200923628 ‘九、發明說明： 【發明所屬之技術領域】 本發明涉及一種熱導管及使用該熱導管之散熱裝置之 組裝方法。 ’ 【先前技術】 ik著電腦產業之迅速發展，十央處理器等發熱電子元 件產生之熱量愈來愈多。為將產生之熱量有效地散去，通 木用之方法係利用一熱導管之一端與該發熱電子元件接 觸，將發熱電子元件產生之熱量導出，同時在該熱導管之 另端套接複數散熱，鳍片，從而將熱量迅速散發出去。盆 中，熱導管係藉由設置於散熱鰭片内之開孔而與該等散執 ^片^之"淮’利用此種結合方式會在熱導管與散熱韓 片^成間隙’該間隙之產生會增大熱導管與散熱韓片間 之"面熱阻’降低熱導管與散熱鳍片間之傳熱效率。 為了降低散熱韓片與熱導管之間之介面熱阻，一種較 二:之方法係藉由錫膏之塗布將熱導管與散熱縛片焊接 ^ 。錫t係由大量焊錫小顆粒與助焊劑混合而成，.在 :溫下狀。為在熱導管與散熱鰭片之間均句地塗布錫 =一般，在散熱歸片之開孔内壁塗布錫膏，然後將熱導 :擦=熱，之開孔内。然，該方法容易造成踢膏因 執部t外溢’造成锡膏之浪費，同時由於刮擦而使 …導…P刀位置處不能塗覆適量之錫 散熱韓片之間之接合不緊密，從而最終影響散熱裝 200923628 '熱效果。故，熱導管與散熱鰭片間之結合方式仍需改進， 以進一步提高熱導管與散熱鰭片間之傳熱效率。 【發明内容】 有鑒於此’有必要提供一種可減少焊料浪費及確保焊 接效果之熱導管及使用該熱導管之散熱裝置之組裝方法。 種熱導管’其至少一部分外表面緊密包覆有固態之 焊錫薄膜，該焊錫薄膜係將熱導管浸入熔融之焊錫溶液 内’取出後經冷卻凝固形成。 一種熱導管，用於插設於一設有開孔之元件内，該熱 ‘官之至少一部分外表面緊密包覆有固態之焊錫薄膜，該 2錫薄膜係由熔融之焊錫經冷卻後形成，其緊密包覆於熱 導管之外表面，並與熱導管生長為一體，該焊錫薄膜在該 包覆有焊錫薄膜之熱導管插設於開孔内後，經熱熔並冷 卻，將該熱導管與該設有開孔之元件固接在一起。 —種散熱裝置之組裝方法，該散熱裝置包括複數設有 開孔之散熱鰭片及插設於該等開孔内之熱導管，該組裝方 广〇括在熱‘官之至少一部分外表面包覆一層固態之焊錫 缚膜，該焊錫薄膜係由炫融之焊錫經冷 有包::熱導管之外表面，並與熱導管生長為二將= =㈣之熱㈣插人所述散熱鰭片之開孔内；加熱熱 與:熱=二焊錫薄膜受熱:!化並填充於熱導管 "、二7成之間隙内，冷卻後得到所需散熱裝置。 與習知技術相比，利用該熱導管之散熱裝置之組裝過 8 200923628 中由於固恶之焊錫薄膜緊密包覆於埶導管卜 =導管生長為—體，而不同於普通 :片熱之導:，韓片之開孔時，谭錫薄臈不會二 ΐ布錫管上脫落，與在散熱鰭片與熱導管間 組裝方：、4么減少了組褒過峨膏之浪費，該 ^°仵加熱後之焊錫可均勻填充於熱導管盥散 =片間之空隙内，確保了锡焊效果，使熱導管:二： 片間具良好之傳熱效果 政，，一曰 【實施方式】 本發明提供—種㈣熱導管，該熱導管之至少一部分 外表面包覆有—層固態之焊錫薄膜，該焊錫薄膜係由熔i 之焊錫經冷卻後形成，其緊密包覆於熱導管之外表面，並 與熱導管生長為-體。該熱導管可插設於設有開孔之散熱 鰭片、散熱器之導熱座、與發熱元件相貼合之吸敎塊等元 件内，其外表面之焊錫_在該⑽熱導管插設於開孔内 後’經熱溶並冷卻，將該熱導f與設有開孔之元件固接在 -起。下面以該導熱管插設於—散熱裝置之散熱鰭片内為 例來進行說明。 如圖1所示，該散熱裝置包括一散熱器10、插設於該散 熱器10内之一根覆錫熱導管20及填充於散熱器1〇與熱導管 20之間之焊錫層40。 該散熱器10包括複數一體成型之散熱鰭片12，其中， 每一散熱鰭片12之上下兩端均設有一間隔部14，藉由該等 散熱鰭片12之間隔部14使相鄰散熱鰭片12間間隔一定之距 200923628 離’從而在相鄰散熱鰭片12間形成流道以供冷媒流體(如散 熱風扇產生之氣體）流過。各散熱鰭片12之中部開設一開孔 16 ’以供熱導管2〇穿過。 ^該熱導官20呈扁平狀，包括一蒸發段22及一包覆有固 L焊錫薄膜3G (如圖2所示）並插設於散熱籍片之開孔 内之冷凝段24。該焊錫薄膜3〇係由溶融之焊錫經冷卻後形 成，其緊密包覆於熱導管20之外表面，與熱導管2〇之外表 面生長為一體，從而使熱導管2〇穿過散熱鰭片12之開孔16 時’該焊錫薄膜30不會由於散熱韓片12之刮擦而由熱導管 2〇上脫落。該焊錫薄膜3〇之厚度較薄，約為〇1_〇2毫米， 使散熱鰭片12上所設之開孔16之孔徑基本上與熱導管加之 欲覆烊錫之部位即熱導管2〇之冷凝段Μ之外徑相同。本實 」十熱‘ & 20與散熱益1()相接觸之部分之橫截面及散熱 器10之開孔16為擬橢圓形。 、、該焊錫層40係熱導管20外所包覆之焊錫薄膜％經加熱 並冷凝後形成（參後述）’其均勾地填充於熱導㈣之冷凝段 Μ與散熱鰭片12_成之間隙内，使該熱導管細散孰器 間具較小之接觸熱阻，並將熱導管20與散熱韓片12固接 在一起。 如圖2所示，本發明散熱裝置採用下述方式進行組裝·· I先，提供所述覆錫熱導管20。具體做法為：在一定 之^境溫度下將錫合金融化成焊錫溶液，如在約139。〇之溫 度每境下將㈣合金棒或絲合金錠融化成桿錫溶液，將 200923628 熱導管20之冷凝段24浸人炫融之焊錫溶㈣，取出後冷卻 凝固，即在熱導管20之外表面形成所述之固態之 膜 30 ； 、 接下來，將包覆有焊錫薄膜3〇之熱導管2〇穿過散熱續 片12之開孔16 ; 最後，加熱該熱導管20與散熱器1〇，使該固態之焊錫 薄劇受熱熔化，均勻填充於熱導管2Q與散㈣化開孔 16間，空隙，並在冷卻後形成該焊錫層4()，將熱導管如和 散熱器10固接在-起，得到所需之散熱裝置。本實施例中， 加熱熱導管20與散減片12時可在職、回焊爐、烤箱、 熱風腔等可提供較高溫度之腔體内實現。 利用上述方法組裝散熱裝置之過程中’由於固態之焊 錫薄膜30緊密包覆於熱導管2G之外表面，並與熱導管默 外表面生長為-體’而不同於呈膏狀之錫f，因此，當数 導管20穿過散熱鰭片12之開孔16時，焊錫㈣邮會由於 散熱，片12之刮擦而由熱導㈣上脫落，與在散熱韓片與 :、、、冷s間塗布錫貧之方式相tb，減少了組裝過程中錫膏之 〜費防止局。卩位置之錫貧被完全刮擦掉之情形發生，使 =加熱後之焊錫可均勻填充於熱導㈣與散熱鰭片Η間之 工隙内’確保了焊接效果，使熱導管2Q與散熱_片12間具 良好之傳熱效果。另外，由於熱導管20穿過散熱鰭片12之 16時，焊錫薄膜30不會由於散熱鰭片12之刮擦而由熱 導吕2〇上脫落，使得熱導管20穿過散熱鰭片12時，不需在 熱導官20與散熱韓片12間之保持較高之定位精度，減小了 11 200923628 該過程之組裝難度，降低了該散熱裝置之組裝成本。而且， 該散熱裝置中焊料之原材料為錫祕合金，相較於習知技術 中所使用之錫嘗而言，.由於節省了將錫叙合金打碎以製成 錫膏之制程，使該散熱裝置之原材料成本低於習知技術中 之散熱裝置，從而降低了該散熱裝置之製造成本。 圖3及圖4所示為該散熱裝置第二實施例之立體圖及該 實施例之部分組裝過程示意圖。本實施例中，散熱器1〇a由 複數相互分離之散熱鰭片12a堆疊形成，各散熱鰭片12a在 其中部之右側設有U形開孔16a，該開孔16a之開口端貫穿對 應散熱鰭片12a之右側。熱導管20與散熱器i〇a相接觸之部 分及熱導管20外所附之焊錫薄膜30a之橫截面均為ue，以 於散熱鰭片12a之開孔16a相匹配。 如第一及第二實施例所述，該焊錫薄膜3〇、3〇a之橫截 面分別為近似之橢圓形和u形，可以理解地，該熱導管2〇、 散熱态10之開孔16及焊錫薄膜30之橫截面也可為圓形。另 外，本發明中所列焊錫薄膜3〇之厚度不限於〇1_〇 2毫米， 其可根據所採用加工方法及焊錫之不同而略有不同。本發 明中，焊錫之熔點也不限s139°c，其可根據所採用焊錫中 不同成分所占比重之不同而變化。本發明中，焊錫之原料 不限於錫鉍合金，也可採用錫與其他原料組合而成之焊錫。 綜上所述，本發明符合發明專利要件，爰依法提出專 =申#。惟，以上該者僅為本發明之較佳實施例，舉凡熟 =本案技藝之人士 ’在爰依本發明精神所作之等效修娜或、 變化，皆應涵蓋於以下之申請專利範圍内。 12 200923628 '【圖式簡單說明】 圖1係本發明散熱裝置第一實施例之立體圖。 圖2係圖1之部分組裝過程示意圖。 圖3係本發明散熱裝置第二實施例之立體圖。 圖4係圖3之部分組裝過程示意圖。 【主要元件符號說明】 散熱器 10 、 10a 散熱鰭片 12 、 12a 間隔部 14 開孔 16 、 16a 熱導管 20 蒸發段 22 冷凝段 24 焊錫薄膜 30 、 30a 焊錫層 40 13200923628 ‘9. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to a heat pipe and a method of assembling a heat sink using the heat pipe. ‘[Prior Art] ik With the rapid development of the computer industry, the heat generated by the heating electronic components such as the Ten Central Processor is increasing. In order to effectively dissipate the generated heat, the method of using wood is to contact the heat-generating electronic component with one end of a heat pipe, and heat generated by the heat-generating electronic component is discharged, and a plurality of heat sinks are disposed at the other end of the heat pipe. , fins, which quickly dissipate heat. In the basin, the heat pipe is separated from the heat dissipation fins by the opening provided in the heat dissipation fins, and the combination of the heat pipe and the heat dissipation film is used in the gap. This will increase the heat resistance between the heat pipe and the heat sink to reduce the heat transfer efficiency between the heat pipe and the heat sink fin. In order to reduce the thermal resistance between the heat-dissipating Korean film and the heat pipe, a second method is to solder the heat pipe and the heat-dissipating die by coating the solder paste. The tin t is made up of a large amount of small solder particles mixed with a flux. In order to apply tin between the heat pipe and the heat sink fins, generally, the solder paste is coated on the inner wall of the heat sinking film, and then the heat guide: rub = heat, in the opening. However, this method is easy to cause the sponge to be wasted due to the overflow of the holding portion, and at the same time, due to the scratching, the position of the P-knife cannot be coated with an appropriate amount of tin. The final effect of the heat dissipation 200923628 'thermal effect. Therefore, the combination between the heat pipe and the heat sink fins still needs to be improved to further improve the heat transfer efficiency between the heat pipe and the heat sink fins. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a heat pipe which can reduce solder waste and ensure a soldering effect, and a method of assembling a heat sink using the heat pipe. At least a portion of the outer surface of the heat pipe ' is tightly coated with a solid solder film which is formed by immersing the heat pipe in the molten solder solution and then solidifying by cooling. A heat pipe for inserting into an element provided with an opening, at least a portion of the outer surface of the heat member is tightly covered with a solid solder film formed by cooling the molten solder. The film is tightly coated on the outer surface of the heat pipe and integrated with the heat pipe. After the heat pipe coated with the solder film is inserted into the opening, the hot film is heat-melted and cooled, and the heat pipe is heated. It is fixed together with the component provided with the opening. a method for assembling a heat dissipating device, the heat dissipating device comprising a plurality of fins having openings and heat pipes inserted in the openings, the assembly being widely included in at least a part of the outer surface of the hot Covered with a solid solder sealing film, the solder film is cooled by a soldered solder: the outer surface of the heat pipe, and the heat pipe is grown to two. = = (4) heat (4) inserted into the heat sink fin Inside the opening; heating heat and: heat = two solder film is heated: and filled in the heat pipe ", two 70% gap, after cooling to get the required heat sink. Compared with the prior art, the heat dissipating device using the heat pipe is assembled. In 200923628, the solder film of the solid and evil is tightly coated on the crucible tube, and the tube is grown as a body, which is different from the ordinary: sheet heat guide: When the Korean film is opened, Tan Xi will not fall off the tin tube, and assemble it between the heat sink fin and the heat pipe: 4, which reduces the waste of the group.仵When the solder is heated, it can be uniformly filled in the gap between the heat pipe and the gap between the sheets to ensure the soldering effect, so that the heat pipe: 2: The film has a good heat transfer effect, and a glimpse [Embodiment] The invention provides a fourth heat pipe, wherein at least a part of the outer surface of the heat pipe is coated with a solid-state solder film formed by cooling the solder of the melt, which is tightly coated on the outer surface of the heat pipe. And grow with a heat pipe as a body. The heat pipe can be inserted into a heat dissipating fin provided with an opening, a heat conducting seat of the heat sink, a sucking block attached to the heat generating component, and the like, and the solder on the outer surface thereof is inserted in the (10) heat pipe After the inside of the opening, 'heat-dissolved and cooled, the heat guide f is fixed to the element provided with the opening. The following is an example in which the heat pipe is inserted into the heat sink fin of the heat sink. As shown in FIG. 1, the heat sink includes a heat sink 10, a tin-coated heat pipe 20 inserted into the heat sink 10, and a solder layer 40 filled between the heat sink 1 and the heat pipe 20. The heat sink 10 includes a plurality of integrally formed heat dissipating fins 12, wherein each of the heat dissipating fins 12 is provided with a spacing portion 14 at the upper and lower ends thereof, and the adjacent heat dissipating fins are formed by the spacing portions 14 of the heat dissipating fins 12. The strips 12 are spaced apart by a distance of 200923628 to form a flow path between the adjacent fins 12 for the flow of a refrigerant fluid (such as a gas generated by a heat dissipating fan). An opening 16 ′ is formed in the middle of each of the heat dissipation fins 12 for the heat pipe 2 to pass through. The heat guide 20 is flat and includes an evaporation section 22 and a condensation section 24 which is coated with a solid L solder film 3G (shown in Figure 2) and inserted into the opening of the heat sink. The solder film 3 is formed by cooling the molten solder, and is tightly coated on the outer surface of the heat pipe 20 to be integrated with the outer surface of the heat pipe 2 so that the heat pipe 2 passes through the heat sink fins. When the opening 16 of 12 is used, the solder film 30 is not peeled off by the heat pipe 2 due to the scratch of the heat-dissipating Korean film 12. The thickness of the solder film 3 is relatively thin, about 〇1_〇2 mm, so that the aperture of the opening 16 provided in the heat dissipation fin 12 is substantially the same as the heat pipe and the heat pipe 2 that is intended to cover the tin. The outer diameter of the condensation section is the same. The cross section of the portion of the "ten heat" & 20 that is in contact with the heat sink 1 () and the opening 16 of the heat sink 10 are quasi-elliptical. The solder layer 40 is formed by heating and condensing the solder film coated on the outside of the heat pipe 20 to form a condensed section Μ and a heat sink fin 12_ which are uniformly filled in the heat guide (4). Within the gap, the heat pipe has a small contact thermal resistance between the fine diffusers, and the heat pipe 20 is fixed to the heat sink Korean piece 12. As shown in Fig. 2, the heat sink of the present invention is assembled in the following manner. First, the tin-coated heat pipe 20 is provided. The specific method is: financializing the tin alloy into a solder solution at a certain temperature, such as at about 139. The temperature of the crucible melts (4) the alloy rod or the wire alloy ingot into a tin tin solution, and the condensing section 24 of the 200923628 heat pipe 20 is immersed in the molten tin (4), and then taken out and cooled and solidified, that is, outside the heat pipe 20 Forming the solid film 30 on the surface; Next, the heat pipe 2 coated with the solder film 3 is passed through the opening 16 of the heat sink 12; finally, the heat pipe 20 and the heat sink 1 are heated. The solid solder solder is melted by heat, uniformly filled between the heat pipe 2Q and the dispersing opening 16, gap, and formed into the solder layer 4 after cooling, and the heat pipe is fixed to the heat sink 10, for example. At the moment, the required heat sink is obtained. In this embodiment, when the heat pipe 20 and the diffuser 12 are heated, they can be realized in a cavity which can provide a higher temperature, such as a job, a reflow oven, an oven, a hot air chamber, and the like. In the process of assembling the heat dissipating device by the above method, 'the solid-state solder film 30 is tightly coated on the outer surface of the heat pipe 2G, and the outer surface of the heat pipe grows as a body-body', unlike the paste-like tin f. When the number of conduits 20 passes through the opening 16 of the heat dissipating fins 12, the solder (four) post will be peeled off by the heat guide (4) due to heat dissipation, and the scraping of the sheet 12, and between the heat sink and the: The method of coating tin lean is phase tb, which reduces the amount of solder paste in the assembly process. The tin-depleted position of the crucible is completely scraped off, so that the solder after heating can be uniformly filled in the gap between the thermal guide (4) and the fins of the fins to ensure the welding effect, so that the heat pipe 2Q and heat dissipation _ The film 12 has a good heat transfer effect. In addition, since the heat pipe 20 passes through the heat sink fins 16 16 , the solder film 30 is not peeled off by the heat guide fins due to the scratch of the heat dissipation fins 12 , so that the heat pipes 20 pass through the heat dissipation fins 12 . There is no need to maintain a high positioning accuracy between the thermal guide 20 and the heat sink Korean 12, which reduces the assembly difficulty of the process of 200923628, and reduces the assembly cost of the heat sink. Moreover, the raw material of the solder in the heat dissipating device is a tin alloy, which is compared with the tin tart used in the prior art, because the process of breaking the tin alloy into a solder paste is saved, so that the heat dissipation is achieved. The raw material cost of the device is lower than that of the prior art, thereby reducing the manufacturing cost of the heat sink. 3 and 4 are perspective views of a second embodiment of the heat sink and a partial assembly process of the embodiment. In this embodiment, the heat sink 1A is formed by stacking a plurality of heat dissipating fins 12a separated from each other, and each of the heat dissipating fins 12a is provided with a U-shaped opening 16a on the right side of the middle portion thereof, and the open end of the opening 16a penetrates through the corresponding heat dissipation. The right side of the fin 12a. The portion of the heat pipe 20 that is in contact with the heat sink i〇a and the solder film 30a attached to the heat pipe 20 are both ue in cross section so that the openings 16a of the heat radiating fins 12a match. As shown in the first and second embodiments, the cross-sections of the solder films 3 〇 and 3 〇 a are approximately elliptical and u-shaped, respectively. It is understood that the heat pipe 2 〇, the opening 10 of the heat-dissipating state 10 The cross section of the solder film 30 can also be circular. Further, the thickness of the solder film 3 所列 listed in the present invention is not limited to 〇1_〇 2 mm, which may vary slightly depending on the processing method used and the solder. In the present invention, the melting point of the solder is also not limited to s139 °c, which may vary depending on the proportion of the different components in the solder used. In the present invention, the raw material of the solder is not limited to the tin-bismuth alloy, and solder in which tin and other raw materials are combined may be used. In summary, the present invention complies with the requirements of the invention patent, and is proposed according to law. However, the above is only a preferred embodiment of the present invention, and the equivalents and variations of those skilled in the art of the present invention should be included in the following claims. 12 200923628 '[Simple description of the drawings] Fig. 1 is a perspective view of a first embodiment of a heat sink according to the present invention. Figure 2 is a schematic view of a part of the assembly process of Figure 1. Figure 3 is a perspective view of a second embodiment of the heat sink of the present invention. Figure 4 is a schematic view of a part of the assembly process of Figure 3. [Main component symbol description] Heat sink 10, 10a Heat sink fins 12, 12a Spacer 14 Opening 16 , 16a Heat pipe 20 Evaporation section 22 Condensing section 24 Solder film 30 , 30a Solder layer 40 13