sixthly, flatness measurement: placing the semi-etched copper strip on a standard platform, and measuring and recording the four-corner warping height by using a tool microscope, a feeler gauge or a vernier caliper;
seventhly, evaluating flatness: and according to the warping height and the technical requirements, carrying out flatness evaluation.
Example 2
The technical requirements of the high-precision lead frame material copper strip used in the mobile phone direction are as follows:
number C2680
The specification of the copper strip is as follows: 0.15X 150mm
The state is as follows: hard state (H)
The method comprises the following steps: after etching, the film is flat and the warping is less than or equal to 0.75mm
The flatness testing process comprises the following steps:
first step, sampling: taking a copper strip with the length of 80mm and the width of 80 mm;
step two, film covering: the copper strip of the sample is manually pasted with films on two sides by adopting the corrosion-resistant transparent adhesive tape, and the films are uniform, bubble-free and damage-free;
step three, edge etching: manually cutting a film of the copper strip of the sample, which is 3mm away from the edge, by a blade, etching the edge by 20-60% sulfuric acid or nitric acid, and cleaning the surface of the sample by clean water;
fourthly, plate making: designing etched patterns and sizes according to use requirements, carrying out manual single-sided plate making on the copper strip subjected to edge etching, manually cutting the edges of the patterns by a blade, and displaying the surface of the copper strip after demolding, wherein the longitudinal distance between the patterns and the transverse edges of the copper strip is 5mm, and the transverse distance between the patterns and the longitudinal edges of the copper strip is 5 mm;
fifthly, full etching: etching the copper strip after the plate making in a container by adopting 60 percent sulfuric acid or nitric acid, soaking for 2 minutes, taking out when the depth reaches 100 percent of the thickness of the copper strip, cleaning by using clear water, and wiping to dry;
sixthly, flatness measurement: placing the fully etched copper strip on a standard platform, and measuring and recording the four-corner warping height by adopting a tool microscope, a feeler gauge or a vernier caliper;
seventhly, evaluating flatness: and according to the warping height and the technical requirements, carrying out flatness evaluation.
Claims (2)
1. A method for testing the flatness of a copper strip of a high-precision lead frame material for etching is characterized by comprising the following steps of: the process flow is as follows: sampling, coating film, edge etching, plate making, full etching or half etching, flatness measurement and flatness evaluation.
2. The method for testing the flatness of a copper strip of a high-precision lead frame material for etching according to claim 1, wherein the method comprises the following steps:
first step, sampling: taking a copper strip with the length of 30-300mm and the width of 30-300 mm;
step two, film covering: the copper strip of the sample is manually pasted with films on two sides by adopting the corrosion-resistant transparent adhesive tape, and the films are uniform, bubble-free and damage-free;
step three, edge etching: manually cutting the film at the periphery of the copper strip of the sample by using a blade, etching the edge part by using 20-60% sulfuric acid or nitric acid, and cleaning the surface of the sample by using clean water;
fourthly, plate making: designing etched patterns and sizes according to use requirements, carrying out manual single-sided plate making on the copper strip subjected to edge etching, wherein the longitudinal distance between the pattern and the transverse edge of the copper strip is 2-50mm, the transverse distance between the pattern and the longitudinal edge of the copper strip is 2-50mm, manually cutting the edge of the pattern by using a blade, and displaying the surface of the copper strip after demolding;
and a fifth step of full etching or half etching: etching the copper strip after plate making in a container by adopting 10-60% sulfuric acid or nitric acid, soaking for 1-15 minutes, measuring the etching depth after washing with clear water, taking out when the etching depth reaches 5-100% of the thickness of the copper strip, cleaning with clear water, and wiping to dry;
sixthly, flatness measurement: placing the copper strip subjected to full etching or half etching on a standard platform, and measuring and recording the four-corner warping height by adopting a tool microscope, a feeler gauge or a vernier caliper;
seventhly, evaluating flatness: and according to the warping height and the technical requirements, carrying out flatness evaluation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010306208.1A CN113532336B (en) | 2020-04-17 | 2020-04-17 | Method for testing flatness of copper strip of high-precision lead frame material for etching |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010306208.1A CN113532336B (en) | 2020-04-17 | 2020-04-17 | Method for testing flatness of copper strip of high-precision lead frame material for etching |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113532336A true CN113532336A (en) | 2021-10-22 |
| CN113532336B CN113532336B (en) | 2024-01-30 |
Family
ID=78123391
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010306208.1A Active CN113532336B (en) | 2020-04-17 | 2020-04-17 | Method for testing flatness of copper strip of high-precision lead frame material for etching |
Country Status (1)
| Country | Link |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4259436A (en) * | 1978-04-26 | 1981-03-31 | Shinko Electric Industries Co., Ltd. | Method of making a take-carrier for manufacturing IC elements |
| JPH10340933A (en) * | 1997-06-09 | 1998-12-22 | Nec Corp | Manufacture of semiconductor device |
| CN102781168A (en) * | 2012-07-24 | 2012-11-14 | 中山市达进电子有限公司 | Manufacturing method for golden fingerboard without lead wire |
| CN204854698U (en) * | 2015-07-29 | 2015-12-09 | 山西春雷铜材有限责任公司 | Copper strips warpage measuring device for lead frame |
| CN105682348A (en) * | 2016-03-08 | 2016-06-15 | 深圳崇达多层线路板有限公司 | Fabrication method for printed circuit board (PCB) with gold finger of which three surfaces coated with gold |
| CN109506598A (en) * | 2018-11-19 | 2019-03-22 | 信利光电股份有限公司 | A kind of plate testing flatness method and device |
| CN110351955A (en) * | 2019-06-17 | 2019-10-18 | 江门崇达电路技术有限公司 | A kind of production method of the PCB with local electric thick gold PAD |
-
2020
- 2020-04-17 CN CN202010306208.1A patent/CN113532336B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4259436A (en) * | 1978-04-26 | 1981-03-31 | Shinko Electric Industries Co., Ltd. | Method of making a take-carrier for manufacturing IC elements |
| JPH10340933A (en) * | 1997-06-09 | 1998-12-22 | Nec Corp | Manufacture of semiconductor device |
| CN102781168A (en) * | 2012-07-24 | 2012-11-14 | 中山市达进电子有限公司 | Manufacturing method for golden fingerboard without lead wire |
| CN204854698U (en) * | 2015-07-29 | 2015-12-09 | 山西春雷铜材有限责任公司 | Copper strips warpage measuring device for lead frame |
| CN105682348A (en) * | 2016-03-08 | 2016-06-15 | 深圳崇达多层线路板有限公司 | Fabrication method for printed circuit board (PCB) with gold finger of which three surfaces coated with gold |
| CN109506598A (en) * | 2018-11-19 | 2019-03-22 | 信利光电股份有限公司 | A kind of plate testing flatness method and device |
| CN110351955A (en) * | 2019-06-17 | 2019-10-18 | 江门崇达电路技术有限公司 | A kind of production method of the PCB with local electric thick gold PAD |
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| Publication number | Publication date |
|---|---|
| CN113532336B (en) | 2024-01-30 |
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