TWM541187U - Combination structure of heat radiator - Google Patents

Description

Radiator combination structure

The present invention relates to a heat sink assembly structure, and more particularly to a heat sink assembly structure which is convenient to disassemble and can be stably fastened and reduced in manufacturing cost.

With the rapid development of the electronic information industry, the processing power of electronic components such as central processing units continues to increase, and when electronic components operate, heat energy is generated. When the thermal energy of electronic components is too high, it will affect its processing efficiency and longevity. Therefore, the industry will The heat conduction element that absorbs heat and dissipates heat of the electronic component is used for heat conduction and heat dissipation, and the heat conduction element is usually a heat sink such as a heat sink or a heat conduction plate, but the heat dissipation device cannot be directly fixed to the electronic component. It needs to be fixed by screw lock, and the component screw of the screw lock must be passed through the tool for disassembly or assembly. If there is no tool at hand, it is not convenient to disassemble or assemble, so the industry will also use the buckle. The heat sink is fixed to the circuit board. The invention discloses a heat sink fastening device, which includes a first fastener, a second fastener and a handle. The first fastener has a lower pressure. a resilient arm, the elastic arm is bent to extend at one end to form a first buckle, and the other end has a receiving surface; A fastener having a fastener disposed at the first end of the receiving surface. The handle is connected to the second fastening member, and is provided at one end thereof with an eccentric wheel pressing against the receiving surface, the eccentric wheel is formed with a bump near the free end thereof, and the convex point is rotated by the second fastening member when the eccentric wheel rotates One side slides to the opposite side and is engaged with one side edge of the second fastener, and the eccentricity When the wheel rotates, a flange is formed on the edge of the contact surface to effectively fix the heat sink and the circuit board, but the buckle is relatively inconvenient in disassembly and assembly, and the manufacturing cost is relatively increased.

Therefore, how to improve the above-mentioned missing problems is the technical difficulty point that the creators of this case want to solve.

Therefore, in order to effectively solve the above problems, the main purpose of the present invention is to provide a heat sink combination structure which is convenient to disassemble and can be stably buckled and reduced in manufacturing cost.

In order to achieve the above object, the present invention provides a heat sink assembly structure, comprising: a heat sink and a buckle, wherein the heat sink has a bottom portion, and a plurality of heat dissipation fins extend vertically at the bottom surface position, and the bottom side The side of the groove has a base, and the side of the base has a side extending vertically, and a groove is formed on the side of the base. The heat sink and a circuit board are disposed, and the side edge is formed with at least one crotch portion at a position relative to the groove, and the side edge is extended with a plurality of fins spaced apart from each other at a position opposite to the other end of the base. An inclined portion is disposed on each of the fins, and an edge of the inclined portion is oppositely disposed with respect to the protruding portion, and the circuit board is oppositely disposed between the bottom portion and the base, and a bottom surface of the circuit board is oppositely disposed on the bottom portion So that the bottom of the heat sink can be attached to the at least one heat-generating electronic component on the top surface of the circuit board and fixed between the inclined portion and the flange portion, thereby the heat sink With the board When placed in the recess, the circuit board is disposed on the crotch portion, and the electronic component on the side of the circuit board is attached to the bottom of the heat sink, and the extension portion of the heat sink is obliquely The card is set up to achieve the convenience of disassembly and assembly, and can be stably buckled and reduced in production cost.

1‧‧‧ radiator combination structure

2‧‧‧heatsink

21‧‧‧ bottom

22‧‧‧ Heat sink fins

23‧‧‧ Exhibition Department

231‧‧‧Inlay

3‧‧‧ buckle

31‧‧‧Base

32‧‧‧ side

321‧‧‧檐

322‧‧‧ side slot

33‧‧‧Flap

331‧‧‧ oblique

332‧‧‧Slots

333‧‧‧Guidance Department

34‧‧‧ Groove

4‧‧‧ boards

41‧‧‧Fever electronic components

42‧‧‧Heat-conducting parts

Figure 1 is a schematic perspective view of a preferred embodiment of the present invention.

Figure 2 is a perspective exploded view of the preferred embodiment of the present invention.

Figure 3 is a schematic cross-sectional view of a preferred embodiment of the present invention.

Figure 4 is a schematic perspective view of another preferred embodiment of the present invention.

Figure 5 is a perspective exploded view of another preferred embodiment of the present invention.

Figure 6 is a schematic cross-sectional view showing another preferred embodiment of the present invention.

Figure 7 is a perspective view of a further preferred embodiment of the present invention.

Figure 8 is a perspective exploded view of still another preferred embodiment of the present invention.

Figure 9 is a schematic cross-sectional view showing a further preferred embodiment of the present invention.

Figure 10 is a schematic diagram of the implementation of the preferred embodiment of the present invention.

Figure 11 is a schematic view of further implementation of the preferred embodiment of the present invention.

Please refer to FIG. 1 to FIG. 3 , which are schematic diagrams of a three-dimensional combination and a schematic exploded view and a schematic cross-sectional view of a preferred embodiment of the present invention. As can be clearly seen from the figure, the heat sink assembly structure 1 is mainly The heat sink 2 has a bottom portion 21, and a plurality of heat dissipation fins 22 extend perpendicularly from the surface of the bottom portion 21, and at least one portion of the bottom portion 21 extends horizontally outward. 23, the clip 3 has a base 31. The base 31 has a side edge 32 extending perpendicularly at two sides, and a recess 34 is formed on the base 31 between the side edges 32, and the side is formed. 32 is formed with at least one crotch portion 321 extending toward the groove 34, and the side edge 32 is at the base A plurality of fins 33 are formed at the other end position, and the fins 33 are spaced apart from each other, and at least one inclined portion 331 extends from the fins 33, and the inclined portion 331 is directed to the groove 34. Extending, the flap 33 is formed with a slot 332 at the position of the inclined portion 331, and the inclined portion 331 integrally extends the position of the flap 33 relative to the side 32 of the slot 332, and the flap The other end of the side edge 32 is curvedly extended to have a guiding portion 333, and the edge of the two side guiding portions 333 defines a width larger than the width of the groove 34, and the heat sink 2 and a circuit board 4 When the recess 34 is disposed, the width between the two side portions 23 and the width of the circuit board 4 are the same as the width of the recess 34, and the circuit board 4 and the bottom portion 21 of the heat sink 2 are The guiding portion 333 can be conveniently inserted into the recess 34. When the circuit board 4 passes through the inclined portion 331, the circuit board 4 presses the inclined portion 331 into the slot 332 until After the circuit board 4 passes through the inclined portion 331, the inclined portion 331 returns to the original position, and the circuit board 4 is oppositely disposed on the crotch portion 321 Then, the heat sink 2 passes through the inclined portion 331. Similarly, the protruding portion 23 of the heat sink 2 presses the inclined portion 331 into the slot 332 until the protruding portion 23 passes the After the inclined portion 331, the inclined portion 331 returns to the original position. At this time, the inclined portion 331 is oppositely disposed on the protruding portion 23, so that the bottom portion 21 of the heat sink 2 can be attached to the top surface of the circuit board 4. At least one of the heat-generating electronic components 41 and the circuit board 4 is fixed between the inclined portion 331 and the flange portion 321 , whereby the heat sink 2 and the circuit board 4 are disposed in the recess 34 The circuit board 4 is disposed on the crotch portion 321 , and the electronic component on the upper side of the circuit board 4 is attached to the bottom portion 21 of the heat sink 2 , and the extension portion 23 of the heat sink 2 is bound by the inclined portion 331 is provided, so that the circuit board 4 and the heat sink 2 are assembled and fixed by the buckle 3, and at the same time, the disassembly and assembly is convenient and can be stably buckled and reduced. The cost of production costs.

Referring to FIG. 4 to FIG. 6 , FIG. 4 is a perspective view, a perspective exploded view, and a schematic cross-sectional view of another preferred embodiment of the present invention. It can be clearly seen from the figure that the wing is The slot 33 is formed at the position of the inclined portion 331, and the inclined portion 331 integrally extends the position of the tab 33 relative to the side edges 32 of the slot 332 to serve the circuit board 4 When the extending portion 23 of the heat sink 2 passes through the inclined portion 331, the circuit board 4 and the protruding portion 23 press the inclined portion 331 into the slot 332 until the protruding portion 23 passes the After the inclined portion 331, the inclined portion 331 returns to the original position. At this time, the inclined portion 331 is oppositely disposed on the protruding portion 23, so that the bottom portion 21 of the heat sink 2 can be attached to the top surface of the circuit board 4. At least one of the heat-generating electronic components 41 and the circuit board 4 is fixed between the inclined portion 331 and the flange portion 321 , whereby the heat sink 2 and the circuit board 4 are disposed in the recess 34 When the circuit board 4 is disposed on the crotch portion 321, the electronic component on the upper side of the circuit board 4 is attached to the bottom portion 21 of the heat sink 2, and the heat sink 2 is extended. The 23 is latched by the inclined portion 331 so that the circuit board 4 and the heat sink 2 are assembled and fixed by the buckle 3, and at the same time, the disassembly and assembly is convenient and stable and can be stably buckled and reduced. The cost of the effect.

Referring to FIG. 7 to FIG. 9 , FIG. 7 is a perspective view, a perspective exploded view, and a schematic cross-sectional view of another preferred embodiment of the present invention. It can be clearly seen from the figure, wherein the side is The side 32 and the base 31 are formed with a plurality of side grooves 322 at the position of the crotch portion 321 , and the ends of the crotch portion 321 integrally extend the position of the side 32 relative to the side groove 322 so that when the inclined portion 331 is opposite to the card The bottom portion 21 of the heat sink 2 is attached to the at least one heat-generating electronic component 41 on the top surface of the circuit board 4 and is connected to the circuit When the plate 4 is fixed between the inclined portion 331 and the crotch portion 321 , the heat energy of the heat-generating electronic component 41 can simultaneously achieve thermal energy convection through the arrangement of the side grooves 322 to improve the heat dissipation efficiency of the heat sink assembly structure 1 . By.

Referring to FIG. 10 and FIG. 11 , it is a schematic diagram of a preferred embodiment of the present invention and a further embodiment of the present invention. It can be clearly seen from the figure that at least one of the portions 23 can be disposed on the exhibition portion 23 . The slot 231 is provided for the inclined portion 331 to ensure that the circuit board 4 and the heat sink 2 are assembled and fixed by the clip 3. Further, the bottom surface of the circuit board 4 is provided with The heat-generating electronic component 41 is disposed between the heat-generating electronic component 41 and the base 31 with a heat-conducting member 42 so that the heat-generating electronic component 41 can simultaneously conduct heat conduction by the buckle 3.

It should be noted that the above is only the preferred embodiment of the present case and is not intended to limit the creation. If the changes made in accordance with the concept of the creation are within the scope of the spirit of the creation, for example, for the configuration or arrangement The type is transformed, and the equivalent effect of various changes, modifications and applications shall be included in the scope of the case and shall be combined with Chen Ming.

1‧‧‧ radiator combination structure

2‧‧‧heatsink

21‧‧‧ bottom

22‧‧‧ Heat sink fins

23‧‧‧ Exhibition Department

3‧‧‧ buckle

31‧‧‧Base

32‧‧‧ side

321‧‧‧檐

33‧‧‧Flap

331‧‧‧ oblique

332‧‧‧Slots

333‧‧‧Guidance Department

34‧‧‧ Groove

4‧‧‧ boards

41‧‧‧Fever electronic components

Claims (9)

A heat sink assembly structure includes: a heat sink having a bottom portion and a plurality of heat dissipation fins extending perpendicularly from the bottom surface, and the bottom side edge horizontally extending at least one extension portion; a buckle, the buckle The base has a base extending perpendicularly from one side of the base, and a recess is formed between the two sides for the heat sink and a circuit board, and the side is provided with at least one portion for Cooperating with a bottom surface of the circuit board, the one end of the side edge is extended with a plurality of fins spaced apart from each other, and the one of the fins extends with an inclined portion of the protruding portion, and the bottom of the heat sink is attached At least one heat-generating electronic component on the top surface of the circuit board and fixed to the circuit board between the inclined portion and the flange portion. The heat sink assembly structure of claim 1, wherein the circuit board and the heat sink are fixedly disposed in the recess, and a width between the two sides and a width of the circuit board. Consistent with the width of the groove. The heat sink assembly of claim 1, wherein the fin is formed with a slot at the inclined portion, and the inclined portion integrally extends the side of the slot. The heat sink assembly of claim 1, wherein the inclined portion integrally extends the airfoil, and the inclined portion extends toward the groove. The heat sink assembly according to claim 1, wherein the fins are bent and extended with respect to the other end of the side to have a guiding portion. The heat sink assembly of claim 5, wherein the edge of the two side guides defines a width greater than a width of the groove. The heat sink assembly of claim 1, wherein the bottom surface of the circuit board is provided with the heat-generating electronic component, and a heat conducting member is disposed between the heat-generating electronic component and the base. The heat sink assembly structure of claim 1, wherein the protrusion portion is provided with at least one recessed groove for the oblique portion to be engaged. The heat sink assembly of claim 1, wherein the side of the buckle and the base are formed with a plurality of side grooves, and the two ends of the same portion integrally extend the side with respect to the side groove. Location.