CN203327356U - Moisture-proof printed circuit board - Google Patents
Moisture-proof printed circuit board Download PDFInfo
- Publication number
- CN203327356U CN203327356U CN2013201796122U CN201320179612U CN203327356U CN 203327356 U CN203327356 U CN 203327356U CN 2013201796122 U CN2013201796122 U CN 2013201796122U CN 201320179612 U CN201320179612 U CN 201320179612U CN 203327356 U CN203327356 U CN 203327356U
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- CN
- China
- Prior art keywords
- copper coin
- substrate
- circuit board
- printed circuit
- pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The utility model discloses a moisture-proof printed circuit board which comprises a substrate, a first copper board and a second copper board, wherein the surface layer and the bottom layer of the substrate are covered by organic silicon resin layers respectively; the first copper board is connected above the substrate; the second copper board is connected below the substrate; water leakage grooves are formed on the left and right sides of the first copper board; and water leakage holes are formed at the bottom of the second copper board. Through adopting the mode disclosed by the utility model, the moisture-proof printed circuit board can ensure good moisture-proof performance of the first copper board and the second copper board; a moisture-proof effect can be exerted very well; and the service life is prolonged.
Description
Technical field
The utility model relates to field of electrical components, particularly relates to a kind of damp-proof printed circuit board (PCB).
Background technology
The electronic equipment that printed circuit board (PCB) almost can be seen at us all be unable to do without it, and little electronic watch, calculator, the general-purpose computer of arriving, arrive greatly the electronic devices and components such as computer communication electronic equipment, and between them, electrical interconnection all will be used printed circuit board (PCB).
Along with the highdensity development trend of printed circuit board (PCB), the production requirement of circuit board is more and more higher.Printed circuit board (PCB) is easy to be subject to the impact of moisture or smog etc., produces moist phenomenon, thereby circuit board is corroded, and has affected the useful life of circuit board.
The utility model content
The technical problem that the utility model mainly solves is to provide a kind of damp-proof printed circuit board (PCB), can guarantee the first copper coin and the good humidity resistance of the second copper coin, can bring into play well moistureproof effect, has extended useful life.
For solving the problems of the technologies described above, the technical scheme that the utility model adopts is: a kind of damp-proof printed circuit board (PCB) is provided, comprise: substrate, the first copper coin and the second copper coin, the top layer of described substrate and bottom all are covered as silicone resin layer, described the first copper coin is connected to the top of substrate, described the second copper coin is connected to the below of substrate, and the left and right sides of described the first copper coin offers leak-off chute, and the bottom of described the second copper coin is offered and is equipped with leaking hole.
In preferred embodiment of the utility model, described silicone resin layer is covered by electrostatic spraying or spray gun spraying.
In preferred embodiment of the utility model, described the first copper coin laminates and is fixedly connected with substrate, and described the second copper coin laminates and is fixedly connected with substrate.
In preferred embodiment of the utility model, described leak-off chute is inclined to set, and the angle of inclination of described leak-off chute is 30 degree ~ 48 degree.
In preferred embodiment of the utility model, described leaking hole is provided with eight, and described eight leaking holes equidistantly are evenly distributed on the edge of the second both sides, front and back, copper coin bottom.
The beneficial effects of the utility model are: the utility model damp-proof printed circuit board arrangement is simple, can guarantee the first copper coin and the good humidity resistance of the second copper coin, can bring into play well moistureproof effect, has extended useful life.
The accompanying drawing explanation
Fig. 1 is the structural representation of the utility model damp-proof printed circuit board (PCB) one preferred embodiment;
In accompanying drawing, the mark of each parts is as follows: 1, substrate, the 2, first copper coin, the 3, second copper coin, 4, silicone resin layer, 5, leak-off chute, 6, leaking hole.
Embodiment
Below in conjunction with accompanying drawing, preferred embodiment of the present utility model is described in detail, thereby so that advantage of the present utility model and feature can be easier to be it will be appreciated by those skilled in the art that, protection range of the present utility model is made to more explicit defining.
Refer to Fig. 1, the utility model embodiment comprises:
A kind of damp-proof printed circuit board (PCB) comprises: substrate 1, the first copper coin 2 and the second copper coin 3, the top layer of described substrate 1 and bottom all are covered as silicone resin layer 4.
In the utility model, described silicone resin layer 4 covers top layer and the bottom of substrate 1 by methods such as electrostatic spraying or spray gun sprayings, and it has hydrophobicity performance, can bring into play well moistureproof effect.
Described the first copper coin 2 is connected to the top of substrate 1, and described the second copper coin 3 is connected to the below of substrate 1.Particularly, described the first copper coin 2 laminates and is fixedly connected with substrate 1, and described the second copper coin 3 laminates and is fixedly connected with substrate 1.
The left and right sides of described the first copper coin 2 offers leak-off chute 5.Particularly, described leak-off chute 5 is inclined to set, and can get rid of the moisture on the first copper coin 2 in time, guarantees the good humidity resistance of the first copper coin 2.Wherein, the angle of inclination of described leak-off chute 5 is 30 degree ~ 48 degree.
The bottom of described the second copper coin 3 is offered and is equipped with leaking hole 6.Particularly, described leaking hole 6 is provided with eight, and described eight leaking holes 6 equidistantly are evenly distributed on the edge of the second copper coin 3 both sides, front and back, bottoms, can get rid of the moisture on the second copper coin 3 in time, guarantee the good humidity resistance of the second copper coin 3.
The beneficial effect of the utility model damp-proof printed circuit board (PCB) is:
Can guarantee the first copper coin 2 and the good humidity resistance of the second copper coin 3, can bring into play well moistureproof effect, extend useful life.
The foregoing is only embodiment of the present utility model; not thereby limit the scope of the claims of the present utility model; every equivalent structure or conversion of equivalent flow process that utilizes the utility model specification and accompanying drawing content to do; or directly or indirectly be used in other relevant technical fields, all in like manner be included in scope of patent protection of the present utility model.
Claims (5)
1. a damp-proof printed circuit board (PCB), it is characterized in that, comprise: substrate, the first copper coin and the second copper coin, the top layer of described substrate and bottom all are covered as silicone resin layer, described the first copper coin is connected to the top of substrate, described the second copper coin is connected to the below of substrate, and the left and right sides of described the first copper coin offers leak-off chute, and the bottom of described the second copper coin offers leaking hole.
2. according to claim
1Described damp-proof printed circuit board (PCB) is characterized in that described silicone resin layer is covered by electrostatic spraying or spray gun spraying.
3. according to claim
1Described damp-proof printed circuit board (PCB), is characterized in that, described the first copper coin laminates and is fixedly connected with substrate, and described the second copper coin laminates and is fixedly connected with substrate.
4. according to claim
1Described damp-proof printed circuit board (PCB) is characterized in that described leak-off chute is inclined to set, and the angle of inclination of described leak-off chute is 30 degree ~ 48 degree.
5. according to claim
1Described damp-proof printed circuit board (PCB), is characterized in that, described leaking hole is provided with eight, and described eight leaking holes equidistantly are evenly distributed on the edge of the second both sides, front and back, copper coin bottom.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013201796122U CN203327356U (en) | 2013-04-11 | 2013-04-11 | Moisture-proof printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013201796122U CN203327356U (en) | 2013-04-11 | 2013-04-11 | Moisture-proof printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203327356U true CN203327356U (en) | 2013-12-04 |
Family
ID=49666645
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013201796122U Expired - Fee Related CN203327356U (en) | 2013-04-11 | 2013-04-11 | Moisture-proof printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203327356U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107509351A (en) * | 2017-08-12 | 2017-12-22 | 高飞 | A kind of Internet of Things electronic instrument |
| CN107509379A (en) * | 2017-08-12 | 2017-12-22 | 高飞 | A kind of Internet of Things message handler |
-
2013
- 2013-04-11 CN CN2013201796122U patent/CN203327356U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107509351A (en) * | 2017-08-12 | 2017-12-22 | 高飞 | A kind of Internet of Things electronic instrument |
| CN107509379A (en) * | 2017-08-12 | 2017-12-22 | 高飞 | A kind of Internet of Things message handler |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131204 Termination date: 20140411 |