CN112654175A - Method for manufacturing solder resist PCB in blind groove by uncovering method - Google Patents
Method for manufacturing solder resist PCB in blind groove by uncovering method Download PDFInfo
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- CN112654175A CN112654175A CN202011261713.5A CN202011261713A CN112654175A CN 112654175 A CN112654175 A CN 112654175A CN 202011261713 A CN202011261713 A CN 202011261713A CN 112654175 A CN112654175 A CN 112654175A
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- adhesive tape
- solder resist
- pcb
- inner layer
- blind
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a method for manufacturing a solder resist PCB in a blind slot by an uncovering method, which comprises the following steps: making inner layer patterns, silk-screen solder resist, exposure, development, baking, blackening/browning, pasting a high-temperature adhesive tape, removing the adhesive tape by laser, laminating, blindly fishing out and uncovering, removing the adhesive and making the inner layer patterns by the next procedure. The blind groove is completely manufactured when being welded on the inner layer plate, and the solder resist is always kept in the plate in the subsequent manufacturing process by utilizing the high-temperature adhesive tape for blocking glue and combining the cover opening method, so that the corrosion of various solutions in the processing process is avoided, and the solder resist in the blind groove can be effectively protected; the prepreg does not carry out windowing treatment, but covers the plate in a whole way, can generate a reshaping effect, fills the gaps of the patterns in the blind groove and plays a complete glue blocking effect.
Description
Technical Field
The invention belongs to the technical field of circuit boards, and particularly relates to a method for manufacturing a solder resist PCB in a blind slot by an uncovering method.
Background
In recent years, PCBs are continuously miniaturized and multifunctional, and specifically, in terms of product structures, structures such as various blind holes, buried holes, blind grooves and the like appear. Wherein, the course of working of blind groove structure is especially complicated, mainly embodies: lamination alignment precision, blind groove glue resistance, poor glue layering of a notch and the like among the inner layers. In addition, a chip is often installed in the blind slot, the welding point of the chip is often a BGA structure, and solder resistance blocking is needed among BGA balls to prevent short circuit during welding.
The traditional manufacturing method is that when the inner layer is manufactured, solder masks are printed in a silk screen mode at the position of a blind groove and exposed and developed. And windowing the prepreg at the position of the blind groove, pre-stacking, placing the gasket in the blind groove, laminating, and removing the gasket after laminating to obtain the required PCB. This conventional fabrication method has significant drawbacks. Because the gasket can not completely fill the gaps between the patterns in the blind grooves, the pressure at the positions is small, the prepreg is in a flowing state at a high temperature during lamination, and the prepreg flows into the blind grooves due to the existence of pressure difference, so that residual glue is left in the blind grooves after lamination. Meanwhile, because the gasket is generally higher than the upper interlayer plate, when laminating, if the thickness of the gasket is too high, the conditions that the resistance welding in the blind groove is subjected to extra pressure, the resistance welding drops, the resistance welding at the line part is damaged and the like are easily caused. Therefore, according to the traditional manufacturing method, the following problems are easy to occur: A. the inside incomplete glue that appears in the blind groove easily, B, the blind notch glue poor layering appears, C, too high gasket will lead to easily hindering and weld and break or defect, D, because the prepreg has carried out the windowing operation, then can appear the glue poor phenomenon that stratifies in the notch position, directly lead to the panel to scrap.
Disclosure of Invention
The invention aims to provide a method for manufacturing a solder resist PCB in a blind groove by an uncovering method, solves the problem of stubborn diseases in the traditional method by adjusting a laminating mode, using a high-temperature adhesive tape to resist glue, improving a solder resist screen printing method and the like, and provides a reliable PCB processing method for solder resist in the blind groove.
The purpose of the invention can be realized by the following technical scheme:
a method for manufacturing a solder resist PCB in a blind slot by an uncovering method comprises the following steps:
s1, making patterns on the inner-layer plate to obtain the inner-layer plate with a specific pattern;
s2, carrying out whole-board screen printing solder mask on the inner-layer board;
s3, exposure, development and baking;
s4, performing blackening or browning treatment on the inner layer board containing the solder resist and other inner layer boards;
s5, pasting a plurality of layers of high-temperature adhesive tapes;
s6, cutting the adhesive tape by laser to remove the unnecessary adhesive tape part on the board surface;
s7, sequentially stacking the inner plates and the prepregs according to the laminated structure;
s8, after laminating, carrying out depth control blind fishing, and milling off part of the plate at the windowing position;
and S9, after the blind fishing with depth control, the plate is manufactured in the next procedure.
Preferably, in step S2, the pre-treatment method of the solder resist is super-roughening, and the thickness of the solder resist after the post-baking treatment is 20um or more.
Preferably, in step S5, the high temperature adhesive tape is a low viscosity adhesive tape capable of maintaining chemical stability and physical stability for at least 4 hours at a temperature of at least 250 ℃ and a pressure of 300 Bar.
Preferably, in step S5, the high temperature adhesive tape is a PI adhesive tape, the thickness of the adhesive tape is 0.04mm, and 2-4 layers of the adhesive tape are applied at the position of the window.
Preferably, in step S6, after the high temperature adhesive tape is cut by the laser, the size of the residual adhesive tape of the high temperature adhesive tape is 0.1-0.2 mm smaller than the single side of the window size.
Preferably, in step S7, the stacking sequence of the plates is as follows from bottom to top: lower inner layer board-high temperature adhesive tape-prepreg-upper inner layer board.
Preferably, in step S7, in step S7, when the number of layers of tape is 2, the prepreg is not windowed, and when the number of layers of tape is 3 to 4, the prepreg away from the solder resist is windowed, and a rivet hole or four grooves are drilled in the prepreg for positioning in lamination.
The invention has the beneficial effects that:
1. the blind groove is completely welded on the inner layer plate in an internal resistance manner, and the high-temperature adhesive tape is utilized to resist glue and combine with the cover opening method in the subsequent manufacturing process, so that the resistance welding is always kept in the plate, the corrosion of various solutions and the abrasion under the mechanical force condition in the processing process are avoided, and the resistance welding in the blind groove can be effectively protected;
2. the cover opening method can avoid the problems caused by the traditional gasket glue blocking method, if the thickness of the gasket is thicker or the thickness of the pre-stacked plates is lower, the thickness of the gasket is larger than that of the plates, the notch glue flow is easy to be insufficient, the notch glue is poor if the thickness of the gasket is light, the lamination risk exists if the thickness of the gasket is lower or the thickness of the pre-stacked plates is higher, the thickness of the gasket is lower than that of the plates, the insufficient glue blocking occurs, a large amount of colloidal substances remained in a blind groove cannot be removed, and the cover opening method is utilized, namely, the high-temperature adhesive tape is pasted at the position of an inner layer opening window to protect the solder mask, and the thickness uniformity of the high-temperature adhesive tape is good, so that the problems caused by the poor uniformity of the thickness of the gasket in the;
3. for the condition of pasting 2 layers of high-temperature adhesive tapes, the prepreg does not carry out windowing treatment, but covers the plate in a whole way, and because the prepreg completely covers the high-temperature adhesive tapes, the prepreg has certain fluidity at high temperature and high pressure during pressing, can generate a complex effect and fill the gaps of the patterns in the blind grooves, thereby achieving the complete glue blocking effect; and in the case of applying 3-4 layers of high-temperature adhesive tapes, windowing is carried out on the prepreg far away from the welding-resistant surface, so that the overall thickness of the adhesive tape is about 0.1mm, and delamination caused by over-thickness of the adhesive tape is prevented. In contrast, with the conventional pad method, since the pad cannot fill the gap between the patterns in the blind groove, the glue of the prepreg can still flow into the blind groove from the gap between the patterns, resulting in residual glue in the blind groove.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
A method for manufacturing a solder resist PCB in a blind slot by an uncovering method specifically comprises the following steps:
s1, making an inner layer pattern, specifically, obtaining a required inner layer plate through pretreatment, exposure, development and etching, wherein the inner layer plate is divided into an inner layer core plate and a windowing inner layer plate, the inner layer core plate is the inner layer plate needing screen printing solder resistance in advance, the inner layer core plate can be single-side solder resistance or double-side solder resistance, the windowing inner layer plate is formed by milling the corresponding position of a blind groove of the inner layer plate and laminating the blind groove with the inner layer core plate to form a blind groove structure, and the windowing inner layer plate can be laminated on the inner layer core plate, can also be laminated below the inner layer core plate, and can also be laminated on two sides of the inner layer core plate;
s2, performing silk-screen solder mask on the inner core board, and determining single-sided silk-screen solder mask or double-sided silk-screen solder mask according to a required structure, wherein the pre-treatment of the solder mask uses super-coarsening to increase the bonding force between the solder mask and a copper surface, the thickness of the silk-screen solder mask needs to be controlled to be more than 20 mu m, the pre-baking condition is determined according to the characteristics of a solder mask material, and the pre-baking condition used here is baking for 30 minutes at 75 ℃;
and S3, after the pre-baking is finished, exposing and developing the solder resist, and then baking the solder resist. Wherein the exposure amount needs to reach 12 grids (21 grids of exposure ruler), the postbaking parameters are determined according to the characteristics of the solder resist material, and the postbaking condition used in the postbaking process is baking for 1 hour at 150 ℃;
s4, carrying out blackening or browning treatment on the inner core plate and the windowed inner layer plate;
and S5, sticking 3-4 layers of high-temperature adhesive tapes to the inner core plate, compacting each layer of adhesive tape by using a film pressing machine, and continuously sticking the next layer. The high-temperature adhesive tape used here is a PI adhesive tape which does not fall off, the thickness of the PI adhesive tape is 0.04mm, and the thickness of the PI adhesive tape does not change obviously after lamination;
s6, milling the appearance corresponding to the blind groove through laser milling, and tearing off the residual adhesive tape, wherein the appearance milled by the laser is 0.1-0.2 mm smaller than the single side of the appearance size of the blind groove, and the allowance is used for preventing the adhesive tape from being embedded into the groove opening due to the contraposition deviation or the sliding plate during lamination, so that the adhesive tape cannot be completely removed;
s7, riveting the plates according to the laminated structure, wherein the laminated sequence is from bottom to top: inner core board-high temperature sticky tape-prepreg-upper strata plywood, if two-sided blind groove structure, then the stromatolite order is from up time to time down in proper order: the method comprises the following steps of (1) carrying out lower-layer inner-layer board-prepreg-high-temperature adhesive tape-inner-layer core board-high-temperature adhesive tape-prepreg-upper-layer board, wherein, in the case of pasting 2 layers of high-temperature adhesive tapes, the prepreg does not carry out windowing treatment but wholly covers the high-temperature adhesive tapes, in the case of pasting 3-4 layers of high-temperature adhesive tapes, windowing treatment is carried out on the prepreg far away from one side of the high-temperature adhesive tapes, the windowing position is consistent with resistance welding, and the windowing size is determined according to the flow characteristic of the prepreg (in general, the windowing size of the prepreg is 0.1-0.15mm larger than that of the resistance welding windowing window), and then entering;
and S8, after lamination, carrying out depth control blind fishing on the position needing to be windowed, and after the depth control blind fishing is finished, making the plate enter the next procedure for manufacturing.
The foregoing is merely exemplary and illustrative of the present invention and various modifications, additions and substitutions may be made by those skilled in the art to the specific embodiments described without departing from the scope of the invention as defined in the following claims.
Claims (8)
1. A method for manufacturing a solder resist PCB in a blind slot by an uncovering method is characterized by comprising the following steps:
s1, making patterns on the inner-layer plate to obtain the inner-layer plate with a specific pattern;
s2, carrying out whole-board screen printing solder mask on the inner-layer board;
s3, exposure, development and baking;
s4, performing blackening or browning treatment on the inner layer board containing the solder resist and other inner layer boards;
s5, pasting a plurality of layers of high-temperature adhesive tapes;
s6, cutting the adhesive tape by laser to remove the unnecessary adhesive tape part on the board surface;
s7, sequentially stacking the inner plates and the prepregs according to the laminated structure;
s8, after laminating, carrying out depth control blind fishing, and milling off part of the plate at the windowing position;
and S9, after the blind fishing with depth control, the plate is manufactured in the next procedure.
2. The method for manufacturing the solder resist PCB in the blind via by the uncapping method according to the claim 1, wherein in the step S2, the pre-processing mode of the solder resist is super-roughening, and the thickness of the solder resist after post-baking is more than 20 um.
3. The method for fabricating a blind via solder resist PCB according to claim 1, wherein the high temperature adhesive tape is a low viscosity adhesive tape capable of maintaining chemical and physical stability for at least 4 hours at a temperature of at least 250 ℃ and a pressure of 300Bar in step S5.
4. The method for manufacturing the solder resist PCB in the blind via by the uncapping method according to the claim 3, wherein in the step S5, the high temperature adhesive tape is PI adhesive tape, the thickness of the adhesive tape is 0.04mm, and 2-4 layers of the adhesive tape are applied at the position of the window.
5. The method for manufacturing the solder resist PCB in the blind via by the uncapping method according to the claim 1, wherein in the step S6, after the high temperature adhesive tape is cut by the laser, the size of the residual adhesive tape of the high temperature adhesive tape is 0.1-0.2 mm smaller than the single side of the window size.
6. The method for manufacturing the solder resist PCB in the blind via by the uncapping method according to the claim 1, wherein in the step S7, if the structure is a single-sided blind via structure, the sequence of the lamination of the plates is as follows from bottom to top: lower inner layer board-high temperature adhesive tape-prepreg-upper inner layer board.
7. The method for manufacturing the solder resist PCB in the blind via by the uncapping method according to the claim 1, wherein in the step S7, if the structure is a double-sided blind via structure, the sequence of the lamination of the plates is as follows from bottom to top: the lower inner layer plate, the prepreg, the high-temperature adhesive tape, the inner core plate, the high-temperature adhesive tape, the prepreg and the upper inner layer plate.
8. The method for manufacturing the solder resist PCB in the blind via by the uncapping method according to claim 1, wherein in step S7, when the number of the layers of the adhesive tape is 2, the prepreg is not windowed, when the number of the layers of the adhesive tape is 3-4, the prepreg far away from the solder resist is windowed, and a rivet hole is drilled or four slots are drilled on the prepreg for lamination positioning.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011261713.5A CN112654175A (en) | 2020-11-12 | 2020-11-12 | Method for manufacturing solder resist PCB in blind groove by uncovering method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011261713.5A CN112654175A (en) | 2020-11-12 | 2020-11-12 | Method for manufacturing solder resist PCB in blind groove by uncovering method |
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| Publication Number | Publication Date |
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| CN112654175A true CN112654175A (en) | 2021-04-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202011261713.5A Pending CN112654175A (en) | 2020-11-12 | 2020-11-12 | Method for manufacturing solder resist PCB in blind groove by uncovering method |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102548258A (en) * | 2011-12-28 | 2012-07-04 | 东莞生益电子有限公司 | Production method of stepped groove circuit board with through hole, soldermask and circuit graphics at groove bottom |
| CN103153000A (en) * | 2013-02-01 | 2013-06-12 | 东莞生益电子有限公司 | Manufacture method for gold finger circuit board and circuit board manufactured by method |
| CN104486911A (en) * | 2014-10-31 | 2015-04-01 | 镇江华印电路板有限公司 | Manufacturing technology for flex-rigid joint board having welding disc or golden finger at inner layer |
| CN107592735A (en) * | 2017-08-22 | 2018-01-16 | 深圳崇达多层线路板有限公司 | Thick desired ladder board manufacturing method more than a kind of high accuracy |
| CN107683031A (en) * | 2017-11-07 | 2018-02-09 | 珠海杰赛科技有限公司 | A kind of processing method for solving rigid-flex combined board outer-layer circuit and making film |
| CN108055787A (en) * | 2017-12-05 | 2018-05-18 | 深圳崇达多层线路板有限公司 | A kind of solder-resisting manufacturing methods of stepped plate |
-
2020
- 2020-11-12 CN CN202011261713.5A patent/CN112654175A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102548258A (en) * | 2011-12-28 | 2012-07-04 | 东莞生益电子有限公司 | Production method of stepped groove circuit board with through hole, soldermask and circuit graphics at groove bottom |
| CN103153000A (en) * | 2013-02-01 | 2013-06-12 | 东莞生益电子有限公司 | Manufacture method for gold finger circuit board and circuit board manufactured by method |
| CN104486911A (en) * | 2014-10-31 | 2015-04-01 | 镇江华印电路板有限公司 | Manufacturing technology for flex-rigid joint board having welding disc or golden finger at inner layer |
| CN107592735A (en) * | 2017-08-22 | 2018-01-16 | 深圳崇达多层线路板有限公司 | Thick desired ladder board manufacturing method more than a kind of high accuracy |
| CN107683031A (en) * | 2017-11-07 | 2018-02-09 | 珠海杰赛科技有限公司 | A kind of processing method for solving rigid-flex combined board outer-layer circuit and making film |
| CN108055787A (en) * | 2017-12-05 | 2018-05-18 | 深圳崇达多层线路板有限公司 | A kind of solder-resisting manufacturing methods of stepped plate |
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Application publication date: 20210413 |