CN110785025A - PCB manufacturing method and PCB - Google Patents
PCB manufacturing method and PCB Download PDFInfo
- Publication number
- CN110785025A CN110785025A CN201911087679.1A CN201911087679A CN110785025A CN 110785025 A CN110785025 A CN 110785025A CN 201911087679 A CN201911087679 A CN 201911087679A CN 110785025 A CN110785025 A CN 110785025A
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- China
- Prior art keywords
- groove
- hole
- pcb
- stepped groove
- stepped
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a PCB manufacturing method and a PCB, and relates to the manufacturing technology of printed circuit boards. The manufacturing method comprises the following steps: forming a conducting through hole on the daughter board corresponding to the position to be provided with the stepped groove, and metallizing the conducting through hole; overlapping the daughter board with the prepreg and other daughter boards, and pressing into a mother board; a step groove is formed in the motherboard, and the groove depth of the step groove is greater than the distance from the board surface of the motherboard to the hole opening of the via hole; and arranging a conductive material at the bottom of the stepped groove to conduct the bottom of the groove with the via hole. According to the invention, the through hole is formed at the bottom of the stepped groove, so that the component can be conducted with the inner layer circuit pattern of any layer when being attached to the bottom of the stepped groove; the depth of the notch of the stepped groove is basically required to be capable of exposing the via hole, and the actual depth of the stepped groove can be flexibly adjusted by changing the thickness of the conductive material at the bottom of the groove according to the thickness of the component; the bottom of the stepped groove does not need to be manufactured with complex circuit patterns, and the manufacturing process can be simplified.
Description
Technical Field
The invention relates to a manufacturing technology of a printed circuit board, in particular to a manufacturing method of a PCB and the PCB.
Background
With the development of electronic product technology, the surface mounting and miniaturization trends of components are more and more obvious, and in order to meet the high-density mounting or crimping requirements of printed circuit boards, stepped grooves are designed on multilayer printed circuit boards, and the components are mounted in the grooves to reduce the assembly volume. The traditional step groove is generally processed by embedding a glue-blocking material or controlling a depth milling mode: when the glue-blocking material is embedded for processing, the bottom of the stepped groove can only be a designated inner layer, for example, an inner layer which is required to be conducted by a component, the depth range of the stepped groove is limited, the thickness and the size of the component which is attached to the stepped groove at a client side can be directly limited, and the problem of glue-blocking material residue at the bottom of the groove is solved; when the depth control milling mode is adopted for processing, the manufacturing process of the groove bottom graph is very complex, and especially when the groove bottom graph is communicated with the inner layer graph and the groove wall is not metalized, the designed product structure can be manufactured through multiple procedures.
Disclosure of Invention
The invention aims to provide a PCB manufacturing method and a PCB, which can lead the bottom of a stepped groove to be conducted to any inner layer circuit pattern and have less limitation on the depth of the stepped groove.
In order to achieve the purpose, the invention adopts the following technical scheme:
in one aspect, the present invention provides a method for manufacturing a PCB, including:
forming a conducting through hole on the daughter board corresponding to the position to be provided with the stepped groove, and metallizing the conducting through hole;
overlapping the daughter board with a prepreg and other daughter boards, and pressing into a mother board;
a step groove is formed in the motherboard, and the groove depth of the step groove is greater than the distance from the board surface of the motherboard to the hole opening of the via hole;
and arranging a conductive material at the bottom of the stepped groove to enable the bottom of the stepped groove to be communicated with the via hole.
Wherein, set up conducting material at the tank bottom of ladder groove, make the tank bottom with the via hole switches on, include:
carrying out metallization treatment on the bottom of the stepped groove;
or, covering conductive adhesive on all or part of the groove bottom of the stepped groove to enable the conductive adhesive to cover the hole opening of the via hole.
Wherein, be in the tank bottom of ladder groove covers the conducting resin, include:
spraying conductive adhesive on the bottom of the stepped groove;
the thickness of the conductive adhesive is equal to the difference between the depth of the notch of the stepped groove and the required depth.
Wherein, be in the tank bottom of ladder groove covers the conducting resin, include:
adhering a conductive adhesive to the bottom of the stepped groove;
wherein the conductive paste is cut into a pad shape.
Further, after metallizing the via, the method further includes:
and plugging the via hole.
Further, cover conducting resin at the whole or partial tank bottom of ladder groove, make conducting resin cover behind the drill way of conducting hole, still include:
and carrying out surface treatment on the part of the groove bottom coated with the conductive adhesive.
In another aspect, the present invention also provides a PCB, including:
a via hole is formed in the bottom of the stepped groove formed in the PCB;
and the groove bottom is provided with a conductive material which is conducted with the inner layer circuit pattern of the PCB through the conducting hole.
Wherein the conductive material is a metal layer electroplated on the bottom of the tank; or the conductive material is conductive adhesive pasted on the groove bottom, and the conductive adhesive at least covers the hole opening of the via hole.
The thickness of the conductive adhesive is equal to the difference between the depth of the notch of the stepped groove and the required depth.
The invention has the beneficial effects that:
according to the invention, the through hole is formed at the bottom of the stepped groove, so that the component can be conducted with the inner layer circuit pattern of any layer when being attached to the bottom of the stepped groove; the depth of the notch of the stepped groove is basically required to be capable of exposing the via hole, and the actual depth of the stepped groove can be flexibly adjusted by changing the thickness of the conductive material at the bottom of the groove according to the thickness of the component; the bottom of the stepped groove does not need to be manufactured with complex circuit patterns, and the manufacturing process can be simplified.
Drawings
Fig. 1 is a flowchart of a method for manufacturing a PCB according to an embodiment of the present invention;
FIG. 2 is a schematic diagram illustrating steps of a method for fabricating a PCB according to a first embodiment of the present invention;
FIG. 3 is a cross-sectional view of a PCB provided in accordance with an embodiment of the present invention;
FIG. 4 is a top view of the bottom of the stepped slot in the second embodiment of the present invention;
FIG. 5 is a cross-sectional view of a PCB provided by a second embodiment of the invention;
fig. 6 is a schematic step diagram of a method for manufacturing a PCB according to a second embodiment of the present invention.
In the figure: 1-a daughter board; 2-via holes; 3-step groove; 4-conductive adhesive; 5-metal layer.
Detailed Description
In order to make the technical problems solved, technical solutions adopted and technical effects achieved by the present invention clearer, the technical solutions of the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments.
Example one
The embodiment provides a manufacturing method of a PCB, which is suitable for a PCB product with a mounted or pressed component in a stepped groove.
Fig. 1 is a flowchart of a method for manufacturing a PCB according to an embodiment of the present invention. As shown in fig. 1, the manufacturing method includes the following steps:
and S11, forming a through hole on the daughter board corresponding to the position to be provided with the step groove, and metalizing the through hole.
The daughter board comprises a single or a plurality of core boards, and circuit patterns are manufactured on the core boards according to needs. As shown in fig. 2, the sub-board 1 is provided with holes, which may be blind holes or through holes, corresponding to positions where the stepped grooves are to be formed, and the through holes 2 are formed by performing hole metallization after drilling the holes, which are generally dense. The depth of the opening needs to ensure that the component is arranged in the stepped groove and can be conducted to the target inner layer pattern.
And plugging the via hole 2, wherein the plugging material can be insulating materials such as resin, ink and the like.
And S12, overlapping the daughter board with a prepreg and other daughter boards, and pressing into a mother board.
After pressing, the via hole 2 on the daughter board 1 is located in the inner layer of the motherboard.
S13, a step groove is formed in the motherboard, and the groove depth of the step groove is larger than the distance from the board surface of the motherboard to the hole opening of the via hole.
Milling out the ladder groove 3 through controlling the depth at the position of waiting to set up the ladder groove, the tank bottom need expose the conducting hole 2 of making in step S11, consequently, the fluting depth of ladder groove 3 is greater than the face of mother board arrives the distance in the drill way of conducting hole 2.
And S14, arranging a conductive material at the groove bottom of the stepped groove to enable the groove bottom to be communicated with the via hole.
Specifically, it is right step groove 3 electroplates, obtains the metallic step groove, and if necessary, gets rid of the metal level of cell wall, perhaps only carries out metallization to the cell bottom, makes the cell bottom with conducting hole 2 switches on, and behind the installation components and parts, components and parts accessible this metal level 5 and conducting hole switch on target inlayer figure.
According to the steps, a PCB can be obtained, as shown in FIG. 3, a via hole 2 is arranged at the bottom of a stepped groove 3 formed on the PCB; the groove bottom is provided with a conductive material, and the conductive material is conducted with the inner layer circuit pattern of the PCB through the conducting hole 2. Wherein the conductive material is a metal layer 5 electroplated on the bottom of the tank.
In the embodiment, the through hole is formed at the bottom of the stepped groove, and the bottom of the stepped groove is metallized, so that the component can be conducted with the inner layer circuit pattern of any layer when being attached to the bottom of the stepped groove, and the depth of the stepped groove does not need to be set to a target inner layer; and the groove bottom of the stepped groove does not need to be manufactured with complex circuit patterns, so that the manufacturing process can be simplified.
Example two
In this embodiment, on the basis of one step S11-S13, the conductive material and the attaching method thereof in step S14 are changed, as shown in fig. 6, step S14 specifically includes:
and covering the whole or part of the groove bottom of the stepped groove 3 with conductive adhesive 4 to enable the conductive adhesive 4 to cover the hole opening of the via hole 2.
When the bottom of the stepped groove is completely covered with the conductive adhesive, spraying the conductive adhesive on the bottom of the stepped groove by adopting spraying equipment; the thickness of the conductive adhesive is equal to the difference between the depth of the notch of the stepped groove and the required depth. The required depth is the groove depth required by the design of a PCB product so as to meet the installation of components, and the groove depth is greater than the required depth.
Alternatively, as shown in fig. 4, the conductive adhesive 4 is cut into a pad shape (optionally, a single pad shape or a continuous pad shape), and is adhered to the bottom of the stepped groove 3. It should be noted that the conductive adhesive 4 may be cut into a desired shape and then adhered to the opening of the via hole 2; alternatively, after the whole conductive adhesive 4 is adhered to the bottom of the groove, the conductive adhesive 4 may be cut by laser and the non-pad portion may be removed, or the non-pad portion of the conductive adhesive 4 may be ablated by laser.
And performing surface treatment on the part of the groove bottom covered with the conductive adhesive 4, namely performing surface treatment such as gold immersion on the conductive adhesive 4 in the shape of the welding pad to obtain a reliable welding pad.
Correspondingly, a PCB can be obtained by the method, as shown in FIG. 5, a via hole 2 is arranged at the bottom of a stepped groove 3 formed on the PCB; the groove bottom is provided with a conductive material, and the conductive material is conducted with the inner layer circuit pattern of the PCB through the conducting hole 2. The conductive material is a conductive adhesive 4 attached to the bottom of the groove, and the conductive adhesive 4 at least covers the hole opening of the via hole 2. The thickness of the conductive adhesive 4 is equal to the difference between the groove depth of the stepped groove 3 and the required depth.
In the embodiment, the through hole is formed at the bottom of the stepped groove, and the conductive adhesive is adhered to the bottom of the stepped groove, so that the component can be conducted with the inner layer circuit pattern of any layer when being adhered to the bottom of the stepped groove; the depth of the notch of the stepped groove is basically required to be capable of exposing the via hole, and the actual depth of the stepped groove can be flexibly adjusted by changing the thickness of the conductive material at the bottom of the groove according to the thickness of the component; the bottom of the stepped groove does not need to be manufactured with complex circuit patterns, and the manufacturing process can be simplified.
The technical principle of the present invention is described above in connection with specific embodiments. The description is made for the purpose of illustrating the principles of the invention and should not be construed in any way as limiting the scope of the invention. Based on the explanations herein, those skilled in the art will be able to conceive of other embodiments of the present invention without inventive effort, which would fall within the scope of the present invention.
Claims (10)
1. A method for manufacturing a PCB is characterized by comprising the following steps:
forming a conducting through hole on the daughter board corresponding to the position to be provided with the stepped groove, and metallizing the conducting through hole;
overlapping the daughter board with a prepreg and other daughter boards, and pressing into a mother board;
a step groove is formed in the motherboard, and the groove depth of the step groove is greater than the distance from the board surface of the motherboard to the hole opening of the via hole;
and arranging a conductive material at the bottom of the stepped groove to enable the bottom of the stepped groove to be communicated with the via hole.
2. The manufacturing method according to claim 1, wherein providing a conductive material on a groove bottom of the stepped groove to make the groove bottom conductive with the via hole comprises:
carrying out metallization treatment on the bottom of the stepped groove;
or, covering conductive adhesive on all or part of the groove bottom of the stepped groove to enable the conductive adhesive to cover the hole opening of the via hole.
3. The method of claim 2, wherein coating the bottom of the stepped trench with a conductive paste comprises:
spraying conductive adhesive on the bottom of the stepped groove;
the thickness of the conductive adhesive is equal to the difference between the depth of the notch of the stepped groove and the required depth.
4. The method of claim 2, wherein coating the bottom of the stepped trench with a conductive paste comprises:
adhering a conductive adhesive to the bottom of the stepped groove;
wherein the conductive paste is cut into a pad shape.
5. The method of claim 1, further comprising, after metallizing the via:
and plugging the via hole.
6. The manufacturing method of claim 1, wherein after the step groove is completely or partially covered with a conductive adhesive so that the conductive adhesive covers the hole of the via hole, the method further comprises:
and carrying out surface treatment on the part of the groove bottom coated with the conductive adhesive.
7. A PCB, characterized by:
a via hole is formed in the bottom of the stepped groove formed in the PCB;
and the groove bottom is provided with a conductive material which is conducted with the inner layer circuit pattern of the PCB through the conducting hole.
8. The PCB of claim 7, wherein:
the conductive material is a metal layer electroplated on the bottom of the tank.
9. The PCB of claim 7, wherein:
the conductive material is conductive adhesive pasted on the groove bottom, and the conductive adhesive at least covers the hole opening of the via hole.
10. The PCB of claim 9, wherein:
the thickness of the conductive adhesive is equal to the difference between the depth of the notch of the stepped groove and the required depth.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911087679.1A CN110785025A (en) | 2019-11-08 | 2019-11-08 | PCB manufacturing method and PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911087679.1A CN110785025A (en) | 2019-11-08 | 2019-11-08 | PCB manufacturing method and PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110785025A true CN110785025A (en) | 2020-02-11 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911087679.1A Pending CN110785025A (en) | 2019-11-08 | 2019-11-08 | PCB manufacturing method and PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110785025A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004342641A (en) * | 2003-05-13 | 2004-12-02 | Nec Toppan Circuit Solutions Inc | Printed circuit board with built-in capacitor |
| CN1750737A (en) * | 2004-09-18 | 2006-03-22 | 三星电机株式会社 | Printed circuit board having chip package mounted theron and method of fabricating same |
| JP2009266992A (en) * | 2008-04-24 | 2009-11-12 | Kyocera Corp | Multiple pattern wiring substrate, wiring substrate, and electronic equipment |
| CN101662888A (en) * | 2009-09-28 | 2010-03-03 | 深南电路有限公司 | Preparation method for PCB plate with step trough |
| CN102300397A (en) * | 2011-06-30 | 2011-12-28 | 深南电路有限公司 | Metal matrix circuit board and manufacturing method thereof |
| CN102438413A (en) * | 2011-10-17 | 2012-05-02 | 广州杰赛科技股份有限公司 | Second-order ladder groove bottom graphical printed board and processing method thereof |
| CN102469689A (en) * | 2010-11-15 | 2012-05-23 | 深南电路有限公司 | Manufacturing process for PCB (Printed Circuit Board) step board |
-
2019
- 2019-11-08 CN CN201911087679.1A patent/CN110785025A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004342641A (en) * | 2003-05-13 | 2004-12-02 | Nec Toppan Circuit Solutions Inc | Printed circuit board with built-in capacitor |
| CN1750737A (en) * | 2004-09-18 | 2006-03-22 | 三星电机株式会社 | Printed circuit board having chip package mounted theron and method of fabricating same |
| JP2009266992A (en) * | 2008-04-24 | 2009-11-12 | Kyocera Corp | Multiple pattern wiring substrate, wiring substrate, and electronic equipment |
| CN101662888A (en) * | 2009-09-28 | 2010-03-03 | 深南电路有限公司 | Preparation method for PCB plate with step trough |
| CN102469689A (en) * | 2010-11-15 | 2012-05-23 | 深南电路有限公司 | Manufacturing process for PCB (Printed Circuit Board) step board |
| CN102300397A (en) * | 2011-06-30 | 2011-12-28 | 深南电路有限公司 | Metal matrix circuit board and manufacturing method thereof |
| CN102438413A (en) * | 2011-10-17 | 2012-05-02 | 广州杰赛科技股份有限公司 | Second-order ladder groove bottom graphical printed board and processing method thereof |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200211 |
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| RJ01 | Rejection of invention patent application after publication |