CN109429428B - Circuit board and manufacturing method thereof - Google Patents

Circuit board and manufacturing method thereof Download PDF

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Publication number
CN109429428B
CN109429428B CN201710757788.4A CN201710757788A CN109429428B CN 109429428 B CN109429428 B CN 109429428B CN 201710757788 A CN201710757788 A CN 201710757788A CN 109429428 B CN109429428 B CN 109429428B
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China
Prior art keywords
conductive structure
circuit board
bearing surface
height
layer
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CN201710757788.4A
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Chinese (zh)
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CN109429428A (en
Inventor
侯宁
何四红
李彪
黄美华
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Hongqisheng Precision Electronics Qinhuangdao Co Ltd
Avary Holding Shenzhen Co Ltd
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Hongqisheng Precision Electronics Qinhuangdao Co Ltd
Avary Holding Shenzhen Co Ltd
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Priority to CN201710757788.4A priority Critical patent/CN109429428B/en
Publication of CN109429428A publication Critical patent/CN109429428A/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

The invention relates to a circuit board which comprises an insulating layer, a conductive structure formed on the surface of the insulating layer, a nickel plating layer formed on the upper surface and the side surface of the conductive structure and a gold layer formed on the upper surface and the side surface of the nickel plating layer, wherein the conductive structure comprises a plurality of conductive patterns, each conductive pattern comprises a quadrangle with the length of the upper bottom equal to that of the lower bottom and at least one protruding edge positioned on one side surface of the quadrangle, and the height of the protruding edge is less than or equal to that of the quadrangle. The invention also provides a manufacturing method of the circuit board.

Description

Circuit board and manufacturing method thereof
Technical Field
The invention relates to the field of circuit board manufacturing, in particular to a circuit board capable of preventing corrosion of corrosive gas and a manufacturing method thereof.
Background
In the formation process of the circuit board, the copper conductive circuit layer is usually subjected to surface treatment after the formation of the copper conductive circuit layer so as to prevent oxidation of the copper conductive circuit layer. One of the most common surface treatment methods is to form a nickel plating layer on the surface of the copper conductive circuit layer and further form a gold plating layer on the surface of the nickel plating layer. The nickel plating layer coats the surface and the side face of the copper conducting circuit layer, and the gold plating layer coats the surface and the side face of the nickel plating layer. When the circuit board works in a humid and high-temperature environment, corrosive gas enters through the tiny gaps, galvanic cell effect is easy to occur at the joint of the nickel plating layer and the gold plating layer to corrode the nickel plating layer, and finally, the nickel layer is corroded gradually, the gold plating layer falls off and peels off, when the nickel layer is hollow, galvanic cell corrosion between the nickel layer and the copper conducting circuit layer occurs, and the nickel layer is corroded completely.
Disclosure of Invention
Therefore, it is desirable to provide a circuit board and a method for manufacturing the same.
A circuit board comprises an insulating layer, a conductive structure formed on the surface of the insulating layer, nickel-plated layers formed on the upper surface and the side surfaces of the conductive structure and gold layers formed on the upper surface and the side surfaces of the nickel-plated layers, wherein the conductive structure comprises a plurality of conductive patterns.
In a preferred embodiment, the cross-sectional shape of the ledge is rectangular or square or right trapezoid.
In a preferred embodiment, the ledge includes a first bearing surface bearing against the quadrangle, a second bearing surface formed on the surface of the insulating layer, and a connecting surface connecting the first bearing surface and the second bearing surface, the first bearing surface is perpendicular to the second bearing surface, the connecting surface is an arc surface or a plane, and the height of the first bearing surface is less than or equal to the height of the quadrangle.
In a preferred embodiment, when the cross-sectional shape of the ledge is a rectangle, a square or a right trapezoid, the height of the ledge is less than the height of the quadrilateral.
In a preferred embodiment, the thickness of the conductive structure is defined as T, and the cross-sectional length d of the protrusion and the thickness T of the conductive structure satisfy the following relation: d ≧ T/2, and d ≧ 2 um.
The invention also relates to a manufacturing method of the circuit board.
A manufacturing method of a circuit board comprises the following steps:
providing a copper-clad substrate, wherein the copper-clad substrate comprises an insulating layer and a copper foil layer formed on the surface of the insulating layer;
forming the copper foil layer into a conductive structure, wherein the conductive structure comprises a plurality of conductive patterns, each conductive pattern comprises a quadrangle with the length of the upper bottom equal to that of the lower bottom and at least one protruding edge positioned on one side surface of the quadrangle, and the height of each protruding edge is less than or equal to that of the quadrangle;
forming a nickel layer on the upper surface and the side surface of the conductive structure; and
and forming gold layers on the upper surface and the side surfaces of the nickel plating layer.
In a preferred embodiment, the conductive structure is formed by an etching process.
In a preferred embodiment, the cross-sectional shape of the ledge is rectangular or square or right trapezoid.
In a preferred embodiment, the ledge includes a first bearing surface bearing against the quadrangle, a second bearing surface formed on the surface of the insulating layer, and a connecting surface or a plane connecting the first bearing surface and the second bearing surface, the first bearing surface is perpendicular to the second bearing surface, the connecting surface is an arc surface, and the height of the first bearing surface is less than or equal to the height of the quadrangle.
In a preferred embodiment, when the cross-sectional shape of the ledge is a rectangle, a square or a right trapezoid, the height of the ledge is less than the height of the quadrilateral.
In a preferred embodiment, the thickness of the conductive structure is defined as T, and the cross-sectional length d of the protrusion and the thickness T of the conductive structure satisfy the following relation: d ≧ T/2, and d ≧ 2um
Compared with the prior art, the circuit board manufacturing method and the circuit board manufactured by the method provided by the invention have the advantages that the circuit board comprises a plurality of conductive patterns, the protruding edges are formed on at least one side of the conductive patterns, the protruding edges are smaller than or equal to the thickness of the conductive circuit, the nickel layer covers the conductive structures, and the gold layer completely covers the nickel layer, so that gaps formed by the nickel layer, the gold layer and the insulating layer are reduced, and thus the contact area of corrosive gas with the nickel layer and the gold layer is reduced to a certain extent, the reaction time of the nickel plating layer and the corrosive gas is prolonged, and the gold plating layer is prevented from being stripped and falling off from the circuit board to a certain extent.
Drawings
Fig. 1 is a schematic cross-sectional view of a copper-clad substrate according to a first embodiment of the present invention.
Fig. 2 is a schematic cross-sectional view of a dry film formed on the surface of a copper-clad substrate.
Fig. 3 is a cross-sectional view of the dry film shown in fig. 2 after exposure.
Fig. 4 is a cross-sectional view of the dry film shown in fig. 3 after development.
Fig. 5 is a cross-sectional view of the copper-clad substrate after etching.
Fig. 6 is a cross-sectional view of a conductive structure formed after stripping off a dry film.
FIG. 7 is a cross-sectional view of a nickel layer formed on the surface and sides of a conductive structure.
Fig. 8 is a cross-sectional view of the circuit board obtained after forming gold layers on the surface and side surfaces of the nickel layer.
Fig. 9 is a cross-sectional view of a conductive structure provided in a second embodiment.
Fig. 10 is a cross-sectional view of a conductive structure provided in a third embodiment.
Fig. 11 is a cross-sectional view of a conductive structure provided in a fourth embodiment.
Description of the main elements
Circuit boards 100,200,300,400
Copper-clad substrate 10
Insulating layer 12
First copper foil layer 14
Dry film 16
Etch stop layer 160
Conductive pattern 140
Conductive structure 14
Quadrilateral 142
Ledges 144, 244, 344, 444
First bearing surface 1440
Second bearing surface 1442
Connecting surface 1444
Nickel plating layer 20
Gold plating layer 30
The following detailed description will further illustrate the invention in conjunction with the above-described figures.
Detailed Description
First embodiment
The following describes a method for manufacturing the circuit board 100 according to the present technical solution by taking the manufacturing of a single-layer circuit board as an example, where the method for manufacturing the circuit board 100 includes the following steps:
in a first step S1, referring to fig. 1, a copper-clad substrate 10 is provided, where the copper-clad substrate 10 is a single-sided copper-clad substrate. The copper-clad substrate 10 may be a soft copper-clad substrate or a hard copper-clad substrate. The copper-clad substrate 10 includes an insulating layer 12 and a copper foil layer 14 formed on a surface of the insulating layer 12, and the thickness of the copper foil layer 14 may be 2 um.
In other embodiments, the copper-clad substrate 10 may also be a double-layer copper-clad substrate.
In a second step S2, please refer to fig. 2 to 6, the copper foil layer 14 is formed into a conductive structure. The conductive structure 14 includes a plurality of conductive patterns 140, and the conductive patterns 140 include a quadrilateral 142 having an upper base and a lower base equal in length and at least one protruding edge 144 located on one side of the quadrilateral. The height of the ledge 144 is less than or equal to the height of the quadrilateral 142; and the thickness of the conductive structure 14 is defined as T, the cross-sectional length d of the ledge 144 and the thickness T of the conductive structure satisfy the following relation: d ≦ T/2. The control range of the etching factor is calculated according to the etching factor, the control range of the etching factor is 2-4, the length of a quadrilateral is defined as L, according to the concept of the etching factor, a relation T ÷ (2d + L-L)/2 ≧ 2 can be obtained, that is, d ≦ T/2 and d ≧ 2um can be obtained, and the situation that the protrusion edge can prevent corrosive gas from entering a gap formed by the insulating layer, the nickel plating layer and the gold plating layer can be guaranteed only if the cross-sectional length d of the protrusion edge 144 meets the relation.
In this embodiment, referring to fig. 6, the ledge 144 includes a first bearing surface 1440 bearing against the quadrilateral 142, a second bearing surface 1442 formed on the surface of the insulating layer, and a connecting surface 1444 connecting the first bearing surface 1440 and the second bearing surface 1442, the first bearing surface 1440 is perpendicular to the second bearing surface 1442, the connecting surface 1444 is an arc surface, and the height of the first bearing surface 1440 is equal to the height of the quadrilateral 142.
Of course, it is understood that the height of the first bearing surface 1440 may also be less than the height of the quadrilateral 142.
In this embodiment, the method of forming the copper foil layer 14 into the conductive structure 140 includes:
s21: referring to fig. 2, a Dry Film 16(Dry Film) is formed on the surface of the copper foil layer 14.
S22: referring to fig. 3, the dry film 16 is exposed to form an etch stop layer 160.
S23: referring to fig. 4, the dry film 16 is developed, and the unexposed portion is developed.
S24: referring to fig. 5, the copper foil layer 14 is etched, and the copper foil layer 14 not covered by the etching barrier layer 160 is etched, thereby forming the conductive structure 140. The conductive pattern can be formed into a quadrangle and a protruding edge positioned on the side surface of the quadrangle by controlling the thickness of the dry film, the exposure precision, the etching time and the pressure. The protruding edge can be formed on one side surface of the quadrangle or two opposite side surfaces.
S25: referring to fig. 6, the etch stop layer 160 is removed, thereby forming a conductive structure 140 on the surface of the insulating layer. The conductive structure 140 can be a conductive pad, a conductive trace, or a combination thereof.
In a third step S3, referring to fig. 7, a nickel plating layer 20 is formed on the top and side surfaces of the conductive structure 140, and the nickel plating layer 20 completely covers the top and side surfaces of the conductive structure 140.
In a fourth step S4, referring to fig. 8, a gold plating layer 30 is formed on the upper surface and the side surface of the nickel plating layer 20, and the gold plating layer 30 completely covers the upper surface and the side surface of the nickel plating layer 20.
Referring to fig. 8 again, fig. 8 also provides a circuit board manufactured by the above circuit board manufacturing method.
The circuit board 100 includes an insulating layer 12, a conductive structure 140 formed on the surface of the insulating layer 12, a nickel plating layer 20 formed on the upper surface and the side surface of the conductive structure 140, and a gold plating layer 30 formed on the upper surface and the side surface of the nickel plating layer 20.
The conductive structure 14 includes a plurality of conductive patterns 140, and the conductive patterns 140 include a quadrilateral 142 having an upper base and a lower base equal in length and at least one protruding edge 144 located on one side of the quadrilateral. The height of the ledge 144 is less than or equal to the height of the quadrilateral 142; and the thickness of the conductive structure 14 is defined as T, the cross-sectional length d of the ledge 144 and the thickness T of the conductive structure satisfy the following relation: d is not less than T/2 and not less than 2um, and the protruding edge can be ensured to block corrosive gas from entering the gap formed by the insulating layer, the nickel plating layer and the gold plating layer when the cross-sectional length d of the protruding edge 144 meets the relationship.
In this embodiment, the ledge 144 includes a first bearing surface 1440 bearing against the quadrilateral 142, a second bearing surface 1442 formed on the surface of the insulating layer, and a connecting surface 1444 connecting the first bearing surface 1440 and the second bearing surface 1442, the first bearing surface 1440 is perpendicular to the second bearing surface 1442, the connecting surface 1444 is an arc surface, and the height of the first bearing surface 1440 is equal to the height of the quadrilateral 142.
Of course, it is understood that the height of the first bearing surface 1440 may also be less than the height of the quadrilateral 142.
The conductive structures 140 can be used as bonding pads, conductive traces, or a combination of bonding pads and conductive traces.
Second embodiment
Referring to fig. 9, the circuit board 200 of the second embodiment is substantially the same as the circuit board 100 of the first embodiment, except that the cross-sectional shape of the protruding edge 244 of the circuit board 200 is rectangular, and the height of the protruding edge 244 is smaller than the height of the quadrangle 142.
It is understood that the conductive structure 14 of the circuit board 200 may be formed using two etching processes.
Third embodiment
Referring to fig. 10, a circuit board 300 according to the third embodiment is substantially the same as the circuit board 100 according to the first embodiment, except that the cross-sectional shape of the protruding edge 344 of the circuit board 300 is trapezoidal, and the height of the protruding edge 344 is smaller than the height of the quadrangle 142.
It is understood that the conductive structure 14 of the circuit board 300 may be formed by using two etching processes.
Fourth embodiment
Referring to fig. 11, the structure of the circuit board 400 provided by the fourth embodiment is substantially the same as that of the circuit board 100 provided by the first embodiment, except that the cross-sectional shape of the protruding edge 444 of the circuit board 400 is a triangle, and the height of the protruding edge 444 is smaller than that of the quadrangle.
It is understood that the conductive structure 14 of the circuit board 400 may be formed by using two etching processes.
In summary, the circuit board includes a plurality of conductive patterns, at least one side of the conductive patterns is formed with a protruding edge, since the thickness of the protruding edge is less than or equal to the thickness of the conductive circuit, and the nickel layer covers the conductive structure, and the gold layer completely covers the nickel layer, which is equivalent to reducing a gap formed by the nickel layer, the gold layer and the insulating layer, so that the contact area between corrosive gas and the nickel layer and the gold layer is reduced to a certain extent, thereby delaying the reaction time of the nickel plating layer and the corrosive gas, and preventing the gold plating layer from peeling off from the circuit board to a certain extent.
It is understood that various other changes and modifications may be made by those skilled in the art based on the technical idea of the present invention, and all such changes and modifications should fall within the protective scope of the claims of the present invention.

Claims (9)

1. A circuit board comprises an insulating layer, a conductive structure formed on the surface of the insulating layer, nickel-plated layers formed on the upper surface and the side surfaces of the conductive structure and gold-plated layers formed on the upper surface and the side surfaces of the nickel-plated layers, wherein the conductive structure comprises a plurality of conductive patterns, the conductive patterns comprise a quadrangle with the length of the upper bottom equal to that of the lower bottom and at least one protruding edge positioned on one side surface of the quadrangle, the height of the protruding edge is less than or equal to that of the quadrangle, the thickness of the conductive structure is defined as T, and the sectional length d of the protruding edge and the thickness T of the conductive structure meet the relation: d ≧ T/2, and d ≧ 2 um.
2. The circuit board of claim 1, wherein the cross-sectional shape of the ledge is rectangular, square, or right trapezoid.
3. The circuit board of claim 1, wherein the ledge comprises a first bearing surface for bearing against the quadrilateral, a second bearing surface formed on the surface of the insulating layer, and a connecting surface for connecting the first bearing surface and the second bearing surface, the first bearing surface is perpendicular to the second bearing surface, the connecting surface is an arc surface or a plane, and the height of the first bearing surface is less than or equal to the height of the quadrilateral.
4. The circuit board of claim 2, wherein when the cross-sectional shape of the ledge is a rectangle, a square, or a right trapezoid, the height of the ledge is less than the height of the quadrilateral.
5. A manufacturing method of a circuit board comprises the following steps:
providing a copper-clad substrate, wherein the copper-clad substrate comprises an insulating layer and a copper foil layer formed on the surface of the insulating layer;
forming the copper foil layer into a conductive structure, wherein the conductive structure comprises a plurality of conductive patterns, each conductive pattern comprises a quadrangle with the length of the upper bottom equal to that of the lower bottom and at least one protruding edge positioned on one side of the quadrangle, the height of each protruding edge is less than or equal to that of the quadrangle, the thickness of the conductive structure is defined as T, and the sectional length d of each protruding edge and the thickness T of the conductive structure satisfy the following relation: d is ≦ T/2, and d ≧ 2 um;
forming a nickel layer on the upper surface and the side surface of the conductive structure; and
and forming gold layers on the upper surface and the side surfaces of the nickel layer.
6. The method of claim 5, wherein the conductive structure is formed by an etching process.
7. The method for manufacturing a circuit board according to claim 5, wherein the cross-sectional shape of the protruding edge is a rectangle, a square, or a right trapezoid.
8. The method for manufacturing a circuit board according to claim 5, wherein the ledge includes a first bearing surface for bearing against the quadrilateral, a second bearing surface formed on the surface of the insulating layer, and a connecting surface for connecting the first bearing surface and the second bearing surface, the first bearing surface is perpendicular to the second bearing surface, the connecting surface is an arc surface or a plane, and the height of the first bearing surface is less than or equal to the height of the quadrilateral.
9. The method for manufacturing a circuit board according to claim 5, wherein when the cross-sectional shape of the ledge is a rectangle, a square, or a right trapezoid, the height of the ledge is less than the height of the quadrangle.
CN201710757788.4A 2017-08-29 2017-08-29 Circuit board and manufacturing method thereof Active CN109429428B (en)

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CN109429428B true CN109429428B (en) 2020-12-15

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101047145A (en) * 2006-03-30 2007-10-03 京东方科技集团股份有限公司 Method for preparing metal wire in active drive TFT matrix
CN103050438A (en) * 2012-12-18 2013-04-17 深圳深爱半导体股份有限公司 Etching method of contact hole
CN204466039U (en) * 2015-02-11 2015-07-08 广东安居宝显示科技有限公司 Golden finger structure, flexible PCB and liquid crystal display module
CN205566810U (en) * 2016-05-06 2016-09-07 鹤山市中富兴业电路有限公司 Printed circuit board's five bread of golden finger gold structure
CN106537625A (en) * 2014-07-17 2017-03-22 法国圣戈班玻璃厂 Conductive support for an OLED, OLED comprising said support and its manufacture

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101047145A (en) * 2006-03-30 2007-10-03 京东方科技集团股份有限公司 Method for preparing metal wire in active drive TFT matrix
CN103050438A (en) * 2012-12-18 2013-04-17 深圳深爱半导体股份有限公司 Etching method of contact hole
CN106537625A (en) * 2014-07-17 2017-03-22 法国圣戈班玻璃厂 Conductive support for an OLED, OLED comprising said support and its manufacture
CN204466039U (en) * 2015-02-11 2015-07-08 广东安居宝显示科技有限公司 Golden finger structure, flexible PCB and liquid crystal display module
CN205566810U (en) * 2016-05-06 2016-09-07 鹤山市中富兴业电路有限公司 Printed circuit board's five bread of golden finger gold structure

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