CN107567191A - It is a kind of to improve the process that precision is bored outside mechanical blind hole plate - Google Patents
It is a kind of to improve the process that precision is bored outside mechanical blind hole plate Download PDFInfo
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- CN107567191A CN107567191A CN201710861232.XA CN201710861232A CN107567191A CN 107567191 A CN107567191 A CN 107567191A CN 201710861232 A CN201710861232 A CN 201710861232A CN 107567191 A CN107567191 A CN 107567191A
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Abstract
The invention discloses a kind of process for improving brill precision outside mechanical blind hole plate, comprise the following steps：S1, bore wad cutter：Wad cutter is bored in the edges of boards of production plate；The production plate is the multi-layer sheet after pressing；S2, cut out plate edging：Production plate edges of boards gummosis and copper foil gong are fallen, then carrying out edging processing makes edges of boards neatly smooth；S3, ceramic nog plate：Remove the PP culls and brown layer of production plate plate face；S4, drill point PIN holes：In the edges of boards drill point PIN holes of production plate；S5, outer layer drilling：Drilling operation is carried out using borehole data.The inventive method is by changing technological process, sanction plate edging and outer layer drilling after pressing use two sets of different positioning holes, and it is instant beat, avoid influence of the middle process flow " ceramic nog plate " to the production actual harmomegathus of plate, drilling precision and accuracy are effectively increased, improves drilling quality.
Description
Technical field
The present invention relates to mechanical blind hole plate micro hole machining technical field, and in particular to one kind is improved and bored outside mechanical blind hole plate
The process of precision.
Background technology
If pressing anteposition has mechanical endoporus in the core plate or daughter board of outer layer, we term it mechanical blind hole for this kind of plate
Plate.For most HDI factories, the positioning hole (3 folder PIN holes) of this kind of plate outer layer drilling is typically that plate is cut out after pressing
Just got before edging, because this 3 hole (pressing from both sides PIN holes) positioning can also be used by so cutting out plate edging, equivalent to cutting out plate edging+outer
Layer drilling only need beat one-time positioning hole, idiographic flow be pressing-drill point PIN holes-sanction plate edging-except gummosis-ceramic nog plate-in addition to
Layer drilling.
But the technological process ceramics nog plate of drill point PIN holes and outer layer drilling centre can be to production plate (especially in the above method
Thickness of slab in below 0.69mm) actual harmomegathus coefficient produce significant impact, make the production plate quilt that will carry out outer layer drilling
Elongate.
Drawing coefficient required for outer layer drilling drilling produces according to the metric data of folder PIN hole patterns, above-mentioned technique stream
Plate outer layer drilling fore-clamp PIN holes are produced in journey to be got in advance, and are practiced shooting for spacing, cause outer layer can not be further according to folder before drilling
PIN target patterns measure plank harmomegathus, bring measurement difficult.Due to the technique among " beating folder PIN holes " and " outer layer drilling "
Flow " ceramic nog plate " can produce significant impact to the actual harmomegathus for producing plate, so as to cause drawing coefficient ≠ life of outer brill drilling
The actual harmomegathus coefficient of plate is produced, drilling precision is affected, and the quality of certain outer layer drilling just and then have dropped, and thus will lead
Cause logical blind hole drilling coefficient to mismatch, the quality defects such as internal layer short circuit are caused when serious.
The content of the invention
The present invention makes outer brill precision with cutting out plate edging for the drilling of existing machinery blind hole plate outer layer using same positioning hole
Be affected the problem of causing quality defect, there is provided a kind of to improve the process that precision is bored outside mechanical blind hole plate, this method is led to
Cross change technological process, sanction plate edging after pressing and outer layer drilling use two sets of different positioning holes, and be it is instant beat,
Middle process flow " ceramic nog plate " is avoided to producing the influence of the actual harmomegathus of plate, effectively increases drilling precision and accurate
Property, improve drilling quality.
In order to solve the above-mentioned technical problem, the invention provides a kind of technique side improved and precision is bored outside mechanical blind hole plate
Method, comprise the following steps：
S1, bore wad cutter：Wad cutter is bored in the edges of boards of production plate；The production plate is the multi-layer sheet after pressing.
Preferably, in step S1, outer copper foil, PP pieces, core plate on request successively after lamination, are carried out pressing and forms production
Plate.
Preferably, the core plate has made internal layer circuit before pressing.
Preferably, in step S1, four wad cutters is bored in the edges of boards of production plate, the positioning of plate edging is cut out as later step
Hole.
S2, cut out plate edging：Production plate edges of boards gummosis and copper foil gong are fallen, then carrying out edging processing makes the neat light of edges of boards
It is sliding.
Preferably, step S21 is also included between step S2 and S3, except gummosis：Remove the gummosis on production plate.
S3, ceramic nog plate：Remove the PP culls and brown layer of production plate plate face.
S4, drill point PIN holes：In the edges of boards drill point PIN holes of production plate.
Preferably, in step S4, two folder PIN holes are bored in the edges of boards of production plate, as determining for later step outer layer drilling
Position hole.
Preferably, in step S4, a fool proof hole is bored while the edges of boards for producing plate bore two folder PIN holes.
S5, outer layer drilling：Drilling operation is carried out using borehole data.
Compared with prior art, the present invention has the advantages that：
Plate is produced when cutting out plate edging and outer layer drills using two sets of different positioning holes after being pressed in the present invention, and
Beaten to be instant；The harmomegathus of plank is just to measure the drawing coefficient to drilling is bored out (during drill point PIN holes) before outer layer drilling,
Folder PIN is not destroyed in hole in advance, can avoid centre using the actual harmomegathus that production plate is measured with folder PIN target patterns
Influence of the technological process ceramics nog plate to the production actual harmomegathus of plate, can solve well " outer layer drilling drilling drawing coefficient ≠
The phenomenon of the actual harmomegathus coefficient of production plate ", effectively increases drilling precision and accuracy, improves drilling quality；Use this hair
Bright method can solve to cause logical blind hole drilling coefficient mismatch, internal layer short circuit etc. due to drilling drawing coefficient inaccuracy very well
Situation about scrapping.
Embodiment
In order to more fully understand the technology contents of the present invention, the technical side below in conjunction with specific embodiment to the present invention
Case is described further and illustrated.
Embodiment
A kind of preparation method of wiring board shown in the present embodiment, improved including one kind and bore precision outside mechanical blind hole plate
Process, including following treatment process：
(1), sawing sheet：Core plate is outputed by jigsaw size 320mm × 420mm, and core plate thickness of slab is 0.2mm, the outer layer copper of core plate
Face thickness is 0.5OZ.
(2), brown：Brown processing is carried out to core plate, one layer of brown layer is formed in core plate surface.
(3), drilling blind hole：According to borehole data on core plate drilling blind hole.
(4) brown layer, is moved back：Remove the brown layer on core plate.
(5) internal layer circuit (negative film technique), is made：Inner figure is shifted, and light-sensitive surface, light-sensitive surface are coated with vertical application machine
8 μm of film thickness monitoring, using Full-automatic exposure machine, internal layer circuit and edges of boards target are completed with 5-6 lattice exposure guide rule (21 lattice exposure guide rule)
Hole, the exposure of folder PIN holes；Internal layer is etched, and the core plate after exposure imaging is etched into inner line figure and edges of boards wad cutter figure
With folder PIN hole patterns, it is 3mil that internal layer line width, which measures,；Then check internal layer circuit opens short circuit, circuit breach, circuit pin hole etc.
Defect, defective to scrap processing, flawless product goes out to downstream.
(6), press：Brown speed is according to bottom copper copper thickness brown, by outer copper foil, PP pieces and polylith core plate on request successively
After lamination, pressed according to the characteristic of plate from appropriate lamination, form production plate (i.e. multi-layer sheet).
(7) wad cutter, is bored：Internal layer wad cutter figure, which is corresponded to, in the edges of boards of production plate bores four wad cutters.
(8) plate edging, is cut out：Using four wad cutters as positioning hole, production plate edges of boards gummosis and copper foil gong are fallen, then carried out
Edging processing makes edges of boards neatly smooth.
(9), except gummosis：Remove the gummosis on production plate.
(10), ceramic nog plate：The PP culls and brown layer of production plate plate face, convenient follow-up plating are removed by physical friction
And etching and processing.
(11), drill point PIN holes：Internal layer two folder PIN holes of folder PIN hole patterns brill are corresponded in the edges of boards of production plate and one anti-
Slow-witted hole.
(12), outer layer drills：Using two folder PIN holes and fool proof hole as positioning hole, carry out drilling using borehole data and add
Work.
(13), heavy copper:Making the hole metallization on production plate, backlight tests 10 grades, and the heavy copper thickness in hole is 0.5 μm,
(14), electric plating of whole board:With 1.8ASD current density electric plating of whole board 20min.
(15) outer-layer circuit (positive blade technolgy), is made：Outer graphics shift, luxuriant and rich with fragrance using Full-automatic exposure machine and positive circuit
Woods, outer-layer circuit exposure is completed with 5-7 lattice exposure guide rule (21 lattice exposure guide rule), it is developed, form outer-layer circuit figure on production plate
Shape；Outer graphics are electroplated, then the copper facing and tin plating respectively on production plate, and copper facing is the current density electric plating of whole board with 1.8ASD
60min, tin plating is to electroplate 10min with 1.2ASD current density, 3-5 μm of tin thickness, then moves back film successively again, etches and move back tin,
Then the defects of opening short circuit, circuit breach, circuit pin hole of outer-layer circuit is checked, it is defective to scrap processing, flawless product
Go out to downstream.
(16), welding resistance, silk-screen character：According to prior art and by design requirement solder mask and silk-screen are made on production plate
Character.
(17), it is surface-treated：It is surface-treated according to prior art and by design requirement on production plate.
(18), it is molded：According to prior art and design requirement gong profile is pressed, circuit board finished product is made.
(19), electric performance test：The electric property of wiring board is detected, qualified wiring board is detected and enters next processing
Link；
(20), inspection eventually：The outward appearance of finished product, hole copper thickness, thickness of dielectric layers, green oil thickness, internal layer copper thickness etc. are taken a sample test respectively,
Qualified product can shipment.
The technical scheme provided above the embodiment of the present invention is described in detail, specific case used herein
The principle and embodiment of the embodiment of the present invention are set forth, the explanation of above example is only applicable to help and understands this
The principle of inventive embodiments；Meanwhile for those of ordinary skill in the art, according to the embodiment of the present invention, in specific embodiment party
There will be changes in formula and application, in summary, this specification content should not be construed as limiting the invention.
Claims (7)
1. a kind of improve the process that precision is bored outside mechanical blind hole plate, it is characterised in that comprises the following steps：
S1, bore wad cutter：Wad cutter is bored in the edges of boards of production plate；The production plate is the multi-layer sheet after pressing；
S2, cut out plate edging：Production plate edges of boards gummosis and copper foil gong are fallen, then carrying out edging processing makes edges of boards neatly smooth；
S3, ceramic nog plate：Remove the PP culls and brown layer of production plate plate face；
S4, drill point PIN holes：In the edges of boards drill point PIN holes of production plate；
S5, outer layer drilling：Drilling operation is carried out using borehole data.
2. according to claim 1 improve the process that precision is bored outside mechanical blind hole plate, it is characterised in that step S2 and
Also include step S21 between S3, except gummosis：Remove the gummosis on production plate.
3. according to claim 1 improve the process that precision is bored outside mechanical blind hole plate, it is characterised in that step S1
In, outer copper foil, PP pieces, core plate on request successively after lamination, are carried out pressing and form production plate.
4. according to claim 3 improve the process that precision is bored outside mechanical blind hole plate, it is characterised in that the core plate
Internal layer circuit has been made before pressing.
5. according to claim 1 improve the process that precision is bored outside mechanical blind hole plate, it is characterised in that step S1
In, four wad cutters are bored in the edges of boards of production plate, the positioning hole of plate edging is cut out as later step.
6. according to claim 1 improve the process that precision is bored outside mechanical blind hole plate, it is characterised in that step S4
In, bore two folder PIN holes, the positioning hole as the drilling of later step outer layer in the edges of boards of production plate.
7. according to claim 6 improve the process that precision is bored outside mechanical blind hole plate, it is characterised in that step S4
In, bore a fool proof hole while edges of boards for producing plate bore two folder PIN holes.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710861232.XA CN107567191B (en) | 2017-09-21 | 2017-09-21 | It is a kind of to improve the process that precision is bored outside mechanical blind hole plate |
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| CN201710861232.XA CN107567191B (en) | 2017-09-21 | 2017-09-21 | It is a kind of to improve the process that precision is bored outside mechanical blind hole plate |
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| CN107567191A true CN107567191A (en) | 2018-01-09 |
| CN107567191B CN107567191B (en) | 2019-07-23 |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109788669A (en) * | 2019-03-04 | 2019-05-21 | 深圳市泰科思特精密工业有限公司 | It is a kind of improve pressing after the inclined phenomenon of layer pcb board processing method |
| CN110167268A (en) * | 2019-04-28 | 2019-08-23 | 珠海中京电子电路有限公司 | A kind of drilling switching method of two pin plate |
| CN113015335A (en) * | 2021-02-25 | 2021-06-22 | 奥士康科技股份有限公司 | Method for improving core plate direct-pressure PCB drilling alignment |
| CN113423195A (en) * | 2021-05-28 | 2021-09-21 | 安捷利（番禺）电子实业有限公司 | Preparation method of PCB and prepared PCB |
| CN114745856A (en) * | 2022-04-08 | 2022-07-12 | 南京大量数控科技有限公司 | Through hole drilling method for PCB with high hole thickness-diameter ratio |
| CN117156693A (en) * | 2023-10-30 | 2023-12-01 | 圆周率半导体(南通)有限公司 | Method for reducing deformation of ATE product |
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| CN102917554A (en) * | 2012-10-17 | 2013-02-06 | 无锡江南计算技术研究所 | Manufacturing method of multilayer double-copper conductor plate |
| CN104333979A (en) * | 2014-10-21 | 2015-02-04 | 深圳崇达多层线路板有限公司 | Method of carrying out secondary hole drilling in multi-layer board |
| CN106604551A (en) * | 2016-12-19 | 2017-04-26 | 深圳崇达多层线路板有限公司 | Circuit board production method through automatic pressing and profiling |
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| CN102917554A (en) * | 2012-10-17 | 2013-02-06 | 无锡江南计算技术研究所 | Manufacturing method of multilayer double-copper conductor plate |
| CN104333979A (en) * | 2014-10-21 | 2015-02-04 | 深圳崇达多层线路板有限公司 | Method of carrying out secondary hole drilling in multi-layer board |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109788669A (en) * | 2019-03-04 | 2019-05-21 | 深圳市泰科思特精密工业有限公司 | It is a kind of improve pressing after the inclined phenomenon of layer pcb board processing method |
| CN110167268A (en) * | 2019-04-28 | 2019-08-23 | 珠海中京电子电路有限公司 | A kind of drilling switching method of two pin plate |
| CN110167268B (en) * | 2019-04-28 | 2020-05-05 | 珠海中京电子电路有限公司 | Drilling switching method for two pin plate |
| CN113015335A (en) * | 2021-02-25 | 2021-06-22 | 奥士康科技股份有限公司 | Method for improving core plate direct-pressure PCB drilling alignment |
| CN113423195A (en) * | 2021-05-28 | 2021-09-21 | 安捷利（番禺）电子实业有限公司 | Preparation method of PCB and prepared PCB |
| CN114745856A (en) * | 2022-04-08 | 2022-07-12 | 南京大量数控科技有限公司 | Through hole drilling method for PCB with high hole thickness-diameter ratio |
| CN117156693A (en) * | 2023-10-30 | 2023-12-01 | 圆周率半导体(南通)有限公司 | Method for reducing deformation of ATE product |
| CN117156693B (en) * | 2023-10-30 | 2023-12-29 | 圆周率半导体(南通)有限公司 | Method for reducing deformation of ATE product |
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| CN107567191B (en) | 2019-07-23 |
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