CN109506598A - A kind of plate testing flatness method and device - Google Patents
A kind of plate testing flatness method and device Download PDFInfo
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- CN109506598A CN109506598A CN201811376558.4A CN201811376558A CN109506598A CN 109506598 A CN109506598 A CN 109506598A CN 201811376558 A CN201811376558 A CN 201811376558A CN 109506598 A CN109506598 A CN 109506598A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
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Abstract
The invention discloses a kind of plate testing flatness method and devices.The present invention is using flatness reference substance as reference, the difference in height between each reference point and the measurement point in each region to be measured is measured by tool metallographic microscope, the difference of maximum difference in height and the smallest difference in height is exactly the flatness of plate, entire test process is not necessarily to exclusively with testing flatness instrument, but the tool metallographic microscope and flatness reference substance common using circuit board plant and Mo Zu factory, implementation is simple, without specially purchasing testing flatness instrument, it is at low cost, it is expensive to solve current testing flatness instrument, when circuit board plant or Mo Zu factory etc. can not normally be monitored if without this equipment production material or supplied materials flatness the technical issues of.
Description
Technical field
The present invention relates to Material Testing Technology field more particularly to a kind of plate testing flatness method and devices.
Background technique
Circuit board plant or Mo Zu factory etc. need flat by specially testing at present in order to monitor the flatness for producing material or supplied materials
The testing flatness instrument of whole degree carries out testing flatness.
But currently marketed testing flatness instrument is expensive, popularity is low, when circuit board plant or Mo Zu factory etc.
The flatness of production material or supplied materials can not be normally monitored if without this equipment.
Therefore, it is expensive to result in current testing flatness instrument, if when circuit board plant or Mo Zu factory etc. are without this
Equipment then can not normally monitor the technical issues of flatness for producing material or supplied materials.
Summary of the invention
The present invention provides a kind of plate testing flatness method and devices, solve current testing flatness instrument price
Valuableness, when circuit board plant or Mo Zu factory etc. can not normally monitor the skill of the flatness of production material or supplied materials if without this equipment
Art problem.
The present invention provides a kind of plate testing flatness methods, comprising:
Plate: being placed in the detection platform of tool metallographic microscope by S1, and flatness reference substance is placed on the of plate
One preset regions, choose the reference point of the first preset quantity in flatness reference substance, and it is pre- to choose second in the region to be measured of plate
Set the measurement point of quantity；
S2: the difference in height of each reference point Yu each tested point is measured respectively by tool metallographic microscope；
S3: the maximum difference in height that measurement obtains is subtracted into the smallest difference in height and obtains the flatness of plate.
Preferably, step S2 is specifically included:
S21: adjust tool metallographic microscope FA selector bar call for auxiliary judgment optical point and observation point whether
Conplane first rectangular patterns, wherein when optical point and observation point be not in same plane, the first rectangular patterns are separated into
Second rectangular patterns and third rectangular patterns, when optical point and observation point are in same plane, the second rectangular patterns and third square
Shape pattern is merged into complete first rectangular patterns；
S22: observation point is adjusted at i-th of reference point by the X/Y axis mobile bar for adjusting tool metallographic microscope, adjusts Z
Axis focusing handwheel is merged into complete first rectangular patterns up to the second rectangular patterns and third rectangular patterns, and tool metallographic is shown
The Z axis zeroing data of the timer display unit of micro mirror, the initial value of i are 1；
S23: observation point is adjusted to j-th of measurement point by the X/Y axis mobile bar for adjusting tool metallographic microscope, adjusts Z
For axis focusing handwheel until the second rectangular patterns and third rectangular patterns are merged into complete first rectangular patterns, record timer is aobvious
Show that the Z axis data in portion obtain the difference in height of i-th of reference point and j-th of measurement point, the initial value of j is 1；
S24: judge whether j is equal to jmax, if so, S25 is thened follow the steps, if it is not, then the numerical value of j adds 1, return step
S23, wherein jmaxFor the second preset quantity；
S25: judge whether i is equal to imax, if so, S3 is thened follow the steps, if it is not, then the numerical value of i adds 1, return step S22,
Wherein, imaxFor the first preset quantity.
Preferably, before step S1 further include: step S0；
S0: tool metallographic microscope is initialized.
Preferably, flatness reference substance is specially optics sensor.
Preferably, plate is specially wiring board.
The present invention provides a kind of plate testing flatness devices, comprising:
With reference to selection unit, for plate to be placed in the detection platform of tool metallographic microscope, by flatness reference substance
The first preset regions of plate are placed on, the reference point of the first preset quantity are chosen in flatness reference substance, in the to be measured of plate
Choose the measurement point of the second preset quantity in region；
Height measurement unit, for measuring the height of each reference point Yu each tested point respectively by tool metallographic microscope
It is poor to spend；
Smooth computing unit, the maximum difference in height for obtaining measurement subtract the smallest difference in height and obtain the flat of plate
Whole degree.
Preferably, height measurement unit specifically includes:
Subelement is assisted, the FA selector bar for adjusting tool metallographic microscope is called for auxiliary judgment optical point and sight
Whether measuring point is in conplane first rectangular patterns, wherein when optical point and observation point be not in same plane, the first rectangle
Pattern is separated into the second rectangular patterns and third rectangular patterns, when optical point and observation point are in same plane, the second histogram
Case and third rectangular patterns are merged into complete first rectangular patterns；
With reference to subelement, observation point is adjusted to i-th of reference by the X/Y axis mobile bar for adjusting tool metallographic microscope
At point, adjusting Z axis focusing handwheel is merged into complete first rectangular patterns up to the second rectangular patterns and third rectangular patterns, will
The Z axis zeroing data of the timer display unit of tool metallographic microscope, the initial value of i are 1；
Observation point is adjusted to j-th of measurement by difference subelement, the X/Y axis mobile bar for adjusting tool metallographic microscope
At point, adjusting Z axis focusing handwheel is merged into complete first rectangular patterns up to the second rectangular patterns and third rectangular patterns, remembers
The Z axis data of record timer display unit obtain the difference in height of i-th of reference point and j-th of measurement point, and the initial value of j is 1；
Judgment sub-unit, for judging whether j is equal to jmax, if so, triggering returns to subelement, if it is not, the then numerical value of j
Add 1, triggers difference subelement, wherein jmaxFor the second preset quantity；
Subelement is returned to, for judging whether i is equal to imax, if so, smooth computing unit is triggered, if it is not, the then number of i
Value plus 1, triggering refer to subelement, wherein imaxFor the first preset quantity.
Preferably, further includes: tool initial cell；
Tool initial cell, for being initialized to tool metallographic microscope.
Preferably, flatness reference substance is specially optics sensor.
Preferably, plate is specially wiring board.
As can be seen from the above technical solutions, the invention has the following advantages that
The present invention provides a kind of plate testing flatness methods, comprising: S1: plate is placed in tool metallographic microscope
Detection platform, flatness reference substance is placed on to the first preset regions of plate, is chosen in flatness reference substance first preset
The reference point of quantity chooses the measurement point of the second preset quantity in the region to be measured of plate；S2: pass through tool metallographic microscope point
The difference in height of each reference point Yu each tested point is not measured；S3: the maximum difference in height that measurement obtains is subtracted into the smallest height
Degree difference obtains the flatness of plate.
The present invention using flatness reference substance as reference, by tool metallographic microscope measure each reference point and it is each to
The difference of difference in height between the measurement point in survey region, maximum difference in height and the smallest difference in height is exactly the smooth of plate
Degree, entire test process are not necessarily to exclusively with testing flatness instrument, but the tool gold common using circuit board plant and Mo Zu factory
Phase microscope and flatness reference substance, implementation is simple, at low cost without specially purchasing testing flatness instrument, solves and works as
Preceding testing flatness instrument is expensive, when circuit board plant or Mo Zu factory etc. can not normally monitor production if without this equipment
The technical issues of flatness of material or supplied materials.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention without any creative labor, may be used also for those of ordinary skill in the art
To obtain other attached drawings according to these attached drawings.
Fig. 1 is a kind of process signal of one embodiment of plate testing flatness method provided in an embodiment of the present invention
Figure；
Fig. 2 is a kind of process signal of another embodiment of plate testing flatness method provided in an embodiment of the present invention
Figure；
Fig. 3 is a kind of structural representation of one embodiment of plate testing flatness device provided in an embodiment of the present invention
Figure.
Specific embodiment
The embodiment of the invention provides a kind of plate testing flatness method and devices, solve current testing flatness
Instrument is expensive, when circuit board plant or Mo Zu factory etc. can not normally be monitored if without this equipment production material or supplied materials it is smooth
The technical issues of spending.
In order to make the invention's purpose, features and advantages of the invention more obvious and easy to understand, below in conjunction with the present invention
Attached drawing in embodiment, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that disclosed below
Embodiment be only a part of the embodiment of the present invention, and not all embodiment.Based on the embodiments of the present invention, this field
Those of ordinary skill's all other embodiment obtained without making creative work, belongs to protection of the present invention
Range.
Referring to Fig. 1, the embodiment of the invention provides a kind of one embodiment of plate testing flatness method, comprising:
Step 101: plate being placed in the detection platform of tool metallographic microscope, flatness reference substance is placed on plate
The first preset regions, choose the reference point of the first preset quantity in flatness reference substance, choose the in the region to be measured of plate
The measurement point of two preset quantities；
It should be noted that plate, which is placed in tool, carries out microscopical detection platform, flatness reference substance is placed
The first preset regions of progress flatness detection are not needed in plate；
It is as a reference point in the point that flatness reference substance chooses the first preset quantity, the is chosen in the area to be tested of plate
The test point of two preset quantities；
First preset quantity and the second preset quantity pass through actual needs respectively and are determined, and such as the first preset quantity selects
It is 8, the second preset quantity is selected as 16.
Step 102: measuring the difference in height of each reference point Yu each tested point respectively by tool metallographic microscope；
It should be noted that tool, which carries out microscope, can obtain the Z axis seat of each point by adjusting Z axis focusing handwheel
Mark, the difference in height of each reference point Yu each tested point is calculated by Z axis measurement of coordinates.
Step 103: the maximum difference in height that measurement obtains being subtracted into the smallest difference in height and obtains the flatness of plate.
It should be noted that because of the difference in height of each reference point and each tested point obtained in step 102, and plate
Flatness be difference in plate between maximum height of projection and minimum height of projection, so the maximum for needing to obtain measurement
Difference in height subtract the smallest difference in height and obtain the flatness of plate.
The present embodiment using flatness reference substance as reference, by tool metallographic microscope measure each reference point with it is each
The difference of difference in height between the measurement point in region to be measured, maximum difference in height and the smallest difference in height is exactly the flat of plate
Whole degree, entire test process are not necessarily to exclusively with testing flatness instrument, but the tool common using circuit board plant and Mo Zu factory
Metallographic microscope and flatness reference substance, implementation is simple, at low cost without specially purchasing testing flatness instrument, solves
Current testing flatness instrument is expensive, when circuit board plant or Mo Zu factory etc. can not normally monitor life if without this equipment
The technical issues of flatness of production material or supplied materials.
The above are a kind of one embodiment of plate testing flatness method provided in an embodiment of the present invention, and the following are this hairs
A kind of another embodiment for plate testing flatness method that bright embodiment provides.
Referring to Fig. 2, the embodiment of the invention provides a kind of another embodiment of plate testing flatness method, packet
It includes:
Step 201: tool metallographic microscope is initialized；
It should be noted that needing to initialize tool metallographic microscope before being detected, selection is closed
Suitable eyepiece and object lens, by the detection platform of tool metallographic microscope and the height adjustment of object lens to suitable height, such as routinely
Select 20 times of object lens.
Step 202: plate being placed in the detection platform of tool metallographic microscope, flatness reference substance is placed on plate
The first preset regions, choose the reference point of the first preset quantity in flatness reference substance, choose the in the region to be measured of plate
The measurement point of two preset quantities；
It should be noted that plate to be placed in the detection platform of tool metallographic microscope, flatness reference substance is placed
In the first preset regions of plate, choose the reference point of the first preset quantity in flatness reference substance, the first preset quantity according to
Actual needs is selected, and the first preset quantity is such as selected as 8, then 8 reference points can mark as to D8；
The measurement point of the second preset quantity is chosen in the region to be measured of plate, the second preset quantity carries out according to actual needs
Selection, is such as selected as 8 for the second preset quantity, then 8 measurement points can mark as to L8.
Step 203: the FA selector bar for adjusting tool metallographic microscope is called is for auxiliary judgment optical point and observation point
It is no in conplane first rectangular patterns, wherein when optical point and observation point be not in same plane, the first rectangular patterns point
From at the second rectangular patterns and third rectangular patterns, when optical point and observation point are in same plane, the second rectangular patterns and
Three rectangular patterns are merged into complete first rectangular patterns；
It should be noted that the FA selector bar for adjusting tool metallographic microscope calls the first rectangular patterns, the first histogram
Whether case can be used for auxiliary judgment optical point and observation point in same plane, when optical point and observation point be not in same plane
When, the first rectangular patterns are separated into the second rectangular patterns and third rectangular patterns；
When optical point and observation point are in same plane, the second rectangular patterns and third rectangular patterns are merged into complete
One rectangular patterns；
When tool metallographic microscope view refernce point, then observation point is reference point, when tool metallography microscope sem observation is joined
When examination point, then observation point is measurement point.
Step 204: observation point is adjusted at i-th of reference point by the X/Y axis mobile bar for adjusting tool metallographic microscope, is adjusted
Section Z axis focusing handwheel is until the second rectangular patterns and third rectangular patterns are merged into complete first rectangular patterns, by tool gold
The Z axis zeroing data of the timer display unit of phase microscope, the initial value of i are 1；
It should be noted that observation point is adjusted to i-th of reference point by the X/Y axis mobile bar for adjusting tool metallographic microscope
Place, adjusts Z axis focusing handwheel until the second rectangular patterns and third rectangular patterns are merged into complete first rectangular patterns, then this
When optical point be generally aligned in the same plane with reference point；
It, then can be high with the Z axis of reference point at this time by the Z axis zeroing data of the timer display unit of tool metallographic microscope
Degree is Z axis zero point, is convenient for subsequent data record.
Step 205: observation point is adjusted to j-th of measurement point by the X/Y axis mobile bar for adjusting tool metallographic microscope, is adjusted
Section Z axis focusing handwheel is until the second rectangular patterns and third rectangular patterns are merged into complete first rectangular patterns, when recording gauge
The Z axis data of device display unit obtain the difference in height of i-th of reference point and j-th of measurement point, and the initial value of j is 1；
It should be noted that observation point is adjusted to j-th of measurement point by the X/Y axis mobile bar for adjusting tool metallographic microscope
Place, adjusts Z axis focusing handwheel until the second rectangular patterns and third rectangular patterns are merged into complete first rectangular patterns, then this
When optical point and measurement point position in approximately the same plane；
The Z axis data of j-th of measurement point are exactly the Z axis difference in height of j-th of measurement point Yu i-th of reference point at this time.
Step 206: judging whether j is equal to jmax, if so, thening follow the steps 207, if it is not, then the numerical value of j adds 1, return to step
Rapid 205, wherein jmaxFor the second preset quantity；
It should be noted that judging whether j is equal to jmax, if it is, explanation has measured i-th of reference point and institute
There is the difference in height of measurement point, thens follow the steps 207；
If it is not, then the difference in height of explanation also unmeasured complete i-th of reference point and all measurement points, then the numerical value of j adds 1,
Next measurement point return step 205 is replaced to continue to measure difference in height.
Step 207: judging whether i is equal to imax, if so, thening follow the steps 208, if it is not, then the numerical value of i adds 1, return to step
Rapid 204, wherein imaxFor the first preset quantity；
It should be noted that needing to judge if having measured the difference in height of i-th of reference point Yu all measurement points
Whether i is equal to imax, finished if so, illustrating that the difference in height of each reference point and each measurement point has all measured, execute step
208；
If it is not, then illustrating that then the numerical value of i adds 1, replaces next ginseng there are also the unmeasured difference in height with measurement point of reference point
Examination point return step 204 continues to measure.
Step 208: the maximum difference in height that measurement obtains being subtracted into the smallest difference in height and obtains the flatness of plate.
It should be noted that can be obtained when the difference in height of each reference point and each measurement point has all been measured and finished
The maximum difference in height that measurement obtains is subtracted the smallest difference in height and obtained by maximum difference in height and the smallest difference in height out
The flatness of plate, such as when the calculation formula of flatness are as follows:
P=max (H11、H11、H11、...、Hij、...、H88)-min(H11、H11、H11、...、Hij、...、H88)
Wherein, HijFor the difference in height of i-th reference point and j-th of measurement point；
The flatness the big, illustrates that plate surface is more coarse, flatness is bad.
Further, flatness reference substance is specially optics sensor.
It should be noted that the requirement on machining accuracy of optics sensor (sensitive chip) is higher, and in each circuit board plant
Or it can be easy to seek in Mo Zu factory, it is possible to using optics sensor as flatness reference substance；
It is also an option that the preferable object of other flatness is as flatness reference substance in actual application.
Further, plate is specially wiring board.
It should be noted that plate to be detected can be wiring board, optics sensor is such as placed to the DIE of assist side
The windowing area of wiring board and the flatness in HOLDER (pedestal) area are detected by (chip) area, but can not in actual application
It is limited to wiring board, other kinds of plate can also be detected by the method.
Using flatness reference substance as reference in the present embodiment, by each reference point of tool metallographic microscope measurement and respectively
The difference of difference in height between the measurement point in a region to be measured, maximum difference in height and the smallest difference in height is exactly plate
Flatness, entire test process are not necessarily to exclusively with testing flatness instrument, but the work common using circuit board plant and Mo Zu factory
Having metallographic microscope and flatness reference substance, implementation is simple, and it is at low cost without specially purchasing testing flatness instrument, it solves
Current testing flatness instrument is expensive, when circuit board plant or Mo Zu factory etc. can not be monitored normally if without this equipment
The technical issues of flatness of production material or supplied materials.
The above are a kind of another embodiments of plate testing flatness method provided in an embodiment of the present invention, and the following are this
A kind of one embodiment for plate testing flatness device that inventive embodiments provide.
Referring to Fig. 3, the embodiment of the invention provides a kind of one embodiment of plate testing flatness device, comprising:
Flatness is referred to for plate to be placed in the detection platform of tool metallographic microscope with reference to selection unit 301
Object is placed on the first preset regions of plate, chooses the reference point of the first preset quantity in flatness reference substance, plate to
Survey the measurement point that the second preset quantity is chosen in region；
Height measurement unit 302, for measuring each reference point and each tested point respectively by tool metallographic microscope
Difference in height；
Smooth computing unit 303, the maximum difference in height for obtaining measurement subtract the smallest difference in height and obtain plate
Flatness.
Further, height measurement unit 302 specifically includes:
Subelement 3021 is assisted, the FA selector bar for adjusting tool metallographic microscope is called for auxiliary judgment optical point
With observation point whether in conplane first rectangular patterns, wherein when optical point and observation point be not in same plane, first
Rectangular patterns are separated into the second rectangular patterns and third rectangular patterns, when optical point and observation point are in same plane, the second square
Shape pattern and third rectangular patterns are merged into complete first rectangular patterns；
With reference to subelement 3022, observation point is adjusted to i-th by the X/Y axis mobile bar for adjusting tool metallographic microscope
At reference point, Z axis focusing handwheel is adjusted until the second rectangular patterns and third rectangular patterns are merged into complete first histogram
Case, by the Z axis zeroing data of the timer display unit of tool metallographic microscope, the initial value of i is 1；
Observation point is adjusted to j-th by difference subelement 3023, the X/Y axis mobile bar for adjusting tool metallographic microscope
Measurement point adjusts Z axis focusing handwheel until the second rectangular patterns and third rectangular patterns are merged into complete first histogram
The Z axis data of case, record timer display unit obtain the difference in height of i-th of reference point and j-th of measurement point, and the initial value of j is
1；
Judgment sub-unit 3024, for judging whether j is equal to jmax, if so, triggering returns to subelement 3025, if it is not, then
The numerical value of j adds 1, triggers difference subelement 3023, wherein jmaxFor the second preset quantity；
Subelement 3025 is returned to, for judging whether i is equal to imax, if so, smooth computing unit 303 is triggered, if it is not,
Then the numerical value of i adds 1, and triggering refers to subelement 3022, wherein imaxFor the first preset quantity.
Further, further includes: tool initial cell 300；
Tool initial cell 300, for being initialized to tool metallographic microscope.
Further, flatness reference substance is specially optics sensor.
Further, plate is specially wiring board.
It is apparent to those skilled in the art that for convenience and simplicity of description, the system of foregoing description,
The specific work process of device and unit, can refer to corresponding processes in the foregoing method embodiment, and details are not described herein.
In several embodiments provided herein, it should be understood that disclosed system, device and method can be with
It realizes by another way.For example, the apparatus embodiments described above are merely exemplary, for example, the unit
It divides, only a kind of logical function partition, there may be another division manner in actual implementation, such as multiple units or components
It can be combined or can be integrated into another system, or some features can be ignored or not executed.Another point, it is shown or
The mutual coupling, direct-coupling or communication connection discussed can be through some interfaces, the indirect coupling of device or unit
It closes or communicates to connect, can be electrical property, mechanical or other forms.
The unit as illustrated by the separation member may or may not be physically separated, aobvious as unit
The component shown may or may not be physical unit, it can and it is in one place, or may be distributed over multiple
In network unit.It can select some or all of unit therein according to the actual needs to realize the mesh of this embodiment scheme
's.
It, can also be in addition, the functional units in various embodiments of the present invention may be integrated into one processing unit
It is that each unit physically exists alone, can also be integrated in one unit with two or more units.Above-mentioned integrated list
Member both can take the form of hardware realization, can also realize in the form of software functional units.
If the integrated unit is realized in the form of SFU software functional unit and sells or use as independent product
When, it can store in a computer readable storage medium.Based on this understanding, technical solution of the present invention is substantially
The all or part of the part that contributes to existing technology or the technical solution can be in the form of software products in other words
It embodies, which is stored in a storage medium, including some instructions are used so that a computer
Equipment (can be personal computer, server or the network equipment etc.) executes the complete of each embodiment the method for the present invention
Portion or part steps.And storage medium above-mentioned includes: USB flash disk, mobile hard disk, read-only memory (ROM, Read-Only
Memory), random access memory (RAM, Random Access Memory), magnetic or disk etc. are various can store journey
The medium of sequence code.
The above, the above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although referring to before
Stating embodiment, invention is explained in detail, those skilled in the art should understand that: it still can be to preceding
Technical solution documented by each embodiment is stated to modify or equivalent replacement of some of the technical features；And these
It modifies or replaces, the spirit and scope for technical solution of various embodiments of the present invention that it does not separate the essence of the corresponding technical solution.
Claims (10)
1. a kind of plate testing flatness method characterized by comprising
Plate: being placed in the detection platform of tool metallographic microscope by S1, and flatness reference substance is placed on the first pre- of plate
Region is set, chooses the reference point of the first preset quantity in flatness reference substance, chooses the second preset number in the region to be measured of plate
The measurement point of amount；
S2: the difference in height of each reference point Yu each tested point is measured respectively by tool metallographic microscope；
S3: the maximum difference in height that measurement obtains is subtracted into the smallest difference in height and obtains the flatness of plate.
2. a kind of plate testing flatness method according to claim 1, which is characterized in that step S2 is specifically included:
S21: whether the FA selector bar for adjusting tool metallographic microscope calls for auxiliary judgment optical point and observation point same
First rectangular patterns of plane, wherein when optical point and observation point be not in same plane, the first rectangular patterns are separated into second
Rectangular patterns and third rectangular patterns, when optical point and observation point are in same plane, the second rectangular patterns and third histogram
Case is merged into complete first rectangular patterns；
S22: observation point is adjusted at i-th of reference point by the X/Y axis mobile bar for adjusting tool metallographic microscope, adjusts Z axis tune
Burnt handwheel is until the second rectangular patterns and third rectangular patterns are merged into complete first rectangular patterns, by tool metallographic microscope
Timer display unit Z axis zeroing data, the initial value of i is 1；
S23: observation point is adjusted to j-th of measurement point by the X/Y axis mobile bar for adjusting tool metallographic microscope, adjusts Z axis tune
Burnt handwheel is until the second rectangular patterns and third rectangular patterns are merged into complete first rectangular patterns, record timer display unit
Z axis data obtain the difference in height of i-th of reference point and j-th of measurement point, the initial value of j is 1；
S24: judge whether j is equal to jmax, if so, S25 is thened follow the steps, if it is not, then the numerical value of j adds 1, return step S23,
In, jmaxFor the second preset quantity；
S25: judge whether i is equal to imax, if so, S3 is thened follow the steps, if it is not, then the numerical value of i adds 1, return step S22,
In, imaxFor the first preset quantity.
3. a kind of plate testing flatness method according to claim 1, which is characterized in that before step S1 further include:
Step S0；
S0: tool metallographic microscope is initialized.
4. a kind of plate testing flatness method according to claim 1, which is characterized in that flatness reference substance is specially
Optics sensor.
5. a kind of plate testing flatness method according to claim 1, which is characterized in that plate is specially wiring board.
6. a kind of plate testing flatness device characterized by comprising
With reference to selection unit, for plate to be placed in the detection platform of tool metallographic microscope, flatness reference substance is placed
In the first preset regions of plate, the reference point of the first preset quantity is chosen in flatness reference substance, in the region to be measured of plate
Choose the measurement point of the second preset quantity；
Height measurement unit, for measuring the height of each reference point Yu each tested point respectively by tool metallographic microscope
Difference；
Smooth computing unit, the maximum difference in height for obtaining measurement subtract the smallest difference in height and obtain the smooth of plate
Degree.
7. a kind of plate testing flatness device according to claim 6, which is characterized in that height measurement unit is specifically wrapped
It includes:
Subelement is assisted, the FA selector bar for adjusting tool metallographic microscope is called for auxiliary judgment optical point and observation point
Whether in conplane first rectangular patterns, wherein when optical point and observation point be not in same plane, the first rectangular patterns
Be separated into the second rectangular patterns and third rectangular patterns, when optical point and observation point are in same plane, the second rectangular patterns and
Third rectangular patterns are merged into complete first rectangular patterns；
With reference to subelement, observation point is adjusted to i-th of reference point by the X/Y axis mobile bar for adjusting tool metallographic microscope
Place adjusts Z axis focusing handwheel until the second rectangular patterns and third rectangular patterns are merged into complete first rectangular patterns, by work
Has the Z axis zeroing data of the timer display unit of metallographic microscope, the initial value of i is 1；
Observation point is adjusted to j-th of measurement point by difference subelement, the X/Y axis mobile bar for adjusting tool metallographic microscope
Place, adjusting Z axis focusing handwheel are merged into complete first rectangular patterns up to the second rectangular patterns and third rectangular patterns, record
The Z axis data of timer display unit obtain the difference in height of i-th of reference point and j-th of measurement point, and the initial value of j is 1；
Judgment sub-unit, for judging whether j is equal to jmax, if so, triggering returns to subelement, if it is not, then the numerical value of j adds 1,
Trigger difference subelement, wherein jmaxFor the second preset quantity；
Subelement is returned to, for judging whether i is equal to imax, if so, smooth computing unit is triggered, if it is not, then the numerical value of i adds
1, triggering refers to subelement, wherein imaxFor the first preset quantity.
8. a kind of plate testing flatness device according to claim 6, which is characterized in that further include: tool is initially single
Member；
Tool initial cell, for being initialized to tool metallographic microscope.
9. a kind of plate testing flatness device according to claim 6, which is characterized in that flatness reference substance is specially
Optics sensor.
10. a kind of plate testing flatness device according to claim 6, which is characterized in that plate is specially wiring board.
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