CN113423195A - Preparation method of PCB and prepared PCB - Google Patents
Preparation method of PCB and prepared PCB Download PDFInfo
- Publication number
- CN113423195A CN113423195A CN202110595246.8A CN202110595246A CN113423195A CN 113423195 A CN113423195 A CN 113423195A CN 202110595246 A CN202110595246 A CN 202110595246A CN 113423195 A CN113423195 A CN 113423195A
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- prepreg
- pcb
- hole
- thickness
- copper layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention provides a preparation method of a PCB capable of reducing laser drilling difficulty and the prepared PCB. The preparation method of the PCB provided by the invention comprises the following steps: a pre-drilling hole penetrating through the prepreg is formed in the laser drilling position of the prepreg; laminating the first copper layer, the prepreg provided with the pre-drilled hole and the core board; and after lamination, drilling a blind hole by using a laser, wherein the blind hole penetrates through the pre-drilled holes of the first copper layer and the prepreg and is connected with the core plate, and the pre-drilled hole surrounds the outer side of the blind hole. The preparation method of the PCB reduces the difficulty of laser drilling and improves the processing capacity of laser drilling, thereby freeing the limitation of laser drilling on the type and specification of the prepreg and improving the processing capacity of products.
Description
Technical Field
The invention belongs to the technical field of circuit board preparation, and particularly relates to a preparation method of a PCB and the prepared PCB.
Background
With the rapid development of information technology, in consideration of the accelerated promotion of high-speed transmission technology such as global 5G and the like in a period of time in the future, various types of mixed-compression structure multilayer board designs and applications are presented in the market in order to meet the requirements of high-frequency and high-speed signal transmission and reduce the production cost of terminal equipment. Printed circuit boards are indispensable materials for electronic products, and as consumer electronic products increase in demand, the demand for printed circuit boards also increases.
The conventional laser blind via manufacturing method of a PCB product is shown in fig. 1. And (3) laminating the first copper layer 1a, the prepreg 2a and the core plate 3a, riveting, laminating after riveting, and performing laser drilling to obtain the blind hole 4 a. Insulating medium between the high reliability product circuit layer and the layer requires relatively thickly, PCB course of working's prepreg also can be relatively thick, thick prepreg glass fiber is thick relatively, glass fiber is thick more, laser drilling is difficult to process more, especially to some prepregs that adopt the filler to carry out the reinforcing, laser drilling is difficult to realize more, even the hole shape is not conform to the requirement, so, normal condition, laser drilling requires the prepreg can only design into two kinds of specifications of 106 or 1080, the thickness of prepreg generally requires below 90 microns, laser drilling machining ability has been restricted, thereby product machining ability has been restricted. Making laser drilling of PCBs with thicker insulating media more difficult. For example, high-frequency prepregs are used for high-frequency high-speed products, a part of the high-frequency prepregs are composed of resin and fillers, the fillers are difficult to process by laser drilling, and the problem of poor copper plating of holes caused by unqualified hole shapes often occurs. It is difficult to realize a good high-frequency high-speed PCB.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a preparation method of a PCB capable of reducing the laser drilling difficulty and the prepared PCB.
The invention provides a preparation method of a PCB (printed Circuit Board), which comprises the following steps:
a pre-drilling hole penetrating through the prepreg is formed in the laser drilling position of the prepreg;
laminating the first copper layer, the prepreg provided with the pre-drilled hole and the core board;
and after lamination, drilling a blind hole by using a laser, wherein the blind hole penetrates through the pre-drilled holes of the first copper layer and the prepreg and is connected with the core plate, and the pre-drilled hole surrounds the outer side of the blind hole.
Preferably, the area of the pre-drilled hole surrounding the outer side of the blind hole is completely or partially filled with a first material, the other positions of the prepreg are obtained by using a second material, the first material is a resin material, and the second material comprises a resin material and a reinforcing material.
Preferably, the reinforcing material is glass fiber or filler, the filler comprises one or more of ceramic powder, silica and broken glass fiber, and the resin material is polypropylene.
Preferably, the thickness of the prepreg is greater than 90 microns; or the thickness of the prepreg is greater than 95 microns; or the thickness of the prepreg is more than 100 microns; or the thickness of the prepreg is more than 110 microns.
Preferably, the thickness of the prepreg is 100-500 microns; or the thickness of the prepreg is 100-300 microns; or the thickness of the prepreg is 100-200 microns; or the thickness of the prepreg is 105-500 microns.
Preferably, the ratio of the aperture of the blind hole to the aperture of the pre-drilled hole is 1: (1.1-1.5).
Preferably, before the pre-drill hole is opened, the drill belt tension coefficient of the pre-drill hole is set according to the drill belt tension coefficient of the laser drilling and the expansion and contraction coefficient of the material of the prepreg.
Preferably, before laminating the laminated boards, the method further comprises the step of riveting and fixing the first copper layer, the prepreg provided with the pre-drilled hole and the core board.
Preferably, the core board comprises a second copper layer, an insulating layer and a third copper layer which are sequentially connected, and the second copper layer is connected with the prepreg.
The invention also provides a PCB which is prepared by the preparation method of the PCB.
The preparation method of the PCB reduces the difficulty of laser drilling and improves the processing capacity of laser drilling, thereby freeing the limitation of laser drilling on the type and specification of the prepreg and improving the processing capacity of products.
Drawings
The foregoing and other objects, features and advantages of the invention will be apparent from the following more particular description of preferred embodiments of the invention, as illustrated in the accompanying drawings. Like reference numerals refer to like parts throughout the drawings, and the drawings are not intended to be drawn to scale in actual dimensions, emphasis instead being placed upon illustrating the principles of the invention.
FIG. 1 is a schematic diagram of a laser blind via fabrication process and structure in the prior art;
fig. 2 is a schematic flow structure diagram of a method for manufacturing a PCB according to an embodiment of the present invention;
FIG. 3 is a schematic flow chart of a method for manufacturing a PCB according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a PCB structure according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of a reference ground and blind hole position relationship structure of a PCB board according to an embodiment of the present invention;
fig. 6 is a schematic diagram of a conductive adhesive, a reinforcing plate and a reference ground structure of a PCB according to an embodiment of the present invention.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings.
It will be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element and be integral therewith, or intervening elements may also be present. The terms "mounted," "one end," "the other end," and the like are used herein for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 2 to 6, an embodiment of the invention provides a method for manufacturing a PCB, including the following steps:
a pre-drilling hole 21 penetrating through the prepreg 2 is formed in the laser drilling position of the prepreg 2;
laminating the first copper layer 1, the prepreg 2 provided with the pre-drilled hole 21 and the core plate 3;
and after lamination, drilling a blind hole 4 by using a laser, wherein the blind hole 4 passes through the pre-drilled holes 21 of the first copper layer 1 and the prepreg 2 and is connected with the core plate 3, and the pre-drilled holes 21 surround the outer side of the blind hole 4.
According to the preparation method of the PCB, the pre-drilled holes 21 are formed in the prepreg 2 in advance in a mechanical drilling mode according to the positions of the laser drilled holes, so that the laminated PCB is easy to realize laser drilling, the laser drilling difficulty is reduced, and the laser drilling processing capacity is improved, so that the limitation of laser drilling on the type of the prepreg 2 and the specification of the prepreg 2 is relieved, and the product processing capacity is improved.
According to the preparation method of the PCB provided by the embodiment of the invention, when the preparation of the circuit board needing laser drilling of the blind hole 4 can be widened, the thickness of the prepreg 2 can be free from the specification limit, and the material selection and the thickness selection of the prepreg 2 are greatly widened.
The preparation method of the PCB provided by the invention can be used for preparing high-reliability product circuits.
Referring to fig. 2, in a preferred embodiment, the area of the pre-drilled hole 21 surrounding the blind hole 4 is completely or partially filled with a first material, and the other positions of the prepreg 2 are obtained by a second material, wherein the first material is a resin material, and the second material comprises a resin material and a reinforcing material. The prepreg 2 pre-drilled hole 21 is a through hole, and after high-temperature pressing, the resin material of the prepreg 2 is filled into the pre-drilled hole 21 at high temperature, so that only the resin in the pre-drilled hole 21 has no reinforcing material, and the difficulty of laser drilling is greatly reduced.
In a preferred embodiment, the reinforcing material is glass fibers or fillers and the resin material is polypropylene.
In a further preferred embodiment, the reinforcing material is a filler, and the filler comprises one or more of ceramic powder, silica and broken glass fibers. The dielectric loss of the PCB can be well reduced by filling the filler in the resin material. However, filling with fillers is less prone to laser drilling than filling with glass fibers. The problem can be better solved by the preparation method of the PCB of the embodiment. When the high-temperature press is carried out, only the resin material is filled into the pre-drilled hole 21, so that the difficulty of laser drilling is reduced.
In a preferred embodiment, the thickness of the prepreg 2 is greater than 90 μm; or the thickness of the prepreg 2 is greater than 95 micrometers; or the thickness of the prepreg 2 is more than 100 micrometers; or the thickness of the prepreg 2 is more than 110 μm. In this embodiment, the prepreg 2 is relatively thick, and can better satisfy the electrical performance of high-reliability products, such as some military products, and meanwhile, by matching with the preparation method of the pre-drilled hole 21 in this embodiment, the thicker prepreg 2 product can also ensure better laser drilling capability.
In a preferred embodiment, the thickness of prepreg 2 is 100-500 μm; or the thickness of the prepreg 2 is 100-300 microns; or the thickness of the prepreg 2 is 100-200 microns; or the thickness of the prepreg 2 is 105-500 μm.
In a preferred embodiment, the ratio of the aperture of the blind hole 4 to the aperture of the pre-drilled hole 21 is 1: (1.1-1.5). Can guarantee laser drilling in pre-drilled hole 21, realize better laser drilling effect, can ensure to fill resin material in the pre-drilled hole 21 behind the pressfitting simultaneously, avoid destroying prepreg 2's performance. In this embodiment, the pre-drilled holes 21 are first formed in the prepreg 2 according to the positions of the laser drilled holes, and the pre-drilled holes 21 may shrink due to the high temperature during the pressing process, and may be deviated in position, resulting in the mismatch between the pre-drilled holes and the laser drilled holes. The aperture through pre-drilling 21 is greater than the aperture of blind hole 4 in this embodiment, and assurance that can be better can not mismatch with laser drilling under the condition that the 21 pressfitting of pre-drilling contracts and rises, guarantees that laser drilling realizes reducing the laser drilling degree of difficulty in pre-drilling 21.
In a preferred embodiment, the aperture in the region of the predrilled hole 21 is greater than 0.15 mm; or the aperture of the pre-drilled hole 21 area is larger than 0.20 mm; or the aperture of the pre-drilled hole 21 area is larger than 0.25 mm; or the aperture of the pre-drilled hole 21 area is larger than 0.30 mm; or the hole diameter in the area of the predrilled hole 21 is greater than 0.40 mm. The diameter of the blind hole 4 is generally less than 0.15mm, and the area of the pre-drilled hole 21 is larger than 0.15mm, so that the blind hole 4 can be prepared in the pre-drilled hole 21.
In a preferred embodiment, the aperture in the region of the predrilled hole 21 is 0.2mm to 0.6 mm; or the hole diameter of the pre-drilled hole 21 area is 0.2mm-0.5 mm. The reasonable setting of the size of the pre-drilled hole 21 is guaranteed, the pre-drilled hole 21 can not deviate from the position of the blind hole 4 after shrinkage and expansion, meanwhile, the pre-drilled hole 21 can be filled more with resin materials after pressing, and the performance of the prepreg 2 is guaranteed.
In a preferred embodiment, the drill string stretch coefficient of the pre-drilled hole 21 is set before the pre-drilled hole 21 is opened, depending on the drill string stretch coefficient of the laser drilling and the expansion and contraction coefficient of the material of the prepreg 2. For example, the deviation condition of the pre-drilled hole 21 is judged according to the expansion and contraction coefficient disc of the prepreg 2 material, and then the drill tape tension coefficient of the pre-drilled hole 21 is determined according to the drill tape tension coefficient of the laser drilling, so that the pre-drilled hole 21 after pressing can be well matched with the position of the blind hole 4 to be drilled after expansion and contraction.
In a preferred embodiment, before laminating the boards, a step of riveting and fixing the first copper layer 1, the prepreg 2 with the pre-drilled hole 21 and the core board 3 is further included. The prepreg 2 provided with the pre-drilled hole 21 and the core plate 3 are well fixed by a copper layer.
Referring to fig. 4, in a preferred embodiment, the core board 3 includes a second copper layer 31, an insulating layer 32, and a third copper layer 22 connected in this order, the second copper layer 31 being connected to the prepreg 2.
Referring to fig. 3, a specific flow of the method for manufacturing a PCB provided in this embodiment includes the following steps:
s1: setting the drill belt tension coefficient of the pre-drilled hole 21 according to the drill belt tension coefficient of the laser drilling and the expansion and contraction coefficient of the material of the prepreg 2;
s2: mechanically drilling the prepreg 2 to obtain a pre-drilled hole 21;
s3: carrying out plate stacking, riveting fixing and pressing on the first copper layer 1, the prepreg 2 provided with the pre-drilled hole 21 and the core plate 3;
s4: and performing laser drilling according to the tensile coefficient of the drill belt drilled by the laser to obtain the blind hole 4.
Referring to fig. 4, an embodiment of the present invention further provides a PCB, which is prepared by the method for preparing a PCB according to any of the above embodiments. The PCB board that this embodiment provided includes PCB board main part and sets up blind hole 4 in PCB board main part, and PCB board main part is including the first copper layer 1, prepreg 2 layer and the core 3 of range upon range of setting, and blind hole 4 runs through first copper layer 1 and prepreg 2 layer in proper order, and is connected with core 3, is provided with the pre-drilled hole 21 region on the prepreg 2 layer, and the pre-drilled hole 21 region runs through prepreg 2 layer, and blind hole 4 sets up in the pre-drilled hole 21 region.
Referring to fig. 5, in a preferred embodiment, a reference stratum 5 is further disposed below the blind hole 4, a reference ground hole 51 penetrating the reference stratum 5 is formed in the reference stratum 5, the reference stratum 5 can be disposed at any position below the blind hole 4, and the reference stratum 5 further includes a partition block dividing the ground-examination hole into a plurality of micro-pore areas.
In the PCB in the embodiment, the reference stratum 5 below the guide hole is punched to reduce the distributed capacitance, so that the transmission performance of the transmission line is improved, and the loss of the transmission line on certain specific frequency points is reduced. The impedance continuity in signal transmission can be improved, and the transmission performance is improved. The reference ground holes 51 are entirely made in a grid or hollow shape by dividing the blocks. Can prevent excessive electromagnetic field leakage and even achieve other purposes of improving transmission performance.
The PCB provided by the embodiment can be better applied to high-frequency transmission, and can reduce the capacitance distribution.
Referring to fig. 6, in a preferred embodiment, the PCB further includes a conductive adhesive 8 and a reinforcing plate 9, the conductive adhesive 8 is disposed between the reference ground 5 and the reinforcing plate 9 for connecting the reference ground 5 and the reinforcing plate 9 to form a complete ground, which can prevent the electromagnetic field from radiating. The conductive adhesive 8 surrounds the reference ground hole 51, so that the conductive adhesive 8 and the reinforcing plate 9 form a blocking space 89 below the reference ground hole 51, and the leakage of an electromagnetic field can be better prevented. At the same time, it is ensured that the value of the distributed capacitance of the system is not too large, because the conductive glue 8 and the stiffening plate 9 are at a certain distance from the reference ground hole 51.
In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
In the description herein, reference to the description of the terms "preferred embodiment," "yet another embodiment," "other embodiments," or "specific examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Although embodiments of the present application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present application, and that variations, modifications, substitutions and alterations may be made to the above embodiments by those of ordinary skill in the art within the scope of the present application.
Claims (10)
1. A preparation method of a PCB board is characterized by comprising the following steps:
a pre-drilling hole penetrating through the prepreg is formed in the laser drilling position of the prepreg;
laminating the first copper layer, the prepreg provided with the pre-drilled hole and the core board;
and after lamination, drilling a blind hole by using a laser, wherein the blind hole penetrates through the pre-drilled holes of the first copper layer and the prepreg and is connected with the core plate, and the pre-drilled hole surrounds the outer side of the blind hole.
2. The method for manufacturing the PCB according to claim 1, wherein the area of the pre-drilled hole surrounding the outer side of the blind hole is completely or partially filled with a first material, and the other positions of the prepreg are obtained by a second material, wherein the first material is a resin material, and the second material comprises a resin material and a reinforcing material.
3. The method for manufacturing a PCB board of claim 2, wherein the reinforcing material is glass fiber or filler, the filler comprises one or more of ceramic powder, silica and broken glass fiber, and the resin material is polypropylene.
4. The method of claim 1, wherein the prepreg has a thickness of greater than 90 μm; or the thickness of the prepreg is greater than 95 microns; or the thickness of the prepreg is more than 100 microns; or the thickness of the prepreg is more than 110 microns.
5. The method for preparing a PCB as claimed in claim 1, wherein the thickness of the prepreg is 100-500 μm; or the thickness of the prepreg is 100-300 microns; or the thickness of the prepreg is 100-200 microns; or the thickness of the prepreg is 105-500 microns.
6. The method of claim 1, wherein the ratio of the aperture of the blind hole to the aperture of the pre-drilled hole is 1: (1.1-1.5).
7. The method of manufacturing a PCB of claim 1, wherein the drill string tension coefficient of the pre-drilled hole is set according to the drill string tension coefficient of the laser drilling and the expansion and contraction coefficient of the material of the prepreg before the pre-drilled hole is opened.
8. The method for manufacturing a PCB of claim 1, further comprising a step of riveting and fixing the first copper layer, the prepreg having the pre-drilled hole, and the core board before laminating the stacked boards.
9. The method of claim 1, wherein the core board comprises a second copper layer, an insulating layer and a third copper layer which are connected in sequence, and the second copper layer is connected with the prepreg.
10. A PCB board prepared by the method of any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110595246.8A CN113423195B (en) | 2021-05-28 | 2021-05-28 | Preparation method of PCB and prepared PCB |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110595246.8A CN113423195B (en) | 2021-05-28 | 2021-05-28 | Preparation method of PCB and prepared PCB |
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| CN113423195A true CN113423195A (en) | 2021-09-21 |
| CN113423195B CN113423195B (en) | 2023-03-14 |
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| CN107911937A (en) * | 2017-11-10 | 2018-04-13 | 生益电子股份有限公司 | The production method and PCB of a kind of PCB |
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2021
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| JPH0697651A (en) * | 1992-09-10 | 1994-04-08 | Hitachi Chem Co Ltd | Production of wiring board |
| JPH09153683A (en) * | 1995-12-01 | 1997-06-10 | Nippon Avionics Co Ltd | Method for manufacturing multilayered printed wiring board |
| JP2003347743A (en) * | 2002-05-28 | 2003-12-05 | Matsushita Electric Works Ltd | Prepreg, multilayer printed circuit board and method for its manufacture |
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| Publication number | Publication date |
|---|---|
| CN113423195B (en) | 2023-03-14 |
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