JP2003204140A - Manufacturing method for wiring board and multilayered wiring board, and multilayfred wiring board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method for a wiring board and a multilayered wiring board using thermoplastic resin, and to provide the multilayered wiring board manufactured by the manufacturing method. <P>SOLUTION: The manufacturing method for the wiring board that forms a wiring patterns on a board 21 containing the thermoplastic resin comprises a groove formation process forming a groove 24 corresponding to the wiring pattern on the board 21, and a filling process filling a conductive paste in the groove 24. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a wiring board and a method of manufacturing a multilayer wiring board using a thermoplastic resin. The present invention also relates to a multilayer wiring board manufactured by this manufacturing method.

[0002]

2. Description of the Related Art In mounting boards mounted on electronic equipment, with the recent miniaturization and multifunctionalization of electronic equipment,
Higher density mounting of electronic components than ever before is required. In order to mount electronic components on a wiring board with high density, not only downsizing of electronic components but also fine and highly accurate wiring processing is required.

On the other hand, it is necessary to consider the method of recycling the mounting board in order to realize the recent reduction in environmental load. Conventional wiring boards made of glass epoxy have excellent heat resistance and workability,
Since the epoxy resin, which is a thermosetting resin, is used as the substrate material, recycling is difficult.

The substrate material that has received attention here is a thermoplastic resin. A wiring board made of a thermoplastic resin is not only capable of fine and highly precise wiring processing, but also has excellent mechanical strength, heat resistance and electrical insulation, and is relatively easy to recycle. Due to these various advantages, research is underway to use a thermoplastic resin as a substrate of a wiring substrate.

For example, when polyimide, which is a thermoplastic resin, is used as a substrate material, conventionally, a copper foil is laminated on a tape made of polyimide, and then the copper foil is etched to form a wiring pattern. Manufactures a printed wiring board having a predetermined wiring pattern. There is also a method of forming a wiring pattern by printing a conductive paste on a substrate instead of the method of etching.

The method using the conductive paste does not require a wet process (etching process) as compared with the method using etching, and thus has an advantage of further contributing to environmental protection.

Therefore, if the wiring board is manufactured from the thermoplastic resin board and the conductive paste, it is possible to realize a high-performance and environment-friendly wiring board. A method for manufacturing a thermoplastic resin substrate having a wiring pattern formed of this conductive paste is disclosed in, for example, Japanese Patent Laid-Open No. 2001-244609. According to this publication, a thermoplastic resin substrate in which a groove corresponding to a wiring pattern is formed by injection-molding a molten thermoplastic resin into a cavity mold having a shape to be a wiring pattern is manufactured. A wiring board is manufactured by filling a conductive paste.

[0008]

By the way, this method of manufacturing a wiring board has a problem that a cavity mold is required and the manufacturing facility becomes large. In this method of manufacturing a wiring board, the molten thermoplastic resin is cooled in the cavity mold, so that there is a problem that the wiring board taken out from the mold is warped due to residual stress during cooling.

Therefore, an object of the present invention is to provide a method for manufacturing a wiring board, a method for manufacturing a multilayer wiring board, and a multilayer wiring board, in which a fine wiring pattern is simply formed on a substrate material made of a thermoplastic resin by a dry process. It is to be.

[0010]

A method of manufacturing a wiring board in which a wiring pattern is formed on a substrate containing a thermoplastic resin according to the present invention includes a groove forming step of forming a groove portion corresponding to the wiring pattern on the substrate. And a filling step of filling the groove portion with a conductive paste.

In particular, the groove forming step is performed by pressing a groove die having a convex shape corresponding to the wiring pattern onto the substrate at a temperature equal to or higher than the softening start temperature of the substrate.

A method of manufacturing a multilayer wiring board according to the present invention comprises a groove forming step of forming a groove portion corresponding to a wiring pattern on a substrate containing a thermoplastic resin and a filling step of filling the groove portion with a conductive paste. A wiring board manufacturing step of manufacturing a plurality of wiring boards to be manufactured, a laminating step of laminating a plurality of manufactured wiring boards, and the plurality of wiring boards being pressed against each other while being heated at a temperature equal to or higher than the softening start temperature of the boards. And a multi-layering step of fusing the plurality of wiring boards to each other by applying pressure.

The multilayer wiring board according to the present invention is
A plurality of wiring boards, each having a wiring pattern formed in a groove portion of a board containing a thermoplastic resin, are stacked, and the plurality of wiring boards are fused to each other.

Also, the wiring board manufacturing apparatus according to the present invention includes a mounting table on which a board containing a thermoplastic resin is mounted, a groove die having a convex shape corresponding to a wiring pattern, and a softening start of the board. A heating and pressing unit that presses the groove mold against the substrate at a temperature equal to or higher than a temperature, and a filling unit that fills the groove formed by the heating and pressing unit with a conductive paste are configured.

In the wiring board manufacturing method, the multilayer wiring board manufacturing method and the wiring board manufacturing apparatus having the above structure,
Grooves are formed in a thermoplastic resin and wiring patterns are formed in the grooves with a conductive paste, so not only fine and highly precise wiring can be processed, but also mechanical strength, heat resistance and electrical insulation are excellent, and recycling is also possible. Is relatively easy.

Particularly, by utilizing the softening start temperature which is a physical property of the thermoplastic resin, the groove can be formed by press working.

The above-mentioned multilayer wiring board is finely and precisely processed for wiring, is excellent in mechanical strength, heat resistance and electrical insulation, and is relatively easy to recycle.

The softening start temperature is a temperature at which the resin changes from a rigid state in which the elastic modulus of the resin sharply decreases to a state in which the resin can be deformed into a shape according to the shape of the object by pressing the object. That is, for example, when the substrate is made of a thermoplastic resin only, it has a glass transition temperature.

[0019]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. In each figure, the same components are designated by the same reference numerals.

FIG. 1 is a process diagram (No. 1) for explaining a method of manufacturing a wiring board.

FIG. 2 is a process diagram (No. 2) for explaining the method of manufacturing the wiring board.

1 and 2, a wiring board according to an embodiment of the present invention includes a groove forming step of forming a wiring groove 24 on one main surface of a substrate 21 as shown in FIG. 2A, a through hole forming step of forming a through hole (through hole) 25, and a groove portion 2 as shown in FIG. 2B.
4 and the through holes 25 are filled with the conductive paste 26 and then dried, and the groove portion 24 as shown in FIG. 2C.
It is manufactured by a polishing step of precision-polishing the main surface of the wiring side on which the wiring is formed. (Groove forming step) In the groove forming step, first,
A thermoplastic resin substrate 21 is prepared. The thermoplastic resin is
Has high heat resistance and high strength. The present invention can utilize both crystalline resins and amorphous resins. The crystalline resin is a resin having a glass transition point (secondary transition point) and a melting point (first transition point), and for example, a liquid crystal polymer (Liqu
id Crystal Polymer, LCP), Polyetheretherketone (PEEK), Polyethernitrile (PEN), Syndiotactic Polystyrene (SPS), Polyphenylene sulfide (PP)
S) or the like can be used. The amorphous resin is a resin having only a glass transition point (secondary transition point), and examples thereof include polyamide imide (PAI) and polyarylate (P
AR), Polyethersulfone, P
ES) etc. can be used. In addition, these composite materials can also be used. Further, in order to obtain the effect of increasing the heat resistant deformation temperature of the wiring board, a composite material in which a thermoplastic resin and a thermosetting resin are mixed (blended) may be used. In this case, the curing temperature of the thermosetting resin needs to be lower than the melting point temperature of the thermoplastic resin, that is, (melting point of the thermoplastic resin) ≧ (curing temperature of the thermosetting resin). As the thermosetting resin, for example, an epoxy resin, a thermosetting polyimide resin, a phenol resin or the like can be used.

The thickness of the substrate is determined according to the strength required for the substrate and the thickness of the electronic component when the electronic component is embedded in the substrate. For example, the thickness is 50 μm or 100 μm.
m, 150 μm, etc.

Then, as shown in FIG. 1A, the film-shaped substrate 21 having such a thickness is placed on the backup plate (press table) 31 via the release sheet 32. The release sheet 32 has a groove portion 2 for a wiring circuit, as will be described later.
Since the groove die 22 is pressed against the substrate 21 while being heated to form the substrate 4, the substrate 21 is moved to the backup plate 31.
It is provided so as not to adhere to the. Groove mold 22
Has a convex shape corresponding to the wiring pattern (groove portion 24), and is manufactured by, for example, etching glass or etching metal or electric discharge machining. Next, as shown in FIG. 1B, Groove 2 to be formed
The groove die 22 having a convex shape with the portion corresponding to 4 as the convex portion 23 is pressed against the substrate 21 by the press 33 while heating. The heating temperature will be described below.

FIG. 4 is a diagram showing the relationship between temperature and elastic modulus in the amorphous resin.

As shown in FIG. 4, the amorphous resin has a large elastic modulus D as the temperature is changed from a low temperature to a high temperature, and the amorphous resin is hard to be deformed according to the mold.
When the mold has a small elastic modulus D, it is deformed according to the mold and changes into a clay-like state in which the shape after deformation is maintained, and further the resin is decomposed by heating.
The temperature at which this solid state changes to a clay-like state is called the glass transition temperature Tg, and the temperature at which the resin itself decomposes is called the decomposition temperature Td.

FIG. 5 is a graph showing the relationship between temperature and elastic modulus of the crystalline resin.

As shown in FIG. 5, the crystalline resin changes from a solid state to a clay-like state similar to the above as the temperature is changed from a low temperature to a high temperature, and is further heated to change from a solid state to a liquid state. become.

In the present embodiment, since the groove portion 24 forming the wiring pattern is formed by pressing the groove die 22 against the substrate 21, the heating temperature needs to be a temperature at which the resin is deformed according to the groove die 22. There is. Therefore, the heating temperature is set to the glass transition temperature Tg or higher and the decomposition temperature Td or lower of the amorphous resin used for the substrate 21 in the case of the amorphous resin, and used for the substrate 21 in the case of the crystalline resin. The glass transition temperature of the crystalline resin is set to Tg or higher and melting point Tm or lower. The magnitude of pressure is determined according to the elastic modulus of the thermoplastic resin at this heating temperature.

When the heating temperature is reached, the thermoplastic resin is softened, and the groove mold 21 is pressed against the groove 23, so that the projections 23 of the groove mold 21 are embedded in the thermoplastic resin.

Then, as shown in FIG. 1C, the groove mold 22 is used.
The pressing and heating are stopped and cooled at a position where only the convex portion 23 is embedded in the substrate 21. Groove 24 even if protrusion 23 is removed
In order to maintain the shape of the groove 21 after the temperature of the substrate 21 becomes lower than the glass transition temperature Tg.
2 is removed to form a groove 24 in the substrate 21.

In the present embodiment, since the groove 24 is formed in this way, the substrate 21 needs to be a material that can be deformed according to the mold when the mold is pressed against a boundary at a certain temperature. .

The groove 24 may be formed by placing a mask having an opening corresponding to the groove 24 to be formed on the substrate 21 and sandblasting the resin in the opening. Groove formation by such heat press working or sandblasting using a mask can form the groove portion 24 in a short time, which is convenient for mass production.

Alternatively, the groove 24 is NC along with an end mill, sandblast or laser light along the wiring pattern.
You may process it by controlling. In these processing methods, since NC control can be performed using the wiring pattern design data (CAD data), NC control processing can be performed immediately after the wiring pattern design is completed, which is suitable for short-term delivery and small-quantity production. Is.

The groove forming method in the above groove forming step is as follows.
Both can be performed in a dry environment, and there is no wet process using an etching solution unlike the conventional process. Therefore, environmental pollution can be suppressed. (Through Hole Forming Step) In FIG. 2A, the through hole forming step is the same as the general hole processing on a printed wiring board.
The position where the through hole 25 is to be formed is processed by NC control with a drill, sandblast, or laser light.

When the groove and the through hole are formed by the same means, for example, sandblasting or laser light, the through hole 25 can be formed during the groove forming step. (Filling Step) In FIG. 2B, the groove 24 and the through hole 25 of the substrate 21 are filled with the conductive paste 26 that is a conductive material by moving the squeegee 34 that is a resin plate-shaped body. The conductive paste is scraped off by the squeegee 34 on the surface of the substrate 21. The conductive paste 26 is manufactured by kneading and mixing powders of conductive materials such as carbon and metal (copper, gold, silver, etc.) using a thermoplastic resin as a binder. Here, it is desirable that the thermoplastic resin of the conductive paste 26 has a melting point Tm (or decomposition temperature Td) equal to or lower than the melting point Tm (or decomposition temperature Td) of the thermoplastic resin of the substrate. The conductive paste 26 is diluted with a solvent from the viewpoint of having a soft viscosity even at room temperature.

A wiring circuit is formed by drying and curing the conductive paste 26 by heat treatment.

Instead of the conductive paste 26, a metal paste in which fine metal particles (for example, silver powder) are dispersed in a solvent may be used.

In the above description, the conductive paste 26 is filled and scraped by the squeegee 34. However, for example, the conductive paste 26 is moved along the groove 24 and the through hole 25 while ejecting the nozzle ejecting the conductive paste 26. Alternatively, these may be filled with the conductive paste 26. In this case, as the ejection nozzle, a nozzle having a needle-like shape so as to fill one groove portion 24 and the through hole 25, or a nozzle having a slit-like opening portion so as to fill a plurality of groove portions 24 and the through hole 25 is used. can do. (Polishing step) As shown in FIG. 2C, in the polishing step, if the squeegee in the filling step is good, the wiring may be formed by itself and the space between the wirings may be cleaned, but in many cases, high reliability is ensured. From the viewpoint of controlling the contamination layer on the surface (the remaining layer of the conductive paste 26), the polishing roller 35 is used.
Remove by polishing with.

By surface polishing, as shown in FIG. 2D, the thickness of the substrate is finished in the order of 1 μm, the main surface of the substrate can be made flat, and the line width and thickness of the wiring circuit are almost the same. Highly accurate finish with no variation.

Through the above steps, the wiring board 10-a as shown in FIG. 2E is formed.

Thus, the wiring board 10-a can be formed by forming the wiring groove 24 in the thermoplastic resin substrate 21 and filling the groove 24 with the conductive paste 26. From the viewpoint of facilitating soldering of the wiring, electrode lands may be further formed on the wiring board 10-a.

Next, an electrode land forming process for forming electrode lands on the wiring board 10-a will be described. (Electrode Land Forming Step) FIG. 3 is a process diagram for explaining a forming method for forming an electrode land.

In the electrode land forming step, as shown in FIG. 3A, a metal foil 28 is laminated on the wiring substrate 10-a on which the wiring circuit is formed by the conductive paste 26, as shown in FIG. 3A. The metal foil 28 is, for example, easy to solder,
From the viewpoint of durability and cost, copper foil and alloy foil mainly composed of iron and nickel are used, and the thickness is 5 to 5.
It is 35 μm.

Next, as shown in FIG. 3B, the electrode land 2
9 is pressed against the wiring board 10-a, and the metal foil 28 is provided only on the portion to be the electrode land 29 as shown in FIG. 3C. Embedded in 10-a.

When pressing the electrode land mold 36, the temperature of the electrode land mold 36 is heated to a temperature at least higher than the melting point of the conductive paste 26, and is lowered to a temperature lower than the melting point of the conductive paste 26. After lowering the temperature of the electrode land mold 36, the electrode land mold 36 is opened. As a result, the electrode lands 29 of the metal foil 28 can be cleaned cleanly.
Can be embedded in -a.

In this way, the wiring board 10-a is provided with the electrode lands 29 as shown in FIG. 3D.
-b is formed.

Next, the wiring board 10 thus formed
A case where electronic components are mounted on -a and 10-b will be described. (First Mounted Wiring Board) The first mounted wiring board is an embodiment in which electronic components are mounted on a board surface opposite to a board surface on which wiring circuits are formed.

FIG. 6 is a process chart for explaining a first mounting method for mounting an electronic component.

The electronic component 41 is placed on the board surface opposite to the board surface on which the wiring circuit is formed in accordance with the position to be mounted. At this time, in particular, as shown in FIG. 6A, the through hole 25 filled with the conductive paste 26 and the electrode of the electronic component 41 are aligned with each other in order to achieve electrical conduction with the wiring pattern.

Then, as shown in FIG. 6B, the electronic component 4
By pressing 1 while heating, electronic component 41
The electrode is inserted into the conductive paste of the through hole 25, and the joint surface between the electronic component 41 and the wiring board 10-c is thermocompression bonded.

Therefore, it is preferable that the tip of the electrode of the electronic component 41 has an acute angle. And the heating temperature is
As described with reference to FIGS. 4 and 5, the wiring board 10
When -c is an amorphous resin, it is set to a glass transition temperature Tg or higher and a decomposition temperature Td or lower, and when it is a crystalline resin, it is set to a glass transition temperature Tg or higher and a melting point Tm or lower. The heating temperature is generally sufficiently lower than the temperature at which electronic components are thermally destroyed. Further, the pressure is the electronic component 41.
It is determined by the number and size of the electrodes and the conductive paste 26 of the through holes 25.

For example, when the electronic component 41 is an IC chip, the electrode is a bump electrode, and when the diameter of the bump electrode is 100 μm, the through hole 25 is approximately 120 μm.
Is. Then, the pressure is set to be, for example, about 10 g load per electrode terminal.

After that, it is cooled to at least the glass transition temperature Tg or lower, and the mounted wiring board 11-a in which the electronic component 41 is mounted on the wiring board 10-c as shown in FIG. 6C is manufactured. (Second Mounted Wiring Board) First Mounted Wiring Board 11-a
Since the electronic component 41 is mounted on the surface of the wiring board 10-c, the thickness of the mounted wiring board 11-a is increased by the thickness of the electronic component 41. For this reason, when forming a multilayer wiring board which will be described later, spacers are required by the thickness of the electronic component 41. Therefore, the second mounting wiring board 11-b
Is an embodiment in which a recess for the electronic component 41 is formed in the portion of the wiring board 10-c on which the electronic component 41 is mounted, and the electronic component 41 is embedded in the recess.

FIG. 7 is a process chart for explaining a second mounting method for mounting an electronic component.

In the wiring board 10-d having the recess 38 for embedding the electronic component 41, the recess 38 is formed in the groove forming step for forming the groove 24. That is, in the groove forming step, the recess mold having the protrusion for forming the recess 38 is placed on the backup plate 31 instead of the release sheet 32, and the groove mold 22 and the groove mold 22 are used during heating and pressing. By sandwiching the substrate 21 with the recess mold, the recess is formed at the same time when the groove 24 is formed. The shape of the recess 38 is substantially the same as or slightly larger than the outer shape of the electronic component 41,
The depth is substantially equal to or deeper than the thickness of the electronic component 41. For example, the electronic component 41 has a size of □ 5 mm and a thickness of 5
In the case of a 0 μm semiconductor chip, the recess 38 had a size of 5.1 mm and a depth of 55 μm.

The electronic component 41 is housed in the recess 38 of the wiring board 10-d thus formed. At this time, in particular, as shown in FIG. 7A, the electrodes of the electronic component 41 and the through holes 25 filled with the conductive paste 26 are aligned with each other.

Then, as shown in FIG. 7B, the electronic component 4
By pressing 1 while heating at a predetermined temperature,
The electrode of the electronic component 41 is inserted into the conductive paste of the through hole 25, and the joint surface between the electronic component 41 and the wiring board 10-d is thermocompression bonded.

Thereafter, the electronic component 41 is cooled to at least the glass transition temperature Tg or lower so that the electronic component 41 does not project from the outer peripheral surface of the wiring substrate 10-d as shown in FIG. 7C. Mounted wiring board 11-b
Is manufactured.

In the above-described first and second mounting wiring boards 11-a and 11-b, the case where the number of electronic components 41 is one has been described, but of course, a plurality of electronic components 41 are mounted. It is also possible. Particularly, in the case of the second mounted wiring board, the mounted wiring board is manufactured by forming the recesses according to the number of electronic components 41 to be mounted. Further, in the above-mentioned first and second mounting wiring boards 11-a and 11-b, in order to effectively arrange the wiring pattern on the main surface of the board 21, the board on which the electronic component 41 is formed with the wiring circuit is formed. Although it is mounted on the surface of the substrate opposite to the surface, the electronic component 41 may be mounted on the surface of the substrate on which the wiring circuit is formed.

Next, the manufacturing process for manufacturing the multilayer wiring board by laminating the wiring boards 10-a and 10-b and the mounting wiring boards 11-a and 11-b will be described.

Here, in the description of the multilayer wiring board, the wiring boards 10-a and 10-b and the mounting wiring board 11-that form each layer are formed.
Each of the wiring boards a and 11-b is referred to as a "unit board". (First Multilayer Wiring Board) The first multilayer wiring board 50 is a wiring board manufactured by laminating only a plurality of wiring boards 10 and heat-sealing them.

FIG. 8 is a diagram for explaining a method of manufacturing the first multilayer wiring board.

In FIG. 8A, the first multilayer wiring board 50
First, the unit substrate 60-b is placed on the backup plate via the release sheet. Next, the unit substrates 60-b are sequentially stacked on the unit substrates 60-b in the order in which they are to be stacked.
-a3, the wiring board 60-a2, and the wiring board 60-a1 are stacked. Here, in the present embodiment, the unit substrate 60-a1
60-a3 are wiring boards 10-a and unit boards 6
Reference numeral 0-b is a wiring board 10-b provided with electrode lands. Note that all the unit boards 60 may be the wiring board 10-a.

Next, the unit boards 60 are aligned with each other. In this case, at least two through holes 56 for positioning are formed in each unit substrate 60. The through hole 56 for positioning is opened in the through hole forming step described above,
The through holes 56 for positioning are formed by not filling the conductive paste 26 in the filling step. Then, the unit boards 60 are aligned with each other by inserting the pins 57 into the positioning through holes 56.

Next, the unit substrates 60-a1 are pressed while heating the unit substrates 60 to heat-bond the joint surfaces of the unit substrates 60, respectively.

As described with reference to FIGS. 4 and 5, the heating temperature is set to the glass transition temperature Tg or higher and the decomposition temperature Td or lower when the unit substrate 60 is the amorphous resin, and is set to the crystalline resin when the unit substrate 60 is the crystalline resin. The glass transition temperature Tg or higher and the melting point Tm or lower are set. The pressure is determined according to the number and thickness of the unit boards 60 to be stacked, the material of the board 21, and the like. For example, P on the substrate 21 of each unit substrate 60
When using EEK, pressure 50 N / cm ² , temperature 3
Under the conditions of 30 ° C. and heating / pressurizing holding time of 30 minutes, the multilayer wiring board 50 having a good laminated state without cracks between layers or poor conduction was obtained.

Thus, the first multilayer wiring board 50 whose cross section is shown in FIG. 8B is manufactured. (Second Multilayer Wiring Board) The second multilayer wiring board 51 is a multilayer wiring board in which the mounting wiring board 11-b is used as one of the unit boards 60 constituting the first multilayer wiring board 50.

FIG. 9 is a diagram for explaining a method of manufacturing the second multilayer wiring board.

In FIG. 9A, the second multilayer wiring board 51
8A except that in the method of manufacturing the first multilayer wiring board 50, a unit board 61-b having electronic components mounted in recesses is used instead of the unit board 60-a3, the first multilayer board described with reference to FIG. 8A is used. Similar to the method of manufacturing the wiring board 50, its cross section is manufactured as shown in FIG. 9B.

As shown in FIG. 9B, the multilayer wiring board 5
The electronic component 41 housed in the unit 1 can be easily grounded from the outside by contacting one main surface with the wiring pattern formed by the conductive paste 26. (Third Multilayer Wiring Board) The third multilayer wiring board 52 is a multilayer wiring board using the mounting wiring board 11-a instead of the mounting wiring board 11-b forming the second multilayer wiring board 51. . That is, in the mounted wiring board 11-a, since the electronic component 41 projects from the main surface of the wiring board 11-a by the thickness, a spacer substrate that compensates for this thickness is used when stacking.

FIG. 10 is a diagram for explaining a method of manufacturing the third multilayer wiring board.

FIG. 10A In the third multilayer wiring substrate 52, first, the unit substrate 60-b is placed on the backup plate via the release sheet. Next, the unit board 60-b
Unit board 61-a on which electronic parts are mounted is stacked,
A spacer substrate 62 for compensating the thickness of the electronic component 41.
Are stacked. Next, the wiring substrate 60-a2 and the wiring substrate 60-a1 are sequentially laminated on the spacer substrate 62 in the order of lamination.

Here, the spacer substrate 62 has an opening having a size substantially equal to or slightly larger than the outer shape of the electronic component 41 at a position corresponding to the position of the electronic component 41 mounted on the unit substrate 61-a. The thickness of the electronic component 41 is substantially the same as or thicker than that of the electronic component 41. For example, when the electronic component 41 is a semiconductor chip having a size of 5 mm and a thickness of 50 μm, the opening has a size of 5.1 mm and the spacer substrate 62 has a thickness of 55 μm.

Next, as in the case of the first multilayer wiring board 50, alignment, heating / pressing, and cooling are performed to heat-bond the joint surfaces of the unit boards 60 to 62, respectively.
Third multilayer wiring board 5 whose cross section is as shown in FIG. 10B
2 is produced.

The first to third multilayer wiring boards 50 are provided.
In 52 to 52, the wiring board 10-b including the electrode land on one of the unit boards 60, which is the outer peripheral surface, is used.
The wiring boards 10-b may be used on both sides of the outer peripheral surface, or the wiring boards 10-a may be used on both sides of the outer peripheral surface.

[0077]

As described above, in the method for manufacturing a wiring board, the method for manufacturing a multilayer wiring board, and the apparatus for manufacturing a wiring board according to the present invention, a groove portion is formed in a thermoplastic resin and a wiring pattern is formed in the groove portion with a conductive paste. As a result, the fine and highly accurate wiring process can be performed, and the mechanical strength,
It has excellent heat resistance and electrical insulation, and is relatively easy to recycle.

The multilayer wiring board according to the present invention is
The wiring is fine and highly precise, has excellent mechanical strength, heat resistance, and electrical insulation, and is relatively easy to recycle.

[Brief description of drawings]

FIG. 1 is a process diagram (1) for explaining a method of manufacturing a wiring board.

FIG. 2 is a process diagram (No. 2) for explaining the method of manufacturing the wiring board.

FIG. 3 is a process drawing (3) for explaining the method of manufacturing the wiring board.

FIG. 4 is a diagram showing a relationship between temperature and elastic modulus in an amorphous resin.

FIG. 5 is a diagram showing a relationship between temperature and elastic modulus in a crystalline resin.

FIG. 6 is a process chart for explaining a first mounting method for mounting an electronic component.

FIG. 7 is a process chart for explaining a second mounting method for mounting an electronic component.

FIG. 8 is a drawing for explaining the manufacturing method of the first multilayer wiring board.

FIG. 9 is a drawing for explaining the manufacturing method of the second multilayer wiring board.

FIG. 10 is a drawing for explaining the manufacturing method of the third multilayer wiring board.

[Explanation of symbols]

10 wiring board 11 Mounted wiring board 21 board 22 Groove type 23 Convex part 24 groove 25 through holes 26 Conductive paste 27 wiring pattern 29 electrode land 33 Press 34 Squeegee

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) H05K 3/46 H05K 3/46 GN Q (72) Inventor Masahiro Izumi 2-17, Higashigotanda, Shinagawa-ku, Tokyo No. 1 F term in Sony EMCS Co., Ltd. (reference) 5E317 AA24 BB01 BB02 BB03 BB12 BB13 BB14 BB15 CC17 CD01 CD32 CD34 GG01 GG14 5E336 AA04 AA05 AA08 BB15 BC04 BC25 BC26 CC32 CC55 DD02 EE05 A07 BB30A02 BB30 A02 BB25 BB43 BB44 BB67 BB72 BB78 DD02 DD13 EE33 ER32 FF23 GG08 GG16 GG20 5E346 AA32 AA43 CC08 CC32 CC37 CC38 CC39 DD02 DD12 DD13 DD50 EE03 EE08 FF18 GG15 HH18 HH26 HH40

Claims (13)

[Claims] 1. A method of manufacturing a wiring board in which a wiring pattern is formed on a substrate containing a thermoplastic resin, a groove forming step of forming a groove portion corresponding to the wiring pattern on the substrate, and filling the groove portion with a conductive paste. And a filling step for filling the wiring board. 2. The method of manufacturing a wiring board according to claim 1, further comprising a through hole forming step of forming a through hole penetrating the substrate, at least before the filling step. 3. The method of manufacturing a wiring board according to claim 1, further comprising a polishing step of polishing a surface of the wiring board on which the wiring pattern is formed, at least after the filling step. 4. At least after the filling step, a metal foil is laminated on a surface of the wiring board on which the wiring pattern is formed, and a convex shape is formed according to a position where a part of the metal foil is to be pressed into the wiring board. 2. The wiring according to claim 1, further comprising an electrode land forming step of forming an electrode land by pressing an electrode land mold including the above to the wiring substrate at a temperature equal to or higher than a softening start temperature of the substrate. Substrate manufacturing method. 5. The mounting process according to claim 1, further comprising, after at least the filling step, a mounting step of burying a part of the electrode terminal of the electronic component in the wiring pattern by pressing the electronic component. Manufacturing method of wiring board. 6. A recess forming step of forming, in a position where an electronic component is to be mounted, a recess having a size at least larger than an outer shape of the electronic component and at least deeper than a thickness of the electronic component, in the substrate, the electronic component. 2. The method for manufacturing a wiring board according to claim 1, further comprising a mounting step of burying a part of the electrode terminal in the wiring pattern in the recess by pressing the electronic component. 7. The recess forming step is a step of forming a recess by pressing a recess mold having a convex shape corresponding to the recess onto the substrate at a temperature equal to or higher than the softening start temperature of the substrate. 7. The method of manufacturing a wiring board according to claim 6, wherein the step is performed at the same time as the groove forming step. 8. The groove forming step is formed by pressing a groove die having a convex shape corresponding to the wiring pattern onto the substrate at a temperature equal to or higher than a softening start temperature of the substrate. A method for manufacturing a wiring board according to claim 1. 9. A wiring for manufacturing a plurality of wiring boards, comprising: a groove forming step of forming a groove portion corresponding to a wiring pattern on a substrate containing a thermoplastic resin; and a filling step of filling the groove portion with a conductive paste. A substrate manufacturing step; a laminating step of laminating a plurality of manufactured wiring boards; and a plurality of wiring boards that are pressed by pressing the plurality of wiring boards against each other while heating at a temperature equal to or higher than a softening start temperature of the boards. And a multilayering step of fusing the wiring boards to each other. 10. The wiring board on which electronic components are mounted is included in the plurality of wiring boards.
A method for manufacturing the multilayer wiring board according to. 11. A multilayer wiring board comprising a plurality of wiring boards, each having a wiring pattern formed in a groove portion of a substrate containing a thermoplastic resin, and the plurality of wiring boards being fused to each other. 12. The multilayer wiring board, wherein the plurality of wiring boards include a wiring board on which electronic components are mounted. 13. A mounting table on which a substrate containing a thermoplastic resin is mounted, a groove mold having a convex shape corresponding to a wiring pattern, and the groove mold at a temperature equal to or higher than a softening start temperature of the substrate. An apparatus for manufacturing a wiring board, comprising: a heating and pressing unit that presses the substrate; and a filling unit that fills a groove formed by the heating and pressing unit with a conductive paste.