JP3966336B2 - Inspection method and inspection system for component mounting board, and manufacturing method of component mounting board - Google Patents

Description

  The present invention relates to a technique for manufacturing a component mounting board by guiding a substrate to be processed to a plurality of processes in order and executing a process in each process. In particular, the present invention relates to a technique in which inspection machines are provided in at least two places of the plurality of steps, and inspection by image processing is performed on a substrate after the execution of the steps.

  The general manufacturing process of a component mounting board includes a process of printing cream solder on a printed wiring board (solder printing process), a process of mounting a part at a position where cream solder is applied (component mounting process), and after mounting the part. The process of heating the board | substrate and soldering components to a board | substrate (soldering process) is included. In order to prevent defective substrates generated in each process from flowing downstream, a board inspection line is provided for each process in order to carry out inspections. There is one in which the substrate determined to be removed is removed.

  Some conventional inspection systems include a server capable of communicating with each inspection machine, and transmits the inspection result for each substrate from each inspection machine to the server. In this case, the server analyzes the occurrence frequency of defects and the transition of inspection results for each inspection machine, creates maintenance rules that are effective in preventing the occurrence of defects and improving product quality. Has been proposed (see Patent Document 1).

Japanese Patent No. 3441111

  In the inspection system disclosed in Patent Document 1, for each process, a relationship between the content of a defect generated in the process and a trouble generated in a manufacturing apparatus (a solder printer, a mounter, a reflow furnace, etc.) is derived. Therefore, it is effective in preventing defects that occur due to changes over time in the manufacturing apparatus. However, defects that occur in the process of manufacturing a substrate are not limited to changes over time in the manufacturing apparatus, but may occur suddenly due to unclear causes. To elucidate the cause of such a sudden failure, not only pay attention to the substrate in the process where the failure occurred, but also check the state of the substrate in the process before the failure occurred It is desirable to do.

  In addition, in a substrate production line in which automated processes are executed in series, even if a defect occurs in an intermediate process, the defective substrate may flow downstream without being removed. In this case, if the defect that occurred is minor and the defect is corrected in the downstream process or the defective part is hidden by the process in the downstream process, the same substrate is determined to be a good product in the downstream process. May be. For such a substrate, it is desirable that the user confirms the state of the substrate in each process and makes a final pass / fail judgment.

  In addition, since the inspection standard set in the inspection machine in the intermediate process is too strict, the defect is determined in the inspection machine, but it may be determined as a non-defective product in the downstream process. In such a case, if the user himself / herself can confirm the state of the substrate in each process, it is confirmed that the substrate determined to be defective may be regarded as a non-defective product, and the inspection machine that has made this determination Appropriate measures can be taken, such as correcting inspection standards.

The present invention has been made paying attention to the above points, and in any of a plurality of processes, when it is determined that there is a defect in an inspection area corresponding to a predetermined part of a predetermined substrate, the defect determination is performed. It is an object of the present invention to allow a user to check an image used for inspection of an inspection area corresponding to each inspection machine while comparing the parts .

  The present invention is applied to a case where a component mounting board is manufactured by a method in which a substrate to be processed is guided to a plurality of processes in order and a process in each process is executed. It is desirable that the plurality of processes include three processes of a solder printing process, a component mounting process, and a soldering process. If a conveyor device is provided between these processes to convey the board, the board to be processed is sent to each process in turn, and the process in each process is performed in a series to complete the component mounting board. Can do. However, each process does not necessarily need to be connected, and a certain process and the next process may be physically separated.

In the component mounting board inspection method and inspection system according to the present invention, an inspection machine that performs inspection by image processing is provided in at least two places of a plurality of steps that are sequentially executed to manufacture a component mounting board, The inspection using the image of the substrate after the execution of the process is executed. In the present invention, an information processing apparatus capable of communicating is installed in each inspection machine.

  The inspection machine can be configured as an appearance inspection apparatus having a camera. Or it can also be set as the inspection apparatus using the fluoroscopic image by X-rays. Both the inspection machine and the information processing apparatus can be configured by one or a plurality of computers. In addition, communication between each inspection machine and the information processing apparatus is preferably performed via a network line such as a LAN line. However, the present invention is not limited to this, and wireless communication may be performed. Moreover, you may enable it to mutually communicate also between each test | inspection machine.

In the inspection method for a component mounting board according to the present invention, in each inspection machine, based on setting data registered in advance, an inspection area corresponding to each component is set in the image of the board and an inspection is executed for each inspection area. Step a for generating inspection result information in which the pass / fail judgment result for each inspection area is associated with the identification information of the inspection area and the substrate and transmitting the inspection result information to the information processing apparatus, and each inspection area used for the inspection And b storing the image data in the memory in a state where the image data can be read by the identification information of the inspection region and the substrate, respectively, and a transmission request including identification information of the predetermined substrate and the inspection region from the information processing apparatus when receiving, reads the image data corresponding to the transmission request using these identification information from the memory, it is transmitted to the information processing apparatus Performing step c. On the other hand, when information indicating a failure determination is included in any of the inspection result information from each inspection machine, the information processing apparatus is associated with the failure determination using the inspection result information including the failure determination. Step A for identifying the identification information of the inspection area and the substrate; Step B for creating a transmission request including each piece of identification information identified in Step A and transmitting it to all the inspection machines ; Step B from each inspection machine in response to the transmission request The transmitted image data is stored in the memory in association with the identification information of the inspection area and the substrate included in the transmission information; Step C of the inspection area and the substrate associated with the image data stored in Step C Steps D of identifying a set from among the combinations of identification information and reading out and displaying all image data corresponding to the combination from the memory To run.

  In the above description, the “substrate identification information” is information that is individually assigned to each substrate, and can be attached to an appropriate position on the substrate in the form of a barcode, a two-dimensional code, a character string, or the like. In this case, each inspection machine can read the identification information from the image of the substrate to be inspected and use it for subsequent processing. In addition, when the order in which the substrates are processed in each process is not changed and the substrate is not removed in the middle process, each time the substrate is received in each process, identification information ( Number etc.) may be set.

According to the above method, when a defect is determined in any of the inspection machines, the information processing apparatus uses the inspection result information from the inspection machine that has performed the defect determination, and the board and the inspection in which the defect is determined. Identify area identification information. Then, by transmitting a transmission request including each identified identification information to all inspection machines, the image data corresponding to these identification information is transmitted from each inspection machine, and the transmitted image data is sent to the transmission request. The information is stored in the memory in association with the identification information of the included inspection area and substrate. Furthermore, since the image data stored in this way is specified by a combination of the identification information of the inspection area and the substrate, read from the memory, and displayed, the user is determined to be defective by the inspection machine in any process. It is possible to check the generated part by comparing images generated by all inspection machines.

In addition, according to this method, the image data transmitted from each inspection machine to the information processing apparatus can be narrowed down to the image data of one inspection area, so that an efficient image transmission process can be performed by reducing the information capacity. It can be performed. Also in the information processing apparatus, it is possible to use memory resources effectively by accumulating only image data required by the user .

In a preferred aspect of the above method, in each inspection machine, in step a, an inspection area corresponding to each component on the board is set using setting data common to the inspection machines.
In another preferred aspect, the information processing apparatus arranges and displays each image data read from the memory in one screen in the step D. This display may be performed by a monitor device attached to the information processing apparatus, but is not limited to this. For example, if a communication line or a drive device for a predetermined storage medium is used as an output destination of image data, each image data can be displayed on a terminal computer used by the user.
According to this aspect, since the image data from each inspection machine can be arranged and displayed in one screen, the user can easily compare the image of the defective part in each process.

Next, in the inspection system for a component mounting board for performing the above inspection method, each inspection machine has setting data for setting an inspection area corresponding to each component in the image of the board to be inspected. Registered for each inspection area, registration means for registering common identification information between the inspection machines as information for specifying the area, and for storing image data used for the inspection Based on the image database and the setting data, an inspection execution unit that sets an inspection region corresponding to each component in the image of the board and executes an inspection for each inspection region, and an inspection result based on the inspection result by the inspection execution unit and test result information transmitting unit that transmits to the information processing apparatus to create the test result information associated quality determination result for each area in each inspection area and the identification information of the substrate, The image data of each inspection area used for serial examination, and an image storage means for storing the image database in readable state by each of the inspection area and the identification information of the substrate, a predetermined inspection area and from the information processing apparatus When the transmission request including the identification information of the board is received, the image transmission unit reads image data corresponding to the transmission request from the image database using the identification information and transmits the image data to the information processing apparatus. On the other hand, the information processing apparatus includes a memory for storing image data transmitted from each inspection machine, a display unit for displaying image data read from the memory, and an inspection result from each inspection machine. When any of the information includes information indicating a defect determination, the inspection result information including the defect determination is used to identify and identify the identification information of the inspection region and the substrate associated with the defect determination. A transmission request means for creating a transmission request including each identification information and transmitting it to all inspection machines, and an inspection region and a board including image data transmitted from each inspection machine in response to the transmission request in the transmission request the image storage means for storing in said memory in association with the identification information, a set from the combination of the identification information of the inspection area and the substrate associated with the image data stored in the memory Identify and read all the image data corresponding to the combination from said memory, and a display control means for displaying them on the display means comprises.

In the inspection machine of the inspection system, the inspection execution means, the inspection result information transmission means, the image storage means, and the image transmission means are all configured by a computer in which a program for executing the means is set. The image database can be provided in a memory built in or external to the computer.

  The computer referred to in the above paragraph is a computer in a broad sense including peripheral circuits such as a communication circuit in addition to a CPU, a ROM, and a RAM, and can be configured by, for example, a personal computer. The inspection result information transmission unit and the image transmission unit can perform information transmission processing to the information processing apparatus using a communication circuit.

  In addition, since this computer needs to have a function for inspection, an inspection machine is constituted by two or more computers, and the function of the inspection and inspection result information transmitting means is set in one computer. The memory, the image storage unit, and the image transmission unit may be set in another computer.

  Further, when the substrate identification information is given to the substrate by a bar code, a two-dimensional code, a character string, etc., each inspection machine is provided with means for recognizing the identification information on the substrate to be inspected. Is desirable. For example, the recognition means extracts an identification code attached to the substrate from the image to be inspected, and recognizes the contents.

The transmission request unit, the image storage unit , and the display control unit on the information processing apparatus side can also be set in a computer having a communication function by a program. The memory can be internal or external to the computer. Further, the above means can be distributed and set to two computers that can communicate with each other.

In a preferred aspect of the system, setting data common to the inspection machines is registered as setting data for each inspection area in the registration means of the inspection apparatus .

In another preferable aspect of the above system, the display control means of the information processing apparatus creates display image data in which each image data read from the memory is arranged in one screen, and the display image data is stored in the display image data. Output to the display means.

  Next, in the component mounting board manufacturing method according to the present invention, the substrate to be processed is guided to a plurality of processes in order, and the process according to each process is performed, and an inspection machine is installed in at least two processes. The inspection using the image of the substrate after execution is executed. Also in this method, an information processing apparatus capable of communicating with each inspection machine is installed, and the same method as the above-described inspection system is executed in each inspection machine and information processing apparatus.

  In the above manufacturing method, the plurality of steps can include a solder printing step, a component mounting step, and a soldering step. The inspection machine is desirably provided for each of these processes, but is not limited thereto, and can be provided, for example, in a solder printing process and a soldering process, or in a component mounting process and a soldering process. Further, in the solder printing process, an inspection machine may be provided in the preceding stage of the solder printer, and the state of the printed wiring board before the solder printing may be inspected.

According to the present invention, when a defect is determined by any of the inspection machines installed in a plurality of processes, each inspection machine determines a substrate determined to be defective for a defect determination portion of the substrate determined to be defective. Since the image data of the corresponding inspection area used at the time of the inspection is collected and displayed on the information processing apparatus, the user can check the image data by comparing them. Therefore, when a sudden failure occurs in any process, compare the images used for inspection of the inspection area corresponding to each inspection machine for the part determined to be defective, the cause of the failure, etc. Can be analyzed in detail. In addition, for a substrate that is determined to be defective in the intermediate process but determined to be a non-defective product in the final process, the user can make a correct determination by checking images in each process. In addition, each image can be confirmed for the purpose of reviewing the inspection standard of the inspection machine in the middle of the process where the defect is determined.

FIG. 1 shows a configuration of a substrate production line to which the present invention is applied.
The board production line of this embodiment has a configuration in which three processes of a solder printing process, a component mounting process, and a soldering process are connected by a conveyor. By sending a printed circuit board to be processed (hereinafter simply referred to as “substrate”) into each step in order, a component mounting substrate in which various components are soldered in place is manufactured. A bar code label indicating a unique identification code is affixed to a substrate sent to the substrate manufacturing line (hereinafter, this identification code is referred to as “substrate code”).

In each process, manufacturing apparatuses 3, 4, and 5 and inspection machines 1A, 1B, and 1C are provided, respectively. The apparatus 3 for manufacturing a solder printing process is a solder printer, and when supplied with a substrate, applies cream solder to the electrode position of the substrate by silk screen printing or the like. The inspection machine 1A inspects the suitability of the solder application position and amount, etc., for the substrate after solder printing. Hereinafter, this inspection machine 1A is referred to as “solder printing inspection machine 1A”.

  The manufacturing apparatus 4 for the component mounting process is a mounter, and executes a process of mounting various components on the board that has undergone the solder printing process. In this component mounting process, there are cases where two types of high-speed mounters for mounting general-purpose components and deformed mounters for mounting other components are used. The inspection machine 1B inspects the presence / absence of components, misalignment, suitability of direction, and the like for a substrate after component mounting. Hereinafter, this inspection machine 1B is referred to as “component mounting inspection machine 1B”.

  The manufacturing apparatus 5 for the soldering process is a reflow furnace, and heats the substrate that has undergone the component mounting process to solder each component to the substrate. The inspection machine 1C determines whether or not the solder position, size, inclination state, etc. are appropriate for the substrate that has passed through the reflow furnace 5, and performs the same inspection as the component mounting machine 1B on the component. Hereinafter, this inspection machine 1C is referred to as “soldering inspection machine 1C”.

  Each of the inspection machines 1A, 1B, and 1C in each process takes in the board carried out from the manufacturing apparatuses 3, 4, and 5 in that process, and performs an appearance inspection using an image obtained by imaging the board. Is what you do. Hereinafter, when the inspection machines 1A, 1B, and 1C are collectively represented, they are simply referred to as “inspection machine 1”.

  Each inspection machine 1 is set in a state where it can communicate with each other via a network line 7 such as a LAN line. Further, a server 2 that is an information processing apparatus is connected to the network line 7. Although details will be described later, the server 2 captures the inspection result for each substrate by communication with each inspection machine 1 and receives transmission of image data used for the inspection as necessary. The transmitted image data is stored in the hard disk of the server 2.

FIG. 2 shows a configuration common to the inspection machines 1.
Each inspection machine 1 includes two personal computers (hereinafter abbreviated as “PC”) 11 and 12 as control bodies. One PC 11 is used for inspection, and the other PC 12 is used for storing an image used for the inspection (hereinafter, when referring to the PCs 11 and 12 individually, “inspection PC 11”, respectively). , "Image saving PC 12"). These PCs 11 and 12 can communicate with each other via the network line 7. Further, any of the PCs 11 and 12 can independently communicate with the inspection machine 1 and the server 2 in other processes without depending on the other PC.

  Further, the inspection machine 1 is provided with a CCD camera 10 for color image generation (hereinafter simply referred to as “camera 10”), a substrate stage 14, a position adjustment mechanism 13, and the like. The camera 10 and the position adjustment mechanism 13 are individually connected to the PCs 11 and 12. Although not shown here, each of the PCs 11 and 12 includes an A / D conversion circuit for digitally converting an image signal from the camera 10. Each of the PCs 11 and 12 is provided with a built-in or external hard disk, and a database for storing inspection results (hereinafter referred to as “inspection result database”) is set in the hard disk on the PC 11 side. . In addition, a database (hereinafter referred to as “image database”) for storing image data used for the inspection is set in the hard disk on the PC 12 side.

  The position adjustment mechanism 13 is for aligning the camera 10 with the substrate to be inspected by adjusting the positions of the camera 10 and the substrate stage 14. This position adjustment mechanism 13 is normally controlled by the inspection PC 11. However, the image storage PC 12 may perform control when the image storage processing of the image storage PC 12 is delayed for some reason. The control in this case is for stopping the camera 10 and the substrate stage 14 until image storage is completed.

  The inspection PC 11 controls the position adjustment mechanism 13 to adjust so that a predetermined range of the substrate on the substrate stage 14 is included in the visual field of the camera 10, and then drives the camera 10 to generate an image to be inspected. Let The image generated here is simultaneously input to the PCs 11 and 12. The inspection PC 11 performs an inspection using the input image based on a preset inspection logic. During this time, the inspection PC 11 communicates with the image storage PC 12 to transmit the contents of the operation during the inspection. Based on the transmission information, the image storage PC 12 converts the input image into an image file at a predetermined timing according to the examination flow, and stores it in the image database.

  In this embodiment, a plurality of imaging target areas are set on the substrate to be inspected according to the size, the camera 10 is positioned for each of these imaging target areas, and an image of the imaging target area is generated. I am doing so. The image storage PC 12 sets an individual folder for each board in the memory area constituting the image database, and converts a plurality of input images obtained for one board into individual image files, and stores them in the folder. I try to save it. This folder is given a folder name including the corresponding board code. In this embodiment, the image data of each substrate is stored for a period of 3.5 days regardless of the inspection result.

  Each inspection machine 1 of this embodiment sets an inspection area for each mounting position of a component on the board, but this inspection area is set using setting data common to the inspection machines 1. . The inspection area is set to a size that sufficiently includes parts, solder, and lands (electrodes) on the substrate. In the inspection PC 11 of each inspection machine 1, after setting an inspection area based on the common setting data, a dedicated inspection area (hereinafter referred to as an “inspection window”) in the inspection area according to the purpose of the inspection. ) Is measured, the image in the inspection window is measured, and the suitability is determined. For example, in the inspection PC 11 in the soldering process, the inspection window is set so as to include the land in the inspection area. In addition, in the inspection PC 11 for the component mounting process and the soldering process, in addition to the inspection window for the land, an inspection window corresponding to the size of the component or the component side electrode is set at a location corresponding to the component. The

  Note that individual code information is assigned to each of the common inspection areas. This code information is shown to the user as an identification number of a component mounted in the area, and is hereinafter referred to as “area code”. In the inspection PC 11, for each inspection area, an inspection result file including the measurement results and pass / fail judgment results executed in the inspection area is created and stored in the inspection result database. The file name of the inspection result file includes the area code of the inspection area. In the inspection result database, a folder having the substrate code as a folder name is set for each substrate, and each inspection result file obtained for the substrate corresponding to the folder is stored therein.

  Further, the inspection PC 11 creates inspection result information in which the pass / fail judgment results for each inspection area are collected separately from the inspection result file, and transmits the inspection result information to the server 2. The inspection result information is obtained by, for example, arranging pass / fail judgment results (OK or NG, specifically “1” or “0”) of each inspection region in the order of the region codes, and in front of the array. The board code is attached.

  FIG. 3 shows an inspection procedure common to each inspection machine 1. FIG. 3 summarizes the processing by the two PCs, and corresponds to processing for one substrate. When processing a plurality of substrates, it is necessary to repeat the procedure of FIG. 3 for each substrate. In FIG. 3 and the following description, each processing step is indicated as “ST”.

  First, in ST1, a substrate to be inspected is carried in from the previous manufacturing apparatus. In the next ST2, the camera 10 is adjusted to a predetermined position on the substrate using the position adjusting mechanism 13, and imaging is started. At the start of imaging, first, the barcode label on the substrate is imaged, and the barcode in the image is decoded to recognize the substrate code. This recognition process is performed by the inspection PC 11, but the recognized substrate code is also transferred to the image storage PC 12.

  In the next ST4, the field of view of the camera 10 is aligned with the first imaging target area, and imaging is performed. In ST5, based on the common setting data, a plurality of inspection areas are set in the input image, and measurement processing and pass / fail judgment processing are executed for each of these areas. The processing of ST4 and ST5 is also performed by the inspection PC 11, and the inspection result file is created from the measurement data obtained for each inspection area and the information on pass / fail judgment and stored in the inspection database of the inspection PC 11. Is done.

  When the inspection for all the inspection areas in the input image is completed, the process proceeds to ST6. This ST6 is executed by the image storage PC 12, and processing for storing the image used for the inspection in ST5 in the image database is performed.

  When the image storage process is completed, the process returns from ST7 to ST4. Thereafter, by repeating the loop of ST4 to ST7, an image is acquired for each imaging target region, an inspection is executed, and the image used for the inspection is stored.

  When all the inspections are completed, the process proceeds from ST7 to ST8, and the pass / fail of the entire substrate is determined based on the pass / fail determination result of each inspection region. In ST9, the determination result is displayed on the monitor 14 or stored in the inspection result database. Further, in the next ST10, the above-described inspection result information is created and transmitted to the server 2. Thereafter, the process proceeds to ST11, the substrate is carried out downstream, and the process is terminated.

  Next, processing in the server 2 will be described with reference to FIG. Note that FIG. 4 is also a procedure executed for one substrate, and processing according to the procedure of FIG. 4 may be performed in parallel for a plurality of substrates. In FIG. 4, each step is indicated by a numerical value in the 100s.

  First, when the inspection result information from the solder printing inspection machine 1A is acquired in ST101, the substrate code attached to the inspection result information is recognized in ST102. In ST103 and 104, the inspection result information with the same code as the board code recognized in ST102 is received from the component mounting inspection machine 1B and the soldering inspection machine 1C, respectively.

  According to the processing of ST101 to ST104, the inspection result information in each inspection machine 1A, 1B, 1C can be taken in for a specific one substrate. Thereafter, the server 2 sequentially checks the inspection result information to check whether or not the defect determination information (NG) is included. Here, if the defect determination information is included in the inspection result information from the predetermined inspection machine 1, ST105 becomes “YES”, and the steps after ST106 are executed. On the other hand, if the defect determination information is not included in any of the inspection result information, ST105 becomes “NO” and the process is terminated.

  In ST106, the area code of the inspection area in which the defect determination information is set is recognized from the position of the defect determination information in the inspection result information. Next, in ST107, each inspection machine 1 is requested to transmit information relating to the inspection area in which the defect determination information is set by a command including the substrate code recognized in ST102 and the area code recognized in ST106. (Hereinafter, this command is referred to as “transmission request”). Specifically, this transmission request is a request for transmission of inspection results and image data in the inspection area of the area code recognized in ST106 for the board of the board code recognized in ST102.

  When response information (details will be described later) is returned from each inspection machine 1 in response to the transmission request, in ST108, the response information is stored in the hard disk. At the time of saving, a folder with a folder name including the board code and area code of the transmission request is set on the hard disk, and response information received from each inspection machine 1 is sequentially stored in the folder. .

  When a plurality of pieces of defect determination information are extracted in ST105, the processes of ST106 to ST108 are executed for each piece of defect determination information. When all pieces of defect determination information have been processed, ST109 becomes “YES” and the process ends.

Here, processing on the inspection machine 1 side in response to the transmission request will be described.
The response process for the transmission request is executed mainly by the image storage PC 12. When receiving the transmission request, the image storage PC 12 searches the image database with the board code in the PC 12 and extracts a folder having the board code as the folder name. Then, after extracting an image file including the inspection area of the area code included in the transmission request from the folder, the image data of the inspection area is cut out from the image data in the file.

  Next, the image storage PC 12 receives an inspection result file including the area code included in the transmission request in the file name through communication with the inspection PC 11. Then, response information including the information read from the inspection result file and the cut image is created and transmitted to the server 2.

  According to the above-described series of processing, when the defect determination is performed in the inspection machine 1 in any process, the response information including the image data used for the inspection of each inspection machine 1 is obtained for the inspection area in which the defect determination is made. It will be accumulated on the server.

The server 2 accepts a call operation from a keyboard (not shown) at a predetermined time and sequentially accesses each folder stored in the hard disk. Then, for each folder, the image data for display is edited using the response information stored in the folder, and this is output to a monitor (not shown).

FIG. 5 shows an example of a display screen edited by the response information file.
In this example, image windows 20A, 20B, and 20C are set for each of the solder printing process, the component mounting process, and the soldering process, and the inspection machines for the processes are respectively set in these windows 20A, 20B, and 20C. An image extracted from the response information 1 is displayed. Both images represent the images in the common inspection area described above at the same magnification. Also, below the image windows 20A, 20B, and 20C, inspection result windows 21A, 21B, and 21C displaying the inspection results (OK is ◯, NG is ×) and measurement results for each inspection item are set. Is done. The display information in these windows 21A, 21B, and 21C is also extracted from the response information.

  Information related to the board to be inspected is displayed above the image windows 20A, 20B, and 20C. In this, information 22 indicating the board code and a part number 23 corresponding to the area code of the inspection area are displayed. It is included. Further, a defect determination mark 24 is set in an image window (window 20B in the illustrated example) corresponding to the process in which the defect is determined. On the left and right ends of the display screen, switching buttons 25 and 26 for switching the display to the previous defective substrate and the next defective substrate are set.

  The server 2 can receive only a specific board code and can display only the board code. When a terminal PC is connected to the server 2 separately, the same operation as the keyboard is performed on the PC to create display image data and display it on the PC side. Also good.

  Also, in this embodiment, a substrate code with a bar code label is assigned to each substrate. However, if the substrate is not removed during manufacturing, an identification number is assigned to each substrate in the processing order in each inspection machine. However, this identification number may be used in place of the substrate code.

  In this embodiment, the image storage PC stores an image for each imaging target area, but instead of this, an image may be cut out from the input image for each inspection area and stored. . Each image file in this case can be given a region code of the corresponding inspection region as a file name. Therefore, when a transmission request from the server is received, the substrate code and region code of the transmission request are used. The corresponding image file can be read quickly.

  Furthermore, in the inspection machine 1 of this embodiment, in response to a transmission request from the server 2, information specified by the transmission request, that is, image data relating to a substrate determined to be defective by the own apparatus or another inspection machine 1 Although the inspection result is transmitted to the server 2, information on a plurality of substrates inspected before and after this substrate may be transmitted. Also in this case, the information read out for each substrate can be limited to the image data and the inspection result of the inspection area where the defect is determined. Further, on the server 2 side, images of the same substrate in each process can be displayed side by side with respect to the inspection area in which the defect determination is made, as shown in FIG. . In addition, for a process in which a defect has occurred, images of the same inspection area (the area in which the defect has occurred) on the defective substrate and a plurality of substrates before and after the defective substrate can be displayed side by side. In addition, an image of a process (for example, a component mounting process) related to the occurrence of the defect on the board in which the defect has occurred is displayed in the center, and images on the right and left of the previous process (for example, a soldering process) of the board before and after the occurrence of the defect May be arranged.

It is explanatory drawing which shows an example of the board | substrate manufacturing line to which this invention was applied. 2 is a block diagram of the inspection machine 1. FIG. It is a flowchart which shows the procedure of a test | inspection. It is a flowchart which shows the procedure of the collation process in a server. It is explanatory drawing which shows an example of the monitor display screen of a server.

Explanation of symbols

1 Inspection machine 1
2 Server 3 Solder printer 4 Mounter 5 Reflow furnace 7 Network line 10 Camera 11 Inspection PC
12 PC for image storage

Claims (7)

An inspection machine that performs inspection by image processing is provided in at least two places of a plurality of processes that are sequentially executed to manufacture a component mounting board, and an inspection using an image of the board after the process is executed is performed. A method that
In addition to installing information processing devices that can communicate with each inspection machine, in each inspection machine, the inspection area corresponding to each part on the board to be inspected can be specified by identification information common to each inspection machine. And
In each inspection machine, based on setting data registered in advance, an inspection area corresponding to each component is set in the image of the board and inspection is performed for each inspection area. Step a for generating inspection result information associated with the identification information of the area and the substrate and transmitting it to the information processing apparatus, and image data of each inspection area used for the inspection are identified with the inspection area and the substrate, respectively. and executes a step b of storing in memory in readable state by information, when receiving a transmission request including the identification information of the predetermined substrate and the inspection area from the information processing apparatus, the use of these identification information Executing step c of reading out image data corresponding to the transmission request from the memory and transmitting it to the information processing apparatus;
When the information processing apparatus includes information indicating defect determination in any of the inspection result information from each inspection machine, the inspection associated with the defect determination using the inspection result information including the defect determination Step A for specifying the identification information of the area and the substrate; Step B for creating a transmission request including each piece of identification information specified in Step A and sending it to all the inspection machines ; Step B for transmission from each inspection machine in response to the transmission request The stored image data is stored in the memory in association with the identification information of the inspection region and the substrate included in the transmission information; each of the inspection region and the substrate associated with the image data stored in Step C Steps D; specifying a set of combinations of identification information and reading out and displaying all image data corresponding to the combination from the memory Row,
An inspection method for a component mounting board characterized by the above. The inspection method for a component mounting board according to claim 1, wherein in each inspection machine , in step a, an inspection area corresponding to each component on the board is set using setting data common to the inspection machines. . 2. The component mounting board inspection method according to claim 1, wherein the information processing apparatus arranges and displays each image data read from the memory in one screen in the step D. 3 . An inspection machine that performs inspection by image processing is provided in at least two places of a plurality of processes that are sequentially executed to manufacture a component mounting board, and an inspection using an image of the board after the process is executed is performed. And a system provided with an information processing device capable of communicating with each inspection machine,
Each inspection machine
The setting data for setting the inspection area corresponding to each part is registered in the image of the board to be inspected for each inspection area, and each inspection area is used as information for specifying the area. A registration means for registering common identification information in
An image database for storing image data used for the inspection;
Based on the setting data, an inspection execution means for setting an inspection area corresponding to each component in the image of the board and executing an inspection for each inspection area;
An inspection result information transmitting unit that creates inspection result information in which the pass / fail judgment result for each inspection region is associated with the identification information of the inspection region and the substrate based on the inspection result by the inspection execution unit, and transmits the inspection result information to the information processing apparatus; ,
Image storage means for storing the image data of each inspection region used for the inspection in the image database in a state that can be read by the identification information of the inspection region and the substrate, respectively .
When a transmission request including identification information of a predetermined inspection area and substrate is received from the information processing apparatus, image data corresponding to the transmission request is read from the image database using the identification information, and the information processing apparatus Image transmitting means for transmitting,
The information processing apparatus includes:
A memory for storing image data transmitted from each inspection machine;
Display means for displaying image data read from the memory;
When information indicating defect determination is included in any of the inspection result information from each inspection machine , using the inspection result information including the defect determination, identification of the inspection region and the substrate associated with the defect determination A transmission request means for identifying information , creating a transmission request including each identified identification information, and transmitting it to all inspection machines;
Image storage means for storing the image data transmitted from each inspection machine in response to the transmission request in the memory in association with the identification information of the inspection area and the substrate included in the transmission request ;
One set is identified from the combination of the identification information of the inspection area and the substrate associated with the image data stored in the memory, all the image data corresponding to the combination is read from the memory, and these are read out. An inspection system for a component mounting board comprising display control means for displaying on the display means . 5. The inspection system for component mounting boards according to claim 4, wherein setting data common to the inspection machines is registered in the registration means as setting data for each inspection area . The display control means of the information processing apparatus creates display image data in which each image data read from the memory is arranged in one screen, and outputs the display image data to the display means. 4. The inspection system for component mounting boards described in 4 . The substrate to be processed is guided to a plurality of processes in order, and the process according to each process is executed. At the same time, an inspection machine for performing inspection by image processing is installed in at least two processes, and the image of the substrate after the process is executed is used. In the method of manufacturing a component mounting board for performing inspection,
In addition to installing information processing devices that can communicate with each inspection machine, in each inspection machine, the inspection area corresponding to each part on the board to be inspected can be specified by identification information common to each inspection machine. And
In each inspection machine, based on setting data registered in advance, an inspection area corresponding to each component is set in the image of the board and inspection is performed for each inspection area. Step a for generating inspection result information associated with the identification information of the area and the substrate and transmitting it to the information processing apparatus, and image data of each inspection area used for the inspection are identified with the inspection area and the substrate, respectively. and executes a step b of storing in memory in readable state by information, when receiving a transmission request including the identification information of the predetermined substrate and the inspection area from the information processing apparatus, the use of these identification information Executing step c of reading out image data corresponding to the transmission request from the memory and transmitting it to the information processing apparatus;
When the information processing apparatus includes information indicating defect determination in any of the inspection result information from each inspection machine, the inspection associated with the defect determination using the inspection result information including the defect determination Step A for specifying the identification information of the area and the substrate; Step B for creating a transmission request including each piece of identification information specified in Step A and sending it to all the inspection machines ; Step B for transmission from each inspection machine in response to the transmission request The stored image data is stored in the memory in association with the identification information of the inspection region and the substrate included in the transmission information; each of the inspection region and the substrate associated with the image data stored in Step C Steps D; specifying a set of combinations of identification information and reading out and displaying all image data corresponding to the combination from the memory Row,
A component mounting board manufacturing method characterized by the above.

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