JP4493350B2 - Structure of heat dissipation module and manufacturing method thereof - Google Patents

Description

  The present invention relates to a structure of a heat radiating module and a method for manufacturing the same, and more particularly to a structure of a heat radiating module by combining a heat pipe and a base plate and a method for manufacturing the same.

  To put it simply, a heat pipe is a single thin, hollow, metal tube sealed at both ends.The shape of the heat pipe is not limited, and theoretically any shape can be designed. One wick is formed, which is moistened by a liquid called hydraulic fluid, and the structure of the heat pipe differs depending on the amount of heat and the temperature.

  Current heat pipes are shelled out of brass, nickel, stainless steel, tungsten, and other alloys when one end of the heat pipe is placed in a hot location and the other end is placed in a relatively cool location. The heat transfer phenomenon begins, and heat enters the wick from a high temperature place through the metal tube wall, and the working fluid in the wick begins to evaporate due to the heat. The portion of the heat pipe that is placed at a high temperature is called the evaporation section, and the gas after evaporation collects in the hollow tube of the evaporation section and flows to the other end of the heat pipe at the same time. Since it is in contact with a low place, the gas begins to condense when it reaches the other end of the relatively low temperature. At this time, the amount of heat is transferred to a relatively low temperature location as the gas passes through the wick, hydraulic fluid, and metal tube wall, so the relatively low temperature portion of the heat pipe is called the condensing unit. First, the gas evaporated in the evaporation part is condensed into a liquid, and the condensed liquid returns from the condensation part to the evaporation part by the action of capillary action. In this way, the fluid circulates constantly, and this is the heat transfer principle of the heat pipe, and the amount of heat is transferred from a hot place to a cold place.

  There are many advantages of heat pipes, mainly due to the unique performance of the heat pipe structure and principle. From the viewpoint of the structure, the heat pipe is a hollow tube and has the same volume. Compared to other metal rods, it is much lighter and has a simple appearance, and when used with other instruments, it eliminates many inconveniences in the structure of the device, and is a sealed tube that operates. There is no need to add liquid and there are no moving parts, so there is no wear, which makes the heat pipe durable and noise-free, and in principle, evaporation and condensation inside the heat pipe Due to the phenomenon, it has high efficiency and near-isothermal heat conduction performance.

  In addition, the application of capillary action allows the fluid inside the heat pipe to continue to circulate in a zero gravity state without the action of external forces, and thus the heat pipe has many advantages. For this reason, it has been widely applied in combination with heatsinks, increasing the use effect of electronic products that are increasing day by day.

  1 and 2 are heat radiation modules having a known structure, and as shown in the figure, are constituted by a plurality of heat radiation fins, a base plate, and a heat pipe, and through holes are provided on the plurality of heat radiation fins. And after arranging the heat radiation fins, the heat pipe formed in the U-shape is penetrated into the through hole on the heat radiation fin, the heat pipe and the heat radiation fin are coupled, and further below the plurality of heat radiation fins and the base Solder is applied to the plate, the base plate and the heat pipe are joined, and the area of the base plate is larger than or equal to the joining surface portion constituted by a plurality of heat radiation fins.

  Moreover, the heat radiation module by the above-mentioned well-known structure is divided into two types as follows.

(1) The material of the radiating fin is aluminum metal, the material of the base plate is copper metal, and the radiating fin needs to be nickel-plated before welding the two.
(2) The material of the heat radiating fin and the base plate is copper metal, and the two are directly welded.

The above-mentioned known structure has a problem in practice, and the heat dissipating fins and the base plate of the heat dissipating module (1) are made of different materials, and further joined by soldering. The conduction efficiency is deteriorated, and the heat dissipation effect is affected by bonding with a further medium, that is, solder, and before the heat sink fin and the base plate made of aluminum are bonded, the nickel plating process is performed. It is necessary to increase the manufacturing cost, and at the same time, the yield rate decreases.

In the heat dissipation module (2), the heat dissipation effect is reduced by the medium, that is, the solder. Besides, the base plate is made of copper metal and the volume is relatively large. Due to the radiation fins, the overall weight is 600 to 700 g heavier than that made of aluminum metal, which is not practical.

In order to solve the above-mentioned drawbacks of the known structure, the inventor of the present invention repeated research and improvement and finally succeeded in inventing the present case.
Japanese Patent Publication No. 5-5580

  In order to solve the disadvantages of the known structure, the main object of the present invention is to directly join the base plate and the heat pipe, eliminate the need to join the base plate and the plurality of heat radiation fins, and simplify the manufacturing process of the heat radiation module. By increasing the yield, the yield rate is increased and the production cost is reduced.

  Another object of the present invention is to provide a structure of a heat radiating module in which a base plate and a heat pipe made of the same material are joined to increase the thermal conductivity.

  Still another object of the present invention is to reduce the weight and cost of the heat radiation module by making the area of the base plate smaller than the area of the surface portion constituted by the plurality of heat radiation fins.

In order to solve the above problem,
The invention of claim 1 is a method of manufacturing the heat dissipation module,
(A) providing a heat pipe through-hole made of copper in a plurality of heat-radiating fins made of aluminum and forming a protruding ring edge on one side of the through-hole to give a constant spacing between the fins;
(B) arranging the plurality of heat dissipating fins in parallel;
(C) One of the copper U-shaped heat pipes is fixed to the plurality of radiating fins by penetrating the through hole vertically with a certain interval by the ring edge ,
(D) A copper base plate formed with a concave groove corresponding to the heat pipe is arranged perpendicular to the arrangement of the plurality of heat radiating fins, and the other U-shape of the heat pipe is soldered, gold, or It is a method for manufacturing a heat dissipation module, comprising a step of directly joining with a brazing material such as silver .

The base plate and the heat pipe in the step (D) are bonded by a bonding material .

The bonding material is a brazing material made of solder, gold, or silver .

Material of the plurality of heat radiating fins are aluminum, wherein the material of the base plate and the heat pipe is copper.

The invention of claim 2 is the structure of the heat dissipation module,
It is composed of a plurality of aluminum radiating fins, a plurality of U-shaped copper heat pipes, and a plurality of copper base plates.
The heat dissipating fin is provided with a copper heat pipe through-hole and a protruding ring edge is formed on one side thereof to give a constant spacing between the fin,
The heat pipe passes through the through hole in one of the U-shapes, and arranges the radiation fins while maintaining a certain distance by the ring edge to the plurality of radiation fins,
The base plate is provided with a copper heat pipe housing concave groove, and the other U-shaped copper heat pipe is directly joined to the housing groove by a brazing material ,
And conducting heat to the heat pipe via the joining by the base plate or al the brazing material is a heat-dissipating device characterized by comprising as dissipating by the plurality of heat dissipating fins.

Area of the base plate is characterized by smaller than the surface portion constituted by a plurality of heat dissipating fins.

Material of the plurality of heat radiating fins are aluminum, the material of the heat pipe and the base plate is characterized in that it is a copper.

Wherein the plurality of surface portions composed of radiating fins is provided with a lower recess, characterized in that it is used for fitting the base plate.

Said heat pipe, characterized in that at least one curved portion.

  The heat pipe is plural.

Between the base plate and the heat pipe is characterized in that it is joined by the joining material.

The bonding material is solder, characterized in that it is a brazing material made of gold or silver.

  Since the base plate is smaller than that of the known structure, the weight can be made lighter than that of the known structure, and since the base plate and the heat pipe are joined, there is no need to join with a plurality of radiating fins. The nickel plating process, which is performed before joining multiple radiating fins, can be omitted, the manufacturing process can be simplified, the yield rate can be increased, and the manufacturing cost can be greatly reduced. It was.

  The purpose of the present invention, its structure and functional characteristics will be described with reference to the drawings as a relatively preferred embodiment.

3, 4, and 5 show a first relatively preferred embodiment of the present invention. In the structure of the heat dissipation module shown in the figure, at least a plurality of heat dissipation fins 21, heat pipes 22, and a base plate 23 are included. The plurality of heat radiating fins 21 are provided with a coaxial upper through hole 211 and a coaxial lower through hole 212, and projecting ring edges 2111 and 2121 are provided on one side of the hole edge. Between the fins arranged in parallel, a flow passage 213 having a width of the ring edges 2111, 2121 is opened, and the gas flows, and the upper through hole 211 and the lower through hole 212 pass through the passage. There are a plurality of heat pipes 22 each having a U-shape having at least one curved portion 221, and both ends of the heat pipe 22 have a plurality of radiating fins, respectively. 1 passes through a passage formed by an upper through-hole 211 and a lower through-hole 212 provided therein, whereby the plurality of heat radiation fins 21 and the heat pipe 22 are joined, and the base plate 23 is a heat pipe. 22 and the same material
One surface is a flat surface, and the other surface is provided with a recessed groove, and one surface of the groove of the base plate 23 is formed by a bonding material having excellent thermal conductivity such as solder, gold, or silver. And the heat pipe 22 are joined, and the base plate 23 is in contact with a surface portion constituted by a plurality of radiating fins 21, and the area of the base plate 23 is constituted by a plurality of radiating fins 21. Smaller than the surface part.

  A lower concave portion 214 is locally provided on a surface portion constituted by the plurality of heat radiation fins 21, and the heat pipe 22 penetrating through the lower through hole 212 is locally exposed, It is joined to the heat pipe 22, and the base plate 23 is fitted in the place of the lower concave portion 214. Further, the material of the plurality of radiating fins 21 is aluminum, and the material of the base plate 23 and the heat pipe 22 is Since it is copper and the material of the base plate 23 and the heat pipe 22 is the same copper, the heat is quickly conducted and further radiated by the plurality of radiation fins 21.

The manufacturing method of the above-mentioned heat radiation module is shown below.
(A) A coaxial upper through hole 211 and lower through hole 212 are provided separately on the plurality of heat radiating fins 21, and projecting ring edges 2111 and 2121 are formed on one side of the through holes 211 and 212.
(B) The plurality of heat radiating fins 21 are arranged in parallel, the widths of the ring edges 2111, 2121 are provided between the fins, and the through holes 211, 212 of the plurality of heat radiating fins 21 form a passage. .
(C) The heat pipe 22 passes through the through holes 211 and 212 and passes through the passage, and fixes the plurality of heat radiation fins 21 and the heat pipe 22.
(D) A base plate 23 made of the same material as the heat pipe 22 is connected to the heat pipe 22.

  Further, since the base plate 23 is made smaller than that of the known structure, the weight can be made lighter than that of the known structure, the base plate 23 and the heat pipe 22 are joined, and the plurality of radiating fins 21 are joined. Therefore, it is possible to omit the nickel plating process performed before joining the plurality of heat radiation fins 21, simplify the manufacturing process, increase the yield rate, and increase the manufacturing cost. Can be greatly reduced.

  FIGS. 6, 7 and 8 show a second comparatively preferred embodiment of the present invention. The overall structure, function and implementation state are the same as those of the above-described embodiment, but the difference is that The plate 33 is flat on both sides, further provided with through holes 331 from the side, and the plurality of heat radiation fins 21 are provided with upper through holes 211, and the surface portions of the plurality of heat radiation fins 21 are recessed. A groove 312 is provided, a part of the heat pipe 22 passes through the upper through hole 211 provided in the plurality of heat radiation fins 21, and a part of the heat pipe 22 is fitted in the concave groove 312 of the plurality of heat radiation fins 21. The portion of the heat pipe 22 that is inserted into the concave groove 312 is half exposed, and further penetrates through a through-hole 331 provided in the base plate 33, thereby the heat pipe 22 and the base plate 33. They are joined.

  9, 10 and 11 show a third comparatively preferred embodiment of the present invention. The overall structure, function and state of implementation are the same as in the previous embodiment, but the difference is that The pipe 43 has two curved portions 431, has an S-shape, forms a pipe upper stage 432, a pipe middle stage 433, and a pipe lower stage 434, and a plurality of heat radiation fins are in two sets. The first set of heat radiation fins 41 are provided with a through hole 411 and a concave groove 412, and a protruding ring edge 4111 is formed on one side of the through hole 411. A flow path having a width of the ring edge 4111 is formed between the plurality of first set of heat dissipating fins 41 arranged. The plurality of heat dissipating fins 42 of the second set include a through hole 421, a concave groove 422, and a lower portion. A recess 423 is provided; A protruding ring edge 4211 is formed on one side of the through hole 421, and a flow path having a width of the ring edge 4211 is formed between the plurality of second radiating fins 42 arranged in parallel. The pipe upper stage 422 of the pipe 43 passes through the through holes 411 in the first set of the plurality of heat radiation fins 41, and the concave groove 412 in the first set of heat radiation fins 41 is the upper half of the pipe middle stage 433 of the heat pipe 43. The pipe lower stage 434 of the heat pipe 43 penetrates through holes 421 provided in the second set of the plurality of radiating fins 42, and in the second set of radiating fins 42. The concave groove 422 fits the lower half of the pipe middle stage 433 of the heat pipe 43, and the first set of the plurality of heat radiation fins 41 and the second set of the plurality of heat radiation fins 42 are joined to the heat pipe 43. Further the lower recess 423 in the plurality of heat dissipating fins 42 are pipe lower 434 of the second set the heat pipe 43, locally exposed, the base plate 23 and the heat pipe 43 is joined.

  The above embodiment is merely a comparatively preferred embodiment of the present invention, and various changes using the method, shape, structure, and apparatus in the present invention are also included in the scope of the right of the present invention.

It is an exploded view of the thermal radiation module by a well-known structure. It is a perspective view after the assembly of the thermal radiation module by a well-known structure. FIG. 3 is an exploded view of the first relatively preferred embodiment of the present invention. FIG. 3 is a perspective view after assembly in the first relatively preferred embodiment of the present invention. 1 is a cross-sectional view of a first relatively preferred embodiment of the present invention. FIG. 4 is an exploded view of a second relatively preferred embodiment of the present invention. FIG. 6 is a perspective view after assembly in a second relatively preferred embodiment of the present invention. FIG. 6 is a cross-sectional view of a second relatively preferred embodiment of the present invention. FIG. 6 is an exploded view of a third relatively preferred embodiment of the present invention. FIG. 6 is a perspective view after assembly in a third relatively preferred embodiment of the present invention. FIG. 6 is a cross-sectional view of a third relatively preferred embodiment of the present invention.

Explanation of symbols

11 Multiple radiating fins 111 Through hole 12 Base plate 13 Heat pipe 21 Multiple radiating fins 211 Upper through hole 2111 Ring edge 212 Lower through hole 2121 Ring edge 213 Flow path 214 Lower recess 22 Heat pipe 221 Curved portion 23 Base plate 33 Base Plate 331 Through-hole 312 Concave groove 41 First set of plurality of radiation fins 411 Through hole 4111 in first set of plurality of radiation fins Ring edge 412 in first set of plurality of radiation fins In first set of plurality of radiation fins Concave groove 42 Second set of plurality of radiation fins 421 Through hole 4211 in second set of plurality of radiation fins Ring edge 422 in second set of plurality of radiation fins Concave groove 423 in second set of plurality of radiation fins 423 Second Lower concave portion 43 in a plurality of heat dissipating fins 43 Heat pipe 431 Curved portion 432 Pipe upper stage 433 Pipe middle stage 434 Pipe lower stage

Claims (5)

A method of manufacturing a heat dissipation module,
(A) providing a heat pipe through-hole made of copper in a plurality of heat-radiating fins made of aluminum and forming a protruding ring edge on one side of the through-hole to give a constant spacing between the fins;
(B) arranging the plurality of heat dissipating fins in parallel;
(C) One of the copper U-shaped heat pipes is fixed to the plurality of radiating fins by penetrating the through hole vertically with a certain interval by the ring edge ,
(D) A copper base plate formed with a concave groove corresponding to the heat pipe is arranged perpendicular to the arrangement of the plurality of heat radiating fins, and the other U-shape of the heat pipe is soldered, gold, or A method of manufacturing a heat dissipation module, comprising a step of directly joining with a brazing material such as silver . In the structure of the heat dissipation module,
It is composed of a plurality of aluminum radiating fins, a plurality of U-shaped copper heat pipes, and a plurality of copper base plates.
The heat dissipating fin is provided with a copper heat pipe through-hole and a protruding ring edge is formed on one side thereof to give a constant spacing between the fin,
The heat pipe passes through the through hole in one of the U-shapes, and arranges the radiation fins while maintaining a certain distance by the ring edge to the plurality of radiation fins,
The base plate is provided with a copper heat pipe housing concave groove, and the other U-shaped copper heat pipe is directly joined to the housing groove by a brazing material ,
Radiator module characterized by comprising as dissipating by the plurality of radiating fins by conducting heat to the heat pipe via the joining by the base plate or al the brazing material.   The structure of the heat radiating module according to claim 2, wherein an area of the base plate is smaller than a surface portion constituted by a plurality of heat radiating fins.   The surface portion composed of the plurality of heat dissipating fins is provided with a lower concave portion to constitute a portion into which a base plate is fitted, and the heat pipe is provided with at least one curved portion. The structure of the heat dissipation module according to claim 2.   The heat dissipation module structure according to claim 2, wherein the base plate and the heat pipe are joined by a joining substance made of a solder material such as solder, gold, or silver.

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