CN115643683B - Filling and plating method for special-shaped resin hole and printed circuit board - Google Patents
Filling and plating method for special-shaped resin hole and printed circuit board Download PDFInfo
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- CN115643683B CN115643683B CN202211660122.4A CN202211660122A CN115643683B CN 115643683 B CN115643683 B CN 115643683B CN 202211660122 A CN202211660122 A CN 202211660122A CN 115643683 B CN115643683 B CN 115643683B
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Abstract
The invention relates to a filling and plating method of a special-shaped resin hole, which is characterized in that a through hole is processed on a laminated board according to the resin hole to be filled, copper is deposited, the layers are communicated, selective resin hole plugging filling is carried out on the through hole, initial curing is carried out after filling, full-board resin hole plugging filling is carried out on the through hole, full-board resin hole plugging filling is completed, final curing is carried out, the surface of the laminated board is ground to remove resin on the surface of the laminated board, the concavity of a resin hole slice is measured, the laminated board is microetched according to the concavity, and the microetched laminated board is directly subjected to copper deposition and thin copper electroplating. According to the invention, the selective resin hole plugging and full-plate resin hole plugging filling process is adopted, the initial curing parameters are adjusted, the binding force and filling effect of the resin for two times are ensured, no crack or bubble is generated in the hole, the resin hole is plated after micro-etching, the surface of the resin hole is protected by thin copper, and the resin hole is not sunk in the subsequent processing flow, so that the degree of sinking is further controlled, and the requirement of chip mounting is met.
Description
Technical Field
The invention relates to the technical field of manufacturing of 5G high-speed data communication printed circuit boards, in particular to a filling and plating method of a special-shaped resin hole and a printed circuit board.
Background
A Printed Circuit Board (PCB) is one of important components in the electronic industry, and is a support for electronic components and an electrical connection carrier. With the continuous change and development of process technology, product design and application fields, more and more metal substrates need to be subjected to a component direct-insert packaging process in a hole, so that the hole wall of the metal substrate needs to be subjected to insulation treatment, namely, resin hole plugging so as to meet the use requirement of the direct-insert packaging process. At present, resin plug holes are widely applied, and meanwhile, strict requirements are required for the degree of recess of the resin plug holes, for example, in the manufacturing of a 5G high-speed data communication printed circuit board, a gourd-shaped disc hole needs to be filled with resin to meet the requirement of chip mounting, a double-sided back drilling or shallow back drilling process needs to be filled with resin to manufacture a welding surface to meet the requirement of mounting of components, the prior art adopts a method of covering resin holes with dry films to drill other holes to improve the degree of recess of the resin, the process needs to grind a plate before the dry films are attached, the dry films are removed, the plate needs to be ground before copper deposition, the process flow is long, dry film materials are consumed, the degree of recess cannot be effectively controlled, and the like. CN105430939A discloses a resin hole plugging method for buried holes of printed circuit boards, which cannot control the dishing degree of the resin hole surface and the bubbles in the hole very well.
Disclosure of Invention
In order to solve the problems, the invention provides a filling and plating method of a special-shaped resin hole, which solves the problem of resin depression in flow processing, can ensure the quality controllability of product depression and protrusion, and meets the reliability requirement of high-precision HDI product IC mounting.
The invention is realized by adopting the following scheme: a filling and plating method for the hole made of different-nature resin includes such steps as machining the through hole to be filled with resin on laminated board, depositing copper for the first time to make the layers be communicated, selectively filling the through hole with resin, primary solidifying, filling the resin in the through hole, final solidifying, grinding the surface of laminated board to remove resin, slicing the filled resin hole, measuring the depression degree, microetching, depositing copper and electroplating thin copper. The invention starts from flow design and material characteristics, solves the technical problem of resin recess in flow processing by analyzing the material characteristics of copper and resin and developing a brand-new processing flow, technology and method, and can control the flatness to be between 0 and-5 mu m to meet the reliability requirement of high-precision HDI product IC mounting, wherein the resin hole filling recess degree required by the industry is less than 10 mu m. The resin hole is sliced and measured, the laminated board is subjected to micro-etching treatment according to the depression degree of the resin hole, the micro-etched laminated board is directly subjected to secondary copper deposition and thin copper electroplating, and the flatness of the resin hole can be controlled according to the product quality requirement. The invention meets the requirement of high-performance chip mounting, and is also suitable for processing conventional products of resin through hole plugging and resin disc holes.
Further, when the resin hole to be filled has a step structure, backdrilling is performed on the through hole after the first copper deposition operation, the drilling precision is controlled, during the backdrilling operation, the diameter of the backdrilling tool is selected according to the design, the depth of the backdrilling tool is calculated, normal processing is performed when the diameter of the backdrilling tool is smaller than the depth of the backdrilling tool, processing is performed after the parameters of the backdrilling tool and the depth of the backdrilling tool are adjusted when the diameter of the backdrilling tool is larger than the depth of the backdrilling tool, then slicing measurement is performed on the processed first piece, the qualification of the first piece is confirmed, and the backdrilled laminated board is etched. Through the control to the back drilling precision, further ensure the depression degree that the resin hole was filled, improve the product short circuit problem simultaneously, satisfy the production demand.
Further, the filling and plating method of the special-shaped resin hole comprises the following steps:
a1, processing a through hole needing resin hole plugging on a laminated board;
step A2, carrying out first copper deposition operation on the laminated board to enable the surface of the inner wall of the through hole to be adhered with a metal layer;
step A3, selectively filling the through holes with resin;
step A4, performing primary curing treatment to ensure that the inside and the outside of the resin lose fluidity and simultaneously keep viscosity;
step A5, carrying out vacuum resin hole plugging filling on the whole plate;
step A6, carrying out final curing operation according to conventional production parameters;
step A7, grinding the laminated board by using a ceramic machine, and grinding and flattening the resin on the board surface;
step A8, slicing the resin hole to measure the depression degree of the resin hole, and carrying out micro-etching treatment on the laminated plate according to the depression degree to ensure that the resin hole and the copper surface are kept horizontal without depression;
step A9, directly depositing copper for the second time on the laminated board;
step A10, plating thin copper of 5-8 μm on the laminated board by adopting a vertical continuous electroplating line;
and step A11, drilling and subsequent conventional processes are carried out according to the normal production process.
Further, in the step A3, a selective resin hole plugging machine is adopted for first filling, when the hole diameter of the through hole is less than or equal to 0.4mm, the hole diameter of the round hole on the hole plugging aluminum sheet is 0.1mm larger than that of the through hole, when the hole diameter of the through hole is greater than 0.4mm, the hole diameter of the round hole on the hole plugging aluminum sheet is the same as that of the through hole, when the through holes with different sizes are filled and the difference between the hole diameters of the through hole and the through hole is greater than 0.15mm, the hole plugging aluminum sheet needs to be separately manufactured; an air guide base plate used in the process of plugging the hole with the resin is an epoxy resin plate with the thickness of 2.0mm, according to the data of manufacturing a plugging aluminum sheet, a through hole with the thickness of 0.5mm is drilled in the air guide base plate, a drill with the depth of 1.5-2.5 mm is used for depth control drilling, and the remaining thickness is 0.3-0.5 mm.
Further, in the step A4, the primary curing is performed by using segmented prebaking, the curing is performed at a low temperature of 60 to 90 ℃ for 20 to 30 minutes, and then the curing is performed at a medium temperature of 100 to 120 ℃ for 15 to 20 minutes.
Further, in the step A5, a vacuum full-plate resin plugging machine is adopted for filling, the vacuum degree is adjusted to be more than 900Mbar, the pressure of the front plug and the rear plug is adjusted to be 5-6 bar, and the moving speed of the front plug and the rear plug is adjusted to be 50-150mm/min for printing.
Further, in step A8, the degree of concavity of the resin pores is measured with a metallographic microscope.
Further, the drilling precision control of the back drill comprises the following steps:
b1, selecting a back drilling tool with the aperture 0.3mm larger than that of the back drilling hole;
step B2, measuring the actual plate thickness of the plate needing back drilling, calculating the difference between the actual plate thickness and the theoretical plate thickness on the process card, comparing the drilling depth of the back drilling hole on the process card, and increasing or decreasing the calculated plate thickness difference data to calculate the actual back drilling depth;
step B3, calculating according to the comparison between the diameter of the back drilling cutter and the actual back drilling depth, when the diameter of the selected back drilling cutter is smaller than the back drilling depth, normally processing, when the diameter of the selected back drilling cutter is larger than the back drilling depth, adjusting parameters of the back drilling cutter and the back drilling depth, selecting the diameter of the back drilling cutter to be larger than the aperture of the back drilling hole by 0.15-0.2mm, and increasing the drilling depth by 0.05-0.15mm;
step B4, slicing and analyzing the first laminated board drilled out from the back, and performing mass production after the first laminated board is qualified;
and step B5, performing line etching on the back-drilled laminated board, and removing burrs left by back drilling.
Further, before filling the through holes needing resin hole plugging, the laminated board is baked according to the design value, and the board surface and the water in the holes are removed.
The invention also provides a printed circuit board and a filling and plating method applying the special-shaped resin hole.
Compared with the prior art, the invention has the following beneficial effects:
1. the invention adopts the selective resin hole plugging and full-plate resin hole plugging filling process, optimizes the initial curing parameters, ensures the binding force and filling effect of the resin for two times, ensures that the resin on the copper surface basically has no depression and protrusion by grinding and brushing a ceramic machine, can control the flatness between 0 and 5 mu m, meets the requirement that the depression degree of the resin hole plugging is less than 10 mu m in the industrial requirement, and ensures the requirement of chip mounting.
2. According to the invention, a resin hole plating process is designed after plate grinding and micro-etching of the resin hole ceramic machine, and thin copper of 5-8 mu m is uniformly plated on the surface of the resin hole, so that the resin hole is not sunken in subsequent processing processes such as plate grinding, plasma degumming and the like, and the quality of resin hole plugging is further ensured.
3. The invention can further improve the resin concavity by adding the micro-etching process, the surface flatness of the special-shaped resin hole can be controlled according to the product quality requirement, and the electroplating can be designed into the resin convex copper cap process after the micro-etching amount is adjusted and the practicability is improved.
Drawings
FIG. 1 is a flow chart of the steps of a filling and plating method for a shaped resin hole according to the present invention.
Fig. 2 is a schematic diagram of a hole in a gourd-shaped tray in an embodiment of the present invention.
Fig. 3 is a schematic diagram of a step structure of the filled resin hole in the embodiment of the present invention.
Detailed Description
To facilitate an understanding of the present invention for those skilled in the art, the present invention will be described in further detail below with reference to specific embodiments and accompanying drawings.
Referring to fig. 1 to 3, the invention relates to a filling and plating method of high-speed data communication products suitable for resin plugging of disk center holes and non-disk center holes, in particular to a filling and plating method of high-speed data communication products with 'gourd-shaped' disk center holes, double-sided resin stepped holes or shallow back-drilled anisotropic resin holes. The invention firstly bonds and laminates a prepreg and a multilayer circuit board into a laminated board, drills a through hole needing resin hole plugging on the laminated board according to a resin hole to be filled, metallizes the hole through a first copper deposition operation, conducts the layers, plates the through hole needing resin hole plugging to a required copper thickness according to design requirements, then selectively fills the resin hole plugging, performs primary curing on the through hole filled with the resin, ensures that the resin loses fluidity inside and outside and keeps better viscosity, is convenient for ink to be perfectly bonded during secondary hole plugging, performs full-board resin hole plugging filling on the through hole after primary curing, polishes the resin on the surface of the laminated board after high-temperature curing of the resin, then performs slicing on the resin hole to measure the depression degree of the resin hole, performs micro-etching treatment on the laminated board according to the depression degree measurement result, and directly performs secondary copper deposition and thin copper electroplating on the laminated board after micro-etching treatment. And before the first copper deposition treatment is carried out on the laminated board, carrying out deburring treatment on the surface of the laminated board so as to remove burrs left on the surface of the laminated board. The deburring process can avoid the problem that the aperture of the through hole needing resin filling is smaller than the preset aperture due to the unsmooth surface of the through hole needing resin filling caused by the residual burrs on the surface of the laminated board. The invention starts from flow design and material characteristics, solves the technical problem of resin depression in flow processing by analyzing the material characteristics of copper and resin and developing a brand-new processing flow, technology and method, and the industrial quality standard requires that the depression is less than 75 mu m and the protrusion is less than 50 mu m, while the resin hole plugging depression required by the industry is less than 10 mu m. The resin hole after the hole plugging is finished is sliced to measure the depression degree of the resin hole, the laminated board is subjected to micro-etching treatment according to the depression degree of the resin hole, the micro-etched laminated board is directly subjected to secondary copper deposition and thin copper electroplating, the flatness of the resin hole can be controlled according to the product quality requirement, and the electroplating after the micro-etching amount is adjusted and etching can be designed into a resin convex copper cap process.
Before filling the through holes needing resin hole plugging, baking the laminated board according to the design value, and removing water on the board surface and in the holes. In this example, the laminate was baked at 150 ℃ for 1 hour to remove moisture on the surface and in the holes.
In this embodiment, the filling and plating method of the anisotropic resin hole of the present invention includes the following steps:
step A1, processing a through hole needing resin hole plugging on a laminated board;
step A2, carrying out first copper deposition operation on the laminated board to enable the surface of the inner wall of the through hole to be attached with a metal layer;
step A3, selectively filling the through holes with resin;
step A4, performing primary curing treatment to ensure that the inside and the outside of the resin lose fluidity and simultaneously keep viscosity;
step A5, performing vacuum resin hole plugging filling on the whole plate;
step A6, carrying out final curing operation according to conventional production parameters;
step A7, grinding the laminated board by using a ceramic machine, and grinding and flattening the resin on the board surface;
step A8, slicing the resin hole to measure the depression degree of the resin hole, and carrying out micro-etching treatment on the laminated plate according to the depression degree to ensure that the resin hole and the copper surface are kept horizontal without depression;
step A9, directly depositing copper for the second time on the laminated board;
step A10, plating thin copper of 5-8 mu m on the laminated board by adopting a vertical continuous electroplating line;
and step A11, drilling and follow-up conventional processes are carried out according to a normal production process.
The filling and plating method of the anisotropic resin hole ensures that no air bubble and no crack exist in the hole by selecting a mode of twice resin filling of resin hole plugging and full-plate resin hole plugging, adjusts the parameter of primary curing to ensure that the fluidity of the inside and the outside of the resin is lost and the viscosity is better kept, is convenient for the ink to be perfectly adhered during the second hole plugging, further improves the resin dent degree through micro-etching and ensures the flatness of the resin hole, and finally adopts electroplating thin copper (without plate grinding) to avoid resin dent due to the protection of the thin copper with the thickness of 5 to 8 mu m in the resin hole, thereby avoiding the resin hole dent caused by conventional process operation, such as plasma glue removing operation.
In the embodiment, the selective resin plugging machine is adopted to selectively fill the through holes needing resin plugging on the laminated board, so that no air bubbles exist in the middle of the through holes, and compared with the traditional resin filling, the resin removal in the through holes needing no resin filling can be avoided or reduced. The selective filling of the through holes is to stack the hole plugging aluminum sheets on the surface of the laminated board for filling, and the positions of the round holes arranged on the hole plugging aluminum sheets correspond to the positions of the through holes needing to be filled with resin in the laminated board, so that the holes are selectively filled with the resin. In order to avoid the reasons of burrs on the surface of the hole plugging aluminum sheet, non-correspondence of the hole diameters and the like, the hole plugging aluminum sheet needs to be compensated for different hole plugging aluminum sheet hole diameters. When the diameter of the through hole needing resin hole plugging is less than or equal to 0.4mm, the aperture of the round hole on the hole plugging aluminum sheet is 0.1mm larger than that of the through hole needing resin hole plugging, and when the aperture of the through hole needing resin hole plugging is more than 0.4mm, the aperture of the round hole of the hole plugging aluminum sheet is the same as that of the through hole needing resin hole plugging. When through holes with different sizes needing resin hole plugging are filled and the aperture difference between the through holes and the through holes is larger than 0.15mm, hole plugging aluminum sheets need to be manufactured separately. An air guide base plate used in the process of plugging the hole with the resin is an epoxy resin plate with the thickness of 2.0mm, a through hole with the thickness of 0.5mm is drilled in the air guide base plate according to the information of manufacturing a plugging aluminum sheet, a drill bit with the thickness of 1.5-2.5 mm is used for depth control drilling, and the air guide base plate is ensured to have good air conductivity and cannot be drilled through after the air guide base plate is left with the thickness of 0.3-0.5 mm. Specifically, the hole plugging aluminum sheet, the laminated board and the air guide base plate are adjusted to be aligned, the vacuum is adjusted to 50-100PA hole plugging speed, the hole plugging speed is reduced to the minimum, and then printing is started.
After hole plugging is completed by selective resin, prebaking is performed, segmented prebaking is used for initial curing, the curing is performed for 20 to 30 minutes at a low temperature of 60 to 90 ℃, and then the curing is performed for 15 to 20 minutes at a medium temperature of 100 to 120 ℃. In the embodiment, the resin is cured at the low temperature of 90 ℃ for 30 minutes and then at the medium temperature of 110 ℃ for 20 minutes, the resin can be effectively prevented from being baked due to overhigh temperature and overlong time of single curing, the viscosity of the resin ink is controlled to be between 150 to 300dpas, so that the resin loses flowability inside and outside and keeps better viscosity, and the ink can be well adhered during secondary hole plugging.
Because the resin has fluidity and certain contractibility, the part of the resin hole after initial curing has certain depression, and the middle of the through hole needing resin hole plugging is filled and can not be further filled by adopting a selective resin machine, and the through hole needs to be plugged by adopting a vacuum full-plate resin hole plugging machine. In the embodiment, the vacuum degree is adjusted to be more than 900Mbar, the pressure of the front and rear plugs is adjusted to be 5-6 bar, the speed of the plugs is adjusted to be 50-150mm/min, and printing is carried out, and whether the resin in the sunken resin hole is full or not can be detected.
In this example, the final cure was carried out using the processing parameters as follows:
the resin adhered to the surface of the laminate was removed by grinding with a ceramic grinding plate. In this embodiment, the ceramic machine of # 600-800 is used to grind the laminated board and grind and level the resin on the board surface, because the ceramic machine is a flat ceramic wheel and is not ground by a needle brush, the resin on the copper surface is basically free of pits and protrusions, and the level is controlled between 0 and-5 μm. After grinding, a quality inspector uses a 10X mirror to inspect so as to ensure that the resin plug holes are full and no residual glue exists on the plate surface.
In order to further improve the resin dishing of 0 to-5 μm, the filled resin holes were sliced to measure the dishing, and the laminate was microetched according to the measured dishing. Specifically, the laminate is subjected to microetching treatment according to the microetching amount of 0 to-5 mu m, so that the resin plug holes are smooth and have no depression. The sag of the resin pores of the cut pieces was measured using a metallographic microscope in this example.
The copper is directly deposited on the laminate after the microetching treatment to protect the whole laminate (including resin holes), a needle brush of 320-800# is used in a conventional copper deposition rough grinding section, and the resin is further sunken after being ground by the needle brush because the resin is softer than the metal copper, so that the copper deposition rough grinding section is not excessive.
In order to ensure that through holes subjected to resin hole plugging in the subsequent production flow cannot generate depressions, the copper-deposited laminated board is protected by adopting a vertical continuous electroplating line to carry out whole board plating and 5-8 mu m plating. For example, in the subsequent drilling process, when the No. 600 brush is used for batch edge grinding, resin is prevented from sinking due to the protection of thin copper with the thickness of 5-8 μm in a resin plug hole. When the plasma adhesive is removed, the resin position can not be sunken because the resin hole has 5 to 8um thin copper protective resin adhesive, thereby ensuring that the flatness of the surface bonding pad of the resin hole is less than 5um, even reaching 100 percent flatness and ensuring the requirement of chip pole mounting. Drilling and subsequent conventional processes are recently carried out according to normal production processes.
When the resin hole to be filled has a step structure, backdrilling is carried out on the through hole after the first copper deposition operation, the drilling precision is controlled, the diameter of a backdrilling tool is selected according to the design during the backdrilling operation, the depth of the backdrilling tool is calculated, normal processing is carried out when the diameter of the backdrilling tool is smaller than the depth of the backdrilling tool, processing is carried out after the parameters of the backdrilling tool and the depth of the backdrilling tool are adjusted when the diameter of the backdrilling tool is larger than the depth of the backdrilling tool, then, slicing measurement is carried out on the processed first piece, the first piece is determined to be qualified, and the laminated board which is backdrilled is etched.
In this embodiment, the drilling accuracy control of the back drill comprises the following steps:
step B1, selecting a cutter: the expansion and shrinkage of the plate are within +/-0.1 mm, in order to prevent the short circuit of expansion and shrinkage deviation, a back drilling cutter with the aperture 0.3mm larger than that of a back drilling hole is selected according to a process card, and the process card is MI in the industry;
step B2, depth measurement: firstly, measuring the actual thickness of a plate needing backdrilling, calculating the thickness difference between the actual plate and the theoretical plate of the flow card, then checking the drilling depth of a backdrilling hole on the flow card, and increasing or decreasing the data with the calculated plate thickness difference to calculate the actual backdrilling depth. Compared with the traditional back drilling process, the back drilling is carried out only according to the theoretical depth on the process card, and accurate control can be achieved.
Step B3, back drilling parameter development: and (3) comparing and calculating according to the diameter of the back drill cutter and the actual back drilling depth, normally machining when the diameter of the selected back drill cutter is smaller than the back drilling depth, adjusting parameters of the back drill cutter and the back drilling depth when the diameter of the selected back drill cutter is larger than the back drilling depth, selecting the diameter of the back drill cutter to be larger than the aperture of a back drilling hole by 0.15-0.2 mm, and increasing the drilling depth by 0.05-0.15MM. Ensuring that the ratio of the diameter of the back drilling tool to the back drilling depth is less than 1: and 1, ensuring the optimal resin hole plugging quality.
Step B4, back drilling the first part: selecting a back drilling cutter according to requirements, determining the back drilling depth, then carrying out first piece processing, carrying out slicing analysis on the processed first piece laminated board, and carrying out batch production after the first piece is qualified.
Step B5, etching: and etching the circuit of the back-drilled laminated board, and removing the residual burrs of the back drilling.
In this embodiment, the printed wiring board is manufactured by the above-described filling and plating method of the anisotropic resin hole.
In the description of the present invention, it is to be understood that the indicated orientations or positional relationships are based on the orientations or positional relationships shown in the drawings and are only for convenience in describing the present invention and simplifying the description, but are not intended to indicate or imply that the indicated devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are not to be construed as limiting the present invention.
Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate a number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "connected," "secured," and the like are to be construed broadly, e.g., as meaning permanently attached, removably attached, or integral to one another; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or may be connected through the use of two elements or the interaction of two elements. The specific meanings of the above terms in the present invention can be understood according to specific situations by those of ordinary skill in the art.
While the invention has been described in conjunction with the specific embodiments set forth above, it is evident that many alternatives, modifications, and variations will be apparent to those skilled in the art in light of the foregoing description. Accordingly, it is intended to embrace all such alternatives, modifications, and variations that fall within the scope of the included claims.
Claims (8)
1. A filling and plating method of a special-shaped resin hole is characterized in that a through hole needing resin hole plugging is processed on a laminated board according to a resin hole to be filled, copper is deposited for the first time to enable the layers to be communicated, selective resin hole plugging filling is carried out on the through hole, the through hole filled with resin is subjected to primary curing, full-board resin hole plugging filling is carried out after the primary curing, final curing is carried out, the surface of the laminated board is ground after the final curing to remove the resin on the surface of the laminated board, the filled resin hole is sliced to measure the concavity of the resin hole, the laminated board is subjected to micro-etching treatment according to the concavity, and the laminated board subjected to the micro-etching treatment is directly subjected to the second copper deposition and thin copper electroplating; when a resin hole to be filled has a step structure, backdrilling the through hole after the first copper deposition operation, controlling the drilling precision, selecting the diameter of a backdrilling tool according to design during the backdrilling operation, calculating the depth of the backdrilling tool, normally processing when the diameter of the backdrilling tool is smaller than the depth of the backdrilling tool, processing after adjusting the parameters of the backdrilling tool and the depth of the backdrilling tool when the diameter of the backdrilling tool is larger than the depth of the backdrilling tool, then performing slicing measurement on a processed first piece, confirming that the first piece is qualified, and etching the backdrilled laminated board; the drilling precision control of the back drill comprises the following steps:
b1, selecting a back drilling tool with the aperture 0.3mm larger than that of the back drilling hole;
step B2, measuring the actual plate thickness of the plate needing back drilling, calculating the difference between the actual plate thickness and the theoretical plate thickness on the process card, comparing the drilling depth of the back drilling hole on the process card, and increasing or decreasing the calculated plate thickness difference data to calculate the actual back drilling depth;
step B3, calculating according to the comparison between the diameter of the back drilling cutter and the actual back drilling depth, when the diameter of the selected back drilling cutter is smaller than the back drilling depth, normally processing, when the diameter of the selected back drilling cutter is larger than the back drilling depth, adjusting parameters of the back drilling cutter and the back drilling depth, selecting the diameter of the back drilling cutter to be larger than the aperture of the back drilling hole by 0.15 to 0.2mm, and increasing the drilling depth by 0.05 to 0.15mm;
step B4, slicing and analyzing the first laminated board drilled out from the back, and performing mass production after the first laminated board is qualified;
and step B5, performing line etching on the back-drilled laminated board, and removing burrs left by back drilling.
2. The fill plating method of a shaped resin hole according to claim 1, characterized in that the fill plating method of a shaped resin hole comprises the steps of:
a1, processing a through hole needing resin hole plugging on a laminated board;
step A2, carrying out first copper deposition operation on the laminated board to enable the surface of the inner wall of the through hole to be adhered with a metal layer;
step A3, selectively filling the through holes with resin;
step A4, performing primary curing treatment to enable the inside and the outside of the resin to lose fluidity and keep viscosity;
step A5, carrying out vacuum resin hole plugging filling on the whole plate;
step A6, carrying out final curing operation according to conventional production parameters;
step A7, grinding the laminated board by using a ceramic machine, and grinding and flattening the resin on the board surface;
a8, slicing the resin holes to measure the concavity of the resin holes, and carrying out micro-etching treatment on the laminated board according to the concavity;
step A9, directly depositing copper for the second time on the laminated board;
step A10, plating thin copper of 5-8 mu m on the laminated board by adopting a vertical continuous electroplating line;
and step A11, drilling and follow-up conventional processes are carried out according to a normal production process.
3. The filling and plating method of the special-shaped resin hole according to claim 2, wherein in the step A3, the selective resin filling machine is used for the first filling, when the hole diameter of the through hole is 0.4mm or less, the hole diameter of the round hole on the hole aluminum sheet is 0.1mm larger than the hole diameter of the through hole, when the hole diameter of the through hole is 0.4mm or more, the hole diameter of the round hole on the hole aluminum sheet is the same as the hole diameter of the through hole, when the through holes with different sizes are filled and the difference between the hole diameters is 0.15mm or more, the hole aluminum sheet is separately manufactured; an air guide base plate used in the process of plugging the hole with the resin is an epoxy resin plate with the thickness of 2.0mm, according to the data of manufacturing a plugging aluminum sheet, a through hole with the thickness of 0.5mm is drilled in the air guide base plate, a drill with the depth of 1.5-2.5 mm is used for depth control drilling, and the remaining thickness is 0.3-0.5 mm.
4. The method for filling and plating the special-shaped resin hole according to claim 2, wherein in the step A4, the initial curing is performed by using a segmented prebaking, the curing is performed at a low temperature of 60 to 90 ℃ for 20 to 30 minutes, and then the curing is performed at a medium temperature of 100 to 120 ℃ for 15 to 20 minutes.
5. The method for filling and plating a profiled resin hole according to claim 2, wherein in the step A5, the resin hole is filled by a vacuum full-plate resin hole plugging machine, the vacuum degree is adjusted to be more than 900Mbar, the pressure of the front and rear plugs is adjusted to be 5-6 bar, and the moving speed of the front and rear plugs is adjusted to be 50-150mm/min for printing.
6. The method of claim 2, wherein the resin hole is recessed by a metallographic microscope in step A8.
7. The method as claimed in claim 1, wherein the laminate is baked to remove moisture on the surface and in the holes before filling the through holes to be plugged with resin.
8. A printed wiring board produced by the method for filling and plating the hole with the shaped resin according to any one of claims 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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|---|---|---|---|---|
| JP2005050981A (en) * | 2003-07-31 | 2005-02-24 | Ngk Spark Plug Co Ltd | Wiring board and its producing process |
| CN106973507A (en) * | 2017-04-20 | 2017-07-21 | 深圳崇达多层线路板有限公司 | A kind of preparation method of filling holes with resin wiring board |
| CN110831336A (en) * | 2019-11-11 | 2020-02-21 | 珠海崇达电路技术有限公司 | Resin hole plugging method for large-aperture back drilling hole |
| CN113163606A (en) * | 2021-04-25 | 2021-07-23 | 东莞市五株电子科技有限公司 | Resin hole plugging method for double-sided back drilling plate |
| CN115112679A (en) * | 2022-06-22 | 2022-09-27 | 江西景旺精密电路有限公司 | Manufacturing method of standard part for verifying depression precision of resin plug hole |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104582316B (en) * | 2014-12-31 | 2018-04-20 | 广州兴森快捷电路科技有限公司 | High density silk screen product method for plugging |
| CN114900972A (en) * | 2022-06-16 | 2022-08-12 | 湖北金禄科技有限公司 | High-density interconnection circuit board and preparation method thereof |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005050981A (en) * | 2003-07-31 | 2005-02-24 | Ngk Spark Plug Co Ltd | Wiring board and its producing process |
| CN106973507A (en) * | 2017-04-20 | 2017-07-21 | 深圳崇达多层线路板有限公司 | A kind of preparation method of filling holes with resin wiring board |
| CN110831336A (en) * | 2019-11-11 | 2020-02-21 | 珠海崇达电路技术有限公司 | Resin hole plugging method for large-aperture back drilling hole |
| CN113163606A (en) * | 2021-04-25 | 2021-07-23 | 东莞市五株电子科技有限公司 | Resin hole plugging method for double-sided back drilling plate |
| CN115112679A (en) * | 2022-06-22 | 2022-09-27 | 江西景旺精密电路有限公司 | Manufacturing method of standard part for verifying depression precision of resin plug hole |
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