CN103299177B

CN103299177B - Soldering inspection method and base plate inspection system and soldering inspection machine

Info

Publication number: CN103299177B
Application number: CN201180064870.XA
Authority: CN
Inventors: 藤井心平; 森弘之; 中岛克起; 谷上昌伸
Original assignee: Omron Corp
Current assignee: Omron Corp
Priority date: 2011-01-13
Filing date: 2011-03-17
Publication date: 2016-04-13
Anticipated expiration: 2031-03-17
Also published as: JP5365643B2; CN103299177A; TW201231960A; WO2012096003A1; JP2012145483A; DE112011104725B9; DE112011104725T5; DE112011104725B4

Abstract

Soldering print inspection machine (10) checks the volume of the welding paste of the pad on substrate, and soldering inspection machine (30) checks the wetting forming height of the rear scolding tin of backflow.Soldering inspection machine (30) logs in the scrutiny program of the multiple determining reference value had containing the measurement value for judging wetting forming height, and for selecting the selective rule of these determining reference value.To this selective rule, the welding paste volume obtained when defining the soldering position according to soldering print inspection machine (10) measurement check object and select which determining reference value.Soldering print inspection machine (10) reads in the welding paste volume corresponding with the soldering position of check object from inspection data administrator (102), decides determining reference value based on this.

Description

Soldering inspection method and base plate inspection system and soldering inspection machine

Technical field

The present invention relates in order to manufactured parts installation base plate and implement multiple operations in, with until the substrate that just terminates of reflow process carries out visual examination for object, thus judge check system and the soldering inspection machine of the methods and applications the method whether the soldering state of the various parts be arranged on substrate is appropriate.

Background technology

Each operation of the general printing process by welding paste (creamsolder, solder(ing) paste), part installation procedure and reflow process produces component mounting board.In production line in recent years, there is the production line having imported base plate inspection system, in this base plate inspection system, inspection machine is equipped with for each operation in these operations, the check result of each inspection machine is aggregated into signal conditioning package, thus can carry out confirming (for example, referring to patent documentation 1) for each same object.

With regard to the inspection at the soldering position after reflow process, widely use this inspection machine, this inspection machine utilizes the specular reflective of scolding tin, throw light on from oblique upper to the substrate of check object, directly over roughly, this substrate is taken simultaneously, the pattern of the reflected light picture in generated image is analyzed.Such as, such process is described: each color light of from the scope of incident angle different direction, substrate being irradiated to red, green, blue respectively in patent documentation 2, according to the COLOR COMPOSITION THROUGH DISTRIBUTION pattern corresponding with these illumination light, generate the image showing scolding tin heeling condition, carry out processing (the 0003rd, 0034 ~ 0040 section with reference to patent documentation 2) based on the inspection benchmark having logged in this COLOR COMPOSITION THROUGH DISTRIBUTION pattern in advance.

For the inspection after solder printing operation, adopt this inspection machine too, by this inspection machine, from directly over take substrate to carry out two dimensional image process, thus the area, printing position etc. of welding paste on each pad on measurement substrate.In addition, the 3D shape at check object position, the inspection machine (such as with reference to patent documentation 3) of volume is obtained by phase-shifting method in addition.

In any operation, if will automatically check, all need to log in inspection machine the inspection benchmark being suitable for each check object position in advance.Inspection benchmark refers to, the detection method at the setting of inspection area, measurement object position, for measure computing method, for judging the determining reference value etc. whether measurement value appropriate, these are various information of the necessity defined to carry out checking, can pass through program (computer program) and realize.

In order to improve the precision of inspection, need to arrange appropriate inspection benchmark for each part.And then for the inspection after final reflow process, also need setting can not miss bad inspection benchmark.

With regard to above-mentioned problem, in patent documentation 2, for same part, the inspection benchmark of different content also can be set because formed leg (fillet) shape is different.According to the summary that it is recorded, in the inspection machine of patent documentation 2, for often kind of part, the multiple inspection reference datas corresponding to multiple leg shapes that can be formed by the part of this kind, correspondingly with the altitude range of the leg of corresponding shape respectively associatedly store.In addition in teaching process, for each part be arranged on substrate, according to the shape data of this part and the size of the pad corresponding with this part, calculate the height of the leg of this part, read the inspection benchmark highly corresponding with this, its inspection area with the part of handling object is associated.Thus, for each part, the inspection benchmark that the shape of leg that application and this part are formed adapts.

Prior art document

Patent documentation

Patent documentation 1:JP patent No. 3966336 publication

Patent documentation 2:JP patent No. 4103921 publication

Patent documentation 3:JP JP 2010-91569 publication

Summary of the invention

The problem that invention will solve

In the scheme that patent documentation 2 is recorded, the existing inspection benchmark in the inspection after reflow process is arranged the following is prerequisite, that is, soldering is in good condition, in other words, can implement appropriately to be treated to prerequisite in the whole operations comprising reflow process.But, in fact, in solder printing operation, various change can be there is because of the time in number to be printed, the printing position of welding paste, in part installation procedure part installation site and also can change relative to the intrusion of welding paste, sometimes, due to the shape change of the scolding tin after backflow, therefore, even certified products, inspection machine also can be judged as the shape being not suitable for checking benchmark.

Below, utilize Figure 12 ~ Figure 15 so that the problems referred to above to be described.Each figure represents that the shape of the scolding tin of soldering position after reflow process is the situation of change because of the state before reflow process for an electrode of lead-in wire part.In the various figures, 300 is pads, and 301 is electrodes of part.In addition, 302 is the welding pastes before backflow, and 303 is the scolding tin (hereinafter, referred to as " after backflow scolding tin ") solidified again after melting because of reflow process.

In fig. 12, the comparison electrode 301 that above gets off generation is floated the example of situation and is not had to produce the example floating situation.In solder printing operation, in each example, although all printed the welding paste 302 of standard volume, but in the example that electrode 301 does not float below situation, the scolding tin of melting is blocked by electrode 302, after causing refluxing, scolding tin 303 is too high, defines the dip plane (leg) of appropriateness in the part (below, this part be called " pad teat ") from the ora terminalis of pad 300 to the front end of electrode 301.On the other hand, in the example on electrode 301 floats, the scolding tin of melting spreads and thinning on pad 300, causes scolding tin 303 after refluxing to become even shape in example below.

So, even if the number to be printed of scolding tin is identical, when the situation that electrode 301 floats with do not float, backflow after scolding tin 303 height, heeling condition also can change.

But, as shown in the example of the bottom of Figure 13, although the amount of welding paste 302 is fewer than standard, sometimes also electrode 301 well can be connected with pad 300 via scolding tin 303 after backflow.In this case, the situation (example on the top of Figure 13) that after backflow, during amount standard with welding paste 302 of the height of scolding tin 303 and heeling condition, electrode 301 floats is identical.

Figure 14 represent the height and causing of the electrode 301 of the part because installing in part installation procedure reflux after the example of shape variation of scolding tin 303.

In the example on the top of Figure 14, electrode 301 appropriateness is embedded in welding paste 302, and therefore, in reflow process, the scolding tin of melting is blocked by electrode 301, defines the dip plane of appropriateness at pad teat.On the other hand, in the example of the bottom of Figure 14, electrode 301 is arranged on high position, and therefore, in reflow process, melting scolding tin is inhaled into the below into electrode 301.Its result, the gradient of scolding tin 303(after backflow) become very slow at pad teat, the degree of tilt near the ora terminalis of electrode 301 then becomes precipitous.In this state, the electrical connection between electrode 301 and pad 300 also can be broken down, but sometimes as shown in the dotted line frame of Figure 15, low when after the backflow of pad teat, the aspect ratio electrode 301 of scolding tin 303 floats.

As shown in above-mentioned each example, although the electrical connection sometimes between electrode 301 and pad 300 is no problem, after backflow, the face shaping of scolding tin 303 becomes the state of approximate bad connection, and after backflow, scolding tin 303 is lower than the state of bad connection.In visual examination after reflow process, due to from directly over take substrate, therefore cannot confirm floating and the state of scolding tin of below of electrode of electrode, can only judge based on the state of scolding tin 303 after the backflow of pad teat.Therefore, in existing inspection, although set such inspection benchmark to not miss bad, namely, when the pattern of the reflected light picture that image shows likely represents bad, be all judged as bad, but, still can produce a lot of under-enumerations (unacceptable product is judged as certified products), cause the low of production efficiency.

The present invention is in order to solve the problem, and object is, in the inspection after reflow process, different and apply different inspection benchmark according to the state implementing the check object position before reflow process, thus whether can distinguish soldering state accurately appropriate.

For the means of dealing with problems

The invention provides a kind of soldering inspection method, while throw light on from prescribed direction to substrate, while take this substrate by camera, the reflected light picture that soldering position in generated image shows is analyzed, thus check the soldering state at this position, described substrate is the substrate being implemented multiple operation in order to manufactured parts installation base plate, in the multiple operations implemented this substrate, last operation is reflow process, and described camera is configured in can the incident position by the normal reflection light of the soldering position indirect illumination light of substrate.In addition, normal reflection light that reflected light picture produces primarily of soldering position indirect illumination light is formed, as long as but the picture formed containing the light reflected on the direction near roughly normal reflection.

In inspection method of the present invention, in at least one operation in the multiple operations implemented before described reflow process, the structure be attached on substrate is measured before next operation starts, as prerequisite, determine the rule of the inspection benchmark needed for inspection after reflow process in the following manner, which refers to, the result according to the measurement process implemented for the position that the soldering position with check object is corresponding before reflow process changes described inspection benchmark.And, for the soldering position of the substrate after described reflow process, by the rule of described inspection benchmark, the measurement process be applied to by implementing before reflow process comes in the result of the measurement process implemented for the position corresponding with this soldering position, thus determines to check benchmark.

As the measurement process of the operation before reflow process, such as, can in solder printing operation, measurement is printed on the area of the welding paste on pad, volume, highly, welding paste is relative to the relative position etc. of pad.In addition, in part installation procedure, the position at the center of part, part electrode can be measured relative to the position of the ora terminalis of pad, part relative to the height etc. of the rotation offset angle of the side-play amount of the regulating position predetermined, part, part or part electrode.According to the present invention, even be arranged on the part of the same place of the substrate of same specification, the welding paste before reflow process or the different situation of part status, also likely apply different inspection benchmark.Therefore, it is possible to implement the inspection of the state before considering the reflow process of this part for each part, thus the precision distinguishing certified products and unacceptable product can be improved.

Above-mentioned inspection method preferred embodiment in, the rule of such setting described inspection benchmark: be used in and differentiate and carry out measuring process for the soldering position of check object and the whether appropriate determining reference value of the measurement value that obtains, changes because of the result of measurement process of carrying out for the position corresponding with this soldering position before reflow process.According to this embodiment, the step measured soldering position is identical, but whether can change according to the state of the welding paste before reflow process or part the measurement value obtained for judging to measure appropriate.

Above-mentioned inspection method other preferred embodiment in, the rule of such setting described inspection benchmark: multiple inspection benchmark that the content determined from the result according to the measurement process before the reflow process of carrying out for the position corresponding with soldering position is different, select the matched inspection benchmark of result of the measurement process before the reflow process of carrying out at the position corresponding with for the soldering position with check object.According to this embodiment, in the inspection after reflow process, the inspection of different content can be implemented according to the state of the welding paste before reflow process or part.

In addition, select before inspection after reflow process starts to check benchmark, inspection benchmark selected by utilization performs inspection, but be not limited only to this, such as, can select to check benchmark after utilizing the inspection of whole inspection benchmark executed in parallel, adopt the inspection benchmark selected by utilizing to carry out the result checked.

Other preferred embodiment in, the rule of such setting described inspection benchmark: processing and the combination of the measurement value obtained according to implementing multiple measurement for the position corresponding with soldering position before reflow process, changing the inspection benchmark for this soldering position.

According to this embodiment, the measurement value that can obtain according to multiple measurement process segments inspection benchmark, thus improves the inspection precision after reflow process further.

Other preferred embodiment in, the rule of such setting described inspection benchmark: carry out the measurement process in solder printing operation according to the pad corresponding for the soldering position with check object and the measurement value obtained, change the inspection benchmark for this soldering position.Thereby, it is possible to according to the volume of welding paste, area, highly, welding paste relative to the difference of the print range etc. of pad, change inspection benchmark.

Other preferred embodiment in, the rule of such setting described inspection benchmark: carry out the measurement process in solder printing operation according to the pad corresponding for the soldering position with check object and the measurement value obtained, the measurement value that the part corresponding with for the soldering position with check object carries out the measurement process in part installation procedure and obtain, changes the inspection benchmark for this soldering position.So, can different according to the pattern of the relation between the state of welding paste and the installment state of part, change inspection benchmark.

Other preferred embodiment in, the amount of the welding paste that each pad measuring on substrate by described solder printing operation prints, is used as the measurement process before described reflow process.Now, the parameter of at least one in the area of expression welding paste, volume, height can be obtained, be used as " amount of welding paste ".

In addition, in this embodiment, in the inspection after described reflow process, the relation at the angle of inclination shown in the reflected light picture showed based on the image of the substrate of check object and this reflected light picture, measure the height of the scolding tin after reflow process, thus judge that whether this measurement value is appropriate.And then, set the rule of described inspection benchmark like this: make the determining reference value whether height for judging the scolding tin after reflow process is appropriate, along with the measurement value of the amount of described welding paste diminishes and step-down.

According to above-mentioned embodiment, the example as shown in the hypomere of Figure 13, cause the height step-down of the scolding tin after reflow process because welding paste amount is few, but likely faulty for soldering state part is judged as certified products.On the other hand, the example as shown in the epimere of Figure 13, float due to electrode generation and cause the height step-down of the scolding tin after reflow process, this part can be judged as bad.

Next, base plate inspection system of the present invention has: be provided in the reflow process in the multiple operations implemented in order to manufactured parts installation base plate, for checking the inspection machine of the substrate after reflow process; In at least one operation before being provided in reflow process, for checking the inspection machine of the substrate after this operation; Apparatus for management of information, it reads in check result information by communicating from each inspection machine, can read according to each substrate and each check object position and manage the check result information of each inspection machine.

The inspection machine of reflow process has following function: for the soldering position of check object, and the multiple inspection benchmark utilizing content different check.And then, in the inspection machine or apparatus for management of information of the reflow process of this system, be provided with following rule storage unit, measurement value acquisition unit and check benchmark determining means.

Rule storage unit, it stores the rule checking benchmark, the rule of this inspection benchmark is used for, for the inspection at the soldering position after reflow process, the result of the measurement process implemented when checking according to the inspection machine pair position corresponding with the soldering position of check object by the operation before reflow process, defines and which selects check benchmark from described multiple inspection benchmark.

Measurement value acquisition unit, it is for the soldering position of the check object after described reflow process, be sent to the check result information of apparatus for management of information from the inspection machine by the operation before reflow process, obtain to be implemented to measure by the inspection machine of the operation before this pair position corresponding with soldering position and process and the measurement value obtained.

Check benchmark determining means, it is by the rule of described inspection benchmark, is applied in the measurement value obtained for the soldering position of described check object by described measurement value acquisition unit, thus determines to be worth matched inspection benchmark with this measurement.

Rule storage unit, measurement value acquisition unit and check benchmark determining means, be arranged in any one in the inspection machine of reflow process and apparatus for management of information.When they are arranged in the inspection machine of reflow process, measurement value acquisition unit is by communicating with apparatus for management of information, be sent in the check result information of apparatus for management of information at the inspection machine of the operation before reflow process, obtain (input) information containing the measurement value corresponding with the soldering position of check object.

In addition, when these unit are arranged in apparatus for management of information, measurement value acquisition unit receives from the inspection machine of the operation before reflow process and preserves check result information, reads the information containing the measurement value corresponding with the soldering position of check object from this check result information.Or, measurement value acquisition unit is had when the inspection machine of the operation before reflow process receives check result information from the function wherein reading measurement value, by checking benchmark determining means, before the check object position of the inspection machine of reflow process is checked, first determine inspection benchmark.

In an embodiment of said system, the inspection machine of reflow process, for the soldering position of check object, utilizes whole described multiple inspection benchmark to perform inspection, and respectively the check result information of each inspection is sent to described apparatus for management of information.In addition, apparatus for management of information possesses described rule storage unit, measurement value acquisition unit and checks benchmark determining means, and possess reception information process unit, object information is checked from the inspection machine of reflow process, from this check result information, select and preserve the information corresponding with the inspection benchmark determined by described inspection benchmark determining means.By this structure, after the inspection machine of reflow process utilizes multiple inspection benchmark to complete complete inspection, in apparatus for management of information, adopt in each check result with reflow process before welding paste and/or the check result of the matched inspection benchmark of state of part.

In other embodiment of said system, the inspection machine of reflow process possesses described rule storage unit, measurement value acquisition unit and checks benchmark determining means.And then, inspection machine also possesses inspection performance element, this inspection performance element, for the soldering position of check object, utilize by checking that the inspection benchmark that benchmark determining means determines performs inspection, the check result information of this inspection gained is sent to described apparatus for management of information.By this structure, in the inspection machine of reflow process, can utilize with reflow process before welding paste and/or the matched inspection benchmark of state of part perform inspection.

In addition, also by rule storage unit, measurement value acquisition unit and can check that benchmark determining means is arranged in apparatus for management of information, the inspection benchmark determined by inspection benchmark determining means is sent to the inspection machine of reflow process from apparatus for management of information, in the inspection machine of reflow process, performs inspection based on this inspection benchmark.

Apply soldering inspection machine of the present invention, take substrate as object, while throw light on from prescribed direction to this substrate, while take this substrate by camera, the reflected light picture that soldering position in generated image shows is analyzed, thus check the soldering state at this position, described substrate is the substrate being implemented multiple operation in order to manufactured parts installation base plate, in the multiple operations implemented this substrate, last operation is reflow process, described camera is configured in can the incident position by the normal reflection light of the soldering position indirect illumination light of substrate, it possesses following input block, rule storage unit, check performance element.

Input block, it inputs measurement value for the soldering position for check object, this measurement value refers to, in at least one operation in the multiple operations implemented before described reflow process, before next operation starts, measurement is attached to structure on the position corresponding with this soldering position and the measurement value that obtains.Should inputting, be not limited to aforesaid way, such as, also can complete input by carrying out communication with described apparatus for management of information or the inspection machine that implements measurement.

Rule storage unit, it stores the rule checking benchmark, and the rule of this inspection benchmark defines in such a way, and which refers to, according to the measurement value inputted by described input block, changes the inspection benchmark at the soldering position for described check object.Check performance element, for the soldering position of the substrate after described reflow process, the rule of described inspection benchmark is applied in the measurement value inputted by described input block, thus determines to be worth matched inspection benchmark with this measurement, based on this inspection benchmark, inspection is performed to soldering position.

By above-mentioned soldering inspection machine, the measurement value that can obtain according to implementing measurement to the soldering position of check object in the operation before reflow process, changes for judging good/bad determining reference value, measurement object, measuring method etc.

The effect of invention

According to the present invention, according to the state of the state of the welding paste before reflow process and/or part, the inspection benchmark that the soldering after reflow process checks can be changed, therefore, it is possible to distinguish certified products and unacceptable product with high precision.

Accompanying drawing explanation

Fig. 1 represents corresponding with the entire infrastructure of the production line of component mounting board for the structure of the base plate inspection system figure associated.

Fig. 2 is the block diagram of the structure representing soldering inspection machine.

Fig. 3 is the block diagram of the structure representing solder printing inspection machine.

Fig. 4 be soldering check the figure of the information flow between the device of being correlated with.

Fig. 5 is the figure for illustration of the method for the wetting forming height of scolding tin after measurement backflow.

Fig. 6 is the figure of the establishing method of determining reference value for illustration of the wetting forming height for scolding tin after judging to reflux.

Fig. 7 is the figure of other establishing method of determining reference value for illustration of the wetting forming height for scolding tin after judging to reflux.

Fig. 8 is the figure for illustration of the method limiting measurement region for welding paste.

Fig. 9 is the process flow diagram of the step of the process represented in soldering inspection machine.

Figure 10 is the figure performing when checking between each device information flow according to multiple inspection benchmark.

Figure 11 is the process flow diagram of the concrete example representing the setting rule checking benchmark and represents the figure of meaning for carrying out the threshold value selected.

Figure 12 is the figure of the result after the backflow of the contrast expression part electrode situation of floating and the situation of not floating.

Figure 13 is the figure that contrast represents the result after the backflow of the situation that part electrode floats and the few situation of welding paste amount.

Figure 14 is the figure that contrast represents the result after the backflow of the situation that the normal situation of height of part electrode and part electrode configure high.

Figure 15 is the figure that contrast represents the result after the backflow of the situation that part electrode floats and the situation that part electrode configures high.

Embodiment

In FIG, the structure of an embodiment of base plate inspection system and the entire infrastructure of the production line of component mounting board is represented in the mode of correspondence association.

In illustrated production line, comprise solder printing operation, part installation procedure and reflow process.In solder printing operation, be provided with solder printing device 11 and solder printing inspection machine 10, this solder printing device 11 is for applying welding paste to each pad on substrate, and this solder printing inspection machine 10 is for checking the result of this device 11.In part installation procedure, be provided with assembly machine (Mounter) 21 and part inspection machine 20, this assembly machine 21 is for the substrate mounting parts after solder printing, and this part inspection machine 20 is for checking the installment state of part.In reflow process, be provided with reflow ovens 31 and soldering inspection machine 30, this reflow ovens 31 is for the welding paste of the substrate after the installation of melting part, and this soldering inspection machine 30 is for checking the substrate after backflow.As shown in thick arrows in FIG., substrate is processed by sending into each device in order, thus completes the component mounting board corresponding with regulatory specifications.

The inspection machine 10,20,30 of each operation is respectively via LAN(LAN (Local Area Network)) loop 100 and being interconnected.On LAN loop 100, be also connected with scrutiny program management devices 101 and check data administrator 102.In scrutiny program management devices 101, log in advance for each inspection machine 10,20,30 and have database, the scrutiny program of this centralized database for performing inspection based on the inspection benchmark predetermined, is used as the database data (librarydata) of often kind of part.

In inspection data administrator 102, preserve the result implementing inspection in each inspection machine 10,20,30.In this check result information, comprise the quality at each check object position judged result and in order to carry out this judgement and implement the measurement result of (measurement).Can for each inspection machine 10,20,30 by often open substrate and by each part on substrate to read check result information.

In addition, scrutiny program management devices 101 also need not separate with inspection data administrator 102, and a computing machine also can be made to have the function of each management devices 101,102.On the contrary, also each management devices 101,102 can be formed by multiple computing machine.

In each inspection machine 10,20,30, be handled as follows before an examination: input represents the data (such as cad data) of the structure of check object substrate, read the database data adapted with the part kind of information of each part shown in these input data from scrutiny program management devices 101, the positional information of each part is associated with database data.Thus, each inspection machine 10,20,30 is set to the environment needed for inspection of check object substrate.In addition, based on the content of the program of database data, also can suitably be changed by setting operation by user.

Fig. 2 represents the structure of soldering inspection machine 30.

The soldering inspection machine 30 of this embodiment has control treatment portion 1, camera (camera) 2, lighting device 3, Substrate table 4 etc.Substrate table 4, can support the substrate S of check object, and this substrate S is being moved up along the side on each limit with this posture with flat-hand position.Camera 2 can generate coloured image, and is provided in the top of Substrate table 4, and its optical axis is towards roughly vertical direction (camera 2 is configured to the state of the substrate S on platform 4 being carried out to front observation).Lighting device 3 is provided between camera 2 and Substrate table 4.

Lighting device 3 comprises ring-type light source 3R, 3G, 3B of sending red light, green light, blue light respectively.Each light source 3R, 3G, 3B are configured to the respective central part state consistent with the optical axis position of camera 2.In addition, the diameter (aperture) of each light source 3R, 3G, 3B is different, and the red light source 3R of minimum diameter is configured in and goes up most, and the blue-light source 3B of maximum gauge is configured in, and green light source 3G configures between which.The object of this configuration is, makes the scope of each color to the incident angle of substrate S incident light different.

In control treatment portion 1, comprise by computer implemented control part 110, image input unit 111, shooting control part 112, lighting control section 113, platform control part 114, storer 115, hard disk unit 116, communication interface 117, input part 118, display part 119 etc.Control part 110, by shooting control part 112, lighting control section 113, platform control part 114, controls the action of camera 2, lighting device 3, Substrate table 4.The image that camera 2 generates, after being carried out digital conversion, inputs to control part 110 in image input unit 111.

In storer 115, except storing the program relevant to above-mentioned control, the also view data, result of calculation etc. of temporary transient specimens preserving object.In hard disk unit 116, preserve based on the scrutiny program group (performance check benchmark) of the database data provided from scrutiny program management devices 101, the measurement data obtained in checking process and check result, image etc. for checking.

Communication interface 117 is for communicating with other device via described LAN loop 100.Input part 118 is specified the operation of beginning and the end checked for carrying out and inputs various setting data.Display part 119 is for showing check result and the image for checking.

Next, Fig. 3 represents the structure of solder printing inspection machine 10.In addition, in this Fig. 3, for the structure corresponding with Fig. 2, the Reference numeral after being used in the Reference numeral identical with Fig. 2 after additional A represents.

This solder printing inspection machine 10, measure based on the height of phase shift ratio juris to the welding paste be printed on the pad of substrate S, it comprises control treatment portion 1A, camera 2A, lighting device 3A, Substrate table 4A, in addition also comprise projector (projector) 5, this projector 5 is for the pattern image to substrate projected fringe shape.In addition, the lighting device 3A of this inspection machine 10 is made up of the ring-type light source 3M sending white light.Control treatment portion 1A, except having the structure identical with the control treatment portion 1 of soldering inspection machine 30, is also provided with projector's control part 120.

With regard to part inspection machine 20, there is the structure roughly the same with soldering inspection machine 30, therefore omit diagram.But, in part inspection machine 10, also can be used as the light source of lighting device 3 with white light source.

In part inspection machine 20, detect the part on substrate according to the image of the substrate S of check object, measure its position, degree of tilt etc., judge that whether the installment state of part is appropriate based on this measurement result.

In addition, as part inspection machine 20, the device of the structure same with the solder printing inspection machine 10 shown in Fig. 3 also can be used.In this case, except the inspection of the installation site of part, posture, the height of part and part electrode, degree of tilt etc. relative to the part of vertical direction can also be checked.

In above-mentioned three kinds of inspection machines 10,20,30, solder printing inspection machine 10 and part inspection machine 20 are for performing the inspection in intermediate step, even if but they are judged as that (substrate) is bad sometimes, also (substrate) quality can be improved by the process of operation afterwards.Therefore, in a lot of workshop, can not take out from production line and be judged as bad substrate by scolding tin print inspection machine 10 or part inspection machine 20, but run them and flow to back segment.

On the other hand, be placed in the soldering inspection machine 30 of final reflow process, need to carry out strict judgement to not miss bad, but as utilized, Figure 12 ~ Figure 15 illustrates, after reflow process, the shape of scolding tin is sometimes because of the printing state of welding paste or the state of part and change, even if scolding tin presents the shape of approximate defective mode after backflow, also still there is numerous parts electrode and be connected good situation with pad.

Therefore, in aforesaid substrate check system, when utilizing soldering inspection machine 30 to check, for the inspection benchmark at the soldering position with regard to this check object, based on the result of the measurement process implemented by other inspection machine 10,20 for the position corresponding with this position, adjust.Specifically, in this embodiment, set multiple good/bad determining reference value for distinguishing soldering, the measurement result according to other inspection machine 10,20 selects determining reference value, is changed the content checking benchmark by the method.Thus, even if the part installed in the same place of the substrate of same size, because the state before the reflow process of respective part is different, therefore also have the situation checking that the content of benchmark is also different.

Represent together in the diagram the inspection of soldering inspection machine 30 information flow between the device of being correlated with and device.In this embodiment, scrutiny program management devices 101, inspection data administrator 102 and solder printing inspection machine 10 participate in the inspection of soldering inspection machine 30.

The scrutiny program management devices 101 of this embodiment, for solder printing inspection machine 10, is provided for checking the scrutiny program ((a) of Fig. 4) of the volume of the welding paste be printed on pad.On the other hand, scrutiny program management devices 101 provides the first following program and the second program for soldering inspection machine 30 simultaneously, this first program is the program of the wetting forming height of scolding tin after the backflow for checking soldering position, this second program is the program for determining change method, this change method is used for changing determining reference value (below, claim this program to be " selective rule ") ((b) (c) of Fig. 4) that will use in this inspection according to the volume of the welding paste corresponding with the soldering position of check object.

Above-mentioned scrutiny program and selective rule, be included in the database data in units of part kind, and be provided to each part.

Solder printing inspection machine 10, based on received (being provided) scrutiny program, measures the volume of the welding paste printed on each pad of the substrate S of check object, thus judges the good/bad of measurement value.Then, the check result information of the measurement value containing each pad is sent to (d) that check data administrator 102(Fig. 4).Check that data administrator 102 preserves this information.

Soldering inspection machine 30 is also based on received (being provided) scrutiny program, the wetting forming height of scolding tin after backflow in each pad of the substrate S of measurement check object, thus judge the good/bad of measurement value, the check result information containing measurement value is sent to (e) that check data administrator 102(Fig. 4).But the determining reference value for this judgement is not constant, but select from multiple determining reference value based on selective rule.In order to this selection, soldering inspection machine 30 access checking data administrator 102, read the volume ((f) of Fig. 4) of the welding paste that the pad in the process of the substrate S of current reception is obtained when being checked by scolding tin print inspection machine 10, by this volume applications in selective rule thus select determining reference value.

At this, the particular content of the inspection implemented in each inspection machine 10,30 is described.

First, in the inspection in solder printing inspection machine 10, by the process based on the 3 d measurement based on phase-shifting method principle in solder printing inspection machine 10, calculate the volume of welding paste.In 3 d measurement, be a circulation with multiple projections, perform and make move of stripe ormal weight while from the pattern image process of projector's 5 pairs of substrate S projected fringe shapes at every turn, and, coordinate the opportunity of each projection and taken by camera 2A.If finish projection and the shooting of a circulation, then one by one with each time shooting gained image in inspection area (setting for each pad) in each pixel for object, detect the change of the brightness in each shooting, using the sine wave of this change as one-period, obtain sinusoidal wave phase place.And then, the phase place calculated based on the pixel for handling object, the projecting plane of pattern image and the relation between camera 2A with the reference field preset (face of such as corresponding with substrate height) carry out triangulation, thus the distance calculating from reference field to the point corresponding with the pixel of handling object.This distance represents the height of the point corresponding with the pixel of handling object.

In addition, different from above-mentioned process, in solder printing inspection machine 10, take under the white illumination of Lighting Division 3, detect the color of welding paste according to the inspection area in generated image.Then, the pixel for the color detecting this scolding tin calculates altitude information, carries out integration to this altitude information, thus obtains the volume of welding paste.

If calculated the volume of welding paste by said method, then in solder printing inspection machine 10, this volume is contrasted with the determining reference value logged in for each inspection area, thus judge good/bad, but the substrate having carried the welding paste being judged as " bad " is also made to flow into subsequent handling.

Next, be described for the measurement process for carrying out checking in soldering inspection machine 30.

In the soldering inspection machine 30 of this embodiment, the each color light of red, green, blue is irradiated from the different direction substrate S of incident angle respectively, therefore, because of the light being incident to camera 2 in the normal reflection light of each color light of irradiating the dip plane of the rear scolding tin that refluxes, and the image of the heeling condition being represented the rear scolding tin of backflow by each color distribution patterns of red, green, blue can be generated.Assorted region in image, shows the angle of inclination roughly the same with the incident angle of each self-corresponding illumination light.In this embodiment, the red area that the red light that in three looks, incident angle range is minimum produces shows the inclination (being 8 ~ 15 degree in this embodiment) of mitigation, and the blue region that the blue light that in three looks, incident angle is maximum produces shows precipitous inclination (being 25 ~ 38 degree in this embodiment).In addition, from the green area that the green light of the range illumination between red light and blue light is given birth to, the angular range (being 15 ~ 25 degree in this embodiment) between showing by the angular range shown in red area and blue region.

The method of the wetting forming height of scolding tin after relation between Fig. 5 represents based on the angle of inclination shown in assorted region and these regions and obtaining refluxes.

In this Fig. 5, for chip element 200, the schematic diagram of the leg 202 of scolding tin after the backflow that the electrode 201 of this chip element 200 is connected with pad 203 will be represented, with this leg 202 of shooting and the schematic diagram of image that obtains is upper and lower corresponding associates.In the schematic diagram of image, represent assorted region with different pattern respectively.

In this embodiment, range set containing whole part 200 in image is the inspection area (not shown) of part thus detects part 200, further, inspection area F is set to each pad 203, thus detect red sector territory in the F of this inspection area, territory, Green Zone, territory, blue area.In the image of the leg of the shape shown in Fig. 5, usually, along the place near the outside ora terminalis from the pad 202 in image towards the direction of part electrode 201, distribute red, green, blue in order.In addition, the place near part 200, produces the dark areas representing orientated at steep inclinations face sometimes, and this dark areas exceeds the scope can using blue area domain representation.

Utilize the feature of above-mentioned image, in this embodiment, distinguish the direction of four the look areal distribution comprising dark areas in the F of inspection area, along this direction setting measurement line L, on this measurement line L, extract and be positioned at A2, A3, the A4 in assorted region and the intersection point A1 crossing with the outside ora terminalis in red sector territory at borderline.And then, based on the testing result of part, extract the intersection point A5 of the ora terminalis of measurement line L and part electrode 201.

Next, in extracted point, to each point except an A5, the angle of inclination corresponding with this point is suitable for.Although the angle of inclination shown in assorted region has width to a certain degree respectively, can think that adjacent look interregional boundary position represents the angle near the boundary value of the respective range of tilt angles shown in look region.Thus, in this embodiment, based on previous illustrative range of tilt angles, 8 degree are suitable for an A1,15 degree are suitable for an A2,25 degree are suitable for an A3,38 degree are suitable for an A4.Further, as shown in the curve map on the right side of Fig. 5, according to the relation between the coordinate of each point A1 ~ A4 and the angle be suitable for each point A1 ~ A4, the curve of approximation M along the angle change representing measurement line L is derived.And then, integration is carried out to each point in the scope of the some A1 a to A5 from this curve of approximation M, thus, calculates the height of the scolding tin corresponding with an A5, it can be used as the wetting forming height of the rear scolding tin of backflow.

Although the angle of inclination shown in assorted region has the width of prescribed level respectively, but with regard to the boundary position between look region, due to the high angle of inclination of fiduciary level can be obtained, therefore, to think according to the relation between the coordinate of each point A1 ~ A4 and angle of inclination and the curve of approximation obtained can show tilt variation along measuring line rightly.In addition, also can infer the angle of inclination of each point in the indefinite dark areas of heeling condition, based on this deduction, the height of the scolding tin closest to part 200 can be obtained.

Profit obtains the wetting forming height of the rear scolding tin of backflow in this way, by this measurement value compared with determining reference value, but for the pad 203 now paid close attention to, obtain the volume of the welding paste measured when it is checked by scolding tin print inspection machine 10, decide the value of determining reference value according to this volume.In one embodiment, from three determining reference value U0 shown in Fig. 6 below, U1, U2, select the matched value of volume with acquired welding paste.

In figure 6, for the distribution of the measurement value of the wetting forming height of scolding tin after the backflow of certain part, following three types is divided into represent: the volume " appropriately " (near the standard value predetermined) of welding paste, to be in the scope of " scolding tin is too much ", to be in the scope of " scolding tin is very few ".In addition, in this embodiment, standard value is set to 100%, by more than 70% and the measurement value being less than 130% be set to " scolding tin is appropriate ", the measurement value of more than 130% is set to " scolding tin is too much ", the measurement value being less than 70% is set to " scolding tin is very few ", but classification is also not limited only to this.

In Fig. 6, no matter which kind of type, all and that obtain the distribution curve (with single dotted broken line represent) of measurement value good according to soldering position is associated with to the word (character) of " OK ", basis is created that part electrode such as to float at the bad soldering position and the distribution curve (represented by dashed line) of measurement value that obtains is associated with the word (character) of " NG ".

As shown in each curve map, after backflow scolding tin wetting forming height and good/bad between relation, the volume because of welding paste is different and have very big-difference.Produced whole bad in order to not miss, need determining reference value to be set to than welding paste the value that bad group when being " scolding tin is too much " is taller, if but set like this in Fig. 6 example, then can a lot of certified products be judged as bad, cause productivity low.

Therefore, in this embodiment, for often kind of part, utilize the sample quite counted, according to the type of welding paste volume, obtain soldering in good condition time backflow after the distribution of wetting forming height of scolding tin and soldering state bad time backflow after the distribution of wetting forming height of scolding tin, for each type, the value U0 outside the distribution of group bad for removing, U1, U2 are set as determining reference value.

The determining reference value U0 of above-mentioned three types, U1, U2 and for selecting their program, provided by as selective rule.Soldering inspection machine 30 is according to the scrutiny program of the database data based on each part and selective rule, for each soldering position of check object, obtain by the volume of solder printing inspection machine 10 to the welding paste that the pad corresponding with this position measures, select and the matched determining reference value of this volume.Then, according to this determining reference value, judge the good/bad of the wetting forming height of scolding tin after the backflow measured in own device.

The setting of determining reference value is not limited to said method.Such as, also can pass through the method shown in Fig. 7, set the function of the relation between measurement value and determining reference value representing welding paste volume.

In the example of fig. 7, X-axis be set to the volume of welding paste and Y-axis be set in the plane of the wetting forming height of the rear scolding tin of backflow, the measurement value describing to obtain according to the sample quite counted is distinguished according to good sample, bad sample, based on the distribution range that these measurements are worth, setting represents the straight line E of the determining reference value of each welding paste volume.In each measurement value, the measurement value in the scope on straight line E is judged as certified products, and the measurement value in the scope under straight line E is judged as bad.

Such setting straight line E: the group G making bad sample _nGmeasurement value be all positioned under straight line E, make the group G of good sample _oKinterior measurement value is as often as possible positioned on straight line E.Thus, the formula Y=α X+ β of the straight line E calculated by login, is suitable for the measurement value X of the volume of welding paste to this formula, thus can change the determining reference value corresponding with the wetting forming height of scolding tin after backflow according to the volume of welding paste.Thereby, it is possible to pole fine adjusts determining reference value.

When adopting the method for Fig. 7, determine the formula Y=α X+ β of above-mentioned straight line E, generate selective rule and be provided to soldering inspection machine 30, the formula that this selective rule comprises this straight line and the program defined for utilizing this formula to calculate the algorithm of determining reference value.Thus, in soldering inspection machine 30, for each soldering position of check object, obtain the volume of the welding paste measured for the pad corresponding with this position by solder printing inspection machine 10, utilize this volume to calculate determining reference value.

No matter adopting which kind of method in Fig. 6, Fig. 7, in order to set appropriate determining reference value, all needing the causal sample quite counted between the wetting forming height to the rear scolding tin of volume and backflow representing welding paste to analyze.These samples are not limited to the data obtained according to substrate in kind, such as, can obtain the welding paste according to various volume by the method for fluid simulation and the leg shape obtained, survey the wetting forming height of this leg, thus generate multiple sample.

Next, as long as be the volume of the pad outshot being formed with leg by the volume defining of the welding paste used when determining determining reference value, then more appropriate determining reference value can be set.

The volume of welding paste is obtained in order to be limited to pad outshot, such as shown in Fig. 8, in soldering inspection machine 30, region N1, N2 of being formed with leg are determined in distribution based on the color of the pad in image, in inspection data administrator 102, for each pixel in above-mentioned zone N1, N2, utilize the altitude information of the welding paste obtained by solder printing inspection machine 10, the volume of the scolding tin in region N1, N2 is measured again.In addition, although the fiduciary level of measurement value is slightly poor, when solder printing inspection machine 30 checks, can be measurement region by the range set of the normal size based on pad outshot, thus obtain the volume of the welding paste in this measurement region.

In the embodiment illustrated to this, measure premised on the wetting forming height of scolding tin after backflow to utilize soldering inspection machine 30, volume based on the welding paste obtained by solder printing inspection machine 10 decides determining reference value, but is not limited in wetting forming height for the inspection parameter of the object making determining reference value change.Such as, according to part kind, in inspection area, sometimes also detect specific look region (blue or red), whether appropriately to judge its position, area, but also can be used for the object of these determining reference value judged as variation setting.

Also be not limited to the volume of welding paste for the measurement value of operation before determining determining reference value, the mean value of the height of welding paste, welding paste also can be used relative to the position and area etc. of the print range of pad.In addition, the combination of multiple measurement value also can be used to decide determining reference value.

In addition, the state of the part before reflow process likely brings impact to soldering.Such as, if the installation site of part deviation occurs and causes the area of pad teat to change, then after backflow, the angle of inclination of scolding tin also can change.Therefore, can by deciding determining reference value according to the combination of the measurement result of solder printing inspection machine 10 and the measurement result of part installation check machine 20.Also soldering inspection machine 30 can be utilized to check the position and degree of tilt etc. of part, therefore, also pad teat can be measured according to the measurement result of gained during this inspection, but according to the difference of part, sometimes cause because of backflow scolding tin to soak the top being molded into part electrode, be difficult to the ora terminalis determining part electrode.Sometimes for this part, utilize the part before reflow process to check time measurement data, correctly can calculate the value of pad teat.

, utilize Fig. 9 below, by be used for the object that determining reference value is changed inspection and when determining determining reference value the measurement parameter that uses be set to arbitrarily, the broad steps of the process of enforcement in soldering inspection machine 30 is described.In addition, in this explanation, the process obtaining the information logged in own device is called " reading ", the process being obtained the information logged in this other device by the communication with other device is called " reading in ".

In this step, step S1 and step S2 represents the setting process before inspection.First, in initial step S1, carry out for middle operations selecting the substrate of check object such as the lists from substrate, according to this operation, the substrate design data that sensing pin logs in selected substrate.In step s 2, read in from scrutiny program management devices 101 database data corresponding with various part be included in substrate design data, it correspondingly with the installation site of the part in substrate design data is associated.Thus, the scrutiny program group needed for the inspection of each part is signed in in soldering inspection machine 30.

Then, according to the setting operation of user, implement to revise the process of scrutiny program, the process (all not shown) etc. for substrate segmentation reference object region, be transferred to inspection (process).

In inspection, first, the measurement value determining to use the inspection machine of front operation to obtain is to the part performing inspection and the kind (step S3) of measurement value used.Then, suitably switch and take reference object region, setting inspection area, check object position in the picture, one side, performs circular treatment LP for each inspection area.

In circular treatment LP, based on the scrutiny program for the inspection area setting in process, perform feature extraction process and measurement process (step S4).And then, when needs decide determining reference value based on the measurement value in front operation (step S5 is "Yes"), read in required measurement value (step S6) from inspection data administrator 102, read in measurement value is applied to selective rule and decides determining reference value (step S7).Then, the measurement value obtained in step s 4 which is contrasted with the determining reference value determined in step 7, thus judge good/bad (step S8).On the other hand, do not needing in the situation (step S5 is "No") deciding determining reference value based on the measurement value of front operation, read the determining reference value (step S9) at inspection area unique login, utilize this determining reference value to perform the judgement process of step S8.

If perform circular treatment LP to complete inspection region, then in step slo, each judged result is gathered, thus judge the good/bad of whole substrate, result is exported to and checks data administrator 102 etc.Below, in the situation (step S11 is "Yes") that there is follow-up substrate, with this substrate for object carries out circular treatment LP.

As shown in above-mentioned steps, in the soldering inspection machine 30 of present embodiment, position that can be corresponding for the soldering position with check object, based on the measurement value that the inspection machine 10,20 by front operation obtains, carrys out variable setting determining reference value.Therefore, even if the measurement value calculated by own device is identical, if the installment state of the state of the welding paste before reflow process and part is different, then determining reference value also can dissimilate, and therefore, likely makes check result different because respective state is different.

Next, according to the kind of the inspection performed by soldering inspection machine 30, be not limited by and set the method that determining reference value changes inspection reference content changeably, sometimes change significantly changing of contents processing self etc. and check that the method for benchmark is also fine.Alignment processing is carried out in order to this situation be included, in embodiment shown in Figure 10 below, set multiple inspection benchmark that the scrutiny program that performs for the specific inspection implemented by soldering inspection machine 30 is different, check benchmark to select from these and be worth matched inspection benchmark with the measurement obtained in the inspection of the operation before reflow process.

In Fig. 10, represent at each inspection machine 10,20,30 and scrutiny program management devices 101 and check the main information stream carrying out between data administrator 102 exchanging.

In this embodiment, for the specific inspection performed by soldering inspection machine 30, in advance for often kind of part, multiple inspection benchmark is set based on cause-effect relationship between the measurement parameter in solder printing inspection machine 10, part inspection machine 20 and the measurement parameter in soldering inspection machine, the program defining each inspection benchmark is edited into respective database data respectively, then they is logged in scrutiny program management devices 101.In scrutiny program management devices 101, also log in the selective rule being used for selecting a benchmark in these multiple inspection benchmark.This selective rule is also transferred into (HA) that check data administrator 102(Figure 10), and be registered in this device.

Soldering inspection machine 30, from scrutiny program management devices 101, for each part of the substrate of check object, read in the multiple database datas ((RO) of Figure 10) comprising the scrutiny program embodying the inspection benchmark that content is different for this part, and these database datas are signed in own device.On the other hand, in solder printing inspection machine 10, part inspection machine 20, samely, the database data ((I) of Figure 10) that one checks benchmark is read in for each part, check based on them, further, the check result comprising the measurement value obtained by this processing procedure is sent to (NI) that check data administrator 102(Figure 10).In inspection data administrator 102, preserve the information that these send as prior art.

Soldering inspection machine 30, performs concurrently with the inspection of each inspection benchmark, whole check results (being included in the measurement value that respective checking process obtains) is sent to (HO) that check data administrator 102(Figure 10).In inspection data administrator 102, before receiving the information of this transmission, based on being provided the selective rule come by scrutiny program management devices 101, from the various inspection benchmark that soldering inspection machine 30 is implemented, select to be worth matched inspection benchmark with the measurement received from solder printing inspection machine 10 or part inspection machine 20.Then, if receive the check result of each inspection benchmark from soldering inspection machine 30, then select the check result corresponding with the inspection benchmark that the object position checked for these is selected, and only preserve this check result.And then, check that the check result of selection feeds back to (HE) of soldering inspection machine 30(Figure 10 by data administrator 102).Thus, in soldering inspection machine 30, make the check result of the feedback received effective, make other check result invalid or discarded.

According to the embodiment of above-mentioned Figure 10, in the check result of multiple inspection benchmark that the contents processing that can to calculate etc. from the setting of inspection area, the kind of feature extracted inspection area and measurement is different, select with reflow process before operation acquired by measurement value shown in reflow process before welding paste and the optimal check result of state of part, be defined as check result.Therefore, it is possible to the difference of state according to the welding paste before reflow process and part, change the scope of examination of actual enforcement.

In addition, in the example of Figure 10, soldering inspection machine 30 is made to perform the complete inspection utilizing multiple inspection benchmark, in each check result, make with reflow process before the matched check result of pattern of measurement value that obtains effective, but the method checked is not limited in this.Such as, also before soldering inspection machine 30 starts to check, the selection result checking benchmark can be notified, according to this notice from inspection data administrator 102, only perform the inspection utilizing the inspection benchmark selected by soldering inspection machine 30, this result is sent to and checks data administrator 102.In addition, also can will check that the selective rule of benchmark logs in soldering inspection machine 30, in soldering inspection machine 30, from checking that data administrator 102 reads in the measurement data that other inspection machine 10,20 measures, by these measurement market demands in selective rule, thus select to check benchmark in soldering inspection machine 30 self.

In addition, when selecting as described above to check benchmark in soldering inspection machine 30, the measurement value for this selection is not limited to be from checking the value that data administrator 102 inputs, and also can be the value directly inputted from the inspection machine implementing this measurement.This is also same in the embodiment of previous change determining reference value.

At this, the object lesson of the selective rule of the inspection benchmark used in the example of Figure 10 is described.

In fig. 11, for by lead-in wire part as the soldering inspection of object, utilize process flow diagram and schematic diagram, represent the selective rule used under specific circumstances, this particular case refers to, uses and checks the combination of the measurement value of gained by solder printing inspection and part and check in benchmark at two the situation selecting.In this example embodiment, in order to distinguish the example of two shown in Figure 15, set and be called the inspection benchmark R1 of the wetting forming height of scolding tin " after the checking backflow ", be called the inspection benchmark R2 in " the red sector territory near the front end detecting part electrode thus check this area ".

Utilize the process flow diagram in Figure 11, the selective rule of this example is described.

In this selective rule, as shown in schematic diagram (A) (B), its prerequisite is, measures the mean value h1 of the height of welding paste 303 in solder printing inspection machine 10, measures the height h2 of part electrode 301 upper surface in part inspection machine 20.In the process utilizing selective rule, first, these measurements value h1, h2 is utilized to calculate the difference in height Δ h(step S101 of part electrode 301 and welding paste 303), a Δ h and two threshold value T1, T2 are compared (step S102, S103).

In schematic diagram (C), by amplifying a part for electrode 301 for the lead-in wire part shown in schematic diagram (B) and the welding paste 303 near it, represent the setting example of above-mentioned threshold value T1, T2.In the figure, the value suitable with both differences during state be embedded in electrode 301 appropriateness in welding paste 303 is set to threshold value T2.On the other hand, threshold value T1 be equivalent to electrode 301 float before state time (representing with single dotted broken line in the diagram) both differences in height, therefore, be set to the value slightly less than the thickness of electrode 301.

Get back to the explanation of process flow diagram.In this example embodiment, at Δ h in the situation (step S102 is "Yes") and the situation (step S103 be "Yes") of Δ h at below threshold value T2 of more than threshold value T1, select to check benchmark R1(step S104).On the other hand, under the situation (step S102,103 is "No") that Δ h gets the value from threshold value T2 to T1, select to check benchmark R2(step S105).

According to above-mentioned selective rule, although do not float at part electrode 301, when part electrode 301 is in the position relatively higher than welding paste 303, Δ h is larger than threshold value T2, and less than threshold value T1.Thus, the check result that benchmark R2 obtains is effective now to make utilization check, therefore, it is possible to check out rightly, although produce leg hardly after reflow process, the connection of part electrode 301 and pad 300 also no problem (example of the hypomere of Figure 15).

On the other hand, before reflow process, part electrode 301 creates and floats, Δ h is larger than threshold value T1, when having installed part electrode 301 rightly, Δ h becomes below threshold value T2, therefore, adopts the check result utilizing and check that benchmark R1 obtains in these cases, that is, after adopting utilization backflow, the wetting forming height of scolding tin carries out the result checked.By distinguishing inspection benchmark like this, floating of part electrode 301 can not be missed, thus can be judged as good for the soldering state that the example of the hypomere of Figure 15 is such.

And then, in the above example, also can change according to the measurement value etc. of the volume of welding paste the determining reference value that each inspection benchmark R1, R2 are set.Such as, with regard to inspection benchmark R1, three kinds of determining reference value U0 of the example of setting Fig. 6, U1, U2, as long as the matched value of volume with welding paste can be selected in them, just can utilize strict benchmark when part electrode 301 produces and floats, thus prevent from missing bad, even if the wetting forming height step-down of scolding tin after backflow, it is bad for also can preventing (example of the hypomere of Figure 13) soldering condition adjudgement good with the connection of pad 300 for part electrode 301.

The explanation of Reference numeral

S substrate,

1 control treatment portion,

2 cameras,

3 Lighting Divisions,

4 Substrate tables,

10 solder printing inspection machines,

11 solder printing devices,

20 part inspection machine z,

21 assembly machines,

30 soldering inspection machines,

31 reflow ovens,

102 check data administrator

Claims

1. a soldering inspection method, while throw light on from prescribed direction to substrate, while take this substrate by camera, the reflected light picture that soldering position in generated image shows is analyzed, thus check the soldering state at this position, described substrate is the substrate being implemented multiple operation in order to manufactured parts installation base plate, in the multiple operations implemented this substrate, last operation is reflow process, described camera is configured in can the incident position by the normal reflection light of the soldering position indirect illumination light of substrate, the feature of this soldering inspection method is,

In at least one operation in the multiple operations implemented before described reflow process, the structure be attached on substrate is measured before next operation starts, as prerequisite, determine the rule of the inspection benchmark needed for inspection after reflow process in the following manner, which refers to, result according to the measurement process implemented for the position that the soldering position with check object is corresponding before reflow process changes described inspection benchmark

For the soldering position of the substrate after described reflow process, by the rule of described inspection benchmark, the measurement process be applied to by implementing before reflow process comes in the result of the measurement process implemented for the position corresponding with this soldering position, thus determines to check benchmark;

The result of described measurement process, comprises the welding paste volume at described soldering position or the position of institute's mounting parts and the measurement result of degree of tilt,

Described inspection benchmark is for judging the inspection benchmark that the soldering at described soldering position is highly whether appropriate.

2. soldering inspection method as claimed in claim 1, is characterized in that,

The rule of the described inspection benchmark of such setting:

Be used in and differentiate and carry out measuring process for the soldering position of check object and the whether appropriate determining reference value of the measurement value that obtains, change because of the result of measurement process of carrying out for the position corresponding with this soldering position before reflow process.

3. soldering inspection method as claimed in claim 1, is characterized in that,

The rule of the described inspection benchmark of such setting:

Multiple inspection benchmark that the content determined from the result according to the measurement process before the reflow process of carrying out for the position corresponding with soldering position is different, select the matched inspection benchmark of result of the measurement process before the reflow process of carrying out at the position corresponding with for the soldering position with check object.

4. soldering inspection method as claimed in claim 1, is characterized in that,

The rule of the described inspection benchmark of such setting:

Processing and the combination of the measurement value obtained according to implementing multiple measurement for the position corresponding with soldering position before reflow process, changing the inspection benchmark for this soldering position.

5. soldering inspection method as claimed in claim 1, is characterized in that,

The rule of the described inspection benchmark of such setting:

Carry out the measurement process in solder printing operation according to the pad corresponding for the soldering position with check object and the measurement value obtained, change the inspection benchmark for this soldering position.

6. soldering inspection method as claimed in claim 1, is characterized in that,

The rule of the described inspection benchmark of such setting:

The measurement process in solder printing operation is carried out and the measurement value obtained according to the pad corresponding for the soldering position with check object, the measurement value that the part corresponding with for the soldering position with check object carries out the measurement process in part installation procedure and obtain, changes the inspection benchmark for this soldering position.

7. soldering inspection method as claimed in claim 1, is characterized in that,

The amount of the welding paste that each pad carrying out solder printing operation to measure on substrate by the pad corresponding for the soldering position with check object prints, is used as the measurement process before described reflow process,

In inspection after described reflow process, the relation at the angle of inclination shown in the reflected light picture showed based on the image of the substrate of check object and this reflected light picture, measures the height of the scolding tin after reflow process, thus judges that whether this measurement value is appropriate,

The rule of the described inspection benchmark of such setting:

Make the determining reference value whether height for judging the scolding tin after reflow process is appropriate, along with the measurement value of the amount of described welding paste diminishes and step-down.

8. a base plate inspection system, is characterized in that,

Have:

Be provided in the reflow process in the multiple operations implemented in order to manufactured parts installation base plate, for checking the inspection machine of the substrate after reflow process,

In at least one operation before being provided in reflow process, for checking the inspection machine of the substrate after this operation,

Apparatus for management of information, it reads in check result information by communicating from each inspection machine, can read according to each substrate and each check object position and manage the check result information of each inspection machine;

The inspection machine of described reflow process has following function: for the soldering position of check object, and the multiple inspection benchmark utilizing content different check;

In the inspection machine or apparatus for management of information of described reflow process, be provided with:

Rule storage unit, it stores the rule checking benchmark, the rule of this inspection benchmark is used for, for the inspection at the soldering position after reflow process, the result of the measurement process implemented when checking according to the inspection machine pair position corresponding with the soldering position of check object by the operation before reflow process, define and which selects check benchmark from described multiple inspection benchmark

Measurement value acquisition unit, it is for the soldering position of the check object after described reflow process, be sent to the check result information of apparatus for management of information from the inspection machine by the operation before reflow process, obtain to be implemented to measure by the inspection machine of the operation before this pair position corresponding with soldering position and process and the measurement value obtained

Check benchmark determining means, it is by the rule of described inspection benchmark, is applied in the measurement value obtained for the soldering position of described check object by described measurement value acquisition unit, thus determines to be worth matched inspection benchmark with this measurement;

9. base plate inspection system as claimed in claim 8, is characterized in that,

The inspection machine of described reflow process, for the soldering position of check object, utilizes whole described multiple inspection benchmark to perform inspection, and respectively the check result information of each inspection is sent to described apparatus for management of information,

Described apparatus for management of information possesses described rule storage unit, measurement value acquisition unit and checks benchmark determining means, and possesses reception information process unit,

This reception information process unit, checks object information from the inspection machine of reflow process, from this check result information, selects and preserves the information corresponding with the inspection benchmark determined by described inspection benchmark determining means.

10. base plate inspection system as claimed in claim 8, is characterized in that,

The inspection machine of described reflow process possesses described rule storage unit, measurement value acquisition unit and checks benchmark determining means, and possesses inspection performance element,

This inspection performance element, for the soldering position of check object, utilizes by checking that the inspection benchmark of benchmark determining means decision is to perform inspection, is sent to described apparatus for management of information by the check result information of this inspection gained.

11. 1 kinds of soldering inspection machines, take substrate as object, while throw light on from prescribed direction to this substrate, while take this substrate by camera, the reflected light picture that soldering position in generated image shows is analyzed, thus check the soldering state at this position, described substrate is the substrate being implemented multiple operation in order to manufactured parts installation base plate, in the multiple operations implemented this substrate, last operation is reflow process, described camera is configured in can the incident position by the normal reflection light of the soldering position indirect illumination light of substrate, the feature of this soldering inspection machine is,

Input block, it inputs measurement value for the soldering position for check object, this measurement value refers to, in at least one operation in the multiple operations implemented before described reflow process, before next operation starts, measurement is attached to structure on the position corresponding with this soldering position and the measurement value that obtains

Rule storage unit, it stores the rule checking benchmark, and the rule of this inspection benchmark defines in such a way, and which refers to, according to the measurement value inputted by described input block, changes the inspection benchmark at the soldering position for described check object,

Check performance element, for the soldering position of the substrate after described reflow process, the rule of described inspection benchmark is applied in the measurement value inputted by described input block, thus determines to be worth matched inspection benchmark with this measurement, based on this inspection benchmark, inspection is performed to soldering position;