CN109429428A - Circuit board and preparation method thereof - Google Patents
Circuit board and preparation method thereof Download PDFInfo
- Publication number
- CN109429428A CN109429428A CN201710757788.4A CN201710757788A CN109429428A CN 109429428 A CN109429428 A CN 109429428A CN 201710757788 A CN201710757788 A CN 201710757788A CN 109429428 A CN109429428 A CN 109429428A
- Authority
- CN
- China
- Prior art keywords
- nosing
- quadrangle
- height
- circuit board
- face
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The present invention relates to a kind of circuit boards, it includes insulating layer, the conductive structure for being formed in the surface of insulating layer, the nickel coating for being formed in the conductive structure upper surface and side and the layer gold for being formed in the nickel coating upper surface and side, the conductive structure includes multiple conductive patterns, the conductive pattern includes the quadrangle of upper bottom length and bottom equal length and the nosing for being located at least in one side of quadrangle, and the height of the nosing is less than or equal to the height of the quadrangle.The present invention also provides the production methods of foregoing circuit plate.
Description
Technical field
The present invention relates to circuit board making field more particularly to a kind of circuit board for preventing etchant gas from corroding and its production
Method.
Background technique
In the forming process of circuit board, copper conductive traces layer is usually also needed to copper conductive traces layer carry out table after being formed
Surface treatment is to prevent the oxidation of the copper conductive traces layer.Most common surface treatment mode first is that in copper conductive traces layer table
Face forms nickel coating and re-forms one layer of Gold plated Layer in nickel plating layer surface.Nickel coating coat the copper conductive traces layer surface and
Side, Gold plated Layer coat the surface and side of the nickel coating, due to being formed in the nickel coating of copper conductive traces layer side
It is to rely on the layers of copper of copper conductive traces layer side and grow, the Gold plated Layer of the nickel coating side is by copper conductive traces layer side
The nickel coating in face and grow, in this way, can exist between the nickel coating and Gold plated Layer and insulating layer of copper conductive traces layer side small
, the sightless gap of naked eyes.When the circuit board works in the environment of moist high temperature, corrosive gas can be by described micro-
Small gap enters, and galvanic effect easily occurs in the junction of the nickel coating and Gold plated Layer and corrodes the nickel coating,
It is eventually leading to the result is that nickel layer is gradually corroded, after cavity occurs in nickel layer nickel layer and copper then occur for layer gold ablation
The galvanic corrosion of conducting wire interlayer, then nickel layer may be eroded completely.
Summary of the invention
Therefore, it is necessary to provide a kind of circuit board and preparation method thereof that can solve above-mentioned technical problem.
A kind of circuit board comprising insulating layer, is formed in the conduction at the conductive structure for being formed in the surface of insulating layer
The nickel coating of structure upper surface and side and the layer gold for being formed in the nickel coating upper surface and side, the conductive structure include
Multiple conductive patterns, which is characterized in that the conductive pattern includes the quadrangle and at least of upper bottom length and bottom equal length
Nosing positioned at one side of quadrangle, the height of the nosing are less than or equal to the height of the quadrangle.
In a preferred embodiment, the cross sectional shape of the nosing is rectangle or square or right-angled trapezium.
In a preferred embodiment, the nosing include the first breasting face for bearing against the quadrangle, be formed in it is described
The second of surface of insulating layer bears against the joint face in face and the first breasting face of connection and the second breasting face, and described first, which bears against face, hangs down
Face directly is born against in described second, the joint face is cambered surface or plane, and the height in first breasting face is less than or equal to
The height of the quadrangle.
In a preferred embodiment, when the cross sectional shape of the nosing is rectangle or square or right-angled trapezium,
The height of the nosing is less than the height of the quadrangle.
In a preferred embodiment, define the conductive structure with a thickness of T, the cross-sectional length d of the nosing and institute
It states and meets relational expression between the thickness T of conductive structure: d≤T/2, and d≤2um.
The invention further relates to a kind of production methods of circuit board.
A kind of production method of circuit board comprising following steps:
A copper-clad base plate is provided, the copper-clad base plate includes insulating layer and the copper foil layer for being formed in the surface of insulating layer；
The copper foil layer is formed as into conductive structure, the conductive structure includes multiple conductive patterns, the conductive pattern
Quadrangle including upper bottom length and bottom equal length and it is located at least in the nosing of one side of quadrangle, the nosing
Height be less than or equal to the quadrangle height；
Nickel layer is formed in the upper surface of the conductive structure and side；And
Layer gold is formed in the nickel coating upper surface and side.
In a preferred embodiment, the conductive structure is formed by etch process.
In a preferred embodiment, the cross sectional shape of the nosing is rectangle or square or right-angled trapezium.
In a preferred embodiment, the nosing include the first breasting face for bearing against the quadrangle, be formed in it is described
The second of surface of insulating layer bears against face and connects the first joint face or plane for bearing against face and the second breasting face, and described first
Breasting face bears against face perpendicular to described second, and the joint face is cambered surface, and the height in first breasting face is less than or equal to
The height of the quadrangle.
In a preferred embodiment, when the cross sectional shape of the nosing is rectangle or square or right-angled trapezium,
The height of the nosing is less than the height of the quadrangle.
In a preferred embodiment, define the conductive structure with a thickness of T, the cross-sectional length d of the nosing and institute
It states and meets relational expression between the thickness T of conductive structure: d≤T/2, and d≤2um
Compared with prior art, circuit board manufacturing method provided by the invention and thus method makes the circuit board to be formed,
The circuit board includes multiple conductive patterns, and at least side of the conductive pattern is formed with nosing, due to the thickness of the nosing
Degree be less than or equal to the conducting wire thickness, and the nickel layer is made to cover the conductive structure, the layer gold is complete
Nickel layer described in all standing is the equal of the gap for reducing nickel layer, layer gold and insulating layer and being formed, in this way, subtracting to a certain extent
The contact area of corrosive gas and the nickel layer and layer gold is lacked, to delay the anti-of the nickel coating and corrosive gas
Between seasonable, prevent the Gold plated Layer to remove from the circuit board to a certain extent and fall off.
Detailed description of the invention
Fig. 1 is the diagrammatic cross-section for the copper-clad base plate that invention first embodiment provides.
Fig. 2 is to form the diagrammatic cross-section of dry film on the surface of copper-clad base plate.
Fig. 3 is to the sectional view after dry film shown in Fig. 2 exposure.
Fig. 4 is to the sectional view after dry film shown in Fig. 3 development.
Fig. 5 is to the sectional view after copper-clad base plate etching.
Fig. 6 is the sectional view of the conductive structure formed after stripping dry film.
Fig. 7 is to form the sectional view of nickel layer on the surface of conductive structure and side.
Fig. 8 is to obtain the sectional view of circuit board after the surface of nickel layer and side form layer gold.
Fig. 9 is the sectional view for the conductive structure that second embodiment provides.
Figure 10 is the sectional view for the conductive structure that 3rd embodiment provides.
Figure 11 is the sectional view for the conductive structure that fourth embodiment provides.
Main element symbol description
Circuit board 100,200,300,400
Copper-clad base plate 10
Insulating layer 12
First copper foil layer 14
Dry film 16
Etch stop layer 160
Conductive pattern 140
Conductive structure 14
Quadrangle 142
Nosing 144,244,344,444
First bears against face 1440
Second bears against face 1442
Joint face 1444
Nickel coating 20
Gold plated Layer 30
The present invention that the following detailed description will be further explained with reference to the above drawings.
Specific embodiment
First embodiment
Below for making single layer board, come illustrate the technical program provide circuit board 100 production method, institute
The production method for stating circuit board 100 includes the following steps:
First step S1, referring to Fig. 1, providing a copper-clad base plate 10, the copper-clad base plate 10 is single side copper-clad base plate.It covers
Copper base 10 can be soft copper-clad base plate, or rigid copper-clad base plate.The copper-clad base plate 10 includes insulating layer
12 and it is formed in the copper foil layer 14 on 12 surface of insulating layer, the thickness of the copper foil layer 14 can be 2um.
In other embodiments, the copper-clad base plate 10 can also be bilayer copper clad substrate.
Second step S2, please refers to Fig. 2~6, and the copper foil layer 14 is formed as conductive structure.The conductive structure 14 includes
Multiple conductive patterns 140, the quadrangle 142 and at least position that the conductive pattern 140 includes upper bottom length and equal length of going to the bottom
Nosing 144 in one side of quadrangle.The height of the nosing 144 is less than or equal to the height of the quadrangle 142
Degree；And define the conductive structure 14 with a thickness of T, the cross-sectional length d of the nosing 144 and the thickness T of the conductive structure
Between meet relational expression: d≤T/2.This is to calculate gained according to etching factor, and the control range of etching factor is 2~4, four
The length of side shape is defined as L, according to the concept of etching factor, our available relational expression T ÷ (2d+L-L)/2≤2
D≤T/2 is released, and d≤2um, the cross-sectional length d of the nosing 144 meet above-mentioned relation just and can guarantee that the nosing can stop
The gap that corrosive gas enters the insulating layer and the nickel coating, Gold plated Layer are formed.
In the present embodiment, referring to Fig. 6, the nosing 144 includes bearing against the first of the quadrangle 142 to bear against face
1440, it is formed in the second breasting face 1442 of the surface of insulating layer and connects the first breasting face 1440 and the second breasting face
1442 joint face 1444, described first, which bears against face 1440, bears against face 1442 perpendicular to described second, and the joint face 1444 is
Cambered surface, the described first height for bearing against face 1440 are equal to the height of the quadrangle 142.
It will be appreciated, of course, that the height in the first breasting face 1440 is also less than the height of the quadrangle 142.
In the present embodiment, include: by the method that the copper foil layer 14 forms conductive structure 140
S21: referring to Fig. 2, forming one layer of dry film 16 (Dry Film) on the surface of the copper foil layer 14.
S22: referring to Fig. 3, being exposed the dry film 16 the dry film is formed etch stop layer 160.
S23: referring to Fig. 4, develop to the dry film 16, the position not being exposed it is developed fall.
S24: referring to Fig. 5, being etched to the copper foil layer 14, it is not etched the copper foil layer 14 of the covering of barrier layer 160
It can be etched, to form conductive structure 140.The thickness of the dry film, the precision of exposure, the time of etching and pressure are controlled,
The conductive pattern can be formed to quadrangle and the nosing positioned at quadrangle side.The nosing can be formed in four side
Two either opposite sides of one of side of shape.
S25: referring to Fig. 6, the etch stop layer 160 is removed, to form conductive structure in the surface of insulating layer
140.The conductive structure 140 can be used as conductive pad or conducting wire or the combination for conductive pad and conducting wire.
Third step S3, referring to Fig. 7, forming nickel coating 20, the plating in the upper surface of the conductive structure 140 and side
The upper surface and side of the conductive structure 140 is completely covered in nickel layer 20.
4th step S4, referring to Fig. 8, Gold plated Layer 30 is formed in the upper surface of the nickel coating 20 and side, it is described gold-plated
The upper surface and side of the nickel coating 20 is completely covered in layer 30.
Referring to Fig. 8, Fig. 8, which is also provided, a kind of makes the circuit board formed by foregoing circuit board manufacturing method.
The circuit board 100 include insulating layer 12, be formed in 12 surface of insulating layer conductive structure 140, be formed in
The plating nickel coating 20 of 140 upper surface of conductive structure and side and the plating for being formed in plating 20 upper surface of nickel coating and side
Layer gold 30.
The conductive structure 14 includes multiple conductive patterns 140, and the conductive pattern 140 includes that upper bottom length and bottom are grown
The nosing 144 spent equal quadrangle 142 and be located at least in one side of quadrangle.The height of the nosing 144 is less than
Or the height equal to the quadrangle 142；And define the conductive structure 14 with a thickness of T, the section of the nosing 144 is long
Meet relational expression between the degree d and thickness T of the conductive structure: d≤T/2, and d≤2um, the cross-sectional length d of the nosing 144
It just can guarantee that the nosing can stop corrosive gas to enter the insulating layer and the nickel coating, gold-plated when meeting above-mentioned relation
The gap that layer is formed.
In the present embodiment, the nosing 144 includes bearing against the first of the quadrangle 142 bear against face 1440, formed
Face 1442 is born against the second of the surface of insulating layer and connection first bears against the connection in face 1440 and the second breasting face 1442
Face 1444, described first, which bears against face 1440, bears against face 1442 perpendicular to described second, and the joint face 1444 is cambered surface, and described the
One height for bearing against face 1440 is equal to the height of the quadrangle 142.
It will be appreciated, of course, that the height in the first breasting face 1440 is also less than the height of the quadrangle 142.
The conductive structure 140 can be used as the combination of weld pad, conducting wire or weld pad and conducting wire.
Second embodiment
Referring to Fig. 9, the basic phase of circuit board 100 that the circuit board 200 that second embodiment provides is provided with first embodiment
Together, the difference is that the cross sectional shape of the nosing 244 of circuit board 200 is rectangle, and the height of the nosing 244
Less than the height of the quadrangle 142.
It is formed it is appreciated that the conductive structure 14 of the circuit board 200 can use etch process twice.
3rd embodiment
Referring to Fig. 10, the basic phase of circuit board 100 that the circuit board 300 that 3rd embodiment provides is provided with first embodiment
Together, the difference is that the cross sectional shape of nosing 344 described in circuit board 300 is trapezoidal, and the height of the nosing 344 is less than
The height of the quadrangle 142.
It is formed it is appreciated that the conductive structure 14 of the circuit board 300 can use etch process twice.
Fourth embodiment
Figure 11 is please referred to, the structure for the circuit board 100 that the circuit board 400 and first embodiment that fourth embodiment provides provide
It is essentially identical, the difference is that the cross sectional shape of the nosing 444 of circuit board 400 is triangle, and the nosing 444
Height be less than the quadrangle height.
It is formed it is appreciated that the conductive structure 14 of the circuit board 400 can use etch process twice.
In conclusion the circuit board includes multiple conductive patterns, at least side of the conductive pattern is formed with nosing,
Due to the thickness of the nosing be less than or equal to the conducting wire thickness, and the nickel layer is made to cover the conduction
The nickel layer is completely covered in structure, the layer gold, is the equal of the gap for reducing nickel layer, layer gold and insulating layer and being formed, in this way,
Reduce the contact area of corrosive gas and the nickel layer and layer gold to a certain extent, thus delayed the nickel coating with
The corrosive gas reaction time prevents the Gold plated Layer to remove from the circuit board to a certain extent and falls off.
It is understood that for those of ordinary skill in the art, can do in accordance with the technical idea of the present invention
Various other changes and modifications out, and all these changes and deformation all should belong to the protection model of the claims in the present invention
It encloses.
Claims (11)
1. a kind of circuit board comprising insulating layer, the conductive structure for being formed in the surface of insulating layer are formed in the conductive knot
The nickel coating of structure upper surface and side and the Gold plated Layer for being formed in the nickel coating upper surface and side, the conductive structure include
Multiple conductive patterns, which is characterized in that the conductive pattern includes the quadrangle and at least of upper bottom length and bottom equal length
Nosing positioned at one side of quadrangle, the height of the nosing are less than or equal to the height of the quadrangle.
2. circuit board as described in claim 1, which is characterized in that the cross sectional shape of the nosing be rectangle or square or
Right-angled trapezium.
3. circuit board as described in claim 1, which is characterized in that the nosing includes bearing against the first of the quadrangle to bear against
The joint face in face, the second breasting face for being formed in the surface of insulating layer and the first breasting face of connection and the second breasting face, institute
The first breasting face is stated perpendicular to the second breasting face, the joint face is cambered surface or plane, and described first bears against the height in face
Degree is less than or equal to the height of the quadrangle.
4. circuit board as claimed in claim 2, which is characterized in that when the cross sectional shape of the nosing is rectangle or square
Or when right-angled trapezium, the height of the nosing is less than the height of the quadrangle.
5. circuit board as described in claim 1, which is characterized in that define the conductive structure with a thickness of T, the nosing
Meet relational expression between cross-sectional length d and the thickness T of the conductive structure: d≤T/2, and d≤2um.
6. a kind of production method of circuit board comprising following steps:
A copper-clad base plate is provided, the copper-clad base plate includes insulating layer and the copper foil layer for being formed in the surface of insulating layer；
The copper foil layer is formed as into conductive structure, the conductive structure includes multiple conductive patterns, and the conductive pattern includes
The quadrangle of upper bottom length and bottom equal length and it is located at least in the nosing of one side of quadrangle, the height of the nosing
Degree is less than or equal to the height of the quadrangle；
Nickel layer is formed in the upper surface of the conductive structure and side；And
Layer gold is formed in the nickel coating upper surface and side.
7. the production method of circuit board as claimed in claim 6, which is characterized in that the conductive structure passes through etch process shape
At.
8. circuit board manufacturing method as claimed in claim 6, which is characterized in that the cross sectional shape of the nosing be rectangle or
Square or right-angled trapezium.
9. circuit board manufacturing method as claimed in claim 6, which is characterized in that the nosing includes bearing against the quadrangle
The company in the first breasting face, the second breasting face for being formed in the surface of insulating layer and the first breasting face of connection and the second breasting face
Junction, described first, which bears against face, bears against face perpendicular to described second, and the joint face is cambered surface or plane, and described first bears against
The height in face is less than or equal to the height of the quadrangle.
10. circuit board manufacturing method as claimed in claim 8, which is characterized in that when the cross sectional shape of the nosing is rectangular
When shape or square or right-angled trapezium, the height of the nosing is less than the height of the quadrangle.
11. circuit board manufacturing method as claimed in claim 8, which is characterized in that and define the conductive structure with a thickness of
T meets relational expression between the cross-sectional length d of the nosing and the thickness T of the conductive structure: d≤T/2, and d≤2um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710757788.4A CN109429428B (en) | 2017-08-29 | 2017-08-29 | Circuit board and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710757788.4A CN109429428B (en) | 2017-08-29 | 2017-08-29 | Circuit board and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109429428A true CN109429428A (en) | 2019-03-05 |
| CN109429428B CN109429428B (en) | 2020-12-15 |
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ID=65503571
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710757788.4A Active CN109429428B (en) | 2017-08-29 | 2017-08-29 | Circuit board and manufacturing method thereof |
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| Country | Link |
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| CN (1) | CN109429428B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101047145A (en) * | 2006-03-30 | 2007-10-03 | 京东方科技集团股份有限公司 | Method for preparing metal wire in active drive TFT matrix |
| CN103050438A (en) * | 2012-12-18 | 2013-04-17 | 深圳深爱半导体股份有限公司 | Etching method of contact hole |
| CN204466039U (en) * | 2015-02-11 | 2015-07-08 | 广东安居宝显示科技有限公司 | Golden finger structure, flexible PCB and liquid crystal display module |
| CN205566810U (en) * | 2016-05-06 | 2016-09-07 | 鹤山市中富兴业电路有限公司 | Printed circuit board's five bread of golden finger gold structure |
| CN106537625A (en) * | 2014-07-17 | 2017-03-22 | 法国圣戈班玻璃厂 | Electrically conductive OLED carrier, OLED incorporating it, and its manufacture |
-
2017
- 2017-08-29 CN CN201710757788.4A patent/CN109429428B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101047145A (en) * | 2006-03-30 | 2007-10-03 | 京东方科技集团股份有限公司 | Method for preparing metal wire in active drive TFT matrix |
| CN103050438A (en) * | 2012-12-18 | 2013-04-17 | 深圳深爱半导体股份有限公司 | Etching method of contact hole |
| CN106537625A (en) * | 2014-07-17 | 2017-03-22 | 法国圣戈班玻璃厂 | Electrically conductive OLED carrier, OLED incorporating it, and its manufacture |
| CN204466039U (en) * | 2015-02-11 | 2015-07-08 | 广东安居宝显示科技有限公司 | Golden finger structure, flexible PCB and liquid crystal display module |
| CN205566810U (en) * | 2016-05-06 | 2016-09-07 | 鹤山市中富兴业电路有限公司 | Printed circuit board's five bread of golden finger gold structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109429428B (en) | 2020-12-15 |
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