CN114900972A - High-density interconnection circuit board and preparation method thereof - Google Patents
High-density interconnection circuit board and preparation method thereof Download PDFInfo
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- CN114900972A CN114900972A CN202210682142.5A CN202210682142A CN114900972A CN 114900972 A CN114900972 A CN 114900972A CN 202210682142 A CN202210682142 A CN 202210682142A CN 114900972 A CN114900972 A CN 114900972A
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- 238000002360 preparation method Methods 0.000 title claims abstract description 21
- 238000000227 grinding Methods 0.000 claims abstract description 25
- 238000004519 manufacturing process Methods 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 16
- 238000005086 pumping Methods 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 11
- 229910052802 copper Inorganic materials 0.000 abstract description 11
- 239000010949 copper Substances 0.000 abstract description 11
- 230000000694 effects Effects 0.000 abstract description 7
- 239000011347 resin Substances 0.000 description 17
- 229920005989 resin Polymers 0.000 description 17
- 239000002390 adhesive tape Substances 0.000 description 14
- 238000007650 screen-printing Methods 0.000 description 7
- 230000000740 bleeding effect Effects 0.000 description 6
- 238000012545 processing Methods 0.000 description 6
- 239000011148 porous material Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 238000012797 qualification Methods 0.000 description 3
- 238000012935 Averaging Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 239000013589 supplement Substances 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
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- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The application provides a high-density interconnection circuit board and a preparation method thereof. The preparation method of the high-density interconnection circuit board comprises the following steps: sequentially detecting the apertures of a plurality of plate holes of a plate body to be plugged to obtain a plurality of aperture values; judging whether the difference value between the maximum aperture value and the minimum aperture value is greater than or equal to 0.3mm or not; if not, carrying out primary hole plugging operation on the plate body; otherwise, carrying out secondary hole plugging operation on the plate body; baking the plate body subjected to hole plugging operation; and carrying out plate grinding operation on the baked plate body. According to the preparation method of the high-density interconnection circuit board, the hole plugging quality and efficiency of the plurality of plate holes are improved, the hole plugging effect of the plurality of plate holes is better, the problems that small hole plugs are not full and large holes emit too much oil after hole plugging of the plate holes with different hole diameter values are avoided, the hole plugging quality of the circuit board is improved, the problem that the plugs are replenished again after baking and grinding is avoided, the appearance quality of the surface of the circuit board is poor, and the copper consumption of the circuit board is reduced.
Description
Technical Field
The invention relates to the technical field of circuit board processing, in particular to a high-density interconnection circuit board and a preparation method thereof.
Background
In the manufacturing of the high-density interconnection circuit board, blind holes with different apertures need to be plugged by resin, and in the production process, the blind holes are not full due to the fact that different apertures of one circuit board are different too much, and the problem that oil leakage of large holes is too much is caused after the circuit board is plugged, so that the quality of plugging of the circuit board is poor.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provides a high-density interconnection circuit board with good hole plugging quality and a preparation method thereof.
The purpose of the invention is realized by the following technical scheme:
a method of making a high density interconnect circuit board, comprising:
sequentially detecting the apertures of a plurality of plate holes of a plate body to be plugged to obtain a plurality of aperture values;
judging whether the difference value between the maximum aperture value and the minimum aperture value is greater than or equal to 0.3mm or not; if not, carrying out primary hole plugging operation on the plate body; otherwise, carrying out secondary hole plugging operation on the plate body;
baking the plate body subjected to hole plugging operation;
and carrying out plate grinding operation on the baked plate body.
In one embodiment, if the maximum pore size value and the minimum pore size value are greater than or equal to 0.3 mm; the step of carrying out secondary hole plugging operation on the plate body comprises the following steps:
carrying out first hole plugging operation on the plate body;
pre-baking the plate body subjected to the first hole plugging operation;
and carrying out secondary hole plugging operation on the plate body.
In one embodiment, the step of performing the baking operation on the board body after the hole plugging operation specifically comprises: and baking the plate body subjected to the second hole plugging operation.
In one embodiment, the aperture of the first receptacle is smaller than the aperture of the second receptacle.
In one embodiment, the pre-baking time for the plate body of the first hole plugging operation is 12min to 18 min.
In one embodiment, the baking time of the plate body subjected to the second hole plugging operation is 90-110 min.
In one embodiment, before the step of pre-baking the plate body for the first plugging operation, the preparation method further comprises:
and collecting and stacking the plate bodies subjected to the first hole plugging operation to obtain a first stacked plate group.
In one embodiment, the step of pre-baking the board body for the first hole plugging operation specifically includes: and simultaneously carrying out pre-baking operation on the first stacked plate group.
In one embodiment, before the step of performing the second tap hole operation on the plate body, and after the step of simultaneously performing the pre-baking operation on the first stacked plate group, the preparation method further includes: and placing the plate bodies of the first stacked plate group on an air guide plate one by one for positioning.
In one embodiment, the number of plates of the first stacked plate group is greater than or equal to 90.
In one embodiment, before the step of performing the second plugging operation on the plate bodies, and after the step of positioning the plate bodies of the first stacked plate group one by one on the air guide plate, the preparation method further includes:
and carrying out vacuum pumping operation on the plate body positioned on the air guide plate.
In one embodiment, the time for carrying out the plate grinding operation on the baked plate body is 40-50 s.
A high-density interconnection circuit board is prepared by the preparation method of the high-density interconnection circuit board according to any one of the embodiments.
Compared with the prior art, the invention has at least the following advantages:
before plugging the plate body, sequentially detecting the apertures of a plurality of plate holes of the plate body to be plugged to obtain a plurality of aperture values, and judging whether the difference value between the maximum aperture value and the minimum aperture value is greater than or equal to 0.3 mm; if not, namely the aperture deviation of different plate holes is small, carrying out primary hole plugging operation on the plate body; otherwise, the aperture deviation of different plate holes is great promptly, carry out secondary consent operation to the panel body, carry out the consent processing in batches to the aperture of different plate holes promptly, improve the consent quality and the efficiency of a plurality of plate holes, the consent effect that makes a plurality of plate holes is all better, avoid having the aperture stopper not full after the consent because of the plate hole of different aperture values, the too much problem of macropore oil bleeding, the consent quality of circuit board has been improved, avoid toasting the problem of mending the stopper once more after grinding, the face appearance quality who has improved the circuit board is relatively poor, the copper that has reduced the circuit board simultaneously consumes.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
FIG. 1 is a schematic flow chart illustrating a method of fabricating a high density interconnect circuit board according to one embodiment;
FIG. 2 is a schematic diagram of a screen plate with one-step via holes for a method of fabricating a high-density interconnect circuit board according to an embodiment;
FIG. 3 is a schematic diagram of a screen plate with secondary plugging holes according to one embodiment of the method for manufacturing a high-density interconnection circuit board;
fig. 4 is a schematic view illustrating the positioning of the board body on the air guide plate before step S103 in the method for manufacturing a high-density interconnection circuit board according to an embodiment;
FIG. 5 is a schematic view of the first positioning plate disposed on the air guide plate shown in FIG. 4 being connected to the first connecting guide post;
FIG. 6 is a schematic view of the longitudinal positioning plate disposed on the air guide plate shown in FIG. 4 being connected to the second connecting guide post;
FIG. 7 is a schematic view of the second positioning plate disposed on the air guide plate shown in FIG. 4 being connected to a third connecting guide post;
FIG. 8 is a schematic view of a stop positioning plate disposed on the air guide plate shown in FIG. 4.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
The application provides a preparation method of a high-density interconnection circuit board, which comprises the following steps: sequentially detecting the apertures of a plurality of plate holes of a plate body to be plugged to obtain a plurality of aperture values; and/or judging whether the difference value between the maximum aperture value and the minimum aperture value is greater than or equal to 0.3 mm; if not, carrying out primary hole plugging operation on the plate body; otherwise, carrying out secondary hole plugging operation on the plate body; and/or, baking the plate body after the hole plugging operation; and/or, carrying out plate grinding operation on the baked plate body.
Before plugging the plate body, sequentially detecting the apertures of a plurality of plate holes of the plate body to be plugged to obtain a plurality of aperture values, and judging whether the difference value between the maximum aperture value and the minimum aperture value is greater than or equal to 0.3 mm; if not, namely the aperture deviation of different plate holes is small, carrying out primary hole plugging operation on the plate body; otherwise, the aperture deviation of different plate holes is great promptly, carry out secondary consent operation to the panel body, carry out the consent processing in batches to the aperture of different plate holes promptly, improve the consent quality and the efficiency of a plurality of plate holes, the consent effect that makes a plurality of plate holes is all better, avoid having the aperture stopper not full after the consent because of the plate hole of different aperture values, the too much problem of macropore oil bleeding, the consent quality of circuit board has been improved, avoid toasting the problem of mending the stopper once more after grinding, the face appearance quality who has improved the circuit board is relatively poor, the copper that has reduced the circuit board simultaneously consumes.
In order to better understand the technical solution of the present application, the following further explains the technical solution of the present application:
as shown in fig. 1, the method for manufacturing a high-density interconnect circuit board according to an embodiment is used for manufacturing a high-density interconnect circuit board. Further, the preparation method comprises part or all of the following steps:
s101, the hole diameters of a plurality of plate holes of a plate body to be plugged are sequentially detected to obtain a plurality of hole diameter values.
In this embodiment, the apertures of the plate holes of the plate body to be plugged are sequentially detected to obtain a plurality of aperture values. It is understood that the plate body may have one, two, three or more plate holes for the same plate body. For the same kind of plate holes, the hole diameters of the plate holes are not completely equal but have small deviation from each other due to the influence of machining or manufacturing precision. The average diameter of the different types of plate holes is different for the different types of plate holes.
S103, judging whether the difference value between the maximum aperture value and the minimum aperture value is greater than or equal to 0.3mm or not; if not, carrying out primary hole plugging operation on the plate body; otherwise, carrying out secondary hole plugging operation on the plate body.
In this embodiment, it is determined whether the difference between the maximum aperture value and the minimum aperture value is greater than or equal to 0.3 mm; if not, namely the maximum aperture value and the minimum aperture value are smaller than 0.3mm, namely the aperture deviation of different plate holes is smaller, carrying out primary hole plugging operation on the plate body; otherwise, the maximum aperture value and the minimum aperture value are larger than or equal to 0.3mm, namely, the aperture deviation of different plate holes is larger, secondary hole plugging operation is carried out on the plate body, namely, hole plugging operation is separately carried out on the plate hole with the smaller aperture and the plate hole with the larger aperture of the plate body, the problems that small hole plugs are not full and oil leakage of large holes is too much due to the fact that the plate holes with different aperture values are plugged are avoided, and the hole plugging quality of the circuit board is improved.
S105, baking the plate body subjected to the hole plugging operation.
In this embodiment, the board body after the plugging operation is baked to cure the resin in the plug hole, so that the plug hole of the board body is firmer.
S107, plate grinding operation is carried out on the baked plate body.
In this embodiment, the plate body after baking is ground to overflow unnecessary heavy copper to the plate body surface and grind, realize that the mill plate subtracts the effect of copper.
Before plugging the plate body, sequentially detecting the apertures of a plurality of plate holes of the plate body to be plugged to obtain a plurality of aperture values, and judging whether the difference value between the maximum aperture value and the minimum aperture value is greater than or equal to 0.3 mm; if not, namely the aperture deviation of different plate holes is small, carrying out primary hole plugging operation on the plate body; otherwise, the aperture deviation of different plate holes is great promptly, carry out secondary consent operation to the panel body, carry out the consent processing in batches to the aperture of different plate holes promptly, improve the consent quality and the efficiency of a plurality of plate holes, the consent effect that makes a plurality of plate holes is all better, avoid having the aperture stopper not full after the consent because of the plate hole of different aperture values, the too much problem of macropore oil bleeding, the consent quality of circuit board has been improved, avoid toasting the problem of mending the stopper once more after grinding, the face appearance quality who has improved the circuit board is relatively poor, the copper that has reduced the circuit board simultaneously consumes.
In one embodiment, if the maximum pore size value and the minimum pore size value are greater than or equal to 0.3 mm; the step of carrying out secondary hole plugging operation on the plate body comprises the following steps: firstly, carrying out first hole plugging operation on a plate body; then, pre-baking the plate body subjected to the first hole plugging operation to pre-cure the resin subjected to the previous hole plugging, so that the problem that the resin subjected to the previous hole plugging is easy to fall off is solved; and then carrying out secondary hole plugging operation on the plate body so as to carry out hole plugging operation on the rest plate holes. In this embodiment, the maximum aperture value and the minimum aperture value are greater than or equal to 0.3mm, i.e., the maximum aperture value and the minimum aperture value differ greatly. As shown in fig. 2 and 3, the first screen printing plate 10 is adopted to perform first hole plugging operation on the plate body, the second screen printing plate 20 is adopted to perform second hole plugging operation on the plate body, and thus, hole plugging operation is performed twice through the plate holes of the plate body, so that the plate grinding times are reduced, the problem of secondary plug supplement after baking and grinding is avoided, and the hole plugging quality of the plate body is improved.
In one embodiment, the step of performing the baking operation on the board body after the hole plugging operation specifically comprises: and baking the plate body subjected to the second hole plugging operation, so that the resin subjected to the second hole plugging is reliably cured and connected on the plate body, and the resin subjected to the first hole plugging is reinforced and cured.
In one embodiment, the aperture of the first hole plugging is smaller than that of the second hole plugging, namely, the hole plugging is performed on the hole with the smaller aperture value first, and then the hole plugging is performed on the hole with the larger aperture value, so that the problems of insufficient small hole plugs and excessive large hole oil bleeding existing in the hole plugging of the holes with different aperture values are avoided, and the hole plugging quality of the circuit board is improved.
It will be appreciated that for the plate bodies of both plate holes, the maximum and minimum aperture values are greater than or equal to 0.3 mm. In this embodiment, the step of performing the secondary plugging operation on the plate body includes: firstly, carrying out first hole plugging operation on a plate body; then, pre-baking the plate body subjected to the first hole plugging operation to pre-cure the resin subjected to the previous hole plugging, so that the problem that the resin subjected to the previous hole plugging is easy to fall off is solved; and then carrying out secondary hole plugging operation on the plate body so as to carry out hole plugging operation on the rest plate holes. In this embodiment, the maximum aperture value and the minimum aperture value are greater than or equal to 0.3mm, that is, the deviation between the maximum aperture value and the minimum aperture value is large, two times of hole plugging operations are performed on the plate holes of the plate body, the plate grinding times are reduced, the problem of plug supplement after baking and grinding is avoided, and the hole plugging quality of the plate body is improved.
In one embodiment, the pre-baking time for the plate body of the first hole plugging operation is 12min to 18 min. In this embodiment, the time for pre-baking the plate body subjected to the first hole plugging operation is 15min, so as to better pre-bake the plate body subjected to the first hole plugging operation, so that the resin subjected to the first hole plugging is better pre-cured and connected to the plate body, thereby reducing the time consumed by pre-baking, and simultaneously, enabling the plate hole to be plugged of the plate body to be plugged to be better plugged subsequently. In one embodiment, the temperature for pre-baking the plate body for the first hole plugging operation is 150-160 ℃, so that the plate body can be pre-baked better, and the time required by pre-baking is greatly shortened.
In one embodiment, the baking time of the plate body subjected to the second hole plugging operation is 90-110 min. In this embodiment, the time for baking the board body in the second hole plugging operation is 100min, so that the resin after hole plugging is cured and connected to the board body better, thereby avoiding the problem of long or short time required for baking the board, and making the time for baking the board moderate.
In one embodiment, the step of baking the plate body for the second tap hole operation includes: firstly, baking the plate body subjected to the second hole plugging operation for first preset time at a first preset temperature value; and then baking the plate body subjected to the second hole plugging operation at a second preset temperature value for a second preset time, wherein the first preset temperature value is smaller than the second preset temperature value, and the first preset time is larger than the second preset time, so that the plate body is baked in two different temperature ranges, namely, the plate body is baked in a low-temperature and high-temperature baking mode, and the hole plugging is better formed on the plate body. In this embodiment, the first preset temperature value is a variation temperature value, that is, the first preset temperature value is not a constant value. Specifically, first preset temperature value is for rising temperature earlier the back constant temperature, avoids the great easy condemned problem of plate body difference in temperature in the twinkling of an eye, makes the temperature of being heated of plate body rise gradually, and then makes the consent of plate body be heated and solidify the shaping gradually to toast the plate body better. Further, the first preset temperature value is 105-115 ℃, and the second preset temperature value is 150-160 ℃. In this embodiment, the first preset temperature value is raised from 105 ℃ to 110 ℃ within 20min, and then the temperature of 110 ℃ is maintained for 40 min. The second preset temperature value is 155 ℃, so that the plate body can be better baked.
And for plate bodies with more than three plate holes, the plate holes of the first hole plugging and the second hole plugging are divided, and the hole plugging operation is completed in batches by two hole plugging modes. Specifically, hole plugging batches are classified according to the aperture values of different types of plate holes, wherein the plate hole with the smallest aperture value corresponds to a large-hole plugging type, the plate hole with the largest aperture value corresponds to a small-hole plugging type, and if the aperture values of other types of plate holes are close to the largest aperture value, namely the absolute value of the difference value between the aperture value of other types of plate holes and the largest aperture value is smaller than the absolute value of the difference value between the aperture value of other types of plate holes and the smallest aperture value, hole plugging operation is carried out on the plate holes of other types and the small-hole plugging type at the same time; otherwise, hole plugging operation is carried out on other types of plate holes and large hole plugging at the same time, so that two-time hole plugging operation is realized.
Due to the deviation of the manufacturing precision of the plate body, the aperture values of different types of plate holes are not necessarily equal; further, regarding the plate holes with the largest aperture value, the plate holes with the largest aperture value are all used as large-hole plug hole types within the tolerance value of the plate holes with the largest aperture value; for the plate holes with the minimum aperture value, all the plate holes are taken as small hole plug holes in the tolerance value of the plate holes with the minimum aperture value; taking the aperture value of the plate holes of the large-hole plug hole class as an average value to obtain a first plate hole average value; taking the aperture value of the plate holes of the small-hole plug-hole type as an average value to obtain a second plate hole average value; defining all plate holes in the first plate hole mean value and the tolerance value thereof as a first plate hole group, and defining all plate holes in the second plate hole mean value and the tolerance value thereof as a second plate hole group; removing the plate hole data of the first plate hole group and the second plate hole group to obtain a middle plate hole; averaging the aperture data of the middle plate holes to obtain an average value of the middle plate holes; if the absolute value of the difference value between the average value of the middle plate holes and the average value of the first plate holes is smaller than the absolute value of the difference value between the average value of the middle plate holes and the average value of the second plate holes, the hole plugging operation is carried out on the middle plate holes and the plate holes of the large hole plugging type, otherwise, the hole plugging operation is carried out on the middle plate holes and the plate holes of the small hole plugging type, and the hole plugging quality of the plate holes of the plate body is improved.
Further, if the absolute value of the difference between the average value of the middle plate holes and the average value of the first plate holes is smaller than the absolute value of the difference between the average value of the middle plate holes and the average value of the second plate holes, and the absolute value of the difference between the average value of the middle plate holes and the average value of the first plate holes is larger than or equal to 0.3mm, the plate holes of the third plug hole type are divided. In this embodiment, a method for manufacturing a high-density interconnect circuit board includes: sequentially detecting the apertures of a plurality of plate holes of a plate body to be plugged to obtain a plurality of aperture values; regarding the plate holes with the maximum aperture value, the plate holes with the maximum aperture value are all used as large-hole plug hole types within the tolerance value of the plate holes with the maximum aperture value; for the plate holes with the minimum aperture value, all the plate holes are taken as small hole plug holes in the tolerance value of the plate holes with the minimum aperture value; taking the aperture value of the plate holes of the large-hole plug hole class as an average value to obtain a first plate hole average value; taking the aperture value of the plate holes of the small-hole plug-hole type as an average value to obtain a second plate hole average value; defining all plate holes in the first plate hole mean value and the tolerance value thereof as a first plate hole group, and defining all plate holes in the second plate hole mean value and the tolerance value thereof as a second plate hole group; removing the plate hole data of the first plate hole group and the second plate hole group to obtain a middle plate hole; averaging the aperture data of the middle plate holes to obtain an average value of the middle plate holes; judging whether the maximum aperture value and the minimum aperture value are greater than or equal to 0.3mm or not; if not, carrying out primary hole plugging operation on the plate body; if so, judging whether the absolute value of the difference value between the average value of the middle plate holes and the average value of the first plate holes is smaller than the absolute value of the difference value between the average value of the middle plate holes and the average value of the second plate holes; if the maximum aperture value and the minimum aperture value are greater than or equal to 0.3mm, and the absolute value of the difference value between the average value of the middle plate holes and the average value of the first plate holes is smaller than the absolute value of the difference value between the average value of the middle plate holes and the average value of the second plate holes, carrying out hole plugging operation on the middle plate holes and the plate holes of the large hole plugging type; if the maximum aperture value and the minimum aperture value are greater than or equal to 0.3mm, and the absolute value of the difference value between the average value of the middle plate holes and the average value of the first plate holes is greater than the absolute value of the difference value between the average value of the middle plate holes and the average value of the second plate holes, carrying out hole plugging operation on the middle plate holes and the plate holes of the small hole plugging type; if the absolute value of the difference between the average value of the middle plate holes and the average value of the first plate holes is smaller than the absolute value of the difference between the average value of the middle plate holes and the average value of the second plate holes, and the absolute value of the difference between the average value of the middle plate holes and the average value of the first plate holes is larger than or equal to 0.3mm, carrying out hole plugging operation on the middle plate holes independently; specifically, firstly, hole plugging operation is carried out on plate holes of large-hole plug holes of the plate body for the first time; then, pre-baking the plate body subjected to the first hole plugging operation for one time to pre-cure the resin subjected to the previous hole plugging, so that the problem that the resin subjected to the previous hole plugging is easy to fall off is solved; then, carrying out secondary hole plugging operation on the middle plate hole of the plate body so as to carry out hole plugging operation on the middle plate hole; secondly, pre-baking the plate body subjected to the second hole plugging operation for the second time to pre-cure the resin subjected to the previous hole plugging, so that the problem that the resin subjected to the previous hole plugging is easy to fall off is solved; then, hole plugging operation is carried out for the third time on the plate holes of the small hole plugging type of the plate body so as to carry out hole plugging operation on the plate holes of the small hole plugging type; then baking the plate body subjected to the third hole plugging operation to effectively cure the numerical values of the hole plugging of the plate body, so as to avoid the problem that the resin in the prior hole plugging is easy to fall off; and finally, the baked plate body is subjected to plate grinding operation, and the hole plugging quality of various plate holes of the plate body is improved by performing hole plugging operation on the plate body for three times. It is understood that in other embodiments, the number of times the plate body is plugged is not limited to three times, but may be more than four times.
In one embodiment, before the step of pre-baking the plate body for the first plugging operation, the preparation method further comprises: and collecting and stacking the plate bodies subjected to the first hole plugging operation to obtain a first stacked plate group. In one embodiment, the step of pre-baking the board body for the first hole plugging operation specifically includes: and the first stacked plate group is simultaneously subjected to pre-baking operation, so that the average time required by pre-baking a single plate body is reduced, and the pre-baking efficiency of the single plate body is improved. In this embodiment, the steps of collecting and stacking the plate bodies for the first plugging operation specifically include: the plate bodies subjected to the first hole plugging operation are respectively positioned through the positioning piece, so that the plate bodies subjected to the first hole plugging operation in a plurality of preset numbers are positioned better, and the plate bodies subjected to the first hole plugging operation are quickly collected and stacked. Specifically, the locating piece includes the backup pad and the protruding reference column of locating the backup pad, and the backup pad is used for stacking the support to a plurality of the plate body of first consent operation, and each plate body is equipped with the locating hole, and the reference column is used for fixing a position a plurality of the locating hole of the plate body of first consent operation, makes a plurality of predetermined number the plate body of first consent operation is better positioned the locating piece.
In one embodiment, the number of plates of the first stacked plate group is greater than or equal to 90. It is understood that in other embodiments, the number of the plate bodies of the first stacked plate group is not limited to be greater than or equal to 90, and may be adjusted according to actual needs.
In one embodiment, before the step of performing the second tap hole operation on the plate body, and after the step of simultaneously performing the pre-baking operation on the first stacked plate group, the preparation method further includes: and placing the plate bodies of the first stacked plate group one by one on an air guide plate for positioning so as to respectively perform secondary hole plugging operation on the plate bodies. In this embodiment, the step of placing the plate bodies of the first stacked plate group one by one on the air guide plate for positioning specifically includes: firstly, a plate body is placed on an air guide plate according to a positioning area of the air guide plate; then, the fixed position of the plate body is adjusted, so that the position of the plate body to be plugged corresponds to the screen plate plugging hole, and the plate body to be plugged can be plugged better; and then the plate body is fixed on the air guide plate through the fixing piece, so that the plate body and the air guide plate are relatively fixed and positioned. Specifically, the fixing piece can be a fixing adhesive tape or a fixing pressing block, so that the plate body can be quickly fixed and positioned on the air guide plate.
As shown in fig. 4, the step of fixing the plate body on the air guide plate by the fixing member specifically includes: the periphery of the plate body 40 is glued to the air guide plate 50 by the fixing adhesive tape 30, so that the plate body to be plugged is better fixed on the air guide plate. In order to better fix the plate body on the air guide plate by gluing and to fix the plate body on the air guide plate more reliably, furthermore, the air guide plate 50 is respectively provided with a first transverse positioning plate 52, a longitudinal positioning plate 54, a second transverse positioning plate 56 and a stop positioning plate 58; the first transverse positioning plate and the second transverse positioning plate are arranged in parallel; two ends of the longitudinal positioning plate are respectively abutted against the first transverse positioning plate and the second transverse positioning plate, and two ends of the longitudinal positioning plate are respectively fixedly connected with the first transverse positioning plate and the second transverse positioning plate through fixing adhesive tapes, so that two ends of the longitudinal positioning plate are respectively abutted against and positioned relative to the first transverse positioning plate and the second transverse positioning plate; the stop positioning plate and the longitudinal positioning plate are arranged in parallel; the first transverse positioning plate, the longitudinal positioning plate, the second transverse positioning plate and the stop positioning plate are encircled together to form a positioning groove 53; the locating slot is used for fixing and locating the plate body to be plugged. Specifically, when positioning, the plate body to be plugged is fixed and positioned in the positioning groove, and then the positions of the plate body adjacent to the first transverse positioning plate, the longitudinal positioning plate and the second transverse positioning plate are fixed through the fastening adhesive tape 60, so that the plate body to be plugged is reliably fixed on the air guide plate, and the plugging precision of the plate body is improved. In this embodiment, the air guide plate is provided with an installation positioning column in the positioning groove region in a protruding manner, the installation positioning column corresponds to the positioning hole of the plate body, and when the plate body to be plugged is positioned in the positioning groove, the installation positioning column is located in the positioning hole and connected with the air guide plate. Before the plate body to be plugged is fixed through the fastening adhesive tape, the plate body to be plugged can be finely adjusted relative to the air guide plate, so that the corners of the plate body to be plugged are aligned with the first transverse positioning plate and the longitudinal positioning plate respectively, and the plate body to be plugged is aligned with the plugging screen plate better.
It can be understood that, for making the fastening sticky tape carry out adhesive fixation respectively to the plate body near first horizontal locating plate, the position of vertical positioning board and second horizontal locating plate, furthermore, the thickness of plate body is equal with the thickness of first horizontal locating plate, the thickness of vertical positioning board and the thickness of second horizontal locating plate respectively, the fastening sticky tape that makes the plate body near first horizontal locating plate, the position department of vertical positioning board and second horizontal locating plate carry out adhesive fixation is more level and smooth, the plate body carries out adhesive fixation at the position department of near first horizontal locating plate, vertical positioning board and second horizontal locating plate better simultaneously. In one embodiment, the screen plate is provided with screen plate positioning holes, the screen plate positioning holes are arranged corresponding to the positioning holes of the plate body, so that the screen plate and the plate body to be plugged are both fixedly positioned on the mounting positioning column, the screen plate and the plate body to be plugged are relatively aligned and positioned, and the plate body to be plugged is better plugged through the screen plate. In order to avoid the problem that the screen printing plate moves relative to the plate body, furthermore, the screen printing plate is respectively fixedly positioned with the first transverse positioning plate, the longitudinal positioning plate and the second transverse positioning plate through reinforcing the adhesive tape, so that the screen printing plate is positioned relative to the plate body, and the problem that the screen printing plate moves relative to the plate body is avoided. In this embodiment, before the step of fixing and positioning the screen plate with the first lateral positioning plate, the longitudinal positioning plate and the second lateral positioning plate respectively by the reinforcing adhesive tape, the alignment adjustment is performed on the screen plate and the plate body to be plugged, so that the screen plate and the plug hole of the plate body to be plugged are reliably aligned.
To improve the efficiency of fixing and positioning the plate, as shown in fig. 4 and 5, further, the first positioning plate 52 is slidably disposed on the air guide plate, so that the connection position between the first positioning plate and the air guide plate is adjustable. In this embodiment, the air guide plate 50 is provided with a first connecting guide pillar 51, a first waist-shaped groove 522 is provided on the first transverse positioning plate, the first connecting guide pillar is located in the first waist-shaped groove and connected with the first transverse positioning plate, when the connecting position of the first transverse positioning plate and the air guide plate needs to be adjusted, the fixing adhesive tape is firstly torn, then the relative connecting position of the first connecting guide pillar and the first transverse positioning plate is adjusted, the first transverse positioning plate is bonded on the air guide plate through the fixing adhesive tape, and thus the adjusting of the connecting position of the first connecting guide pillar and the first transverse positioning plate is completed. Specifically, the number of the first connecting guide columns and the first waist-shaped grooves is multiple, the first connecting guide columns and the first waist-shaped grooves are arranged in a one-to-one correspondence mode, each first connecting guide column is located in the corresponding first waist-shaped groove and is in sliding connection with the first transverse positioning plate, and the adjusting accuracy and the adjusting efficiency of the relative position of the first transverse positioning plate and the air guide plate are improved.
To further improve the efficiency of fixing and positioning the plate body, as shown in fig. 4 and 6, a longitudinal positioning plate 54 is further slidably disposed on the air guide plate, so that the connection position between the longitudinal positioning plate and the air guide plate is adjustable. In this embodiment, the air guide plate is provided with the second connecting guide post 57, the longitudinal positioning plate 54 has been provided with a second waist-shaped groove 542, the second connecting guide post is located in the second waist-shaped groove and is connected with the longitudinal positioning plate, when the connecting position of the longitudinal positioning plate and the air guide plate needs to be adjusted, the fixing adhesive tape is torn firstly, then the relative connecting position of the second connecting guide post and the longitudinal positioning plate is adjusted, the longitudinal positioning plate is bonded on the air guide plate through the fixing adhesive tape, and thus the adjustment of the connecting position of the second connecting guide post and the longitudinal positioning plate is completed. Specifically, the number of the second connecting guide pillars and the second waist-shaped grooves is multiple, the second connecting guide pillars and the second waist-shaped grooves are arranged in a one-to-one correspondence mode, each second connecting guide pillar is located in the corresponding second waist-shaped groove and is in sliding connection with the longitudinal positioning plate, and the adjusting accuracy and the adjusting efficiency of the relative position of the longitudinal positioning plate and the air guide plate are improved.
To further improve the efficiency of fixing and positioning the plate body, as shown in fig. 4 and 7, a second positioning plate 56 is slidably disposed on the air guide plate, so that the connection position between the second positioning plate and the air guide plate is adjustable. In this embodiment, the air guide plate 50 is provided with a third connecting guide post 59, the second transverse positioning plate 56 is provided with a third waist-shaped groove 562, the third connecting guide post is located in the third waist-shaped groove and is connected with the second transverse positioning plate, when the connecting position of the second transverse positioning plate and the air guide plate needs to be adjusted, the fixing adhesive tape is firstly torn, then the relative connecting position of the third connecting guide post and the second transverse positioning plate is adjusted, and the second transverse positioning plate is bonded on the air guide plate through the fixing adhesive tape, so that the adjusting of the connecting position of the third connecting guide post and the second transverse positioning plate is completed. Specifically, the number of the third connecting guide pillars and the number of the third waist-shaped grooves are multiple, the third connecting guide pillars and the third waist-shaped grooves are arranged in a one-to-one correspondence manner, and each third connecting guide pillar is located in the corresponding third waist-shaped groove and is in sliding connection with the second transverse positioning plate, so that the adjusting accuracy and the adjusting efficiency of the relative position of the second transverse positioning plate and the air guide plate are improved.
In order to better position the plate, as shown in fig. 4 and 8, further, the stop positioning plate 58 includes a first vertical plate 581 and a second vertical plate 583, the first vertical plate and the second vertical plate are disposed side by side along the same straight line, the first vertical plate is provided with a first chute notch 5812, the second vertical plate is provided with a second chute notch 5832, the first vertical plate is located at the second chute notch, the second vertical plate is located at the first chute notch, so that the first vertical plate and the second vertical plate are slidably connected, and meanwhile, the relative connection position of the first vertical plate and the second vertical plate is adjustable in the side by side direction, so that the stop positioning plate is adjustable in the arrangement direction of the first vertical plate and the second vertical plate. In this embodiment, the edge of the first vertical plate 581 is formed with a guiding protrusion 5815, the second vertical plate 583 is formed with a guiding sliding groove 5835, and the guiding protrusion is located in the guiding sliding groove and slidably connected with the second vertical plate, so that the first vertical plate and the second vertical plate are slidably connected, and the first vertical plate and the second vertical plate are more stable in the relative sliding process. Further, locking waist type groove 5813 has been seted up to first vertical board 581, and locking hole 5833 has been seted up to second vertical board 583, wears to locate locking hole and locking waist type groove respectively through retaining member 70, makes the relative hookup location of first vertical board and second vertical board adjustable, before the regulation, tears the fixed adhesive tape earlier, loosens the retaining member again, adjusts the hookup location of first vertical board and second vertical board again, makes the relative hookup location of first vertical board and second vertical board adjustable.
In one embodiment, before the step of performing the second plugging operation on the plate bodies, and after the step of positioning the plate bodies of the first stacked plate group one by one on the air guide plate, the preparation method further includes: and vacuumizing the plate body positioned on the air guide plate, so that the plate body is better fixed and positioned on the air guide plate, and simultaneously, the resin liquid flows into the plug holes through the screen printing plate better.
In one embodiment, the time for grinding the baked board body is 40-50 s to remove the redundant resin copper layer, so that the qualification rate of plugging the holes in the board body is improved, namely, the one-time qualification rate of the product is improved, and the working efficiency of plugging the holes is improved. In this embodiment, the time for grinding the baked board body is 49s, so that the time for grinding the baked board body is moderate, and the quality of the baked board body is improved.
Further, before the second hole plugging operation is performed on the plate body, the preparation method further comprises the following steps: and collecting and stacking the plate bodies subjected to the second hole plugging operation to obtain a second stacked plate group. In one embodiment, the step of baking the board body for the second plugging operation specifically includes: and the second stacked plate groups are subjected to baking operation simultaneously, so that the average time required for baking a single plate body is reduced, and the pre-baking efficiency of the single plate body is improved. In this embodiment, the steps of collecting and stacking the plate bodies for the second plugging operation specifically include: the plate bodies subjected to the second hole plugging operation are respectively positioned through the positioning piece, so that the plate bodies subjected to the second hole plugging operation in a plurality of preset numbers are positioned better, and the plate bodies subjected to the second hole plugging operation are quickly collected and stacked.
According to the preparation method of the high-density interconnection circuit board, after the apertures of the plurality of plate holes of the plate body are sequentially detected, whether the difference value between the maximum aperture value and the minimum aperture value is larger than or equal to 0.3mm or not is judged, the times of plugging the plate holes of the plate body are selected, then the plate body after plugging operation is baked, and finally the baked plate body is subjected to plate grinding operation, so that the copper reduction amount of the plugging holes of the plate body is reduced, namely the copper consumption of the plugging holes of the plate body is reduced, the problems of secondary plugging and baking grinding after baking and grinding are avoided, and meanwhile, the preparation efficiency and the qualification rate of the plate body are improved. In this embodiment, carry out twice consent to the plate hole of plate body, carry out the first consent to the macropore of the plate hole of plate body promptly earlier, then carry out the operation of drying in advance to the plate body of first consent, then carry out the second consent to the aperture of the plate hole of the plate body after baking in advance, then toast the operation to the plate body of second consent, grind the board operation to the plate body after toasting at last, accomplish the consent operation of high density interconnection circuit board so.
The application also provides a high-density interconnection circuit board which is prepared by adopting the preparation method of the high-density interconnection circuit board in any embodiment. In one embodiment, the method for preparing the high-density interconnection circuit board comprises the following steps: sequentially detecting the apertures of a plurality of plate holes of a plate body to be plugged to obtain a plurality of aperture values; judging whether the difference value between the maximum aperture value and the minimum aperture value is greater than or equal to 0.3mm or not; if not, carrying out primary hole plugging operation on the plate body; otherwise, carrying out secondary hole plugging operation on the plate body; baking the plate body subjected to hole plugging operation; and carrying out plate grinding operation on the baked plate body.
Before plugging the plate body, sequentially detecting the apertures of a plurality of plate holes of the plate body to be plugged to obtain a plurality of aperture values, and judging whether the difference value between the maximum aperture value and the minimum aperture value is greater than or equal to 0.3 mm; if not, namely the aperture deviation of different plate holes is small, carrying out primary hole plugging operation on the plate body; otherwise, the aperture deviation of different plate holes is great promptly, carry out secondary consent operation to the panel body, carry out the consent processing in batches to the aperture of different plate holes promptly, improve the consent quality and the efficiency of a plurality of plate holes, the consent effect that makes a plurality of plate holes is all better, avoid having the aperture stopper not full after the consent because of the plate hole of different aperture values, the too much problem of macropore oil bleeding, the consent quality of circuit board has been improved, avoid toasting the problem of mending the stopper once more after grinding, the face appearance quality who has improved the circuit board is relatively poor, the copper that has reduced the circuit board simultaneously consumes.
Compared with the prior art, the invention has at least the following advantages:
before plugging the plate body, sequentially detecting the apertures of a plurality of plate holes of the plate body to be plugged to obtain a plurality of aperture values, and judging whether the difference value between the maximum aperture value and the minimum aperture value is greater than or equal to 0.3 mm; if not, namely the aperture deviation of different plate holes is small, carrying out primary hole plugging operation on the plate body; otherwise, the aperture deviation of different plate holes is great promptly, carry out secondary consent operation to the panel body, carry out the consent processing in batches to the aperture of different plate holes promptly, improve the consent quality and the efficiency of a plurality of plate holes, the consent effect that makes a plurality of plate holes is all better, avoid having the aperture stopper not full after the consent because of the plate hole of different aperture values, the too much problem of macropore oil bleeding, the consent quality of circuit board has been improved, avoid toasting the problem of mending the stopper once more after grinding, the face appearance quality who has improved the circuit board is relatively poor, the copper that has reduced the circuit board simultaneously consumes.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A method for preparing a high-density interconnection circuit board is characterized by comprising the following steps:
sequentially detecting the apertures of a plurality of plate holes of a plate body to be plugged to obtain a plurality of aperture values;
judging whether the difference value between the maximum aperture value and the minimum aperture value is greater than or equal to 0.3mm or not; if not, carrying out primary hole plugging operation on the plate body; otherwise, carrying out secondary hole plugging operation on the plate body;
baking the plate body subjected to hole plugging operation;
and carrying out plate grinding operation on the baked plate body.
2. The method of claim 1, wherein if the maximum aperture value and the minimum aperture value are greater than or equal to 0.3 mm; the step of carrying out secondary hole plugging operation on the plate body comprises the following steps:
carrying out first hole plugging operation on the plate body;
pre-baking the plate body subjected to the first hole plugging operation;
carrying out secondary hole plugging operation on the plate body;
the step of baking the plate body after the hole plugging operation specifically comprises the following steps: and baking the plate body subjected to the second hole plugging operation.
3. The method for manufacturing a high-density interconnection circuit board according to claim 2, wherein the aperture of the first through hole is smaller than the aperture of the second through hole.
4. The method for preparing a high-density interconnection circuit board according to claim 2, wherein the pre-baking time for the first plugging operation is 12min to 18 min.
5. The method for preparing a high-density interconnection circuit board according to claim 2, wherein the baking time for the board body of the second plugging operation is 90min to 110 min.
6. The method for preparing a high-density interconnection circuit board according to claim 2, wherein before the step of pre-baking the board body for the first plugging operation, the method further comprises:
collecting and stacking the plate bodies subjected to the first hole plugging operation to obtain a first stacked plate group;
the pre-baking step of the plate body subjected to the first hole plugging operation specifically comprises the following steps: simultaneously carrying out pre-baking operation on the first stacked plate group;
before the step of performing the second tap hole operation on the plate body, and after the step of simultaneously performing the pre-baking operation on the first stacked plate group, the preparation method further includes: and placing the plate bodies of the first stacked plate group on an air guide plate one by one for positioning.
7. The method of manufacturing a high-density interconnect circuit board according to claim 6, wherein the number of plate bodies of said first stacked plate group is greater than or equal to 90.
8. The method for manufacturing a high-density interconnection circuit board according to claim 6, wherein before the step of performing the second plugging operation on the board bodies, and after the step of positioning the board bodies of the first stacked plate group one by one on an air guide plate, the method further comprises:
and carrying out vacuum pumping operation on the plate body positioned on the air guide plate.
9. The method for manufacturing a high-density interconnection circuit board according to claim 1, wherein the time for performing the board grinding operation on the baked board body is 40s to 50 s.
10. A high-density interconnect circuit board characterized by being produced by the production method for a high-density interconnect circuit board according to any one of claims 1 to 9.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210682142.5A CN114900972A (en) | 2022-06-16 | 2022-06-16 | High-density interconnection circuit board and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210682142.5A CN114900972A (en) | 2022-06-16 | 2022-06-16 | High-density interconnection circuit board and preparation method thereof |
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| CN114900972A true CN114900972A (en) | 2022-08-12 |
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| CN202210682142.5A Pending CN114900972A (en) | 2022-06-16 | 2022-06-16 | High-density interconnection circuit board and preparation method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115643683A (en) * | 2022-12-23 | 2023-01-24 | 惠州市金百泽电路科技有限公司 | Filling and plating method for special-shaped resin hole and printed circuit board |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204906886U (en) * | 2015-09-22 | 2015-12-23 | 智恩电子(大亚湾)有限公司 | General type aeroscopic plate of silk screen printing consent |
| CN107124826A (en) * | 2017-06-20 | 2017-09-01 | 广州兴森快捷电路科技有限公司 | Improve the method for wiring board welding resistance consent bleed |
| CN109152233A (en) * | 2018-10-19 | 2019-01-04 | 惠州市星之光科技有限公司 | Thousand layer frame of baking for PCB circuit board |
| CN109195339A (en) * | 2018-10-26 | 2019-01-11 | 南通深南电路有限公司 | The filling holes with resin device and method of pcb board |
| CN212486885U (en) * | 2020-06-23 | 2021-02-05 | 东莞市晶美电路技术有限公司 | Multifunctional gas guide plate for PCB (printed circuit board) resistance welding plug hole |
| CN113079648A (en) * | 2021-02-26 | 2021-07-06 | 沪士电子股份有限公司 | Hole plugging method for PCB aluminum separating cover |
| CN113163606A (en) * | 2021-04-25 | 2021-07-23 | 东莞市五株电子科技有限公司 | Resin hole plugging method for double-sided back drilling plate |
| CN213991178U (en) * | 2020-11-09 | 2021-08-17 | 龙南骏亚电子科技有限公司 | Jig for hole plugging base plate of special circuit board |
| CN214315761U (en) * | 2020-12-29 | 2021-09-28 | 宜兴硅谷电子科技有限公司 | Auxiliary jig for resin plug holes with various apertures and large range difference |
| CN214544940U (en) * | 2021-01-27 | 2021-10-29 | 梅州金时裕科技有限公司 | PCB air guide plate |
-
2022
- 2022-06-16 CN CN202210682142.5A patent/CN114900972A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204906886U (en) * | 2015-09-22 | 2015-12-23 | 智恩电子(大亚湾)有限公司 | General type aeroscopic plate of silk screen printing consent |
| CN107124826A (en) * | 2017-06-20 | 2017-09-01 | 广州兴森快捷电路科技有限公司 | Improve the method for wiring board welding resistance consent bleed |
| CN109152233A (en) * | 2018-10-19 | 2019-01-04 | 惠州市星之光科技有限公司 | Thousand layer frame of baking for PCB circuit board |
| CN109195339A (en) * | 2018-10-26 | 2019-01-11 | 南通深南电路有限公司 | The filling holes with resin device and method of pcb board |
| CN212486885U (en) * | 2020-06-23 | 2021-02-05 | 东莞市晶美电路技术有限公司 | Multifunctional gas guide plate for PCB (printed circuit board) resistance welding plug hole |
| CN213991178U (en) * | 2020-11-09 | 2021-08-17 | 龙南骏亚电子科技有限公司 | Jig for hole plugging base plate of special circuit board |
| CN214315761U (en) * | 2020-12-29 | 2021-09-28 | 宜兴硅谷电子科技有限公司 | Auxiliary jig for resin plug holes with various apertures and large range difference |
| CN214544940U (en) * | 2021-01-27 | 2021-10-29 | 梅州金时裕科技有限公司 | PCB air guide plate |
| CN113079648A (en) * | 2021-02-26 | 2021-07-06 | 沪士电子股份有限公司 | Hole plugging method for PCB aluminum separating cover |
| CN113163606A (en) * | 2021-04-25 | 2021-07-23 | 东莞市五株电子科技有限公司 | Resin hole plugging method for double-sided back drilling plate |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115643683A (en) * | 2022-12-23 | 2023-01-24 | 惠州市金百泽电路科技有限公司 | Filling and plating method for special-shaped resin hole and printed circuit board |
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Application publication date: 20220812 |