1324726 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種散熱裝置，尤係 元件熱量之散熱裝置。 用於散發電子 【先前技術】 隨著電子產業迅速發展，如電腦巾電子 度大幅度提高’其產生之熱量也隨之劇 之運异速 件之熱量散發出去，以保證其正常運行，一直 題。隨著近年來高頻圖像處理、無“: 不斷發展’包括顯卡、視頻圖像卡（VGA卡）在内之附加卡 上電子元件發熱量越來越大。例如圖像卡，—护勺括一μ 獨之處理器’稱作圖像處理器(GPU)，其發熱量：：當大早 如不能有效散熱將會影響其正常運行。因此，通常在曰GPU 之表面安裝一散熱裝置進行散熱。該散熱裝置一般包括與 電子元件接觸之散熱器及設於散熱器頂部之風扇，"該散熱 器包括一基座及設於該基座上之複數散熱片。風扇^轉^ 其產生之氣流吹過散熱器之散熱片並與散熱片進行熱交 換’從而將散熱器從電子元件吸收之熱量散發。然而，註 政熱器之底部往往係金屬實體與電子元件接觸，電子元件 產生之熱量從熱源中心向散熱裝置四周慢慢擴散，直接譽 響了整個散熱裝置之散熱速度。 〜 因此，需要設計一種新之散熱裝置，該散熱裝置可以 a將電子元件產生之熱量更加快速、均勻地分佈至整個散轨 裝置。 … 【發明内容】 本發明旨在提供一種可快速、有效對電子元件進行散 熱之散熱裝置。 種散熱裝置，用以對一附加卡上之電子元件進行散 熱，其包括一帶有基座之散熱器、置於該基座上之一風扇 _及一罩设該散熱器與風扇之蓋體，該散熱器基座底部嵌設 至少一與該電子元件接觸之熱管。 與習知技術相比，該散熱裝置基座底部設有與電子元 件接觸之熱官，直接吸收電子元件產生之熱量，並將該熱 量快速而均勻地分佈到整個散熱器基座上，故本發明熱管 散熱裝置與傳統散熱裝置相比，散熱性能有顯著之提升。 【實施方式】 _ 請參閱圖1及圖2,其揭示本發明一散熱裝置100。該 散熱裝置100位於一附加卡10(例如一顯卡）之一側，用於 對附加卡10上處理器12進行散熱，其中該散熱裝置1〇〇 通過與位於附加卡10另一相對側之背板70共同配合而固 定於該附加卡10上。 該散熱裝置100包括一散熱器20、安裝至該散熱器20 上之風扇30、安裝至該散熱器2〇底部之第一、第二熱管 50、60及一扣合於該散熱器2〇上之蓋體4〇。 散熱器20在本實施例中為一紹擠型散熱器，其包括一 132.4726 .基座22及形成於該基座22上之複數散熱鰭片24。基座22 為一板狀體，包括一矩形主體部221及自主體部221 —邊 緣一體延伸之半圓形延伸部223。該等散熱鰭片24位於該 主體部221上，該主體部221上形成有散熱鰭片24之部分 較基座22之其他部分厚，以在其底部容置第一及第二熱管 50、60。主體部221上設有四通孔2210以供螺栓82穿設。 散熱鰭片24垂直於基座22且相互平行以形成複數縱向之 通風道240。請參考圖3與圖4,基座22底部與散熱鰭片 24相對之區域形成二溝槽27、28用以容置第一、第二熱管 5〇、60。該二溝槽27、28分別包括二相互連接且橫向平行 =臂部（圖未標）使其呈u型狀。每一溝槽27、28之其中一 臂部之長度小於另-臂部之長度，二溝槽28之開口相反且 其f部相互父又排列，即每一溝槽27、28較短之臂部伸入 槽27'28之開口中’其中溝槽27之較長臂部與溝 糟28之較短臂部鄰接且連通。1324726 IX. Description of the Invention: [Technical Field] The present invention relates to a heat dissipating device, particularly a heat dissipating device for component heat. Used to distribute electronic technology [Prior Art] With the rapid development of the electronics industry, such as the electronic degree of computerized towels, the heat generated by it has also been dissipated with the heat of the different speed parts to ensure its normal operation. . With the recent high-frequency image processing, there is no ": continuous development" on the add-on card including video card, video image card (VGA card), the electronic components are getting more and more heat. For example, image card, - protective spoon A processor that is called a single image processor (GPU), which generates heat: when it is not able to dissipate heat as early as possible, it will affect its normal operation. Therefore, a heat sink is usually installed on the surface of the GPU. The heat sink generally includes a heat sink in contact with the electronic component and a fan disposed on the top of the heat sink, and the heat sink includes a base and a plurality of heat sinks disposed on the base. The airflow blows through the heat sink of the heat sink and exchanges heat with the heat sink' to dissipate heat absorbed by the heat sink from the electronic component. However, the bottom of the heat exchanger is often in contact with the electronic component and the electronic component. The heat is slowly diffused from the center of the heat source to the periphery of the heat sink, which directly evokes the heat dissipation speed of the entire heat sink. ~ Therefore, it is necessary to design a new heat sink, which can The heat generated by the sub-components is distributed more quickly and evenly to the entire loose-area device. [ SUMMARY OF THE INVENTION The present invention is directed to a heat dissipating device that can quickly and efficiently dissipate heat from electronic components. The electronic component on the card dissipates heat, and includes a heat sink with a base, a fan disposed on the base, and a cover covering the heat sink and the fan, the bottom of the heat sink base being embedded at least a heat pipe in contact with the electronic component. Compared with the prior art, the bottom of the base of the heat sink is provided with a heat contact with the electronic component, directly absorbing heat generated by the electronic component, and distributing the heat to the heat quickly and evenly The heat pipe heat dissipation device of the present invention has a significant improvement in heat dissipation performance compared with the conventional heat sink device. [Embodiment] Referring to Figures 1 and 2, a heat sink 100 of the present invention is disclosed. The heat sink 100 is located on one side of an add-on card 10 (for example, a graphics card) for dissipating heat from the processor 12 on the add-on card 10, wherein the heat sink 1 passes through The heat sink 100 includes a heat sink 20, a fan 30 mounted to the heat sink 20, and the heat sink 2 mounted to the heat sink 2 in a common fit on the opposite side of the add-on card 10. The first and second heat pipes 50 and 60 at the bottom of the crucible and a cover body 4 affixed to the heat sink 2〇. The heat sink 20 is a squeeze-type heat sink in the embodiment, which includes a 132.4726. The base 22 and the plurality of heat dissipation fins 24 formed on the base 22. The base 22 is a plate-shaped body and includes a rectangular main body portion 221 and a semicircular extension portion 223 extending integrally from the main body portion 221. The heat dissipation fins 24 are located on the main body portion 221, and the portion of the main body portion 221 on which the heat dissipation fins 24 are formed is thicker than other portions of the base 22 to accommodate the first and second heat pipes 50, 60 at the bottom thereof. . A four-way hole 2210 is defined in the main body portion 221 for the bolt 82 to pass through. The fins 24 are perpendicular to the susceptor 22 and are parallel to each other to form a plurality of longitudinal louvers 240. Referring to FIG. 3 and FIG. 4, a portion of the bottom of the susceptor 22 opposite to the heat dissipation fins 24 forms two grooves 27, 28 for accommodating the first and second heat pipes 5, 60. The two grooves 27, 28 respectively comprise two mutually connected and laterally parallel = arm portions (not labeled) such that they are U-shaped. The length of one of the arms 27, 28 is smaller than the length of the other arm, the openings of the two grooves 28 are opposite and the f portions are arranged in a parental relationship, that is, the shorter arms of each of the grooves 27, 28. The portion extends into the opening of the slot 27'28 wherein the longer arm of the groove 27 abuts and communicates with the shorter arm of the groove 28.
蓋體40具有一頂壁41及自該頂壁41向下延伸設 Λ Λ . -rS Hit n i 从、-_ _ ——只土 w叼卜延伸設置 該頂^ 41與基座22相隔設置。該頂壁41設有-進風口412,蓋體4G與基座22之間形成1風口 216, 風口 216出風方向與進風口化之進風方向垂直，該 有二二退離風扇3〇。 41末端靠近出風口 處設 弧形開：410’以增大出風口 216之出風面積。 散埶器2〇二美；二5〇 6〇均為扁平熱管’其形狀構造與 底部之溝槽27、28大致相同。第4 包括容置於溝槽27較長臂部中之-較長吸熱段… .容置於溝槽27較短臂邱+ :熱段物熱段52之;:7=玫!段52及一連接吸 溝槽28較短臂部中之接& %第二熱管6〇包括容置於 長臂部中之-較長放b吸熱段61 '容置於溝槽28較 &之連接段63熱段62及—連接物·^與放熱段 =3〇為-軸流式風扇，安裳於基座22之延伸部奶 上’，、盍體40之進風口 412針庫， 通風道240。 12對應並臨近散熱鰭片24之 背板70設置於附加卡1〇之另一側。該背板％呈“十” 22上上各設有—通孔77,以供獅87 Μ並與基座 22上之螺栓82螺鎖。皆 Μ隨轨％ 卡1〇之間設有複數圓 柱^離墊75，以防止背板7〇直接貼合於附加卡1〇上進 而，、附加卡10上之其他電子元件（圖未標）發生干涉。 請再次參考圖i至圖4,組裝時，首先將第―、第二執 官50、60通過焊接或鉚接等方式固定於散熱器2G底部: 溝槽28内’並與基座22下表面—同形成一平面從而直接 與附加卡10上之處理器12接觸吸收其產生之熱量。第一 及第二熱管50、60之U型開口方向相反放置，第—熱管 5〇較短放熱段52伸入第二熱管60之開口中，第二熱管、6〇 較短之吸熱段61伸入第一熱管5〇之開口中，其中，第一 及第二熱管50、60之吸熱段51、61相鄰接，二者共同置 於附加卡10之處理器12上吸收其產生之熱量，二放熱段 52、62相互並行靠近，用以將吸熱段落51、61吸收之熱量 快速傳遞至散熱裝置100之其他部分；然後，將風扇3〇' = 1324726 裝至基座22上，螺栓82穿過散熱器20之通孔2210及相 應附加卡10上之貫穿孔15後，螺絲87穿過背板70之通 孔77與螺栓82之内螺紋相互螺合，從而將固定散熱裝置 100固定於附加卡10上；最後，將蓋體40通過卡扣或者焊 接之方式將散熱器20及風扇30扣合。 工作時，處理器12產生之熱量，一部分由第一、第二 熱管50、60之吸熱段51、61吸收後通過放熱段52、62傳 遞至遠離處理器12之基座22上，再由基座22傳至其上之 散熱鰭片24上；另一部分熱量由直接與處理器12接觸之 基座22吸收後傳遞至其上之散熱鰭片24，最後風扇30提 供之強制氣流流經散熱鰭片24之通風道240，將散熱鰭片 24之熱量帶走，實現良好之散熱效果。 由於第一、第二熱管50、60將處理器12之熱量傳遞至 遠離處理器12之位置，從而可使熱量更加快速、均勻地分 佈到整個基座22,進而提升散熱裝置100整體之散熱能力。 綜上所述，本發明符合發明專利要件，爰依法提出專 利申請。惟，以上所述者僅為本發明之較佳實施例，舉凡 熟悉本案技藝之人士，在爰依本發明精神所作之等效修飾 或變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1係本發明散熱裝置之第一實施例之立體分解圖。 圖2係圖1中散熱裝置之組合圖。 圖3係本發明散熱裝置倒置後之部分組合圖。 1324726 圖4係圖3中散熱裝置之組合圖。 【主要元件符號說明】The cover body 40 has a top wall 41 and a downwardly extending Λ 自 from the top wall 41. The -rS Hit n i extends from the -_ _ - only the soil w 叼 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 The top wall 41 is provided with an air inlet 412, and a tuyeres 216 are formed between the cover body 4G and the base 22. The air outlet direction of the tuyere 216 is perpendicular to the air inlet direction of the air inlet, and the two are separated from the fan 3〇. At the end of 41, near the air outlet, a curved opening: 410' is used to increase the air outlet area of the air outlet 216. The diffuser is 2 〇 2; the 2 〇 6 〇 are flat heat pipes' and their shape is substantially the same as the grooves 27 and 28 at the bottom. The fourth includes a longer endothermic section that is accommodated in the longer arm of the groove 27. ... is accommodated in the shorter arm of the groove 27: the hot section of the hot section 52;: 7 = rose! section 52 and A connection in the shorter arm of the suction groove 28 & % of the second heat pipe 6 〇 includes a long-side b-heat absorption section 61 容 accommodated in the long arm Section 63 hot section 62 and - connection material · ^ and heat release section = 3 〇 is - axial flow fan, Anshang on the extension of the base 22 milk, ', the body 40 of the air inlet 412 needle library, air duct 240. The back plate 70 corresponding to and adjacent to the heat dissipation fins 24 is disposed on the other side of the additional card 1''. The back panel % is "ten" 22 is provided with a through hole 77 for the lion 87 Μ and the bolt 82 on the base 22 is screwed. There are a plurality of cylindrical ^off pads 75 between the rails and the rails, so as to prevent the backplanes 7〇 from directly attaching to the add-on card 1 and further, the other electronic components on the add-on card 10 (not shown) Interference has occurred. Referring to FIG. 4 to FIG. 4 again, in assembling, the first and second officers 50 and 60 are first fixed to the bottom of the heat sink 2G by welding or riveting: the inside of the groove 28 and the lower surface of the base 22 Forming a plane to directly contact the processor 12 on the add-on card 10 absorbs the heat it generates. The U-shaped openings of the first and second heat pipes 50, 60 are oppositely disposed, and the shorter heat-dissipating section 52 of the first heat pipe 5 extends into the opening of the second heat pipe 60, and the second heat pipe, the shorter heat-absorbing section 61 of 6 turns Into the opening of the first heat pipe 5, wherein the heat absorption sections 51, 61 of the first and second heat pipes 50, 60 are adjacent to each other, and the two are collectively placed on the processor 12 of the additional card 10 to absorb the heat generated by the heat card. The two exothermic sections 52, 62 are in close proximity to each other for quickly transferring the heat absorbed by the heat absorption sections 51, 61 to other portions of the heat sink 100; then, the fan 3〇' = 1324726 is attached to the base 22, and the bolts 82 are worn. After passing through the through hole 2210 of the heat sink 20 and the through hole 15 of the corresponding additional card 10, the screw 87 is threaded through the through hole 77 of the back plate 70 and the internal thread of the bolt 82, thereby fixing the fixed heat sink 100 to the additional Finally, the cover 40 is snapped or welded to the heat sink 20 and the fan 30 by snapping or welding. In operation, the heat generated by the processor 12 is partially absorbed by the heat absorption sections 51, 61 of the first and second heat pipes 50, 60 and transmitted to the susceptor 22 remote from the processor 12 through the heat release sections 52, 62. The seat 22 is transmitted to the heat dissipation fins 24 thereon; another portion of the heat is absorbed by the susceptor 22 directly contacting the processor 12 and transmitted to the heat dissipation fins 24 thereon, and finally the forced air flow provided by the fan 30 flows through the heat dissipation fins. The air passage 240 of the piece 24 takes away the heat of the heat dissipation fins 24 to achieve a good heat dissipation effect. Since the first and second heat pipes 50, 60 transfer the heat of the processor 12 to a position away from the processor 12, the heat can be distributed more quickly and evenly to the entire base 22, thereby improving the overall heat dissipation capability of the heat sink 100. . In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. However, the above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is an exploded perspective view showing a first embodiment of a heat sink according to the present invention. 2 is a combination diagram of the heat sink device of FIG. 1. Figure 3 is a partial assembled view of the heat sink of the present invention after being inverted. 1324726 FIG. 4 is a combination diagram of the heat sink device of FIG. [Main component symbol description]
散熱裝置 100 附力口卡 10 處理器 12 貫穿孔 15 散熱器 20 基座 22 ' 77 出風口 216 主體部 221 通孔 2210 延伸部 223 散熱鰭片 24 溝槽 27、28 通風道 240 風扇 30 蓋體 40 頂壁 41 開口 410 進風口 412 側壁 44 轨管 50、60 吸熱段 51 ' 61 放熱段 52、62 連接段 53 ' 63 背板 70 隔離墊 75 螺栓 82 螺絲 87 11Heat sink 100 Attachment card 10 Processor 12 Through hole 15 Heat sink 20 Base 22 ' 77 Air outlet 216 Main body 221 Through hole 2210 Extension 223 Heat sink fin 24 Groove 27, 28 Ventilation duct 240 Fan 30 Cover 40 Top wall 41 Opening 410 Air inlet 412 Side wall 44 Rail 50, 60 Endothermic section 51 ' 61 Heat release section 52, 62 Connection section 53 ' 63 Back plate 70 Isolation pad 75 Bolt 82 Screw 87 11