M351395 八、新型說明： 【新型所屬之技術領域】 本創作是有關一種散熱模組結構，尤指一種具有可提 升散熱模組結構強度及增加熱傳導面積的散熱模組結構單 元。 【先前技術】 近年來’隨著電子資訊科技的突飛猛進，使得電子產 品（如電月1、筆記型電腦）之使用日趨普及且應用更為廣 泛’而在電子產品中’以電腦為例，因電腦之中央處理器 的運算處理速度提升、存取容量增加之趨勢發展，使射 央處理器的發熱功率亦隨著不斷攀升。 為了預防中央處理器過熱而導致電腦裝置發生暫時性 性的失效，因此’電腦裝置f要有足夠之散熱能力 、紐±央處理U纟運作。為能移除巾央處理器於高速 H、所產生之熱能，轴俾巾央處理器在高速運作時仍 境 ’習知技術係將—散熱模組直接配 中央處理器（centerprQC咖runit，_上，以使中央 =理器所產生之難可藉由憾额迅速地躺至外界 參閱第1圖所示，w知之散熱模組結構，係包括一 二鳍片組no、-熱導管12〇、一固定部13〇及一散熱基 123,前述散埶鳍片组ηί)Μ ^ &及-散熱部 片，、且110係套設於前述熱導管120之散埶 5 M351395M351395 VIII. New Description: [New Technology Field] This creation is about a heat dissipation module structure, especially a heat dissipation module structure unit that can enhance the structural strength of the heat dissipation module and increase the heat conduction area. [Prior Art] In recent years, with the rapid advancement of electronic information technology, the use of electronic products (such as electricity month 1, notebook computers) has become more popular and widely used. In electronic products, computers are used as examples. The computer processing speed of the central processing unit of the computer is increasing, and the access capacity is increasing. The heating power of the central processing unit is also rising. In order to prevent the central processor from overheating and causing temporary failure of the computer device, the computer device f must have sufficient heat dissipation capability and the operation of the system. In order to remove the heat energy generated by the towel processor at the high speed H, the axis wiper central processor is still in the high-speed operation. The conventional technology system will be equipped with a central processing unit (centerprQC coffee unitit, _ In order to make the difficulty generated by the central unit, it can be quickly lie to the outside world by the regrets. Referring to Figure 1, the heat dissipation module structure includes a two-fin group no, a heat pipe 12〇 a fixing portion 13A and a heat dissipating base 123, the above-mentioned divergent fin group ηί) Μ ^ & and - heat dissipating portion, and 110 is sleeved on the heat pipe 120 of the heat sink 5 M351395
處理器(圖中未示)之表面。 於該散熱基座140與該固 之底面係貼附於相對中央The surface of the processor (not shown). The heat dissipation base 140 and the bottom surface of the solid are attached to the opposite center
將產!前:中央處理器產生熱源時，藉由前站 =生之熱源傳導至該熱導管m之傳導部 導部122再將献、:盾扁增π . it使知别述散熱模組結構運送中容易因受到搖晃 或震動而產生結構鬆脫等問題。 以上所述’習知之散熱模組結構，其具有下列之缺點： 1·結構強度不穩固。 2.熱傳導效率不佳。 3·散熱效果不良。 是以，要如何解決上述習用之問題與缺失，即為本案 之:i]作人與從事此行業之摘隱商所逐欲研究改善之方向 所在者。 【新型内容】 ^ β爰此，為有效解決上述之問題，本創作之主要目的， 係提供-種增加散熱抵组結構強度的強化散熱模組結構之 6 M351395 本創作之次要目的，係提供一種可増加散熱模組熱傳 導效能的強化散熱模組結構單元。 為達上述目的，本創作之目的，係—種強化散熱模组 結構之單元’其包括：-散熱縛片組、—熱導管及一散熱 基座’前述熱導管具有-傳導部及—散熱部，前述散熱& 牙接δ亥散熱鰭片組，前述傳導部係觸接前述散熱基座，且 該散熱基座具有至少兩支臂，各該支臂具有一延伸端朝該 ♦ 散熱鰭片組延伸抵接，藉由前述該等支臂之延伸端增加結 構強度，進而又增加導熱面積，以提升散熱模組結構之散 熱效果者。 【實施方式】 本創作之上述目的及其結構與功能上的特性，將依據 所附圖式之較佳實施例予以說明。 凊-併參閱第2、3、4圖所示，本創作係一種強化散 _ 馳組結構之單元’林創狀—較錄蝴巾，係包括 —散熱鰭片組20、-熱導管30及-散熱基座4〇，前述散 ^鰭片組20係、由複數散熱鰭》201對應堆疊組成，且每一 ，熱鰭片201具有至少一開孔2〇2，用以供該熱導管3〇穿 攻。 Λ，述熱導管30具有一傳導部301及-散熱部302，該 放…、邛302係穿接前述散熱鰭片組2〇之每一散熱鰭片 2〇1，該傳導部3〇1係觸接該散熱基座40，並且該散熱基 座4〇具有至少兩支臂410及二凹孔420，該等凹孔420係 7 M351395 用以谷置該傳導部3〇1 ; :前述支臂41〇 係形成於該散熱基 座40相對該散熱鰭片組20的一側。 _各該支臂具有-延伸端411 ^伸端411朝該散熱鰭片組Before production: Before the central processor generates a heat source, it is transmitted to the conduction portion guide 122 of the heat pipe m by the heat source of the front station = the heat source m, and then the shield is increased by π. In structural transportation, problems such as loose structure or looseness are caused by shaking or vibration. The above-mentioned conventional heat dissipation module structure has the following disadvantages: 1. The structural strength is not stable. 2. Thermal conduction efficiency is not good. 3. The heat dissipation effect is poor. Therefore, how to solve the above problems and shortcomings in this case is the case: i] the person who is engaged in the research and improvement of the industry. [New content] ^ β爰, in order to effectively solve the above problems, the main purpose of this creation is to provide a kind of enhanced heat dissipation module structure that increases the structural strength of the heat dissipation. 6 M351395 The second purpose of this creation is to provide An enhanced heat dissipation module structural unit capable of adding thermal conduction performance of a heat dissipation module. In order to achieve the above object, the purpose of the present invention is to provide a unit for reinforcing a heat dissipation module structure, which comprises: a heat dissipation tab group, a heat pipe and a heat dissipation base, wherein the heat pipe has a conduction portion and a heat dissipation portion. The heat dissipation & 牙 δ 散热 散热 散热 散热 , , , , , δ δ δ δ δ δ δ δ δ δ δ δ δ δ δ δ δ δ δ δ δ δ δ δ δ δ δ δ δ δ δ δ δ δ δ δ δ The group extends and abuts, and the structural strength is increased by the extending ends of the arms, and the heat conduction area is further increased to improve the heat dissipation effect of the heat dissipation module structure. [Embodiment] The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings.凊 - and as shown in Figures 2, 3, and 4, this creation is a unit that enhances the structure of the scatter-type structure, which is a creator-like towel, including a heat-dissipating fin set 20, a heat pipe 30, and a heat dissipation base 4, wherein the plurality of fin sets 20 are composed of a plurality of heat sink fins 201 corresponding to each other, and each of the heat fins 201 has at least one opening 2〇2 for the heat pipe 3 〇 wear the attack. The heat pipe 30 has a conductive portion 301 and a heat radiating portion 302. The heat sinking portion 302 is connected to each of the heat radiating fins 2'' The heat dissipation base 40 is contacted, and the heat dissipation base 4 has at least two arms 410 and two recessed holes 420, and the recessed holes 420 are 7 M351395 for holding the conductive portion 3〇1; 41〇 is formed on one side of the heat dissipation base 40 with respect to the heat dissipation fin group 20. Each arm has an extended end 411 and an extended end 411 toward the heat sink fin set
^另者，前述散熱基座40相對該散熱籍片組2〇之另面 係貼附於-發熱單元(圖中未示），其中前述發 如中央處理器（Center ProcessorUnit，cpu)「 田°亥發熱單元產生熱量時，該散熱基座4〇係將熱量傳 導給該熱導管30之傳導部301，以及透過前述支臂41〇之 延伸端411將熱量傳遞給前述散熱鰭片組2〇，前述熱導管 30之傳導部301係將熱量傳遞給該散熱部302，再經由該 散熱部302將熱量傳遞給前述散熱鰭片組20，其中前述延 伸端411不僅可傳遞部分之熱量給前述散熱鰭片組2〇，另 一方面係可增加前述散熱基座40與前述散熱鰭片組20結 合之結構強度，故可有效提升熱傳導效能以及增強結構組 合強度。 接著續參閱第4圖所述，前述散熱基座40設有一散熱 器50(Heat sink)，前述散熱器50係配置於該散熱基座40 相對該散熱鰭片組20之面上，且前述熱導管3〇之傳導部 3〇1係穿設於該散熱器50與該散熱基座40相接處。 M351395 當前述發熱單元產生熱量時，該散熱基座40分別將熱 量傳遞給前述散熱器5〇與傳導部301及前述支臂410之延 伸端411 ’其中該傳導部3〇1將一部分熱量傳遞給該散熱 部302，嗣再經由該散熱部3〇2將熱量傳遞給予串設其上 之前述散熱鰭片組20，同時，另一部份熱量係分別被傳導 給該散熱器50及該支臂410，前述散熱器50將熱量對外 擴散迅速散熱，嗣，由該支臂410不僅可將熱量傳遞給該 散熱縛片組20外，同時前述支臂41〇自身亦可以輻射方式 將熱量向外擴散；前述延伸端411在傳遞熱量之過程中， 除了可增加熱傳導效率及導熱面積以輔助散熱外，進而又 可增加整體結構強度。 以上所述，本創作係一種強化散熱模組結構之單元， 其具有下列之優點： 1. 具有增加結構強度。 2. 具有增加導熱效率。 3_散熱效果佳。 惟以上所述者，僅係本創作之較佳可行之實施例而 牛凡用本創作上述之方法、形狀、構造、裝置所為 之變化，皆應包含於本案之權利範圍内。 【圖式簡單說明】 ，1圖係習知之散熱模組結構示意圖，· 第2圖係本創叙触麵模減構分解示意圖； 圖係本創作之強化散熱模組結構組合示意圖； 圖係本創作之另—強化散熱模组結構示意圖。 9 M351395 【主要元件符號說明】 散熱鰭片組 …20 散熱基座… 40 散熱縛片 …201 支臂 … 410 開孔 …202 延伸端 … 411 熱導管 …30 凹孔 … 420 傳導部 …301 散熱器 … 50 散熱部 ...302In addition, the heat dissipation base 40 is attached to the heat-generating unit 2 to the heat-generating unit (not shown), wherein the aforementioned processor (Center Processor Unit, cpu) When the heat generating unit generates heat, the heat sink base 4 transfers heat to the conductive portion 301 of the heat pipe 30, and transmits heat to the heat sink fin group 2 through the extended end 411 of the arm 41〇. The conduction portion 301 of the heat pipe 30 transmits heat to the heat dissipation portion 302, and then transfers heat to the heat dissipation fin group 20 via the heat dissipation portion 302, wherein the extension end 411 not only transmits part of the heat to the heat dissipation fin The sheet set 2〇, on the other hand, can increase the structural strength of the heat sink base 40 combined with the heat sink fin set 20, so that the heat transfer performance and the structural combination strength can be effectively improved. Referring to FIG. 4, the foregoing The heat sink base 40 is provided with a heat sink 50. The heat sink 50 is disposed on the surface of the heat sink base 40 opposite to the heat sink fin group 20, and the heat conducting portion 3 is connected to the heat conducting portion 3〇1. Wear it in The heat exchanger 50 is in contact with the heat dissipation base 40. M351395 When the heat generating unit generates heat, the heat dissipation base 40 transmits heat to the heat sink 5 and the conductive portion 301 and the extended end 411 of the arm 410, respectively. 'The conductive portion 3〇1 transfers a part of the heat to the heat dissipating portion 302, and then transfers heat to the heat dissipating fin group 20 disposed thereon through the heat dissipating portion 3〇2, and at the same time, another heat portion The heat sink 50 is respectively radiated to the heat sink 50 and the arm 410. The heat sink 50 dissipates heat rapidly to the outside, and the arm 410 not only transfers heat to the heat dissipating block group 20, but also the foregoing branch. The arm 41〇 itself can also radiate heat outwardly; the extending end 411 can increase the heat transfer efficiency and the heat transfer area to assist heat dissipation in the process of transferring heat, thereby increasing the overall structural strength. This creation is a unit that strengthens the structure of the heat dissipation module, and has the following advantages: 1. It has increased structural strength. 2. It has increased heat conduction efficiency. 3_The heat dissipation effect is good. The invention is only a preferred embodiment of the present invention, and the changes in the methods, shapes, structures and devices described above are included in the scope of the present application. [Simple description of the schema], 1 Schematic diagram of the structure of the heat-dissipating module of the system, · Figure 2 is a schematic diagram of the decomposing and decomposing of the touch-face mold of the present invention; Figure is a schematic diagram of the structure of the enhanced heat-dissipation module of the creation; 9 M351395 [Description of main components] Heat sink fins...20 Heat sink base... 40 Heat sink tabs...201 Arms...410 Openings...202 Extensions... 411 Heat pipes...30 recessed holes... 420 Conducting... 301 radiator... 50 heat sink...302
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