CN205566810U - Printed circuit board's five bread of golden finger gold structure - Google Patents
Printed circuit board's five bread of golden finger gold structure Download PDFInfo
- Publication number
- CN205566810U CN205566810U CN201620412789.6U CN201620412789U CN205566810U CN 205566810 U CN205566810 U CN 205566810U CN 201620412789 U CN201620412789 U CN 201620412789U CN 205566810 U CN205566810 U CN 205566810U
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- Prior art keywords
- golden finger
- copper foil
- foil layer
- gold
- pad position
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- Manufacturing Of Printed Wiring (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
The utility model discloses a printed circuit board's five bread of golden finger gold structure, which comprises a substrate, be equipped with the copper foil layer on the base plate, the copper foil layer contains golden finger region, gold finger region is equipped with a plurality of golden finger PAD positions, it has nickel dam, gold layer to electroplate in proper order on the copper foil layer of golden finger PAD position, the nickel dam is with the upper surface of copper foil layer and the bare portion cladding of four sides, gold layer is the upper surface of nickel dam and the bare portion cladding of four sides, prevent golden finger pad position in long -term the use, because of the influence of humid tropical environment, golden finger pad position side has the copper ion to take place the oxidation, results in copper ion mobility, and takes place the short circuit with other golden fingers pad position.
Description
Technical field
This utility model relates to printed-board technology field, particularly relates to the golden finger five bread gold structure of a kind of printed circuit board (PCB).
Background technology
At present, along with golden finger is required increasingly stricter by market, traditional golden finger is three bread gold structures.Golden finger pad position is in life-time service, because of the impact of hot and humid environment, side, golden finger pad position has copper ion to aoxidize, causes copper ion migration, and the phenomenon being short-circuited with other golden finger pad position occurs, three the most traditional bread gold golden fingers cannot meet customer demand.
Utility model content
For overcoming the deficiencies in the prior art, the purpose of this utility model is to provide the golden finger five bread gold structure of a kind of printed circuit board (PCB), it is possible to is prevented effectively from golden finger side copper ion and aoxidizes.
This utility model the technical scheme is that for solving its technical problem
A kind of golden finger five bread gold structure of printed circuit board (PCB), including substrate, described substrate is provided with copper foil layer, described copper foil layer contains golden finger area, described golden finger area is provided with multiple golden finger PAD position, being electroplate with nickel dam, layer gold successively on the copper foil layer of described golden finger PAD position, the upper surface of copper foil layer and the exposed part of four sides are coated with by described nickel dam, and the upper surface of nickel dam and the exposed part of four sides are coated with by described layer gold.
Further, described substrate is FR4 epoxy resin board.
Further, described copper foil layer is provided with the lead-in wire connecting rear end, golden finger PAD position.
The beneficial effects of the utility model are: the golden finger five bread gold structure of a kind of printed circuit board (PCB) of the present utility model, golden finger top and four sides are all coated with by nickel dam and layer gold, prevent golden finger pad position in life-time service, impact because of hot and humid environment, side, golden finger pad position has copper ion to aoxidize, cause copper ion migration, and be short-circuited with other golden finger pad position.
Accompanying drawing explanation
Fig. 1 is golden finger cross-sectional view of the present utility model.
Detailed description of the invention
With reference to Fig. 1, the golden finger five bread gold structure of a kind of printed circuit board (PCB) of the present utility model, including substrate 1, described substrate 1 is provided with copper foil layer 2, described copper foil layer 2 is containing golden finger area, described golden finger area is provided with multiple golden finger PAD position, nickel dam 3, layer gold 4 it is electroplate with successively on the copper foil layer 2 of described golden finger PAD position, the upper surface of copper foil layer 2 and the exposed part of four sides are coated with by described nickel dam 3, and the upper surface of nickel dam 3 and the exposed part of four sides are coated with by described layer gold 4.Golden finger of the present utility model uses five bread gold structures, golden finger top and four sides are all coated with by nickel dam 3 and layer gold 4, prevent golden finger pad position in life-time service, impact because of hot and humid environment, side, golden finger pad position has copper ion to aoxidize, cause copper ion migration, and be short-circuited with other golden finger pad position.
Further, described substrate 1 is FR4 epoxy resin board.
Further, described copper foil layer 2 is provided with the lead-in wire connecting rear end, golden finger PAD position, realizes conducting by arranging gage system at circuit board internal layer.
The foregoing is only preferred implementation of the present utility model, as long as realizing within the technical scheme of this utility model purpose broadly falls into protection domain of the present utility model with essentially identical means.
Claims (3)
1. the golden finger five bread gold structure of a printed circuit board (PCB), it is characterized in that: include substrate, described substrate is provided with copper foil layer, described copper foil layer contains golden finger area, described golden finger area is provided with multiple golden finger PAD position, being electroplate with nickel dam, layer gold successively on the copper foil layer of described golden finger PAD position, the upper surface of copper foil layer and the exposed part of four sides are coated with by described nickel dam, and the upper surface of nickel dam and the exposed part of four sides are coated with by described layer gold.
The golden finger five bread gold structure of a kind of printed circuit board (PCB) the most according to claim 1, it is characterised in that: described substrate is FR4 epoxy resin board.
The golden finger five bread gold structure of a kind of printed circuit board (PCB) the most according to claim 1, it is characterised in that: described copper foil layer is provided with the lead-in wire connecting rear end, golden finger PAD position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620412789.6U CN205566810U (en) | 2016-05-06 | 2016-05-06 | Printed circuit board's five bread of golden finger gold structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620412789.6U CN205566810U (en) | 2016-05-06 | 2016-05-06 | Printed circuit board's five bread of golden finger gold structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205566810U true CN205566810U (en) | 2016-09-07 |
Family
ID=56803719
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620412789.6U Active CN205566810U (en) | 2016-05-06 | 2016-05-06 | Printed circuit board's five bread of golden finger gold structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205566810U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109275265A (en) * | 2018-10-26 | 2019-01-25 | 深圳欣强智创电路板有限公司 | The resistance to MFG test golden finger of optical module and the PCB plate production method comprising the golden finger |
| CN109429428A (en) * | 2017-08-29 | 2019-03-05 | 宏启胜精密电子(秦皇岛)有限公司 | Circuit board and preparation method thereof |
| CN109788662A (en) * | 2019-02-26 | 2019-05-21 | 江门崇达电路技术有限公司 | A kind of production method of golden finger circuit board |
-
2016
- 2016-05-06 CN CN201620412789.6U patent/CN205566810U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109429428A (en) * | 2017-08-29 | 2019-03-05 | 宏启胜精密电子(秦皇岛)有限公司 | Circuit board and preparation method thereof |
| CN109429428B (en) * | 2017-08-29 | 2020-12-15 | 宏启胜精密电子(秦皇岛)有限公司 | Circuit board and manufacturing method thereof |
| CN109275265A (en) * | 2018-10-26 | 2019-01-25 | 深圳欣强智创电路板有限公司 | The resistance to MFG test golden finger of optical module and the PCB plate production method comprising the golden finger |
| CN109788662A (en) * | 2019-02-26 | 2019-05-21 | 江门崇达电路技术有限公司 | A kind of production method of golden finger circuit board |
| CN109788662B (en) * | 2019-02-26 | 2021-06-04 | 江门崇达电路技术有限公司 | Manufacturing method of golden finger circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |