CN103228100A - Moisture-proof printed circuit board - Google Patents
Moisture-proof printed circuit board Download PDFInfo
- Publication number
- CN103228100A CN103228100A CN 201310124639 CN201310124639A CN103228100A CN 103228100 A CN103228100 A CN 103228100A CN 201310124639 CN201310124639 CN 201310124639 CN 201310124639 A CN201310124639 A CN 201310124639A CN 103228100 A CN103228100 A CN 103228100A
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- copper coin
- substrate
- circuit board
- printed circuit
- pcb
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Abstract
The invention discloses a moisture-proof printed circuit board which comprises a substrate, a first copper board and a second copper board, wherein the surface layer and the bottom layer of the substrate are covered with organic silicon resin layers; the first copper board is connected above the substrate; the second copper board is connected below the substrate; water leakage grooves are formed on the left and right sides of the first copper board; and water leakage holes are formed at the bottom of the second copper board. With the adoption of the mode, the moisture-proof printed circuit board can ensure good moisture-proof performance of the first copper board and the second copper board; a moisture-proof effect can be exerted very well; and the service life is prolonged.
Description
Technical field
The present invention relates to field of electrical components, particularly relate to a kind of damp-proof printed circuit board (PCB).
Background technology
Printed circuit board (PCB) almost all be unable to do without it at the electronic equipment that we can see, and little electronic watch, calculator, the general-purpose computer of arriving arrives electronic devices and components such as computer communication electronic equipment greatly, and electrical interconnection all will be used printed circuit board (PCB) between them.
Along with the highdensity development trend of printed circuit board (PCB), the production requirement of circuit board is more and more higher.Printed circuit board (PCB) is easy to be subjected to the influence of moisture or smog etc., produces moist phenomenon, thereby circuit board is corroded, and has influenced the useful life of circuit board.
Summary of the invention
The technical problem that the present invention mainly solves provides a kind of damp-proof printed circuit board (PCB), can guarantee first copper coin and the good humidity resistance of second copper coin, can bring into play moistureproof effect well, has prolonged useful life.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: a kind of damp-proof printed circuit board (PCB) is provided, comprise: substrate, first copper coin and second copper coin, the top layer of described substrate and bottom all are covered as silicone resin layer, described first copper coin is connected the top of substrate, described second copper coin is connected the below of substrate, and the left and right sides of described first copper coin offers leak-off chute, and the bottom of described second copper coin is offered and is equipped with leaking hole.
In a preferred embodiment of the present invention, described silicone resin layer covers by electrostatic spraying or spray gun spraying.
In a preferred embodiment of the present invention, described first copper coin laminates with substrate fixedlys connected, and described second copper coin laminates with substrate fixedlys connected.
In a preferred embodiment of the present invention, described leak-off chute is inclined to set, and the angle of inclination of described leak-off chute is 30 degree ~ 48 degree.
In a preferred embodiment of the present invention, described leaking hole is provided with eight, and described eight leaking holes equidistantly are evenly distributed on the edge of both sides, front and back, second copper coin bottom.
The invention has the beneficial effects as follows: damp-proof printed circuit board arrangement of the present invention is simple, can guarantee first copper coin and the good humidity resistance of second copper coin, can bring into play moistureproof effect well, has prolonged useful life.
Description of drawings
Fig. 1 is the structural representation of damp-proof printed circuit board (PCB) one preferred embodiment of the present invention;
The mark of each parts is as follows in the accompanying drawing: 1, substrate, 2, first copper coin, 3, second copper coin, 4, silicone resin layer, 5, leak-off chute, 6, leaking hole.
Embodiment
Below in conjunction with accompanying drawing preferred embodiment of the present invention is described in detail, thereby protection scope of the present invention is made more explicit defining so that advantages and features of the invention can be easier to be it will be appreciated by those skilled in the art that.
See also Fig. 1, the embodiment of the invention comprises:
A kind of damp-proof printed circuit board (PCB) comprises: substrate 1, first copper coin 2 and second copper coin 3, the top layer of described substrate 1 and bottom all are covered as silicone resin layer 4.
Among the present invention, described silicone resin layer 4 covers the top layer and the bottom of substrate 1 by methods such as electrostatic spraying or spray gun sprayings, and it has hydrophobicity performance, can bring into play moistureproof effect well.
Described first copper coin 2 is connected the top of substrate 1, and described second copper coin 3 is connected the below of substrate 1.Particularly, described first copper coin 2 laminates with substrate 1 fixedlys connected, and described second copper coin 3 laminates with substrate 1 fixedlys connected.
The left and right sides of described first copper coin 2 offers leak-off chute 5.Particularly, described leak-off chute 5 is inclined to set, and can be in time the moisture on first copper coin 2 be got rid of, and guarantees the humidity resistance that first copper coin 2 is good.Wherein, the angle of inclination of described leak-off chute 5 is 30 degree ~ 48 degree.
The bottom of described second copper coin 3 is offered and is equipped with leaking hole 6.Particularly, described leaking hole 6 is provided with eight, and described eight leaking holes 6 equidistantly are evenly distributed on the edge of both sides before and after second copper coin, 3 bottoms, can get rid of the moisture on second copper coin 3 in time, guarantees the humidity resistance that second copper coin 3 is good.
The beneficial effect of damp-proof printed circuit board (PCB) of the present invention is:
Can guarantee first copper coin 2 and the good humidity resistance of second copper coin 3, can bring into play moistureproof effect well, prolong useful life.
The above only is embodiments of the invention; be not so limit claim of the present invention; every equivalent structure or equivalent flow process conversion that utilizes specification of the present invention and accompanying drawing content to be done; or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present invention.
Claims (5)
1. damp-proof printed circuit board (PCB), it is characterized in that, comprise: substrate, first copper coin and second copper coin, the top layer of described substrate and bottom all are covered as silicone resin layer, described first copper coin is connected the top of substrate, described second copper coin is connected the below of substrate, and the left and right sides of described first copper coin offers leak-off chute, and the bottom of described second copper coin is offered and is equipped with leaking hole.
2. damp-proof printed circuit board (PCB) according to claim 1 is characterized in that, described silicone resin layer covers by electrostatic spraying or spray gun spraying.
3. damp-proof printed circuit board (PCB) according to claim 1 is characterized in that, described first copper coin laminates with substrate fixedlys connected, and described second copper coin laminates with substrate fixedlys connected.
4. damp-proof printed circuit board (PCB) according to claim 1 is characterized in that described leak-off chute is inclined to set, and the angle of inclination of described leak-off chute is 30 degree ~ 48 degree.
5. damp-proof printed circuit board (PCB) according to claim 1 is characterized in that, described leaking hole is provided with eight, and described eight leaking holes equidistantly are evenly distributed on the edge of both sides, front and back, second copper coin bottom.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201310124639 CN103228100A (en) | 2013-04-11 | 2013-04-11 | Moisture-proof printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201310124639 CN103228100A (en) | 2013-04-11 | 2013-04-11 | Moisture-proof printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103228100A true CN103228100A (en) | 2013-07-31 |
Family
ID=48838298
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201310124639 Pending CN103228100A (en) | 2013-04-11 | 2013-04-11 | Moisture-proof printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103228100A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105015093A (en) * | 2015-06-18 | 2015-11-04 | 镇江华印电路板有限公司 | Good stability carbon film plate |
| CN107079580A (en) * | 2014-11-04 | 2017-08-18 | 三星电子株式会社 | Printed circuit board (PCB) (PCB), PCB components and the washing machine including it |
| CN109135339A (en) * | 2018-08-11 | 2019-01-04 | 辽宁嘉顺化工科技有限公司 | A kind of preparation method and application of moisture-proof modified fused magnesium oxide |
-
2013
- 2013-04-11 CN CN 201310124639 patent/CN103228100A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107079580A (en) * | 2014-11-04 | 2017-08-18 | 三星电子株式会社 | Printed circuit board (PCB) (PCB), PCB components and the washing machine including it |
| CN105015093A (en) * | 2015-06-18 | 2015-11-04 | 镇江华印电路板有限公司 | Good stability carbon film plate |
| CN109135339A (en) * | 2018-08-11 | 2019-01-04 | 辽宁嘉顺化工科技有限公司 | A kind of preparation method and application of moisture-proof modified fused magnesium oxide |
| CN109135339B (en) * | 2018-08-11 | 2020-11-13 | 辽宁嘉顺化工科技有限公司 | Preparation method and application of moisture-proof modified electrical-grade magnesium oxide |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130731 |