M354101 八、新型說明： 【新型所屬之技術領域】 本創作是有關-種散熱模組結構，尤指—種具有可提 升散熱歡結構強度及增加熱料面積陳麵組結 元。 【先前技術】M354101 VIII. New Description: [New Technology Field] This creation is related to the structure of a heat-dissipating module, especially a kind of structure that can enhance the structural strength of the heat-dissipating structure and increase the area of the hot material. [Prior Art]
近年來’隨著電子資訊科技的突雌進，使得電子 品（如電腦、筆記型電腦）之使用日趨普及且應用更為廣 泛，:在電子產品中，以電腦為例，因電腦之中央處理器 的運舁處理速度财、存轉料加之轉魏，使得中 央處理器的發熱功率亦隨著不斷攀升。 為了預防中央處理器過熱而導致電腦裝置發生暫時性 效’因此，電腦裝置需要有足夠之散熱_ =使中央處理n能正常運作。為能移除中央處理器於高速 作時所產生之熱能，進而俾中央處理器在高速運作時仍 Γ維持在正錄態、，f知技㈣將—錄池直接配置在 中央處理器（Center Pr〇cess〇r _，cpu)上以使中央 ，理裔所產生之熱能可H由散熱歡财地散逸至外界環 境。 a請參閱第1圖所示，習知之散熱模組結構，係包括一 放熱鰭片組110、-熱導管12〇、一固定部13〇及一散埶基 幻1，前述熱導管⑽具有—傳導部122及一散熱部 23 ’前述散熱鰭片組11〇係套設於前述熱導f⑽之散熱 5 M354101 邛123 ’則述傳導部122係穿設於該散熱基座140與該固 疋。P 13G間’且該散絲座⑽之底面係貼_相 處理器（圖中未示）之表面。 兴In recent years, with the advancement of electronic information technology, the use of electronic products (such as computers and notebook computers) has become more popular and widely used. In electronic products, computers are used as examples, because of the central processing of computers. The processing speed of the device, the transfer of materials and the transfer of the Wei, so that the heating power of the central processor is also rising. In order to prevent the central processor from overheating, the computer device is temporarily activated. Therefore, the computer device needs to have sufficient heat dissipation _ = to enable the central processing n to operate normally. In order to remove the thermal energy generated by the central processing unit during high-speed operation, and then the central processing unit maintains the positive recording state during high-speed operation, the CPU is directly configured in the central processing unit (Center). Pr〇cess〇r _, cpu) to enable the central, the heat generated by the intellectuals can be dissipated from the heat to the outside world. a, as shown in FIG. 1 , the conventional heat dissipation module structure includes a heat releasing fin set 110, a heat pipe 12〇, a fixing portion 13〇, and a heat sinking base 1 , and the heat pipe (10) has — The conductive portion 122 and the heat dissipating portion 23' are disposed on the heat dissipating fins (10). The conductive portion 122 is disposed through the heat dissipating susceptor 140 and the fixing portion. The bottom surface of the P 13G and the bottom surface of the loose wire holder (10) is attached to the surface of a phase processor (not shown). Xing
當前述中央處理器產生熱源時，藉由前述散熱基座14〇 將產生之熱源料至該熱導管12()之傳導部122，飼該 導部122再將熱源傳導至該散熱部123，並再經由前述散 熱部123將熱源傳遞給該散熱鰭片組11G，前述散熱鰭片 組110將熱肋輻射方式對外概作散熱，但是，僅藉由 及熱導f 12G作熱源料，無法即時將熱源傳遞給前述散 熱鰭片組110 ’並麵料部122财部分透過以塗佈錫 =或以點焊之方式與前述固定部13〇及散熱基座14〇固 疋’因此’使得前述散熱模減構運送巾料因受到搖晃 或震動而產生結構鬆脫等問題。 以上所述，習知之散熱模組結構，其具有下列之缺點： 結構強度不穩固。 2. 熱傳導效率不佳。 3. 散熱效果不良。 是以，要如何解決上述習用之問題與缺失，即為本案 之創作人與從事此行業之_廠商欲研究改善之方向 所在者。 【新型内容】 妥此’為有效解決上述之問題，本創作之主要目的， 係提供-種增加散軸域構強度的強化散減組結構之 M354101 單元（一）。 本創狀:欠要目的，储供—種可增加散熱模組熱傳 導效能的散熱模組結構單元（一）。When the central processing unit generates a heat source, the heat source generated by the heat dissipation base 14 至 is fed to the conductive portion 122 of the heat pipe 12 (), and the guide portion 122 feeds the heat source to the heat dissipation portion 123, and Then, the heat source is transmitted to the heat dissipation fin group 11G via the heat dissipation portion 123. The heat dissipation fin group 110 radiates heat to the outside of the heat dissipation fin group. However, the thermal conduction f 12G is used as the heat source material, and the heat dissipation material cannot be used immediately. The heat source is transmitted to the heat dissipation fin set 110' and the portion of the fabric portion 122 is transparently coated with tin or welded to the fixing portion 13 and the heat dissipation base 14 by spot welding. The structure of the transporting towel is loosened or shaken to cause structural looseness. As described above, the conventional heat dissipation module structure has the following disadvantages: The structural strength is not stable. 2. Thermal conduction efficiency is not good. 3. Poor heat dissipation. Therefore, how to solve the above problems and problems in the past, that is, the creators of this case and the manufacturers who are engaged in this industry want to study and improve the direction. [New content] In order to effectively solve the above problems, the main purpose of this creation is to provide a M354101 unit (1) that enhances the structure of the scattered-domain structure. This creation: the purpose of the lack of purpose, storage and supply - a thermal module structure unit that can increase the thermal conductivity of the thermal module (1).
為達上述目的，本_之目的，係—種触散熱模組 、、'σ構之單元㈠，其包括：—散熱鳍片組、-散熱基座及 至少-熱導管，前述熱導管具有一傳導部及一散熱部，前 述散熱部穿接於該散熱鳍片組，前述傳導部係觸接該散熱 基座’該散熱鳍片組具有複數散熱鳍片，該等散 隔列形成，並且每-散熱鰭片具有至少_σ，崎述散 熱基座具有至少歧臂，料支臂分騎賴接前述凹 口，藉由該等支臂不僅增加雜模組整體結構強度，進而 =可增加熱料效率’令散熱·具有絕佳之散熱效能 者。 【實施方式】 本創作之上述目的及其結構與功能上的特性，將依據 所附圖式之較佳實施例予以說明。 請-併參閱第2、3圖所示，本創作係一種強化散熱模 組結構之單元㈠，在本創作之—較佳實施例巾，係包括 一散熱鳍片組20、一散熱基座40及至少—熱導管3〇，前 述散熱鰭“ 2G係具有複數散熱鳍片2(η，該·熱鳍片 201間隔排列形成，且每一散熱鳍片2〇1具有至少兩凹口 203及至>、一穿孔204，各該穿孔204係用以供前述敎導管 30所穿設。 … 7 M354101 該等凹口 203係設於前述散熱鳍片201之相對兩側， 其中前述凹口 203係可為彼此相對及彼此不相對之其中任 一；在本較最佳實施例中，前述凹口 2〇3係以彼此相對說 明表示，惟本創作實際實施時，並不侷限於此。 另者，前述散熱鳍片201之凹口 203兩侧分別設有一 第-折邊206及-第二折邊207 ’前述第一折邊206及第 二折邊207之底面係分別抵接另一散熱鰭片2〇1之一侧端In order to achieve the above purpose, the purpose of the present invention is a heat-dissipating module, and a unit of the 'sigma structure, which includes: a heat sink fin group, a heat sink base and at least a heat pipe, the heat pipe has a heat pipe a conducting portion and a heat dissipating portion, the heat dissipating portion is connected to the heat dissipating fin group, and the conducting portion is in contact with the heat dissipating base. The heat dissipating fin group has a plurality of heat dissipating fins, and the separated rows are formed, and each The heat dissipating fin has at least _σ, and the heat dissipating susceptor has at least a distracting arm, and the material arm straddles the notch, and the arm not only increases the overall structural strength of the hybrid module, and further increases heat Material efficiency 'allows heat dissipation · has excellent heat dissipation performance. [Embodiment] The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings. Please refer to the second and third figures. The present invention is a unit (1) for reinforcing the structure of the heat dissipation module. The preferred embodiment of the present invention comprises a heat dissipation fin set 20 and a heat dissipation base 40. And at least the heat pipe 3〇, the heat dissipation fin “2G has a plurality of heat dissipation fins 2 (n, the heat fins 201 are arranged at intervals, and each of the heat dissipation fins 2〇1 has at least two notches 203 and to> And a through hole 204, each of the through holes 204 is provided for the stern tube 30. 7 M354101 The notches 203 are disposed on opposite sides of the heat dissipation fin 201, wherein the notch 203 is In the preferred embodiment, the aforementioned notches 2〇3 are shown in opposite directions to each other, but the actual implementation of the present invention is not limited thereto. The first hem 206 and the second hem 207 are respectively disposed on the two sides of the recess 203 of the heat dissipation fin 201, and the bottom surfaces of the first flange 206 and the second flange 207 respectively abut the other heat dissipation fins. One side of 2〇1
面0 &别述熱導管30係包含一傳導部301及一散熱部302， 則述傳導# 301係觸接該散熱基座，前述散熱鳍片組 ，套設於前述散熱部3〇2 ;前述散熱基座4〇具有至少兩支 1〇及1^凹槽420 ’其中該等凹槽420係用以容置該傳 導^謝1^該等支臂分別對應喪接前述凹口 203，並 且别述支臂41G與該凹口 2G3係為緊配合的散接。 , μ阶丞！刊々日蚵该敢熟鳍片組20之另面 ，與至）一發熱單元(圖中未示）接觸，其中前述發埶單元 係為=央處理器(Center阡⑽瓣耐，_:、、 、’j it發鱗域钱;科，該散熱基座4 f給該熱導管加之傳導部斯，以及透過前述支臂410 二分佈地傳導給前述散熱鰭片組20之散_片 ’則述熱導管30之傳導部3〇1係將熱量傳遞給該散熱 。〇2,再經由前述散熱部3〇2將熱源傳導給予串咬其上 傳遞部分之熱 一、 另方面係可增加前述散熱基座40 8 M354101 與散熱鳍片組20結合之結構強度，進而提升熱傳導效能以 及增強結構組合強度，以使散熱模组具有絕佳之散敎效能 者。 ’、 - 接著續—併錢第4、5 ®所示，係為本創作之另一較 佳實施例，該其整體結構及元制連結_大致與前一實 施例相同，在此不另外贅訴相同處，在本實施例中相較前 -實補不同處為前述支臂赫錄熱基座4Q之一端 ❿ 財一延伸部411，前述延伸部411相對該散熱鰭片組2〇 遠離該散熱基座40之-侧，且其用以抵壓該散熱鳍片組 20 ° 前述延伸部411之-端為固定端413，另一端為自由 端414，前述自由端414設一凸塊415，並前述散熱鰭片 201與該凸塊415相對應之處具有一凹孔417，且該凸塊 415嵌入前述凹孔417(如第4圖所示），進而以提升固定散 熱模組結構之效果者；其中前述固定端413與該支臂41〇 固定，換言之，前述固定端413係連接該支臂410，並且 該固定端413係由該支臂410延伸形成。 請參照第6、7A、7B圖所示，係為本創作之另一較佳 實施例，如圖所示，前述散熱基座所延伸構形之支臂 410係具有至少一摺邊418，前述摺邊418朝該支臂410相 對方向凸伸，且形成於該支臂41〇的兩侧，並前述散熱鰭 片組20與該支臂410相對應之凹口 203處更形成有至少一 插槽205，該插槽205與前述摺邊418相對應，當前述支 臂410嵌入前述凹口 203時，前述摺邊418恰嵌入前述插 9 M354101 槽205内，可令前述支臂41〇具有更為緊密之結合性；另 者’前述支臂410遠離該散熱基座4〇之一端更具有一延伸 部411，前述延伸部411相對該散熱鳍片組2〇遠離該散熱 基座40之一侧，且其用以抵壓該散熱鰭片組2〇。 前述延伸部411之一端為固定端413,另一端為自由 端414，前述自由端414設一凸塊415，並前述散熱轉片 201與該凸塊415相對應之處具有一凹孔417，且該凸塊 415嵌入前述凹孔417。 以上所述，本創作係一種強化散熱模組結構之單元 (一），其具有下列之優點： 1. 具有增加結構強度。 2. 具有增加導熱效率。 3. 散熱效果佳。 惟以上所述者’僅縣創作之難可行之實施例而 已’舉凡利用本創作上述之方法、形狀、構造、裝置所為 之變化’皆應包含於本案之翻範圍内。 【圖式簡單說明】 第1圖係習知之散熱模組結構示意圖； =圖係本創作之強化模組結構之分解示意圖； =係本創作之強化模組結構之組合示意圖； 苐4圖係本創作之另—触模組 第5圖係本創作之… 77 強化杈組結構之組合示意圖 M354101 第6圖係本創作之另一強化模組結構之分解示意圖； 第7A圖係本創作之另一強化模組結構之組合示意圖； 第7B圖係本創作之另一強化模組結構之剖面示意圖。 【主要元件符號說明】 散熱鳍片組 -20 散熱基座… 40 散熱鳍片 …201 支臂 … 410 凹口 …203 延伸部 … 411 穿孔 …204 固定端 … 413 插槽 …205 自由端 … 414 第一折邊 …206 凸塊 … 415 第二折邊 …207 凹孔 … 417 熱導管 …30 摺邊 … 418 傳導部 …301 凹槽 … 420 散熱部 …302 11The surface of the heat pipe 30 includes a conductive portion 301 and a heat dissipating portion 302, wherein the conduction #301 is in contact with the heat dissipation base, and the heat dissipation fin group is sleeved on the heat dissipation portion 3〇2; The heat dissipation base 4 has at least two 1 〇 and 1 recess 420 ′, wherein the grooves 420 are used to accommodate the conduction, and the arms respectively corresponding to the aforementioned recess 203, and The arm 41G and the notch 2G3 are closely coupled to each other. , μ order 丞! The other side of the daring fin group 20 is in contact with a heat generating unit (not shown), wherein the hairpin unit is a central processor (Center 阡 (10) flap resistant, _:, And the heat sink base 4 f is coupled to the heat pipe and the conductive portion is distributed to the heat sink fin group 20 through the arm 410. The conduction portion 3〇1 of the heat pipe 30 transmits heat to the heat dissipation. 〇2, and then transmits the heat source through the heat dissipation portion 3〇2 to give heat to the transmission portion of the string, and otherwise increases the heat dissipation. The structural strength of the base 40 8 M354101 combined with the heat sink fin set 20, thereby improving the heat transfer performance and enhancing the structural combination strength, so that the heat dissipation module has excellent divergence performance. ', - Continued - and money 4 And 5 ® is another preferred embodiment of the present invention. The overall structure and the meta-connection are substantially the same as in the previous embodiment, and the same is not claimed herein. In this embodiment, The difference between the front and the real is the one end of the aforementioned arm. The extension portion 411 is opposite to the side of the heat dissipation base 40 away from the heat dissipation fin group 2, and is used for pressing the heat dissipation fin group 20°. The end of the extension portion 411 is a fixed end 413. The other end is a free end 414, the free end 414 is provided with a bump 415, and the heat sink fin 201 has a recess 417 corresponding to the bump 415, and the bump 415 is embedded in the recess 417 ( As shown in FIG. 4, the effect of fixing the structure of the heat dissipation module is further improved; wherein the fixed end 413 is fixed to the arm 41, in other words, the fixed end 413 is connected to the arm 410, and the fixed end is The 413 is formed by extending the arm 410. Referring to Figures 6, 7A and 7B, it is another preferred embodiment of the present invention. As shown in the figure, the arm of the extended configuration of the heat sink base is shown. The 410 series has at least one flange 418 protruding from the opposite direction of the arm 410 and formed on both sides of the arm 41 , and the heat dissipation fin set 20 corresponds to the arm 410 . At least one slot 205 is formed at the recess 203, and the slot 205 corresponds to the aforementioned flange 418. When the arm 410 is embedded in the recess 203, the flange 418 is embedded in the groove 205 of the slot M354101, so that the arm 41〇 can be more tightly coupled; and the arm 410 is away from the heat dissipation. One end of the base 4 has an extension portion 411. The extension portion 411 is away from the heat dissipation base 40 on one side of the heat dissipation fin assembly 2 and is used to press the heat dissipation fin group 2 . One end of the extending portion 411 is a fixed end 413, and the other end is a free end 414. The free end 414 is provided with a protrusion 415, and the heat-dissipating fin 201 has a recess 417 corresponding to the protrusion 415, and the hole 417 The bump 415 is embedded in the aforementioned recessed hole 417. As mentioned above, this creation is a unit (1) for strengthening the structure of the heat dissipation module, which has the following advantages: 1. It has an increased structural strength. 2. Has increased thermal conductivity. 3. Good heat dissipation. However, the above-mentioned examples of the difficulty in the creation of the county alone, and the changes in the methods, shapes, structures, and devices described above by the present invention are all included in the scope of the present disclosure. [Simple diagram of the diagram] Fig. 1 is a schematic diagram of the structure of the heat dissipation module of the conventional method; = diagram of the structure of the enhanced module structure of the creation; = a combination diagram of the structure of the reinforcement module of the creation; 苐4 diagram The other part of the creation - the touch module is shown in Fig. 5... The combination diagram of the enhanced 杈 group structure M354101 Fig. 6 is an exploded view of another reinforced module structure of the creation; the 7A picture is another of the creation A schematic diagram of the combination of the enhanced module structure; Figure 7B is a schematic cross-sectional view of another enhanced module structure of the present invention. [Main component symbol description] Heat sink fin set-20 Heat sink base... 40 Heat sink fin...201 Arm... 410 Notch...203 Extension... 411 Perforation...204 Fixed end... 413 Slot...205 Free end... 414 One fold...206 bump... 415 second fold...207 recess... 417 heat pipe...30 hemming... 418 duct...301 recess... 420 heat sink...302 11