CN103115590A - PCB (printed circuit board) smoothness detection method - Google Patents

PCB (printed circuit board) smoothness detection method Download PDF

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Publication number
CN103115590A
CN103115590A CN 201310028967 CN201310028967A CN103115590A CN 103115590 A CN103115590 A CN 103115590A CN 201310028967 CN201310028967 CN 201310028967 CN 201310028967 A CN201310028967 A CN 201310028967A CN 103115590 A CN103115590 A CN 103115590A
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CN
China
Prior art keywords
pcb
pcb board
planeness
laser
welding
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Application number
CN 201310028967
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Chinese (zh)
Inventor
刘涛
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浪潮电子信息产业股份有限公司
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Priority to CN 201310028967 priority Critical patent/CN103115590A/en
Publication of CN103115590A publication Critical patent/CN103115590A/en

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Abstract

The invention provides a PCB (printed circuit board) smoothness detection method. The detection method particularly includes: step 1, dividing a plane area of a PCB before the PCB enters the welding process; step 2, projecting a laser on the surface of the PCB, and obtaining curvature change data values of the PCB in each area; step 3, judging whether the curvature change data values meet a PCB deformation judging threshold value after obtaining the curvature change data values of the PCB; and step 4, recording judging data, and giving out user reminders for the areas with nonuniform smoothness. Compared with the prior art, by the PCB smoothness detection method, uniformity of welding smoothness can be effectively guaranteed, and instantaneity, reliability and stability in PCB smoothness detection are realized.

Description

A kind of pcb board measurement method of planeness

Technical field

The present invention relates to the computer communication technology field, specifically the pcb board measurement method of planeness of a kind of real-time that guarantees the PCB flatness, reliability, Detection of Stability.

Background technology

on current server master board, density of components is more and more higher, processor socket load bearing seat with 1356 2011 even higher welding pin pin is used more and more extensive on server master board, the network chip of a same hundreds of welding pin also is configured on server master board, pin number so numerous devices all adopts SMD paster welding manner at present, because the flatness on the welding pin plane of device to be welded is higher, when device is welded on pcb board, because the pcb board layer is thinner, and easily distortion, if on the pcb board of device welding and distortion, cause PCB and welding pin plane disengaging, cause the sky weldering of chip, rosin joint etc., therefore often needed the flatness of PCB is checked before welding.

Current flatness inspection to PCB substantially depend on artificial visual surface inspection, this mode can't guarantee to weld the consistance of flatness, the BGA welding region larger for the deformation fluctuation also can't guarantee welding quality by emphasis, quickening along with signal speed, the problems of Signal Integrity that the inconsistent problem of welding that welding plane out-of-flatness brings is brought is more and more serious, and the welding inconsistence problems that welding plane out-of-flatness brings becomes the key factor that affects signal quality.Along with server master board components and parts soldering reliability is required constantly to increase, in order to guarantee data stabilization transmission between server master board welding device, in the welding process of server master board device, stablize effective pcb board flatness and detect particularly importantly, and become and determine one of welding quality key element.

The problems referred to above that run in detecting for current PC B plate flatness need a kind of novel pcb board measurement method of planeness.

Summary of the invention

Technical assignment of the present invention is to solve the deficiencies in the prior art, and a kind of pcb board measurement method of planeness that guarantees to weld flatness is provided.

Technical scheme of the present invention realizes in the following manner, this a kind of pcb board measurement method of planeness, and its concrete testing process is:

Step 1, before pcb board enters welding sequence, its plane domain is divided;

Step 2, with laser projection in pcb board surface, obtain the bending change data value of pcb board in each zone;

Step 3, obtain pcb board bending change data value after, judge whether to satisfy PCB deformation decision threshold;

Step 4, record above-mentioned judgement data, for the inconsistent zone of flatness, provide user's prompting.

The detailed process of described step 1 is: will weld plane domain and be divided, and that is to say, and contain complete welding device area in different zonings.

The detailed process of described step 2 is: laser projection is surperficial in pcb board, obtain the surface level reference point to the distance on pcb board to be measured surface, the surface level reference point here refers to laser and sends a little, in ranging process, the position of this surface level reference point on vertical coordinate is constant, obtains pcb board with respect to the bending change of this constant coordinate position with this.

In above-mentioned laser ranging, adopt programmable logic controller (PLC) to control laser and move in the scanning on pcb board surface, and adopt two dimensions to come respectively the independent laser of controlling in the movement on PCB surface, be i.e. side-to-side movement and seesawing; Laser ranging when at the uniform velocity carrying out forward, is carried out reciprocal amplitude of oscillation motion on the dimension of left and right on the dimension of front and back, movement locus is realized " Z " font propulsion mode.

The detailed process of described step 3 is: after the pcb board bending change value set that obtains, determine the judgment threshold of PCB deformation according to the dense degree of the pin number of master chip and solder joint in the zone, the crooked deviation of PCB in survey zone is over the judgment threshold of this PCB deformation, points out user this position to have the risk of failure welding.

The judgement of described PCB deformation is to complete by data processing centre (DPC), and programmable logic controller (PLC) sends the data value that collects to this data processing centre (DPC), and the flatness that this data processing centre (DPC) sets according to the zone requires to judge.

Described data processing centre (DPC) refers to the microprocessor dsp chip.

The beneficial effect that the present invention compared with prior art produces is:

A kind of pcb board measurement method of planeness of the present invention utilizes a kind of pcb board measurement method of planeness based on laser ranging, change the artificial visual surface inspection of current dependence and complete the mode that the flatness of PCB checks, guarantee the consistance of welding flatness, realized real-time, reliability, the Detection of Stability of the flatness of PCB.

Description of drawings

Accompanying drawing 1 is implementing procedure schematic diagram of the present invention.

Embodiment

Below in conjunction with accompanying drawing, a kind of pcb board measurement method of planeness of the present invention is described in detail below.

The present invention is with laser ranging theory support point, utilize a kind of pcb board measurement method of planeness based on laser ranging, that solves current flatness inspection to PCB depends on artificial visual surface inspection substantially, and this mode can guarantee to weld consistance, the welding quality of flatness.As shown in Figure 1, this a kind of pcb board measurement method of planeness, its concrete testing process is:

Step 1, before pcb board enters welding sequence, its plane domain is divided;

Step 2, with laser projection in pcb board surface, obtain the bending change data value of pcb board in each zone;

Step 3, obtain pcb board bending change data value after, judge whether to satisfy PCB deformation decision threshold;

Step 4, record above-mentioned judgement data, for the inconsistent zone of flatness, provide user's prompting.

The detailed process of described step 1 is: before pcb board enters welding sequence, to weld plane domain is divided, contain complete welding device area in different zonings, division principle is as much as possiblely to comprise complete bga chip therein, over the single-chip more than 100, self is namely as a zoning for BGA pin; Divide validity and efficient for improving, for capacitance-resistance one class, the insensitive welding region of regional flatness is enlarged as much as possible; The smooth consistance on the welding plane of bga chip can be guaranteed after division, the testing efficiency of de-militarized zone can be promoted again.

The detailed process of described step 2 is: laser projection is surperficial in pcb board, obtain the surface level reference point to the distance on pcb board to be measured surface, the surface level reference point here refers to laser and sends a little, in ranging process, the position of this surface level reference point on vertical coordinate is constant, obtains pcb board with respect to the bending change of this constant coordinate position with this.

In above-mentioned laser ranging, adopting programmable logic controller (PLC) to control laser moves in the scanning on pcb board surface, for obtaining PCB surface position information as much as possible, simultaneously for accelerate and laser in the scan efficiency on PCB surface, adopt two dimensions to come respectively the independent laser of controlling in the movement on PCB surface, i.e. side-to-side movement and seesawing; Laser ranging when at the uniform velocity carrying out forward, is carried out reciprocal amplitude of oscillation motion on the dimension of left and right on the dimension of front and back; Movement locus is realized " Z " font propulsion mode, very big like this efficient and the regional coverage that improves scanning.

the detailed process of described step 3 is: after obtaining the regional ensemble of pcb board bending change degree, determine the judgment threshold of PCB deformation according to the dense degree of the pin number of master chip and solder joint in the zone, according to the requirement of chip to the welding flatness, as bga chip solder joint more in the zone, what the judgment threshold of PCB deformation was transferred should hang down, the crooked deviation of PCB in survey zone is over the judgment threshold of this PCB deformation, point out user this position to have the risk of failure welding, the rosin joint that the user is revised in advance avoid the crooked deviation of PCB to be brought, empty weldering problem, and then guarantee welding quality.

The judgement of described PCB deformation is to complete by data processing centre (DPC), and programmable logic controller (PLC) sends the data value that collects to this data processing centre (DPC), and the flatness that this data processing centre (DPC) sets according to the zone requires to judge.

Described data processing centre (DPC) refers to the microprocessor dsp chip.

Through top detailed enforcement, we can carry out the detection that under system, the pcb board flatness changes very easily, not only reached the requirement of real-time that flatness detects, and saved the manual detection cost, improve testing efficient and accuracy, improved the reliability and stability of welding quality.

Except the described technical characterictic of instructions, be the known technology of those skilled in the art.

Claims (7)

1. pcb board measurement method of planeness, it is characterized in that: its concrete testing process is:
Step 1, before pcb board enters welding sequence, its plane domain is divided;
Step 2, with laser projection in pcb board surface, obtain the bending change data value of pcb board in each zone;
Step 3, obtain pcb board bending change data value after, judge whether to satisfy PCB deformation decision threshold;
Step 4, record above-mentioned judgement data, for the inconsistent zone of flatness, provide user's prompting.
2. a kind of pcb board measurement method of planeness according to claim 1, it is characterized in that: the detailed process of described step 1 is: will weld plane domain and be divided, and that is to say, and contain complete welding device area in different zonings.
3. a kind of pcb board measurement method of planeness according to claim 1, it is characterized in that: the detailed process of described step 2 is: laser projection is surperficial in pcb board, obtain the surface level reference point to the distance on pcb board to be measured surface, the surface level reference point here refers to laser and sends a little, in ranging process, the position of this surface level reference point on vertical coordinate is constant, obtains pcb board with respect to the bending change of this constant coordinate position with this.
4. a kind of pcb board measurement method of planeness according to claim 3, it is characterized in that: in above-mentioned laser ranging, adopting programmable logic controller (PLC) to control laser moves in the scanning on pcb board surface, and adopt two dimensions to come respectively the independent laser of controlling in the movement on PCB surface, i.e. side-to-side movement and seesawing; Laser ranging when at the uniform velocity carrying out forward, is carried out reciprocal amplitude of oscillation motion on the dimension of left and right on the dimension of front and back, movement locus is realized " Z " font propulsion mode.
5. a kind of pcb board measurement method of planeness according to claim 1, it is characterized in that: the detailed process of described step 3 is: after the pcb board bending change value set that obtains, determine the judgment threshold of PCB deformation according to the dense degree of the pin number of master chip and solder joint in the zone, the crooked deviation of PCB in survey zone is over the judgment threshold of this PCB deformation, points out user this position to have the risk of failure welding.
6. a kind of pcb board measurement method of planeness according to claim 5, it is characterized in that: the judgement of described PCB deformation is to complete by data processing centre (DPC), programmable logic controller (PLC) sends the data value that collects to this data processing centre (DPC), and the flatness that this data processing centre (DPC) sets according to the zone requires to judge.
7. a kind of pcb board measurement method of planeness according to claim 6, it is characterized in that: described data processing centre (DPC) refers to the microprocessor dsp chip.
CN 201310028967 2013-01-25 2013-01-25 PCB (printed circuit board) smoothness detection method CN103115590A (en)

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Application Number Priority Date Filing Date Title
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Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105066946A (en) * 2015-09-14 2015-11-18 深圳诚和电子实业有限公司 Printed circuit board flatness testing device and method
CN105258651A (en) * 2015-11-05 2016-01-20 东莞市科隆威自动化设备有限公司 PCB (Printed circuit board) buckling deformation detection method
CN105740123A (en) * 2016-01-28 2016-07-06 浪潮电子信息产业股份有限公司 Method for monitoring bending degree of board card in case
CN105955863A (en) * 2016-04-26 2016-09-21 浪潮电子信息产业股份有限公司 Monitoring method and system of physical state of PCB (Printed Circuit Board) in case
CN106055461A (en) * 2016-06-22 2016-10-26 浪潮电子信息产业股份有限公司 Optimization design method of dust removal prompting method for printed circuit board
CN106180843A (en) * 2016-06-29 2016-12-07 深圳崇达多层线路板有限公司 The controlled depth milling method of printed substrate
CN106815444A (en) * 2017-01-20 2017-06-09 福州大学 A kind of method of automatic measurement PCB map files component distance
CN107905073A (en) * 2017-11-09 2018-04-13 南京中高知识产权股份有限公司 The method knead dough smoothness measuring equipment of straight line laser profile scanning surface evenness
CN108613640A (en) * 2016-12-13 2018-10-02 海太半导体(无锡)有限公司 A kind of semiconductor tin ball coplanarity test system and method
CN109341642A (en) * 2018-10-23 2019-02-15 苏州市春菊电器有限公司 A kind of method measuring flatness and measuring device
CN109506598A (en) * 2018-11-19 2019-03-22 信利光电股份有限公司 A kind of plate testing flatness method and device
CN110196022A (en) * 2019-06-20 2019-09-03 英特尔半导体(大连)有限公司 Device and method for measuring angularity
CN110514122A (en) * 2019-09-20 2019-11-29 成都博奥晶芯生物科技有限公司 Microarray cover plate two-dimensional detecting method and device based on laser displacement sensor
WO2020103262A1 (en) * 2018-11-22 2020-05-28 武汉华星光电技术有限公司 Device and method for measuring surface flatness

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105066946A (en) * 2015-09-14 2015-11-18 深圳诚和电子实业有限公司 Printed circuit board flatness testing device and method
CN105258651A (en) * 2015-11-05 2016-01-20 东莞市科隆威自动化设备有限公司 PCB (Printed circuit board) buckling deformation detection method
CN105740123A (en) * 2016-01-28 2016-07-06 浪潮电子信息产业股份有限公司 Method for monitoring bending degree of board card in case
CN105955863A (en) * 2016-04-26 2016-09-21 浪潮电子信息产业股份有限公司 Monitoring method and system of physical state of PCB (Printed Circuit Board) in case
CN106055461A (en) * 2016-06-22 2016-10-26 浪潮电子信息产业股份有限公司 Optimization design method of dust removal prompting method for printed circuit board
CN106180843A (en) * 2016-06-29 2016-12-07 深圳崇达多层线路板有限公司 The controlled depth milling method of printed substrate
CN108613640A (en) * 2016-12-13 2018-10-02 海太半导体(无锡)有限公司 A kind of semiconductor tin ball coplanarity test system and method
CN106815444B (en) * 2017-01-20 2020-05-08 福州大学 Method for automatically measuring distance between PCB (printed circuit board) drawing components
CN106815444A (en) * 2017-01-20 2017-06-09 福州大学 A kind of method of automatic measurement PCB map files component distance
CN107905073A (en) * 2017-11-09 2018-04-13 南京中高知识产权股份有限公司 The method knead dough smoothness measuring equipment of straight line laser profile scanning surface evenness
CN109341642A (en) * 2018-10-23 2019-02-15 苏州市春菊电器有限公司 A kind of method measuring flatness and measuring device
CN109506598A (en) * 2018-11-19 2019-03-22 信利光电股份有限公司 A kind of plate testing flatness method and device
WO2020103262A1 (en) * 2018-11-22 2020-05-28 武汉华星光电技术有限公司 Device and method for measuring surface flatness
CN110196022A (en) * 2019-06-20 2019-09-03 英特尔半导体(大连)有限公司 Device and method for measuring angularity
CN110514122A (en) * 2019-09-20 2019-11-29 成都博奥晶芯生物科技有限公司 Microarray cover plate two-dimensional detecting method and device based on laser displacement sensor

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Application publication date: 20130522