CN103299177A

CN103299177A - Solder-attachment inspection method, PCB-inspection system, and solder-attachment inspection device

Info

Publication number: CN103299177A
Application number: CN201180064870XA
Authority: CN
Inventors: 藤井心平; 森弘之; 中岛克起; 谷上昌伸
Original assignee: Omron Corp
Current assignee: Omron Corp
Priority date: 2011-01-13
Filing date: 2011-03-17
Publication date: 2013-09-11
Anticipated expiration: 2031-03-17
Also published as: DE112011104725B4; DE112011104725B9; TW201231960A; JP5365643B2; CN103299177B; JP2012145483A; DE112011104725T5; WO2012096003A1

Abstract

A solder-printing inspection device (10) measures the volume of solder paste on a land on a PCB, and a solder-attachment inspection device (30) measures the wetting height of the solder after reflow. Said solder-attachment inspection device (30) contains: an inspection program which contains a plurality of evaluation criteria for evaluating the measured wetting height; and a selection rule for selecting from said evaluation criteria. Said selection rule defines which evaluation criterion to select depending on the volume of solder paste on the solder site being inspected, as measured by the solder-printing inspection device (10). The solder-printing inspection device (10) reads, from an inspection-data management device (102), the solder-paste volume corresponding to the solder site being inspected and determines the aforementioned evaluation criterion on the basis thereof.

Description

Soldering inspection method and base plate inspection system and soldering inspection machine

Technical field

The present invention relates to for the manufactured parts installation base plate and in a plurality of operations of implementing, be that object carries out visual examination with the substrate that just finishes up to reflow process, thereby judge soldering state whether check system and the soldering inspection machine of appropriate methods and this method of application that is installed in the various parts on the substrate.

Background technology

General each operation of passing through printing process, part installation procedure and the reflow process of welding paste (cream solder, solder(ing) paste) is produced component mounting board.In production line in recent years, the production line that has imported base plate inspection system is arranged, in this base plate inspection system, be equipped with inspection machine at each operation in these operations, the check result of each inspection machine is aggregated into signal conditioning package, thereby can confirm (for example, with reference to patent documentation 1) at each same object.

With regard to the inspection at the soldering position after the reflow process, be extensive use of this inspection machine, this inspection machine utilizes the specular reflective of scolding tin, from oblique upper the substrate that checks object is thrown light on, directly over roughly, this substrate is taken simultaneously, the pattern of the reflected light picture in the image that generates is analyzed.For example, in patent documentation 2, put down in writing such processing: respectively from the different direction of the scope of incident angle each color light to substrate irradiation red, green, blue, according to the COLOR COMPOSITION THROUGH DISTRIBUTION pattern corresponding with these illumination light, generate the image that shows the scolding tin heeling condition, handle (with reference to the 0003rd, 0034～0040 section of patent documentation 2) based on the inspection benchmark of having logined this COLOR COMPOSITION THROUGH DISTRIBUTION pattern in advance.

For the inspection after the solder printing operation, adopt this inspection machine too, by this inspection machine, from directly over take substrate and carry out two dimensional image and handle, thereby the area of the welding paste on each pad on the instrumentation substrate, printing position etc.In addition, obtain the 3D shape that checks the object position, the inspection machine (for example with reference to patent documentation 3) of volume by phase-shifting method in addition.

In any operation, if check automatically, all need in advance inspection machine to be logined the inspection benchmark that is suitable for respectively checking the object position.The inspection benchmark refers to, the detection method at the setting of inspection area, instrumentation object position, be used for instrumentation computing method, be used for judging whether appropriate judgment standard value etc. of instrumentation value, these are various information of necessity of defining in order to check, can realize by program (computer program).

In order to improve the precision of inspection, need appropriate inspection benchmark be set at each part.And then at the inspection after the final reflow process, also need to set and can not miss bad inspection benchmark.

With regard to above-mentioned problem, in patent documentation 2, for a kind of part, also can set the inspection benchmark of different content because of formed leg (fillet) shape difference.Summary according to its record, in the inspection machine of patent documentation 2, at every kind of part, with the part of this kind the corresponding a plurality of inspection reference datas of a plurality of leg shapes that can form, store with the altitude range of the leg of corresponding shape is corresponding respectively relatedly.In addition in teaching is handled, at each part that is installed on the substrate, according to the shape data of this part and with the size of this part corresponding bonding pad, calculate the height of the leg of this part, read the inspection benchmark highly corresponding with this, its inspection area with the part of handling object is associated.Thus, at each part, the inspection benchmark that the shape of formed leg adapts on application and this part.

The prior art document

Patent documentation

No. 3966336 communique of patent documentation 1:JP patent

No. 4103921 communique of patent documentation 2:JP patent

Patent documentation 3:JP spy opens the 2010-91569 communique

Summary of the invention

The problem that invention will solve

In the scheme of patent documentation 2 records, the existing inspection benchmark in the inspection after the reflow process is the following is prerequisite setting, that is, soldering is in good condition, in other words, and in comprising whole operations of reflow process, can implement appropriately to be treated to prerequisite.But, in fact, in the solder printing operation, various variations can take place because of the time in the number to be printed of welding paste, printing position, the installation site of part and also can change etc. with respect to the amount of being pressed into of welding paste in the part installation procedure, sometimes, because the shape change of the scolding tin after refluxing, therefore, even certified products, inspection machine also can be judged as the shape that is not suitable for checking benchmark.

Below, utilize Figure 12～Figure 15 that the problems referred to above are described.Each figure expression for an electrode of lead-in wire part, the situation of the state change of the shape of the scolding tin of soldering position after reflow process before because of reflow process.In each figure, the 300th, pad, the 301st, the electrode of part.In addition, the 302nd, the welding paste before refluxing, the 303rd, because of the scolding tin that solidifies again after the reflow process fusion (below, be called " back scolding tin refluxes ").

In Figure 12, on get off comparison electrode 301 produce and float the example of situation and not have generation to float the example of situation.In the solder printing operation, in each example, though all printed the welding paste 302 of standard volume, but do not float in the following Example of situation at electrode 301, the scolding tin of fusion is blocked by electrode 302, the back scolding tin 303 that causes refluxing is too high, has formed appropriate dip plane (leg) in the part from the ora terminalis of pad 300 to the front end of electrode 301 (below, this part is called " pad teat ").Relative therewith, in the example on electrode 301 floats, the scolding tin of fusion spreads and attenuation at pad 300, and scolding tin 303 becomes the even shape in the following example after causing refluxing.

So, even the number to be printed of scolding tin is identical, under the situation that electrode 301 floats and the situation of not floating, height, the heeling condition of the back scolding tin 303 that refluxes also can changes.

Yet, shown in the example of the bottom of Figure 13, though the amount of welding paste 302 is lacked than standard, also can electrode 301 well be connected with pad 300 via refluxing back scolding tin 303 sometimes.The situation (example on the top of Figure 13) that electrode 301 floats when in this case, refluxing the amount standard of the height of back scolding tin 303 and heeling condition and welding paste 302 is identical.

Figure 14 represents cause the refluxing example of shape change of back scolding tin 303 of the height because of the electrode 301 of the part of installing in the part installation procedure.

In the example on the top of Figure 14, electrode 301 appropriateness are embedded in the welding paste 302, and therefore, in reflow process, the scolding tin of fusion is blocked by electrode 301, has formed appropriate dip plane at the pad teat.Relative therewith, in the example of the bottom of Figure 14, electrode 301 is arranged on the high position, therefore, in reflow process fusion scolding tin be inhaled into electrode 301 into below.Its result, the gradient of the back scolding tin 303(that refluxes) become very slow at the pad teat, it is precipitous that near the degree of tilt the ora terminalis of electrode 301 then becomes.In this state, being electrically connected also and can breaking down between electrode 301 and the pad 300, but sometimes as shown in the frame of broken lines of Figure 15 like that, low when the aspect ratio electrode 301 of scolding tin 303 floats after the backflow of pad teat.

Shown in above-mentioned each example, though be electrically connected no problemly between electrode 301 and the pad 300 sometimes, the face shaping of the back scolding tin 303 that refluxes becomes the state of approximate bad connection, and the back scolding tin 303 that refluxes is lower than the state of bad connection.In the visual examination after reflow process and since from directly over take substrate, therefore can't confirm floating and the state of the scolding tin of the below of electrode of electrode, can only judge based on the state of scolding tin 303 after the backflow of pad teat.Therefore, in existing inspection, though set such inspection benchmark in order not miss bad, namely, might represent under the condition of poor at the pattern of the reflected light picture that image shows, all it is judged as bad, still, still can produce a lot of under-enumeration (unacceptable product is judged as certified products), cause the low of production efficiency.

The present invention is in order to address the above problem, and purpose is in the inspection after reflow process, use different inspection benchmark according to the state at the inspection object position before the enforcement reflow process is different, thereby whether can distinguish the soldering state accurately appropriate.

For the means of dealing with problems

The invention provides a kind of soldering inspection method, from prescribed direction substrate is thrown light on one side, take this substrate by camera on one side, the reflected light that soldering position in the image that generates is showed looks like to analyze, thereby check the soldering state at this position, described substrate is the substrate that is implemented a plurality of operations for the manufactured parts installation base plate, last operation is reflow process in a plurality of operations of this substrate having been implemented, and described camera is configured in the position of the normal reflection light that can incident be formed by the soldering position indirect illumination light of substrate.In addition, the normal reflection light that the reflected light picture is mainly produced by soldering position indirect illumination light constitutes, but so long as contains the picture that light that near the direction normal reflection roughly reflects constitutes and get final product.

In inspection method of the present invention, in at least one operation in a plurality of operations of before described reflow process, implementing, instrumentation is attached to the structure on the substrate before next operation begins, as prerequisite, determine the rule of the inspection benchmark that inspection after the reflow process is required in the following manner, this mode refers to that the result who handles according to the instrumentation of implementing at the position corresponding with the soldering position that checks object changes described inspection benchmark before reflow process.And, soldering position at the substrate after the described reflow process, with the rule of described inspection benchmark, be applied to by the instrumentation of before reflow process, implementing and handle among the result of the instrumentation processing of implementing at the position corresponding with this soldering position, thereby determine to check benchmark.

Instrumentation as the operation before the reflow process is handled, for example, can be in the solder printing operation, instrumentation be printed on the area, volume of the welding paste on the pad, highly, welding paste is with respect to the relative position of pad etc.In addition, in the part installation procedure, the position at center that can the instrumentation part, part electrode with respect to the position of the ora terminalis of pad, part with respect to height of rotation deviation angle, part or the part electrode of the side-play amount of the regulating position that is predetermined, part etc.According to the present invention, even be installed in the part of same place of the substrate of same specification, the situation that the welding paste before reflow process or part status are different also might be used the inspection benchmark that has nothing in common with each other.Therefore, can implement to have considered the inspection of the state before the reflow process of this part at each part, thereby can improve the precision of distinguishing certified products and unacceptable product.

Above-mentioned inspection method preferred embodiment in, set the rule of described inspection benchmark like this: be used in that differentiation carries out at the soldering position that checks object that instrumentation is handled and instrumentation value appropriate judgment standard value whether, because the result of the instrumentation processing carried out at the position corresponding with this soldering position before the reflow process changes.According to this embodiment, the step of the soldering position being carried out instrumentation is identical, but can change according to the state of the welding paste before the reflow process or part for judging whether the instrumentation value that instrumentation gets is appropriate.

Above-mentioned inspection method other preferred embodiment in, set the rule of described inspection benchmark like this: a plurality of inspection benchmark that the content that determines from the result who handles according to the instrumentation before the reflow process of carrying out at the position corresponding with the soldering position has nothing in common with each other, select and the matched inspection benchmark of handling at the instrumentation before the reflow process of carrying out with corresponding position, the soldering position that checks object of result.According to this embodiment, in the inspection after reflow process, can implement the inspection of different content according to the state of the welding paste before the reflow process or part.

In addition, before beginning, the inspection after the reflow process selects to check benchmark, utilize selected inspection benchmark to carry out inspection, but be not limited only to this, for example, can after having utilized whole inspection benchmark executed in parallel and checking, select to check benchmark, the result that employing utilizes selected inspection benchmark to check.

Other preferred embodiment in, set the rule of described inspection benchmark like this: according to before reflow process, implementing the combination that multiple instrumentation is handled the instrumentation value that gets at the position corresponding with the soldering position, change the inspection benchmark at this soldering position.

According to this embodiment, can handle the instrumentation value that gets according to a plurality of instrumentations and segment the inspection benchmark, thereby further improve the inspection precision after the reflow process.

Other preferred embodiment in, set the rule of described inspection benchmark like this: according at carrying out the instrumentation value that the instrumentation processing in the solder printing operation gets with the soldering position corresponding bonding pad that checks object, change the inspection benchmark at this soldering position.Thus, can be according to the volume of welding paste, area, highly, welding paste is with respect to the difference of print range of pad etc., changes the inspection benchmark.

Other preferred embodiment in, set the rule of described inspection benchmark like this: according to handling the instrumentation value that gets at the instrumentation that carries out in the solder printing operation with the soldering position corresponding bonding pad that checks object, the instrumentation value that gets with carrying out the instrumentation processing in the part installation procedure at the part corresponding with the soldering position that checks object changes the inspection benchmark at this soldering position.So, can be according to the pattern of the relation between the installment state of the state of welding paste and part different, change the inspection benchmark.

Other preferred embodiment in, come the amount of the welding paste that instrumentation each pad on substrate prints by described solder printing operation, the instrumentation that is used as before the described reflow process is handled.At this moment, can obtain at least one the parameter in the area, volume, height of expression welding paste, be used as " amount of welding paste ".

In addition, in this embodiment, in the inspection after described reflow process, the reflected light picture that shows based on the image of the substrate that checks object and the relation at the angle of inclination shown in this reflected light picture, come the height of the scolding tin after the instrumentation reflow process, thereby judge whether this instrumentation value is appropriate.And then, set the rule of described inspection benchmark like this: make the height appropriate judgment standard value whether that is used for judging the scolding tin after the reflow process, along with the instrumentation value of the amount of described welding paste diminishes and step-down.

According to above-mentioned embodiment, the example shown in the hypomere of Figure 13 is such, causes the height step-down of the scolding tin after the reflow process owing to the welding paste amount is few, but the faulty part of soldering state might be judged as certified products.On the other hand, the example shown in the epimere of Figure 13 is such, floats the height step-down that causes the scolding tin after the reflow process owing to electrode produces, and this part can be judged as bad.

Next, base plate inspection system of the present invention has: be provided in the reflow process in a plurality of operations of implementing for the manufactured parts installation base plate, for the inspection machine of the substrate after the inspection reflow process; Be provided in reflow process at least one operation before, for the inspection machine of the substrate after this operation of inspection; Apparatus for management of information, it can check the check result information that each inspection machine was read and managed at the object position according to each substrate and each by communicating by letter to read in check result information from each inspection machine.

The inspection machine of reflow process has following function: at the soldering position that checks object, a plurality of inspection benchmark that utilize content to have nothing in common with each other check.And then, in the inspection machine or apparatus for management of information of the reflow process of this system, be provided with following rale store unit, the instrumentation value obtains the unit and checks that benchmark determines the unit.

The rale store unit, its storage checks the rule of benchmark, the rule of this inspection benchmark is used for, inspection at the soldering position after the reflow process, the result that the instrumentation of implementing when checking according to the inspection machine pair position corresponding with the soldering position that checks object by the operation before the reflow process is handled has defined which selects check benchmark from described a plurality of inspection benchmark.

The instrumentation value obtains the unit, the soldering position of its inspection object after at described reflow process, be sent to the check result information of apparatus for management of information from the inspection machine by the operation before the reflow process, obtain the instrumentation value that is got by the inspection machine pair position corresponding with the soldering position enforcement instrumentation processing of the operation before this.

Check that benchmark determines the unit, it is the rule of described inspection benchmark, is applied to by described instrumentation value to obtain in the instrumentation value that obtains at the soldering position of described inspection object the unit, thereby determines and the matched inspection benchmark of this instrumentation value.

Rale store unit, instrumentation value obtain the unit and check that benchmark determines the unit, are arranged in the inspection machine of reflow process and in the apparatus for management of information any one.Under they are arranged on situation in the inspection machine of reflow process, the instrumentation value obtains the unit by communicating with apparatus for management of information, inspection machine in the operation before reflow process sends to the check result information of apparatus for management of information, obtains the information that (input) contains the instrumentation value corresponding with the soldering position that checks object.

In addition, under these unit are arranged on situation in the apparatus for management of information, the inspection machine that the instrumentation value obtains the operation of unit before reflow process receives and preserves the check result information, reads the information that contains the instrumentation value corresponding with the soldering position that checks object from this check result information.Perhaps, making the instrumentation value obtain the unit has when the inspection machine of the operation before reflow process receives check result information from wherein reading the function of instrumentation value, by checking that benchmark determines the unit, determine the inspection benchmark earlier before the inspection object position of the inspection machine of reflow process checked.

In an embodiment of said system, the inspection machine of reflow process at the soldering position that checks object, utilizes all described a plurality of inspection benchmark to carry out and checks, and respectively the check result information of each inspection is sent to described apparatus for management of information.In addition, apparatus for management of information possesses described rale store unit, the instrumentation value obtains the unit and checks that benchmark determines the unit, and possesses the reception information process unit, inspection machine receiving check object information from reflow process, from this check result information, select and preserve and determined by described inspection benchmark the inspection benchmark information corresponding of unit decision.By this structure, after the inspection machine of reflow process utilizes a plurality of inspection benchmark to finish complete inspection, in apparatus for management of information, in the check result of the matched inspection benchmark of state of the middle employing of each check result and the welding paste before the reflow process and/or part.

In other embodiment of said system, the inspection machine of reflow process possesses described rale store unit, the instrumentation value obtains the unit and checks that benchmark determines the unit.And then, inspection machine also possesses the inspection performance element, and this checks performance element, at the soldering position that checks object, utilization is by checking that the inspection benchmark that benchmark determines the unit to determine carries out inspection, and the check result information of this inspection gained is sent to described apparatus for management of information.By this structure, in the inspection machine of reflow process, can utilize with reflow process before welding paste and/or the matched inspection benchmark of the state of part carry out and check.

In addition, also rale store unit, instrumentation value can be obtained the unit and check that benchmark determines that the unit is arranged in the apparatus for management of information, will be by checking that inspection benchmark that benchmark determines that the unit determines is sent to the inspection machine of reflow process from apparatus for management of information, in the inspection machine of reflow process, check based on this that benchmark is carried out and check.

Used soldering inspection machine of the present invention, be object with the substrate, from prescribed direction this substrate is thrown light on one side, take this substrate by camera on one side, the reflected light that soldering position in the image that generates is showed looks like to analyze, thereby check the soldering state at this position, described substrate is the substrate that is implemented a plurality of operations for the manufactured parts installation base plate, last operation is reflow process in a plurality of operations of this substrate having been implemented, described camera is configured in the position of the normal reflection light that can incident be formed by the soldering position indirect illumination light of substrate, and it possesses following input block, the rale store unit, check performance element.

Input block, it is used for importing the instrumentation value at the soldering position that checks object, this instrumentation value refers to, in at least one operation in a plurality of operations of before described reflow process, implementing, before next operation begins instrumentation be attached to structure on the position corresponding with this soldering position and the instrumentation value.Should import, be not limited to aforesaid way, for example, also can be by communicating to finish input with described apparatus for management of information or the inspection machine of having implemented instrumentation.

The rale store unit, its storage checks the rule of benchmark, and the rule of this inspection benchmark defines in such a way, and this mode refers to that the instrumentation value according to by described input block input changes the inspection benchmark at the soldering position of described inspection object.Check performance element, soldering position at the substrate after the described reflow process, with the rule application of described inspection benchmark in the instrumentation value by described input block input, thereby determine and the matched inspection benchmark of this instrumentation value, check based on this that benchmark is carried out the soldering position and check.

By above-mentioned soldering inspection machine, can be according in the operation before reflow process the instrumentation value that instrumentation get being implemented at the soldering position that checks object, change for judging very/bad judgment standard value, instrumentation object, measuring method etc.

The effect of invention

According to the present invention, can be according to the state of the welding paste before the reflow process and/or the state of part, change the inspection benchmark that the soldering after the reflow process checks, therefore, can distinguish certified products and unacceptable product with high precision.

Description of drawings

Fig. 1 is that expression is with the corresponding related figure with the entire infrastructure of the production line of component mounting board of the structure of base plate inspection system.

Fig. 2 is the block diagram of the structure of expression soldering inspection machine.

Fig. 3 is the block diagram of the structure of expression solder printing inspection machine.

Fig. 4 is the figure that soldering checks the information flow between the device be correlated with.

Fig. 5 is the figure of the method for the wetting moulding height of scolding tin after refluxing for the explanation instrumentation.

Fig. 6 is for the figure of explanation for the establishing method of the judgment standard value of the wetting moulding height of judging the back scolding tin that refluxes.

Fig. 7 is for the figure of explanation for other establishing method of the judgment standard value of the wetting moulding height of judging the back scolding tin that refluxes.

Fig. 8 is the figure that limits the method for measurement region for explanation at welding paste.

Fig. 9 is the process flow diagram of the step of the processing in the expression soldering inspection machine.

Figure 10 is the respectively figure of the information flow between device when carrying out inspection according to a plurality of inspection benchmark.

Figure 11 is the figure that the process flow diagram of concrete example of the expression setting rule that checks benchmark and expression are used for the meaning of the threshold value selected.

Figure 12 is the figure of the result after the backflow of contrast expression part the electrode situation of floating and the situation of not floating.

Figure 13 is the figure of the result after the backflow of the few situation of the contrast expression part electrode situation of floating and welding paste amount.

Figure 14 is the figure of the result after the backflow of the normal situation of height of contrast expression part electrode and the situation that the part electrode disposes highly.

Figure 15 be the contrast expression part electrode situation of floating and part electrode dispose highly situation backflow after result's figure.

Embodiment

In Fig. 1, represent the entire infrastructure of the production line of the structure of an embodiment of base plate inspection system and component mounting board in corresponding related mode.

In illustrated production line, comprise solder printing operation, part installation procedure and reflow process.In the solder printing operation, be provided with solder printing device 11 and solder printing inspection machine 10, this solder printing device 11 is used for each the pad coating welding paste on the substrate, and this solder printing inspection machine 10 is used for the result of this device 11 is checked.In the part installation procedure, be provided with assembly machine (Mounter) 21 and part inspection machine 20, this assembly machine 21 is used for the substrate behind the solder printing is installed part, and this part inspection machine 20 is used for checking the installment state of part.In reflow process, be provided with reflow ovens 31 and soldering inspection machine 30, this reflow ovens 31 is used for the welding paste of the substrate after the fusion part is installed, and this soldering inspection machine 30 is used for checking the substrate after refluxing.Shown in the thick arrow among the figure, substrate sent in order each the device and processed, thereby finish the component mounting board corresponding with regulatory specifications.

The

inspection machine

10,20,30 of each operation is respectively via the LAN(LAN (Local Area Network)) loop 100 and interconnecting.On LAN loop 100, also be connected with scrutiny program management devices 101 and check data administrator 102.In scrutiny program management devices 101, logining in advance at each

inspection machine

10,20,30 has database, this data base set has suffered the scrutiny program that is used for carrying out based on the inspection benchmark that is predetermined inspection, is used as the database data (library data) of every kind of part.

In checking data administrator 102, preserve and in each

inspection machine

10,20,30, implemented the result who checks.In this check result information, comprise the quality that each checks the object position judged result and for carry out this judgement and implement the instrumentation result of (instrumentation).Can be at each

inspection machine

10,20,30 and read check result information by every substrate with by each part on the substrate.

In addition, scrutiny program management devices 101 also needn't separate with checking data administrator 102, also can make a computing machine have each management devices 101,102 function.On the contrary, also can constitute each management devices 101,102 by a plurality of computing machines.

In each

inspection machine

10,20,30, carried out following processing before checking: the input expression checks the data (for example cad data) of the structure of object substrate, read the database data that the part kind of information with each part shown in these input data adapts from scrutiny program management devices 101, the positional information of each part is associated with database data.Thus, each

inspection machine

10,20,30 is set the required environment of inspection that checks object substrate.In addition, the content based on the program of database data also can suitably be changed by setting operation by the user.

Fig. 2 represents the structure of soldering inspection machine 30.

The soldering inspection machine 30 of this embodiment has control handling part 1, camera (camera) 2, lighting device 3, substrate platform 4 etc.Substrate platform 4 can support the substrate S that checks object with flat-hand position, and makes this substrate S mobile in the direction along each limit with this posture.Camera 2 can generate coloured image, and is provided in the top of substrate platform 4, and its optical axis is towards vertical direction (camera 2 is configured to the substrate S on the platform 4 is carried out the state of top view) roughly.Lighting device 3 is provided between camera 2 and the substrate platform 4.

Lighting device 3 comprises ring-

type light source

3R, 3G, the 3B that sends red light, green light, blue light respectively.Each

light source

3R, 3G, 3B are configured to the central part state consistent with the optical axis position of camera 2 separately.In addition, the diameter (aperture) of each

light source

3R, 3G, 3B is different, and the red light source 3R of minimum diameter is configured in and goes up most, and the blue-light source 3B of maximum gauge is configured in the most following, and green light source 3G is configured between them.The purpose of this configuration is, makes each color different to the scope of the incident angle of substrate S incident light.

In control handling part 1, comprise by computer implemented control part 110, image input part 111, shooting control part 112, lighting control section 113, platform control part 114, storer 115, hard disk unit 116, communication interface 117, input part 118, display part 119 etc.Control part 110 is controlled the action of camera 2, lighting device 3, substrate platform 4 by shooting control part 112, lighting control section 113, platform control part 114.The image that camera 2 generates, in image input part 111, be carried out digital conversion after, input to control part 110.

In storer 115, except the storage program relevant with above-mentioned control, go back temporary transient preservation and handle the view data of object, result of calculation etc.In hard disk unit 116, the scrutiny program group (performance checks benchmark) based on the database data that provides from scrutiny program management devices 101, the instrumentation data that obtain checking process and check result are provided, are used for the image of inspection etc.

Communication is used for communicating with other device via described LAN loop 100 with interface 117.Input part 118 is used for specifying the operation of the beginning of inspection and end and imports various setting datas.The image that display part 119 is used for showing check result and is used for inspection.

Next, Fig. 3 represents the structure of solder printing inspection machine 10.In addition, in this Fig. 3, for the structure corresponding with Fig. 2, be used in behind the Reference numeral identical with Fig. 2 the Reference numeral behind the additional A and represent.

This solder printing inspection machine 10, based on the phase shift ratio juris height of the welding paste on the pad that is printed on substrate S is carried out instrumentation, it comprises control handling part 1A, camera 2A, lighting device 3A, substrate platform 4A, in addition also comprise projector (projector) 5, the pattern image that this projector 5 is used for substrate projected fringe shape.In addition, the lighting device 3A of this inspection machine 10 is made of the ring-type light source 3M that sends white light.Control handling part 1A also is provided with projector's control part 120 except having the structure identical with the control handling part 1 of soldering inspection machine 30.

With regard to part inspection machine 20, have the structure roughly the same with soldering inspection machine 30, therefore omit diagram.But, in part inspection machine 10, also can be used as the light source of lighting device 3 with white light source.

In part inspection machine 20, detect part on the substrate according to the image of the substrate S that checks object, its position of instrumentation, degree of tilt etc. judge based on this instrumentation result whether the installment state of part is appropriate.

In addition, as part inspection machine 20, also can use the device with the same structure of solder printing inspection machine shown in Figure 3 10.In this case, except the inspection of the installation site of part, posture, can also check the height of part and part electrode, with respect to degree of tilt of the part of vertical direction etc.

In above-mentioned three kinds of

inspection machines

10,20,30, the inspection of operation in the middle of solder printing inspection machine 10 is used for carrying out with part inspection machine 20, even but sometimes they be judged as (substrate) bad, also can by after the processing of operation improve (substrate) quality.Therefore, in a lot of workshops, can not take out from production line and be judged as bad substrate by solder printing inspection machine 10 or part inspection machine 20, flow to back segment but move them.

On the other hand, placing the soldering inspection machine 30 of final reflow process, need carry out strict judgement in order not miss bad, but as utilize Figure 12～Figure 15 explanation, the shape of scolding tin is sometimes because of the state change of printing state or the part of welding paste after the reflow process, back scolding tin presents the shape of approximate defective mode even reflux, and also still exists the numerous parts electrode to be connected good situation with pad.

Therefore, in the aforesaid substrate check system, when utilizing soldering inspection machine 30 to check, at the inspection benchmark at the soldering position that should check object, based on, adjusting by the result that

other inspection machine

10,20 instrumentations of implementing are handled at the position corresponding with this position.Particularly, in this embodiment, set a plurality of good/bad judgment standard values for the difference soldering, select the judgment standard value according to

other inspection machine

10,20 instrumentation result, change the content that checks benchmark by the method.Thus, even the part of installing in the same place of the substrate of same size because the state difference before the reflow process of part separately, therefore also has the also different situation of content that checks benchmark.

In Fig. 4, represent device that the inspection of soldering inspection machine 30 is correlated with and the information flow between device together.In this embodiment, scrutiny program management devices 101, inspection data administrator 102 and solder printing inspection machine 10 participate in the inspection of soldering inspection machine 30.

The scrutiny program management devices 101 of this embodiment at solder printing inspection machine 10, is provided for checking the scrutiny program (Fig. 4 (a)) of the volume that is printed on the welding paste on the pad.On the other hand, scrutiny program management devices 101 provides following first program and second program simultaneously at soldering inspection machine 30, this first program is the program for the wetting moulding height of scolding tin after the backflow that checks the soldering position, this second program is for the program of determining the change method, this change method is used for volume according to the welding paste corresponding with the soldering position that checks object and changes the judgment standard value that will use in this inspections (below, claim that this program is " selective rule ") (Fig. 4 (b) (c)).

Above-mentioned scrutiny program and selective rule, being included in the part kind is in the database data of unit, and is provided to each part.

Solder printing inspection machine 10, based on (being provided) scrutiny program that receives, the volume of the welding paste that instrumentation prints at each pad of the substrate S that checks object, thus judge the instrumentation value good/bad.Then, the check result information that will contain the instrumentation value of each pad is sent to (d) that checks data administrator 102(Fig. 4).Check data administrator 102 these information of preservation.

Soldering inspection machine 30 is also based on (being provided) scrutiny program that receives, the wetting moulding height of scolding tin after the backflow in each pad of the substrate S of instrumentation inspection object, thereby judge the instrumentation value good/bad, the check result information that will contain the instrumentation value is sent to (e) that checks data administrator 102(Fig. 4).But the judgment standard value that is used for this judgement is not constant, and is based on selective rule and selects from a plurality of judgment standard values.For this selection, soldering inspection machine 30 access checking data administrators 102, read the volume (Fig. 4 (f)) of the welding paste that the pad in the processing of substrate S of current reception obtains when being checked by solder printing inspection machine 10, thereby this volume applications is selected the judgment standard value in selective rule.

At this, the particular content of the inspection of implementing is described in each

inspection machine

10,30.

At first, in the inspection in solder printing inspection machine 10, in solder printing inspection machine 10, by based on the processing based on the 3 d measurement of phase-shifting method principle, calculate the volume of welding paste.In 3 d measurement, be a circulation with multiple projections, and meanwhile carry out and make striped move ormal weight to handle from the pattern image of 5 couples of substrate S of projector projected fringe shape at every turn, and, cooperate the opportunity of each projection and taken by camera 2A.The projection of a circulation and shooting if be through with, be object with each pixel in the inspection area in the image of each time shooting gained (setting at each pad) one by one then, detect the variation of the brightness in each the shooting, with the sine wave of this variation as one-period, obtain sinusoidal wave phase place.And then, based on carrying out triangulation at the relation between the projecting plane of handling phase place that object pixels calculates, pattern image and camera 2A and the predefined reference field face of the corresponding height of substrate (for example with), thereby calculate from reference field to the distance the point corresponding with the processing object pixels.The height of the point that this is corresponding with handling object pixels apart from expression.

In addition, different with above-mentioned processing, in solder printing inspection machine 10, under the white illumination of Lighting Division 3, take, detect the color of welding paste according to the inspection area in the image that generates.Then, calculate altitude information at the pixel of the color that detects this scolding tin, this altitude information is carried out integration, thereby obtain the volume of welding paste.

If calculated the volume of welding paste by said method, then in solder printing inspection machine 10, this volume and the judgment standard value of logining at each inspection area are contrasted, thereby judge good/bad, but also make the substrate that has carried the welding paste that is judged as " bad " flow into subsequent handling.

Next, describe at the instrumentation processing that is used for checking at soldering inspection machine 30.

In the soldering inspection machine 30 of this embodiment, each color light of red, green, blue is shone from the different direction substrate S of incident angle respectively, therefore, can be because of to the light that is incident to camera 2 in the normal reflection light of each color light of the dip plane irradiation of the back scolding tin that refluxes, and generate by each color distribution patterns of red, green, blue represent to reflux image of heeling condition of back scolding tin.Zone of all kinds in the image shows the angle of inclination roughly the same with the incident angle of each self-corresponding illumination light.In this embodiment, the red area that the red light of incident angle scope minimum produces in three looks shows the inclination (being 8～15 degree in this embodiment) of mitigation, and the blue region that the blue light of incident angle maximum produces in three looks shows precipitous inclination (being 25～38 degree in this embodiment).In addition, from the green area that the green light of the irradiation of the scope between red light and the blue light is given birth to, show by the angular range between the angular range shown in red area and the blue region (being 15～25 degree in this embodiment).

Fig. 5 represents to obtain based on the relation between the angle of inclination shown in zone of all kinds and these zones method of the wetting moulding height of the back scolding tin that refluxes.

In this Fig. 5, be example with chip element 200, with the synoptic diagram of the leg 202 of scolding tin after the electrode 201 of this chip element 200 of expression and the backflow that pad 203 is connected, with taking this leg 202 the synoptic diagram of image about corresponding related.In the synoptic diagram of image, represent zone of all kinds with different pattern respectively.

In this embodiment, the scope that contains whole part 200 in the image is set at the inspection area (not shown) that part uses thus detect part 200, and, each pad 203 is set inspection area F, thereby detects red sector territory, territory, Green Zone, territory, blue area in the F of this inspection area.In the image of the leg of shape shown in Figure 5, usually, along near the direction of the place the outside ora terminalis of the pad 202 from image towards part electrode 201, red, green, blue in order distributes.In addition, near the place part 200 produces the dark areas of representing the orientated at steep inclinations face sometimes, and this dark areas exceeds the scope of the enough blue areas of energy domain representation.

Utilize the feature of above-mentioned image, in this embodiment, distinguish and in the F of inspection area, comprise dark areas in the direction of four interior look areal distribution, along this direction setting instrumentation line L, on this instrumentation line L, the intersection point A1 that extracts A2, the A3 be positioned at zone of all kinds, A4 at borderline and intersect with the outside ora terminalis in red sector territory.And then, based on the testing result of part, extract the intersection point A5 of the ora terminalis of instrumentation line L and part electrode 201.

Next, in the point that extracts, to the each point except an A5, be suitable for the angle of inclination corresponding with this point.Though width is to a certain degree arranged respectively at the angle of inclination shown in the zone of all kinds, can think that adjacent look interregional boundary position represents near the angle the boundary value of the range of tilt angles shown in separately the look zone.Thus, in this embodiment, based on previous illustrative range of tilt angles, an A1 is suitable for 8 degree, an A2 is suitable for 15 degree, an A3 is suitable for 25 degree, an A4 is suitable for 38 degree.And shown in the curve map on the right side of Fig. 5, the relation between the angle that is suitable for according to the coordinate of each point A1～A4 and to each point A1～A4 derives along the curve of approximation M of the angle change of expression instrumentation line L.And then, the some A1 from this curve of approximation M is carried out integration to the each point in the scope of an A5, thus, calculate the height of the scolding tin corresponding with an A5, with its wetting moulding height as the back scolding tin that refluxes.

Though the angle of inclination shown in the zone of all kinds has the width of prescribed level respectively, but with regard to the boundary position between the look zone, owing to can obtain the high angle of inclination of fiduciary level, therefore, think that the curve of approximation of obtaining according to coordinate and the relation between the angle of inclination of each point A1～A4 can show rightly along the tilt variation of instrumentation line.In addition, also can infer the angle of inclination of the each point in the indefinite dark areas of heeling condition, infer based on this, can obtain the height near the scolding tin of part 200.

Utilize this method to obtain the wetting moulding height of backflow back scolding tin, this instrumentation value is compared with the judgment standard value, but at the pad 203 that pay close attention to this moment, obtain the volume of the welding paste that measures when it is checked by solder printing inspection machine 10, decide the value of judgment standard value according to this volume.In one embodiment, from following three judgment standard value U0 shown in Figure 6, U1, U2, select the matched value of volume with obtained welding paste.

In Fig. 6, distribution at the instrumentation value of the wetting moulding height of scolding tin after the backflow of certain part is divided into following three types of expressions: near the volume of welding paste " appropriately " (standard value that is predetermined), be in " scolding tin is too much " scope, be in the scope of " scolding tin is very few ".In addition, in this embodiment, standard value is made as 100%, to be made as " scolding tin is appropriate " more than 70% and less than 130% instrumentation value, instrumentation value more than 130% is made as " scolding tin is too much ", will be made as " scolding tin is very few " less than 70% instrumentation value, but classification also is not limited only to this.

Among Fig. 6, which kind of type no matter, all to the distribution curve (representing with the single-point line) of the instrumentation value that well gets according to the soldering position related the literal (character) of " OK ", to according to produced the part electrode float etc. the instrumentation value that bad soldering position get distribution curve (dotting) association the literal (character) of " NG ".

Shown in each curve map, the relation between the wetting moulding height of the back scolding tin that refluxes and very/bad has very big-difference because the volume of welding paste is different.In order not miss produce whole bad, the judgment standard value need be made as than the bad group taller value of welding paste when " scolding tin is too much ", if but in Fig. 6 example, set like this, then a lot of certified products can be judged as badly, cause productivity low.

Therefore, in this embodiment, at every kind of part, utilize the sample of quite counting, type according to the welding paste volume, obtain the wetting moulding distribution highly of scolding tin after the distribution of the wetting moulding height of scolding tin after the backflow of the soldering when in good condition backflow when bad with the soldering state, at each type, value U0, U1, the U2 that removes outside the distribution of bad group is set at the judgment standard value.

Above-mentioned three types judgment standard value U0, U1, U2 and be used for selecting their program, being used as selective rule provides.Soldering inspection machine 30 bases are based on scrutiny program and the selective rule of the database data of each part, at each the soldering position that checks object, obtain the volume of the welding paste that is measured by 10 pairs of solder printing inspection machines and this position corresponding bonding pad, select and the matched judgment standard value of this volume.Then, according to this judgment standard value, the wetting moulding height of scolding tin is good after the backflow that judgement measures in self installs/and bad.

The setting of judgment standard value is not limited to said method.For example, also can set the instrumentation value of expression welding paste volume and the function of the relation between the judgment standard value by method shown in Figure 7.

In the example of Fig. 7, be made as on the wetting moulding plane highly of the back scolding tin that refluxes at the volume that X-axis is made as welding paste and with Y-axis, distinguish according to good sample, bad sample and to describe the instrumentation value that gets according to the sample of quite counting, based on the distribution range of these instrumentation values, set the straight line E of the judgment standard value of each welding paste volume of expression.In each instrumentation value, the instrumentation value in the scope on straight line E is judged as certified products, and the instrumentation value in the scope under straight line E is judged as bad.

Set straight line E like this: the group G that makes bad sample _NGThe instrumentation value all be positioned under the straight line E, make the group G of good sample _OKInterior instrumentation value as often as possible is positioned on the straight line E.Thus, the formula Y=α X+ β of the straight line E that login is obtained is suitable for the instrumentation value X of the volume of welding paste to this formula, thereby can change the judgment standard value highly corresponding with the wetting moulding of the back scolding tin that refluxes according to the volume of welding paste.Thus, can fine adjust the judgment standard value by the utmost point.

Under the situation of the method that adopts Fig. 7, determine the formula Y=α X+ β of above-mentioned straight line E, generate selective rule and it is provided to soldering inspection machine 30, this selective rule comprises the formula of this straight line and has defined and is used for utilizing this formula to calculate the program of the algorithm of judgment standard value.Thus, in soldering inspection machine 30, at each the soldering position that checks object, obtain by the volume of solder printing inspection machine 10 at the welding paste that measures with this position corresponding bonding pad, utilize this volume to calculate the judgment standard value.

No matter adopt which kind of method among Fig. 6, Fig. 7, in order to set appropriate judgment standard value, all need the causal sample of quite counting between the wetting moulding height of the volume of expression welding paste and the back scolding tin that refluxes is analyzed.These samples are not limited to the data that get according to substrate in kind, for example can obtain the leg shape that the welding paste according to various volumes gets by the method for fluid simulation, survey the wetting moulding height of this leg, thereby generate a plurality of samples.

Next, as long as will when determining the judgment standard value, the volume defining of used welding paste be the volume that is formed with the pad outshot of leg, then can set more appropriate judgment standard value.

Obtain the volume of welding paste in order to be limited to the pad outshot, for example shown in Figure 8, in soldering inspection machine 30, determine to be formed with regional N1, the N2 of leg based on the distribution of the color of the pad in the image, in checking data administrator 102, at each pixel in above-mentioned zone N1, the N2, utilize the altitude information of the welding paste of being obtained by solder printing inspection machine 10, the volume of the scolding tin in regional N1, the N2 is carried out instrumentation again.In addition, though the fiduciary level of instrumentation value is poor slightly, when solder printing inspection machine 30 checks, the scope based on the normal size of pad outshot can be set at measurement region, thereby obtains the volume of the welding paste in this measurement region.

In the embodiment of this explanation, wetting moulding with scolding tin after utilizing soldering inspection machine 30 to come instrumentation to reflux highly is prerequisite, volume based on the welding paste of being obtained by solder printing inspection machine 10 decides the judgment standard value, but is not limited in wetting moulding height for the inspection parameter of the object that makes the change of judgment standard value.For example, according to the part kind, also in the inspection area, detect specific look zone (blue or red) sometimes, judge whether its position, area be appropriate, but also can be used for the object that the judgment standard value of these judgements is set as change.

Be used for to determine the instrumentation value of the preceding operation of judgment standard value also to be not limited to the volume of welding paste, the average height, welding paste that also can use welding paste is with respect to the position of the print range of pad and area etc.In addition, also can use the combination of a plurality of instrumentation values to decide the judgment standard value.

In addition, the state of the part before the reflow process might bring influence to soldering.For example, if deviation takes place in the installation site of part and cause the area of pad teat to change, the angle of inclination of the back scolding tin that then refluxes also can change.Therefore, can decide the judgment standard value by the combination according to the instrumentation result of the instrumentation result of solder printing inspection machine 10 and part installation check machine 20.Also can utilize soldering inspection machine 30 to check the position of part and degree of tilt etc., therefore, instrumentation result of gained comes instrumentation pad teat in the time of also can checking according to this, but the difference according to part, sometimes because backflow causes the wetting top that is molded into the part electrode of scolding tin, be difficult to determine the ora terminalis of part electrode.Sometimes for this part, utilize that part before the reflow process checks the time the instrumentation data, can correctly calculate the value of pad teat.

Below, utilizing Fig. 9, will be made as arbitrarily be used to the inspection of the object that makes the change of judgment standard value and the instrumentation parameter of when determining the judgment standard value, using, the summary step of the processing of implementing in the soldering inspection machine 30 is described.In addition, in this explanation, be called " reading " with obtaining login in the process of information in self device, will be by being called " reading in " with process that communicating by letter of other device obtained the information of login in this other device.

In this step, the setting before step S1 and step S2 represent to check is handled.At first, in initial step S1, carry out for the operation that checks the substrate of object from the selections such as tabulation of substrate, according to this operation, sensing pin is to the substrate design data of selected substrate login.In step S2, read in the database data corresponding with various parts that is included in the substrate design data from scrutiny program management devices 101, it is corresponding related with the installation site of part in the substrate design data.Thus, the inspection of each part is required scrutiny program group signs in in the soldering inspection machine 30.

Then, according to user's setting operation, implement to revise the processing of scrutiny program, cut apart the processing (all not shown) in reference object zone etc. at substrate, be transferred to inspection (processing).

In inspection, at first, the instrumentation value that the inspection machine of operation is obtained before determining to use is carried out the part of inspection and the kind (step S3) of employed instrumentation value.Then, Yi Bian suitably switch and take the reference object zone, Yi Bian the inspection area is set at the inspection object position in image, carry out circular treatment LP at each inspection area.

In circular treatment LP, based on the scrutiny program of setting at the inspection area in handling, carry out feature extraction processing and instrumentation and handle (step S4).And then, under the situation that need decide the judgment standard value based on the instrumentation value in the preceding operation (step S5 is "Yes"), from checking that data administrator 102 reads in required instrumentation value (step S6), the instrumentation value of reading in is applied to selective rule decides judgment standard value (step S7).Then, the instrumentation value that will obtain in step S4 contrasts with the judgment standard value that determines in step 7, thereby judges good/bad (step S8).On the other hand, under the situation (step S5 is "No") that need not decide the judgment standard value based on the instrumentation value of preceding operation, read out in the judgment standard value (step S9) of the unique login in inspection area, utilize the judgment processing of this judgment standard value execution in step S8.

If circular treatment LP has been carried out in the complete inspection zone, then in step S10, each judged result is gathered, thereby judge whole base plate good/bad, the result exported to checks data administrator 102 etc.Below, under the situation that has follow-up substrate (step S11 is "Yes"), be that object carries out circular treatment LP with this substrate.

Shown in above-mentioned step, in the soldering inspection machine 30 of present embodiment, can based on the instrumentation value that is obtained by the

inspection machine

10,20 of preceding operation, come variable setting judgment standard value at the position corresponding with the soldering position that checks object.Therefore, even self instrumentation value of obtaining of device is identical, if the state of the welding paste before the reflow process and the installment state difference of part, then the judgment standard value also can dissimilate, and therefore, might make the check result differences because of state difference separately.

Next, according to the kind of the inspection of being carried out by soldering inspection machine 30, be not limited to change the method that checks reference content by setting the judgment standard value changeably, the change significantly that changes contents processing self etc. sometimes checks that the method for benchmark is also fine.In being included in, this situation carries out alignment processing, among the embodiment shown in Figure 10 below, the different a plurality of inspection benchmark of scrutiny program that setting is carried out at the specific inspection of being implemented by soldering inspection machine 30 check the matched inspection benchmark of obtaining in the inspection of selecting benchmark with operation before reflow process of instrumentation value from these.

In Figure 10, be illustrated in each

inspection machine

10,20,30 and scrutiny program management devices 101 and check the main information flow that exchanges between the data administrator 102.

In this embodiment, at the performed specific inspection of soldering inspection machine 30, in advance at every kind of part, set a plurality of inspection benchmark based on cause-effect relationship between the instrumentation parameter in solder printing inspection machine 10, the part inspection machine 20 and the instrumentation parameter in the soldering inspection machine, edit into separately database data respectively with having defined the program that respectively checks benchmark, then they are logined to scrutiny program management devices 101.In scrutiny program management devices 101, also login is used for selecting at these a plurality of inspection benchmark the selective rule of a benchmark.This selective rule also is transferred into (HA) that checks data administrator 102(Figure 10), and be logged in this device.

Soldering inspection machine 30, from scrutiny program management devices 101, each part at the substrate that checks object, read in to comprise and embodied at this part and a plurality of database datas of the scrutiny program of the inspection benchmark that content has nothing in common with each other (Figure 10 (RO)), and these database datas are signed in to self device.On the other hand, in solder printing inspection machine 10, part inspection machine 20, ground same, read in a database data (Figure 10 (I)) that checks benchmark at each part, check based on them, and the check result that will comprise the instrumentation value that obtains by this processing procedure is sent to (NI) that checks data administrator 102(Figure 10).In checking data administrator 102, preserve the information that these send as prior art.

Soldering inspection machine 30 is carried out concurrently with each inspection that checks benchmark, whole check result (being included in the instrumentation value that checking process separately obtains) is sent to (HO) that checks data administrator 102(Figure 10).In checking data administrator 102, before receiving the information of this transmission, based on next selective rule is provided by scrutiny program management devices 101, from the various inspection benchmark that soldering inspection machine 30 is implemented, select and the matched inspection benchmark of instrumentation value that receives from solder printing inspection machine 10 or part inspection machine 20.Then, if receive the check result that each checks benchmark from soldering inspection machine 30, then select the check result corresponding with the inspection benchmark of selecting at the object position of these inspections, and only preserve this check result.And then, check that data administrator 102 feeds back to the check result of selecting soldering inspection machine 30(Figure 10 (HE)).Thus, in soldering inspection machine 30, make the check result of the feedback that receives effective, make other check result invalid or discarded.

Embodiment according to above-mentioned Figure 10, can be from the check result of different a plurality of inspection benchmark such as the contents processing of the kind of the setting of inspection area, the feature the inspection area, extracted and instrumentation calculating etc., select with reflow process before the obtained instrumentation value of operation shown in reflow process before welding paste and the optimal check result of state of part, it is defined as check result.Therefore, can change the scope of examination of actual enforcement according to the difference of the state of the welding paste before the reflow process and part.

In addition, in the example of Figure 10, make soldering inspection machine 30 carry out the complete inspection that utilizes a plurality of inspection benchmark, in each check result, make the matched check result of pattern of the instrumentation value that obtains before with reflow process effective, but the method that checks is not limited in this.For example, also can before beginning to check, soldering inspection machine 30 check the selection result of benchmark from checking data administrator 102 notices, according to this notice, only carry out the inspection that utilizes the inspection benchmark of being selected by soldering inspection machine 30, this result is sent to checks data administrator 102.In addition, also the selective rule that checks benchmark can be logined to soldering inspection machine 30, in soldering inspection machine 30, from checking that data administrator 102 reads in the instrumentation data that

other inspection machine

10,20 measures, these instrumentation data are applied to selective rule, thereby in soldering inspection machine 30 self, select to check benchmark.

In addition, selecting in soldering inspection machine 30 as described above under the situation of inspection benchmark, it is from checking the value of data administrator 102 inputs that the instrumentation value that is used for this selection is not limited to, and also can be the value of directly importing from the inspection machine of having implemented this instrumentation.Also be same among the embodiment of this change judgment standard value formerly.

At this, the object lesson of the selective rule of the inspection benchmark that uses is described in the example of Figure 10.

In Figure 11, part is example as the soldering inspection of object going between, utilize process flow diagram and synoptic diagram, represent the selective rule that uses under specific circumstances, this particular case refers to that use is selected one situation by the combination of the instrumentation value of solder printing inspection and part inspection gained in two inspection benchmark.In this example, be called in order to distinguish two examples shown in Figure 15, to have set " the wetting moulding height of the back scolding tin that check to reflux " inspection benchmark R1, be called the inspection benchmark R2 of " thereby near the red sector territory of detecting the front end of part electrode checks this area ".

Utilize the process flow diagram among Figure 11, the selective rule of this example is described.

In this selective rule, as synoptic diagram (A) (B) shown in, its prerequisite is, the average height h1 of instrumentation welding paste 303 in solder printing inspection machine 10, the height h2 of instrumentation part electrode 301 upper surfaces in part inspection machine 20.In the processing that utilizes selective rule, at first, utilize these instrumentation values h1, h2 to calculate the difference in height Δ h(step S101 of part electrode 301 and welding paste 303), Δ h and two threshold value T1, T2 are compared (step S102, S103).

In synoptic diagram (C), amplify by a part and near the welding paste 303 it to the electrode 301 of the lead-in wire part shown in the synoptic diagram (B), represent the setting example of above-mentioned threshold value T1, T2.In the figure, both the suitable value of difference in the time of will be with the state that is embedded in electrode 301 appropriateness in the welding paste 303 is made as threshold value T2.On the other hand, both difference in height of (representing with the single-point line in the diagram) therefore, was set to the value slightly littler than the thickness of electrode 301 when threshold value T1 was equivalent to the state of electrode 301 before floating.

Get back to the explanation of process flow diagram.In this example, Δ h at the situation more than the threshold value T1 (step S102 is "Yes") and Δ h under the situation below the threshold value T2 (step S103 is "Yes"), select to check benchmark R1(step S104).On the other hand, under Δ h gets situation (step S102,103 is "No") from the value of threshold value T2 to T1, select to check benchmark R2(step S105).

According to above-mentioned selective rule, though do not float at part electrode 301, when part electrode 301 was in than the high relatively position of welding paste 303, Δ h was bigger than threshold value T2, and littler than threshold value T1.Thus, make this moment utilize to check that the check result that benchmark R2 obtains is effective, therefore, can check out rightly, though after reflow process, produce leg hardly, be connected also no problem (example of the hypomere of Figure 15) of part electrode 301 and pad 300.

On the other hand, part electrode 301 has produced under the situation of floating before reflow process, Δ h is bigger than threshold value T1, under the situation that part electrode 301 has been installed rightly, Δ h becomes below the threshold value T2, therefore, adopts in these cases and utilizes the check result that checks that benchmark R1 obtains, that is the result that the wetting moulding of scolding tin highly checked after, employing utilization was refluxed.Check benchmark by such differentiation, can not miss floating of part electrode 301, thereby can be judged as very for the such soldering state of example of the hypomere of Figure 15.

And then, in above-mentioned example, also can wait according to the instrumentation value of the volume of welding paste to change each is checked the judgment standard value that benchmark R1, R2 set.For example, with regard to checking benchmark R1, set three kinds of judgment standard value U0, U1, the U2 of the example of Fig. 6, as long as can in them, select the matched value of volume with welding paste, just can produce at part electrode 301 and utilize strict benchmark when floating, thereby prevent from missing bad, even the wetting moulding height step-down of the back scolding tin that refluxes can prevent that also (example of the hypomere of Figure 13) soldering state that part electrode 301 and being connected of pad 300 is good is judged as bad.

The explanation of Reference numeral

The S substrate,

1 control handling part,

2 cameras,

3 Lighting Divisions,

4 substrate platforms,

10 solder printing inspection machines,

11 solder printing devices,

20 part inspection machine z,

21 assembly machines,

30 soldering inspection machines,

31 reflow ovens,

102 check data administrator

Claims

1. soldering inspection method, from prescribed direction substrate is thrown light on one side, take this substrate by camera on one side, the reflected light that soldering position in the image that generates is showed looks like to analyze, thereby check the soldering state at this position, described substrate is the substrate that is implemented a plurality of operations for the manufactured parts installation base plate, last operation is reflow process in a plurality of operations of this substrate having been implemented, described camera is configured in the position of the normal reflection light that can incident be formed by the soldering position indirect illumination light of substrate, this soldering inspection method is characterised in that

In at least one operation in a plurality of operations of before described reflow process, implementing, instrumentation is attached to the structure on the substrate before next operation begins, as prerequisite, determine the rule of the inspection benchmark that inspection after the reflow process is required in the following manner, this mode refers to, the result who handles according to the instrumentation of implementing at the position corresponding with the soldering position that checks object before reflow process changes described inspection benchmark

Soldering position at the substrate after the described reflow process, rule with described inspection benchmark, be applied to by the instrumentation of before reflow process, implementing and handle among the result of the instrumentation processing of implementing at the position corresponding with this soldering position, thereby determine to check benchmark.

2. soldering inspection method as claimed in claim 1 is characterized in that,

Set the rule of described inspection benchmark like this:

Be used in that differentiation carries out at the soldering position that checks object that instrumentation is handled and instrumentation value appropriate judgment standard value whether, because the result of the instrumentation processing carried out at the position corresponding with this soldering position before the reflow process changes.

3. soldering inspection method as claimed in claim 1 is characterized in that,

Set the rule of described inspection benchmark like this:

A plurality of inspection benchmark that the content that determines from the result who handles according to the instrumentation before the reflow process of carrying out at the position corresponding with the soldering position has nothing in common with each other, select and the matched inspection benchmark of handling at the instrumentation before the reflow process of carrying out with corresponding position, the soldering position that checks object of result.

4. soldering inspection method as claimed in claim 1 is characterized in that,

Set the rule of described inspection benchmark like this:

According to before reflow process, implementing the combination that multiple instrumentation is handled the instrumentation value that gets at the position corresponding with the soldering position, change the inspection benchmark at this soldering position.

5. soldering inspection method as claimed in claim 1 is characterized in that,

Set the rule of described inspection benchmark like this:

According at carrying out the instrumentation value that the instrumentation processing in the solder printing operation gets with the soldering position corresponding bonding pad that checks object, change the inspection benchmark at this soldering position.

6. soldering inspection method as claimed in claim 1 is characterized in that,

Set the rule of described inspection benchmark like this:

According to handling the instrumentation value that gets at the instrumentation that carries out in the solder printing operation with the soldering position corresponding bonding pad that checks object, the instrumentation value that gets with carrying out the instrumentation processing in the part installation procedure at the part corresponding with the soldering position that checks object changes the inspection benchmark at this soldering position.

7. soldering inspection method as claimed in claim 1 is characterized in that,

Come the amount of the welding paste that instrumentation each pad on substrate prints by described solder printing operation, the instrumentation that is used as before the described reflow process is handled,

In the inspection after described reflow process, the reflected light picture that shows based on the image of the substrate that checks object and the relation at the angle of inclination shown in this reflected light picture are come the height of the scolding tin after the instrumentation reflow process, thereby are judged whether this instrumentation value is appropriate,

Set the rule of described inspection benchmark like this:

Whether the height that make to be used for judging the scolding tin after the reflow process appropriate judgment standard value, along with the instrumentation value of the amount of described welding paste diminishes and step-down.

8. a base plate inspection system is characterized in that,

Have:

Be provided in the reflow process in a plurality of operations of implementing for the manufactured parts installation base plate, for the inspection machine of the substrate after the inspection reflow process,

Be provided in reflow process at least one operation before, for the inspection machine of the substrate after this operation of inspection,

Apparatus for management of information, it can check the check result information that each inspection machine was read and managed at the object position according to each substrate and each by communicating by letter to read in check result information from each inspection machine;

The inspection machine of described reflow process has following function: at the soldering position that checks object, a plurality of inspection benchmark that utilize content to have nothing in common with each other check;

In the inspection machine or apparatus for management of information of described reflow process, be provided with:

The rale store unit, its storage checks the rule of benchmark, the rule of this inspection benchmark is used for, inspection at the soldering position after the reflow process, the result that the instrumentation of implementing when checking according to the inspection machine pair position corresponding with the soldering position that checks object by the operation before the reflow process is handled, defined which from described a plurality of inspection benchmark, selects check benchmark

The instrumentation value obtains the unit, the soldering position of its inspection object after at described reflow process, be sent to the check result information of apparatus for management of information from the inspection machine by the operation before the reflow process, obtain the instrumentation value that is got by the inspection machine pair position corresponding with the soldering position enforcement instrumentation processing of the operation before this

9. base plate inspection system as claimed in claim 8 is characterized in that,

The inspection machine of described reflow process at the soldering position that checks object, utilizes all described a plurality of inspection benchmark to carry out and checks, and respectively the check result information of each inspection is sent to described apparatus for management of information,

Described apparatus for management of information possesses described rale store unit, the instrumentation value obtains the unit and checks that benchmark determines the unit, and possesses the reception information process unit,

This receives information process unit, from the inspection machine receiving check object information of reflow process, from this check result information, selects and preserve and determined by described inspection benchmark the inspection benchmark information corresponding of unit decision.

10. base plate inspection system as claimed in claim 8 is characterized in that,

The inspection machine of described reflow process possesses described rale store unit, the instrumentation value obtains the unit and checks that benchmark determines the unit, and possesses the inspection performance element,

This checks performance element, at the soldering position that checks object, utilizes by checking that the inspection benchmark that benchmark determines the unit to determine carries out inspection, and the check result information of this inspection gained is sent to described apparatus for management of information.

11. soldering inspection machine, be object with the substrate, from prescribed direction this substrate is thrown light on one side, take this substrate by camera on one side, the reflected light that soldering position in the image that generates is showed looks like to analyze, thereby check the soldering state at this position, described substrate is the substrate that is implemented a plurality of operations for the manufactured parts installation base plate, last operation is reflow process in a plurality of operations of this substrate having been implemented, described camera is configured in the position of the normal reflection light that can incident be formed by the soldering position indirect illumination light of substrate, this soldering inspection machine is characterised in that

Input block, it is used for importing the instrumentation value at the soldering position that checks object, this instrumentation value refers to, in at least one operation in a plurality of operations of before described reflow process, implementing, before next operation begins instrumentation be attached to structure on the position corresponding with this soldering position and the instrumentation value

The rale store unit, its storage checks the rule of benchmark, and the rule of this inspection benchmark defines in such a way, and this mode refers to that the instrumentation value according to by described input block input changes the inspection benchmark at the soldering position of described inspection object,

Check performance element, soldering position at the substrate after the described reflow process, with the rule application of described inspection benchmark in the instrumentation value by described input block input, thereby determine and the matched inspection benchmark of this instrumentation value, check based on this that benchmark is carried out the soldering position and check.