JP3146514U - Thermal module unit - Google Patents

Abstract

A heat dissipation module having improved heat conduction efficiency as well as structural strength.
The heat-conducting tube includes a heat-radiating tube, a heat-dissipating base, and a heat-dissipating fin-piece set. The heat dissipating part is inserted through the heat dissipating fin piece set. The base includes both support arms 410, and the extended end 411 is provided against the bottom of the heat radiating fin piece assembly to reinforce the support strength, and heat is conducted from the heat radiating base through the extended end to dissipate heat. To improve.
[Selection] Figure 2

Description

  The present invention relates to a heat radiating module structure, and particularly relates to a heat radiating module unit that achieves an improvement in heat radiating module structural strength and an increase in heat conduction area.

  In recent years, the use of electronic products (e.g., computers, notebook computers) has been increasingly increased and widely applied due to dramatic progress in electronic information science and technology. In electronic products, taking a computer as an example, the calculation processing speed of the central processing unit of the computer is improved, and the amount of heat generated by the central processing unit is increased due to the increase in access capacity.

  In order to prevent the computer device from being temporarily or permanently expired due to overheating of the central processing unit, the computer device normally drives the central processing unit with a sufficient heat dissipation effect, and heat generated during high-speed operation of the central processing unit In order to release energy and maintain the normal state even when the central processing unit operates at high speed, in the known technology, a heat dissipation module is directly placed on the central processor unit (CPU), and the thermal energy generated by the central processing unit Is quickly discharged to the outside by a heat dissipation module.

   As shown in FIG. 1, the known heat radiation module structure includes a heat radiation fin piece set 110, a heat conducting tube 120, a fixing portion 130, and a heat radiation base 140. The heat conducting tube 120 includes a conductive portion 122 and a heat radiating portion 123, and the heat radiating fin piece set 110 covers the heat radiating portion 123 of the heat conducting tube 120. The conductive portion 122 includes the heat radiating base 140 and the fixing portion 130. The bottom surface of the heat dissipating base 140 is placed in close contact with the surface facing the central processing unit (not shown).

When the central processing unit generates heat energy, the heat energy generated by the heat radiating base 140 is transmitted to the conductive portion 122 of the heat conducting tube 120, and the conductive portion 122 transmits the heat energy to the heat radiating portion 123. The unit 123 transmits heat energy to the heat dissipating fin piece set 110. The heat dissipating fin piece set 110 dissipates heat by diffusing heat energy outward by a radiation method. However, the heat conducting tube 120 only conducts thermal energy and cannot immediately transmit the thermal energy to the heat dissipating fin piece set 110, and the conducting portion 122 is partially coated with solder paste, or It is only fixed to the fixing part 130 and the heat radiation base 140 by a point soldering method. For this reason, in the above-described heat dissipation module structure, the heat conducting tube is easily bent due to shaking or vibration during transportation, and in the worst case, the entire heat dissipation module structure is broken.
JP-A-11-274383

    The problem to be solved is that the heat dissipation effect is deteriorated because the strength of the whole structure is low and the heat conduction efficiency is poor. Accordingly, it is an object of the present invention to solve the above-mentioned known problems and disadvantages.

  The present invention comprises at least a heat conducting tube, a heat radiation base, and a heat radiation fin piece set. Among them, the heat conducting tube includes a conductive portion and a heat radiating portion. The conductive portion contacts the heat radiating base, and the heat radiating portion is inserted into the heat radiating fin piece set. Further, the base has at least both supporting arms, and each supporting arm has an extended end and extends toward the radiating fin piece set, and contacts the side surface of the radiating fin piece set. The main feature is that not only the overall structural strength of the heat dissipation module is increased by the extended ends of the support arms, but also the heat conduction area is increased, and the heat dissipation module has good structural strength and heat dissipation efficiency. .

  The unit that reinforces the heat dissipation module structure of the present invention has the effect that the structural strength is improved, the heat conduction efficiency is improved, and the heat dissipation effect is improved.

    In order to improve the above-mentioned problems, it is a main object of the present invention to provide a unit that reinforces the heat dissipation module structure.

    It is a next object of the present invention to provide a heat dissipation module structure unit that enhances the heat conduction effect of the heat dissipation module.

In order to achieve the above object, an object of the present invention is a unit that provides a heat dissipation module structure, and includes a heat dissipating fin piece set, at least a heat conducting tube, and a heat dissipating base. The heat conducting tube includes a conductive portion and a heat radiating portion, and the heat radiating portion is inserted into the heat radiating fin piece set. The conductive portion is in contact with the heat radiating base, and the base has at least both support arms, and each support arm has an extended end and extends toward the bottom of the heat radiating fin piece set. In addition to increasing the overall structural strength of the heat dissipation module by the extended ends of the support arms, the heat conduction area is increased and the heat dissipation effect of the heat dissipation module structure is enhanced.
(Implementation method)

The above object of the present invention and its structural and functional characteristics will be described with reference to the best embodiment.

  2, 3, and 4 show a unit in which the heat dissipation module structure of the present invention is strengthened. In one embodiment of the present invention, the heat dissipating fin piece set 20, at least one heat conducting tube 30, and one heat dissipating base are shown. 40. The heat radiating fin piece set 20 is formed by overlapping a plurality of heat radiating fin pieces 201, and each radiating fin piece 201 includes an opening 202 into which the heat conducting tube 30 is inserted.

  The heat conducting tube 30 includes a conductive portion 301 and a heat radiating portion 302. The heat radiating portion 302 is inserted into each heat radiating fin piece 201 of the heat radiating fin piece set 20, and the conductive portion 301 is in close contact with the heat radiating base 40. .

  The heat dissipation base 40 includes a support arm 410 and two concave holes (or concave grooves) 420, and the plurality of concave holes 420 are used to fit and arrange the conductive portion 301. The support arm 410 is formed on the heat radiation base 40 and faces each side of the heat radiation fin piece set 20.

  Each of the support arms 410 described above has an extended end 411 and is extended toward the radiating fin piece set 20 to support it. In other words, the extended end 411 of the support arm 410 is extended toward the 20 locations of the heat dissipating fin piece set 20 and is abutted to the bottom of the heat dissipating fin piece set 20, and further greatly improves the structural strength of the heat dissipating module. The heat energy is conducted to the heat radiating fin piece set 20 through the support arm 410 to improve the heat conductivity of the heat radiating base 40.

  Separately, a heat generating unit (not shown) is disposed in close contact with the side surface of the heat radiation base 40 opposite to the heat radiation fin piece set 20. These heat generating units are, for example, a central processor (CPU).

  When the heat generating unit generates heat, the heat radiating base 40 conducts heat to the conductive portion 301 of the heat conducting tube 30 and further transfers the heat to the heat radiating fin piece set 20 through the extended end 411 of the support arm 410. . The conducting portion 301 of the heat conducting tube 30 conducts heat to the heat radiating portion 302, and then conducts heat to the heat radiating fin piece set 20 through the heat radiating portion 302. The extended end 411 not only conducts part of the heat to the heat dissipating fin piece set 20, but also significantly increases the overall structural strength of the heat dissipating module, thereby effectively increasing the heat conduction efficiency and the structural strength.

  As shown in FIG. 4, the heat dissipation base 40 is provided with a heat sink 50 (Heat sink). The heat radiator 50 is disposed on the heat radiating base 40 and is opposed to the surface of the heat radiating fin piece set 20, and the conductive portion 301 of the heat conducting tube 30 is in contact with the heat radiator 50 and the heat radiating base 40. Insert in place.

  When the heat generating unit generates heat, the heat dissipating base 40 conducts heat to the heat radiator 50, the conductive portion 301, and the extended end 411 of the support arm 410, respectively. The conduction part 301 conducts a part of heat to the heat radiation part 302, and then conducts heat from the heat radiation part 302 to the heat radiation fin piece set 20 connected thereto, and at the same time another part of the heat is Conduction is conducted to the radiator 50 and the support arm 410, respectively. The radiator 50 discharges heat to the outside and immediately radiates heat. The support arm 410 conducts heat to the heat dissipating fin piece set 20, and at the same time, the support arm 410 itself diffuses heat outward by a radiation method. In the process of conducting heat, the extended end 411 increases the heat conduction efficiency and heat conduction area to increase heat dissipation, and further greatly increases the overall structural strength.

  The above description is only a preferred embodiment of the present invention, and all changes due to the above-described methods, shapes, structures, and apparatuses using the present invention are included in the claims of the present invention.

This is a known heat dissipation module structure. It is a decomposition | disassembly instruction | indication figure of the structure which strengthens the thermal radiation module of this invention. It is an assembly instruction diagram for strengthening the heat dissipation module structure of the present invention. FIG. 4 is another instruction diagram for strengthening the heat dissipation module structure of the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 20 Radiation fin piece group 201 Radiation fin piece 202 Opening hole 30 Heat conducting tube 301 Conducting part 302 Heat radiating part 40 Heat radiating base 410 Support arm 411 Extension end 420 Concave hole 50 Radiator

Claims (4)

In the heat dissipation module composed of a heat dissipation fin piece set, a heat conducting tube and a heat dissipation base,
The heat conducting tube includes a conduction portion and a heat radiation portion, the heat radiation portion is inserted and fixed to the heat radiation fin piece set, the conduction portion is disposed in close contact with the heat radiation base, and the base extension end is provided. A heat radiating module unit characterized in that the heat radiating fin piece set is provided and supported by both supporting arms and conducts heat from the base.   The heat radiating module unit according to claim 1, wherein the support arm is formed on the heat radiating base and faces one side of the heat radiating fin piece set.   The heat dissipation module unit according to claim 1, wherein the heat dissipation base is provided with a heatsink.   The heat radiation module according to claim 1, 2 or 3, wherein a bottom portion of the heat radiating fin piece set is opposed to the heat radiating base, and an extended end of the support arm is abutted against the bottom portion of the heat radiating fin piece set. unit.

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