US20130133862A1

US20130133862A1 - Heat dissipation device with fixing member for heat pipe thereof

Info

Publication number: US20130133862A1
Application number: US13/537,064
Authority: US
Inventors: Shih-Yao Li; Jui-Wen Hung
Original assignee: Foxconn Technology Co Ltd
Current assignee: Foxconn Technology Co Ltd
Priority date: 2011-11-25
Filing date: 2012-06-29
Publication date: 2013-05-30
Also published as: TWI514120B; TW201321946A

Abstract

An exemplary heat dissipation device includes a heat absorbing base, a heat pipe thermally connected to the heat absorbing base, and a fixing member including a main body abutting to the heat absorbing base and two clamps extending from the main body, the heat pipe is sandwiched between the main body and the heat absorbing base, each of the clamps includes an arm portion and a curved portion extending from the arm portion toward the heat absorbing base, the arm portions of the two clamps clamp two opposite lateral sides of the heat absorbing base, the curved portions of the two clamps elastically clamp edges of the heat absorbing base away from the main body.

Description

BACKGROUND

1. Technical Field
The present disclosure generally relates to heat dissipation devices such as those used in electronic apparatuses, and more particularly to a heat dissipation device with a fixing member which secures a heat pipe of the heat dissipation device to a heat absorbing base of the heat dissipation device.
2. Description of Related Art
It is well known that heat is generated by many kinds of electronic components, such as central processing units (CPUs), integrated circuit chips and memory cards, during their operation. If the heat is not efficiently removed, the electronic components may malfunction or suffer damage. Typically, a heat dissipation device is provided to cool such electronic components.
The heat dissipation device typically includes a heat absorbing base, a heat sink and a heat pipe. The heat absorbing base is attached to a heat generating electronic component such as a CPU, and absorbs heat from the heat generating electronic component. The heat pipe thermally connects the heat absorbing base with the heat sink, to transfer the heat from the heat absorbing base to the heat sink. The heat pipe is generally soldered to the heat absorbing base with tin. However, if in operation the temperature of the heat dissipation device is too high, the tin is liable to melt. This may cause the heat pipe to loosen from the heat absorbing base or even separate from the heat absorbing base. As a result, the heat generated by the heat generating electronic component can not be taken away efficiently, and the heat generating electronic component may malfunction or suffer damage.
What is needed, therefore, is a heat dissipation device which can overcome the described limitations.

BRIEF DESCRIPTION OF THE DRAWINGS

Many aspects of the disclosure can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the disclosure.

FIG. 1 is an assembled, isometric view of a heat dissipation device in accordance with an embodiment of the disclosure.

FIG. 2 is an exploded view of the heat dissipation device of FIG. 1.

FIG. 3 is similar to FIG. 2, but viewed from another aspect.

FIG. 4 is an enlarged view of a fixing member of the heat dissipation device of FIG. 2.

DETAILED DESCRIPTION

Reference will now be made to the drawings to describe one or more embodiments of the present heat dissipation device, in detail.
Referring to FIG. 1, a heat dissipation device 100 in accordance with an embodiment of the disclosure is shown. The heat dissipation device 100 includes a heat sink 10, a heat absorbing base 30, a heat pipe 20 thermally connecting the heat sink 10 with the heat absorbing base 30, and a fixing member 40 for fixing the heat absorbing base 30 on a heat generating electronic component (not shown) such as a CPU.
Referring also to FIGS. 2 and 3, the heat sink 10 includes a top plate 11, a bottom plate 12, and a plurality of fins 13 between the top plate 11 and the bottom plate 12. The top plate 11 and the bottom plate 12 are planar and parallel to each other. Each of the fins 13 is perpendicular to the top plate 11 and the bottom plate 12. Every two neighboring fins 13 are spaced apart from each other, and cooperatively define a passage 14 therebetween. Each fin 13 defines two receiving holes 16 in a middle thereof. Each fin 13 also comprises two annular flanges 15 extending perpendicularly from a main body thereof around the receiving holes 16, respectively. When the fins 13 are assembled together, the flanges 15 of each fin 13 abut a neighboring fin 13, and the corresponding receiving holes 16 and flanges 15 of the fins 13 align with each other, respectively.
The heat pipe 20 includes an evaporating section 22, a pair of condensing sections 21, and a pair of connecting sections 23 interconnecting the evaporating section 22 and the condensing sections 21. The condensing sections 21 are a first condensing section 211 and a second condensing section 212, which are parallel to each other. The first condensing section 211 and the second condensing section 212 are received in the two channels 16. The evaporating section 22 is cylindrical. The evaporating section 22 and the first condensing section 211 form an acute angle therebetween, and the evaporating section 22 and the second condensing section 212 form an obtuse angle therebetween. The connecting sections 23 are a first connecting section 231 interconnecting the first condensing portion 211 and one end of the evaporating section 22, and a second connecting section 232 interconnecting the second condensing section 212 and another end of the evaporating section 22. The two connecting sections 231, 232 are curved, and the curvature of the first connecting section 231 is greater than that of the second connecting section 232.
The heat absorbing base 30 includes a first surface 31 and a second surface 32 at opposite sides thereof. The first surface 31 is for contacting the heat generating component. The heat absorbing base 30 defines an approximately semicylindrical first groove 33 in the second surface 32.
The fixing member 40 includes a main body 41, and four clamps 42 extending correspondingly from four corner edges of the main body 41 generally toward the heat absorbing base 30. The main body 41 is plate shaped and defines an approximately semicylindrical second groove 411 corresponding to the first groove 33. The second groove 411 and the first groove 33 cooperatively receive the evaporating section 22 of the heat pipe 20 therein.
Referring also to FIG. 4, the four clamps 42 are substantially L-shaped. Each clamps 42 includes an arm portion 421 for clamping a lateral side of the heat absorbing base 30, a curved portion 422 extending from the arm portion 421 generally toward the heat absorbing base 30, and a securing portion 423 extending from the curved portion 422 in a direction generally away from the heat absorbing base 30 and perpendicular to the arm portion 421. The securing portion 423 is used for securing the heat dissipation device 100 more firmly in position when the heat dissipation device 100 is applied in, e.g., an electronic device. For example, the securing portion 423 can be engaged with a corresponding component (not shown) of the electronic device, such as a clip on a circuit board on which the heat generating electronic component is mounted.
When the heat dissipation device 100 is assembled, the two condensing sections 211, 212 of the heat pipe 20 are respectively received in the corresponding receiving holes 16 of the heat sink 10. The evaporating section 22 of the heat pipe 20 is pre-positioned in the first groove 33 of the heat absorbing base 30, for example by being soldered in the first groove 33 with tin. Then the fixing member 40 is locked on the heat absorbing base 30, with one semicylindrical portion of the evaporating section 22 away from the first groove 33 received in the second groove 411. The main body 41 and the four clamps 42 are pressed onto the heat absorbing base 30, until the curved portions 422 of the clamps 42 elastically clamp edges of the first surface 31 of the heat absorbing base 30. In this position, the arm portions 421 of the clamps 42 clamp two opposite lateral sides of the heat absorbing base 30, and the main body 41 is firmly attached to the second surface 32 of the heat absorbing base 30. Finally, the securing portions 423 of the fixing member 40 are engaged with other components (such as clips, not shown), and the first surface 31 of the heat absorbing base 30 is attached to the heat generating electronic component.
In use of the heat dissipation device 100, the heat absorbing base 30 absorbs the heat generated by the heat generating electronic component quickly. The heat is transferred to the heat sink 10 via the heat pipe 20, and then dissipated into ambient air efficiently.
In summary, the heat dissipation device 100 includes the first groove 33 and the second groove 411, which cooperatively receive the evaporating section 22 of the heat pipe 20. In addition, the fixing member 40 includes the clamps 42, which have the arm portions 421 and the curved portions 422. The arm portions 421 clamp lateral sides of the heat absorbing base 30, and the curved portions 422 elastically clamp the edges of the first surface 31 of the heat absorbing base 30. Thereby, the heat pipe 20 can be fixed to the heat absorbing base 30 firmly. Furthermore, if solder is applied between the fixing member 40 and the heat absorbing base 30, the strength and reliability of the connection between the heat pipe 20 and the heat absorbing base 30 are further enhanced.
It is to be understood that the above-described embodiments are intended to illustrate rather than limit the disclosure. Variations may be made to the embodiments without departing from the spirit of the disclosure as claimed. The above-described embodiments illustrate the scope of the disclosure but do not restrict the scope of the disclosure.

Claims

What is claimed is:

1. A heat dissipation device comprising:

a heat absorbing base;

a heat pipe thermally connected to the heat absorbing base; and

a fixing member comprising a main body abutting the heat absorbing base and two clamps extending from the main body, the heat pipe being sandwiched between the main body and the heat absorbing base, each of the clamps comprising an arm portion and a curved portion extending from the arm portion generally toward the heat absorbing base, the arm portions of the clamps clamping two opposite lateral sides of the heat absorbing base, the curved portions of the clamps elastically clamping edges of the heat absorbing base away from the main body.

2. The heat dissipation device according to claim 1, wherein the heat absorbing base comprises an approximately semicylindrical first groove, and the heat pipe comprises an evaporating section partly received in the first groove.

3. The heat dissipation device according to claim 2, wherein the heat absorbing base further comprises a first surface and a second surface at opposite sides thereof, the first groove is provided in the second surface, the first surface is adapted to be attached to a heat generating electronic component, and the second surface is adapted to be attached to the main body.

4. The heat dissipation device according to claim 3, wherein the main body defines an approximately semicylindrical second groove corresponding to the first groove, and the first groove and the second groove cooperatively receive the evaporating section of the heat pipe therein.

5. The heat dissipation device according to claim 2, wherein the heat pipe further comprises a pair of condensing sections parallel to each other, and two connecting sections respectively interconnecting the evaporating section and the pair of condensing sections.

6. The heat dissipation device according to claim 4, wherein the two connecting sections are both curved, and the curvature of the first connecting section is greater than that of the second connecting section.

7. The heat dissipation device according to claim 4, wherein the evaporating section and one of the condensing sections form an acute angle therebetween, and the evaporating section and the other one of the condensing sections form an obtuse angle therebetween.

8. The heat dissipation device according to claim 1, further comprising a heat sink, wherein the heat sink comprises a plurality of fins parallel to each other, and every two neighboring fins are spaced apart from each other with a passage defined therebetween.

9. The heat dissipation device according to claim 1, wherein each of the clamps further comprises a securing portion extending from the curved portion in a direction generally away from the heat absorbing base.

10. The heat dissipation device according to claim 9, wherein the securing portion is substantially perpendicular to the arm portion of the clamp.

11. A heat dissipation device comprising:

a heat absorbing base;

a heat pipe thermally connected to the heat absorbing base; and

a fixing member comprising:

a main body abutting the heat absorbing base; and

two clamps extending from opposite sides of the main body, each of the clamps comprising:

an arm portion; and

a curved portion extending from the arm portion generally toward the heat absorbing base;

the arm portions of the clamps clamping two opposite lateral sides of the heat absorbing base, and the curved portions of the clamps elastically clamping edges of the heat absorbing base away from the main body such that the heat pipe is interferingly engaged between the main body and the heat absorbing base.