CN112328051B - Novel octopus heat dissipation device - Google Patents
Novel octopus heat dissipation device Download PDFInfo
- Publication number
- CN112328051B CN112328051B CN202011035549.6A CN202011035549A CN112328051B CN 112328051 B CN112328051 B CN 112328051B CN 202011035549 A CN202011035549 A CN 202011035549A CN 112328051 B CN112328051 B CN 112328051B
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- CN
- China
- Prior art keywords
- heat
- pipes
- pipe
- discharging pipe
- double
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 28
- 241000238413 Octopus Species 0.000 title claims abstract description 16
- 238000001816 cooling Methods 0.000 claims abstract description 15
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 12
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 12
- 238000001125 extrusion Methods 0.000 claims abstract description 7
- 239000006096 absorbing agent Substances 0.000 claims abstract description 6
- 239000000758 substrate Substances 0.000 claims abstract description 6
- 238000010438 heat treatment Methods 0.000 claims abstract description 4
- 238000007599 discharging Methods 0.000 claims description 24
- 238000005516 engineering process Methods 0.000 abstract description 3
- 238000010521 absorption reaction Methods 0.000 abstract description 2
- 230000002708 enhancing effect Effects 0.000 abstract description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Abstract
The invention discloses a novel octopus heat dissipation device, which comprises a heat absorption device, a heat transfer device and a heat dissipation device; the heat absorber is arranged on the upper heating plate part of the CPU; the heat transfer device is connected to the heat absorber and the heat radiator through a substrate, and the substrate adopts an aluminum extrusion frame to extrude the heat transfer device to an aluminum plate groove; the heat transfer device is a double-row heat pipe; the double-row heat pipes are formed by a plurality of heat conduction pipes and conduct enough heat; the heat dissipating device is a cooling end provided with a radiator, and the cooling end is a radiator fin for effectively enhancing a heat dissipating surface. Through the mode, the heat pipe technology can be fully utilized, the original fan performance can be kept, the heat dissipation requirement of the CPU can be met, a large amount of heat generated by the CPU is brought to the cooling end more quickly, the heat dissipation area is increased, the heat dissipation requirement of the high-power CPU is met, and the heat dissipation efficiency is improved.
Description
Technical Field
The invention relates to the technical field of heat dissipation devices, in particular to a novel octopus heat dissipation device.
Background
With the development of new infrastructure such as cloud computing and big data, the requirements on the computing speed of the data are higher and higher, the computing speed and the computing amount of a processor are also higher and higher, so that the power consumption of CPU components is continuously increased, the temperature specification requirements are also continuously reduced, especially the power consumption of the CPU is greatly increased by 80% every year, the heat dissipation of the electronic device becomes a problem of quite burning hands at present, the requirements on the power consumption of a system heat dissipation fan in the society are also higher and higher, the requirements on the power consumption of a machine room PUE are reduced, and energy conservation is a mainstream trend at present. How to effectively solve the problem of overhigh temperature of each electronic component, the air quantity should not be simply increased at least, and the air quantity of the system is basically limited by the prior fan technology. What can be done is that the current reasonable distribution of the air quantity is used, so as to achieve the maximization of the utilization rate, and the limited air quantity is more fully utilized to meet the specification requirements of all devices, thus being a technical problem which needs to be solved urgently. The requirements of the server on the hard disk and the CPU are higher and higher, how to meet the requirements of computer types in a limited space, not only are the problems faced by the hardware and the mechanism departments, but also the restriction of heat dissipation becomes the bottleneck of a plurality of designs, and for computer types, the CPU with higher performance is better, but the CPU with higher performance faces a great problem, the higher performance is higher, the higher the power consumption of the CPU is, how to effectively reduce the temperature value of the CPU to the corresponding specification requirement range, and the self performance requirements are met.
Disclosure of Invention
The technical problem to be solved by the invention is to provide the novel octopus heat dissipation device, which can enhance the medium flux, further increase the rate of heat source taken away, enhance the heat dissipation performance, improve the heat dissipation area, meet the heat dissipation requirement of a high-power CPU and improve the heat dissipation efficiency.
In order to solve the technical problems, the invention adopts a technical scheme that: 1. a novel octopus heat dissipation device comprising: a heat sink, a heat transfer device, and a heat sink; the heat absorber is arranged on the CPU heating plate; the heat transfer device is connected with the heat absorbing device and the heat dissipating device through the substrate; the heat transfer device is a double-row heat pipe; the double-row heat pipes are a low heat pipe and an upper heat pipe which are formed by a plurality of heat conducting pipes; the layout positions of the low heat discharging pipes and the upper heat discharging pipes are staggered up and down; the low heat discharging pipe and the upper heat discharging pipe are of symmetrical structures; the heat dissipation device is a cooling end provided with a radiator.
Further, the base plate adopts an aluminum extrusion framework, and the double-row heat pipes are installed in aluminum plate grooves in the aluminum extrusion framework.
Further, one ends of the low heat discharging pipe and the upper heat discharging pipe are arranged in a T shape, and the other ends of the low heat discharging pipe and the upper heat discharging pipe are closely arranged side by side.
Further, one ends of the T-shaped arrangement of the low heat discharging pipe and the upper heat discharging pipe are connected to the heat radiating device; one end of the low heat discharging pipe and one end of the upper heat discharging pipe are closely arranged side by side and are connected with the heat absorbing device.
Further, the cooling end is formed by a plurality of radiator fins; the radiator fins are connected with one end of the T-shaped arrangement of the double-row heat pipes.
Further, gaps are arranged among the radiator fins.
Further, the lengths of the radiator fins are not smaller than the width of one end of the T-shaped arrangement of the double-row heat pipes
The beneficial effects of the invention are as follows: the invention fully utilizes the heat pipe technology, can meet the heat dissipation requirement of the CPU by keeping the original fan performance, brings a large amount of heat generated by the CPU to the cooling end more quickly, improves the heat dissipation area, meets the heat dissipation requirement of the high-power CPU, and improves the heat dissipation efficiency.
Drawings
FIG. 1 is a schematic perspective view of a preferred embodiment of a novel octopus heat sink according to the present invention;
FIG. 2 is a schematic view of a dual heat pipe of a novel octopus heat sink of the present invention;
FIG. 3 is a schematic view of a heat extraction tube on a novel octopus heat sink of the present invention;
FIG. 4 is a schematic view of a low heat rejection tube of a novel octopus heat sink of the present invention;
fig. 5 is a schematic diagram of a cooling end of a novel octopus heat dissipating device according to the present invention.
The components in the drawings are marked as follows: 1. a cooling end; 2. a heat transfer device; 3. a heat sink; 4. an upper heat pipe; 5. a low heat pipe; 6. a radiator rib.
Detailed Description
The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making clear and defining the scope of the present invention.
Referring to fig. 1 to 5, an embodiment of the present invention includes:
referring to fig. 1, a novel octopus heat dissipation device comprises: a heat sink 3, a heat transfer device 2, and a heat sink; the heat absorber 3 is arranged on the CPU upper heating plate; the heat transfer device 2 is connected to the heat absorber 3 and the heat radiator through a substrate, the substrate adopts an aluminum extrusion framework, and the heat transfer device 2 is extruded into an aluminum plate groove in the aluminum extrusion framework to ensure flatness and effectiveness.
Referring to fig. 2, the heat transfer device is a double-row heat pipe for transferring a heat transfer medium, the double-row heat pipe is a heat transfer pipe made of a heat transfer material, the double-row heat pipe comprises an upper heat removal pipe 4 and a lower heat removal pipe 5, the upper heat removal pipe 4 and the lower heat removal pipe 5 comprise a plurality of heat transfer pipes, the upper heat removal pipe 4 and the lower heat removal pipe 5 are arranged up and down, one end of the upper heat removal pipe 4 and the lower heat removal pipe 5 are in a symmetrical structure, the other end of the upper heat removal pipe 4 and the lower heat removal pipe 5 are arranged side by side in a close manner, the layout positions of the upper heat removal pipe 4 and the lower heat removal pipe 5 are staggered up and down, so that sufficient heat transfer quantity is ensured, one end of the upper heat removal pipe 4 and the lower heat removal pipe 5 in the T-shaped arrangement is inserted into the heat transfer device, and one end of the upper heat removal pipe 4 and the lower heat removal pipe 5 is tightly arranged to be connected with the heat absorption device; the double-row heat pipes are used for efficiently conveying all heat of the CPU part to the cooling end.
Referring to fig. 5, the heat dissipating device is a cooling end 1 provided with a radiator, the cooling end 1 is a plurality of radiator fins 6 for effectively enhancing a heat dissipating surface, gaps are arranged between the radiator fins 6, the length of the radiator fins 6 is not smaller than the width of one end of the double-row heat pipe T-shaped arrangement, the radiator fins 6 are made of metal aluminum, after heat of a CPU part is conveyed to the cooling end 1 through the double-row heat pipes in a full efficient manner, the heat is dissipated by the radiator fins 6 of the cooling end 1 in a large area, and the effect of rapid heat transfer and heat dissipation is achieved through organic combination.
The foregoing description is only illustrative of the present invention and is not intended to limit the scope of the invention, and all equivalent structures or equivalent processes or direct or indirect application in other related technical fields are included in the scope of the present invention.
Claims (4)
1. The utility model provides a novel octopus heat dissipation device which characterized in that includes: a heat sink, a heat transfer device, and a heat sink; the heat absorber is arranged on the CPU heating plate; the heat transfer device is connected with the heat absorbing device and the heat dissipating device through the substrate; the heat transfer device is a double-row heat pipe; the double-row heat pipes are a low heat pipe and an upper heat pipe which are formed by a plurality of heat conducting pipes; the layout positions of the low heat discharging pipes and the upper heat discharging pipes are staggered up and down; the low heat discharging pipe and the upper heat discharging pipe are of symmetrical structures; the heat dissipation device is a cooling end provided with a radiator;
one ends of the low heat discharging pipe and the upper heat discharging pipe are arranged in a T shape, and the other ends of the low heat discharging pipe and the upper heat discharging pipe are closely arranged side by side; one ends of the T-shaped arrangement of the low heat discharging pipe and the upper heat discharging pipe are connected to the heat radiating device; one end of the low heat discharging pipe and one end of the upper heat discharging pipe are closely arranged side by side and are connected with a heat absorbing device;
the cooling end is formed by a plurality of radiator fins; the radiator fins are connected with one end of the T-shaped arrangement of the double-row heat pipes.
2. A novel octopus heat sink as claimed in claim 1, wherein: the base plate adopts an aluminum extrusion framework, and the double-row heat pipes are installed in aluminum plate grooves in the aluminum extrusion framework.
3. A novel octopus heat sink as claimed in claim 1, wherein: gaps are arranged among the radiator fins.
4. A novel octopus heat sink as claimed in claim 1, wherein: the lengths of the radiator fins are not smaller than the width of one end of the T-shaped arrangement of the double-row heat pipes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011035549.6A CN112328051B (en) | 2020-09-27 | 2020-09-27 | Novel octopus heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011035549.6A CN112328051B (en) | 2020-09-27 | 2020-09-27 | Novel octopus heat dissipation device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112328051A CN112328051A (en) | 2021-02-05 |
| CN112328051B true CN112328051B (en) | 2023-08-08 |
Family
ID=74304309
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011035549.6A Active CN112328051B (en) | 2020-09-27 | 2020-09-27 | Novel octopus heat dissipation device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112328051B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202421984U (en) * | 2011-12-24 | 2012-09-05 | 淅川县电业局 | Heat radiation device for central processing unit of computer |
| CN108762443A (en) * | 2018-05-24 | 2018-11-06 | 郑州云海信息技术有限公司 | A kind of T-type radiator applied to computer |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW545104B (en) * | 2002-11-28 | 2003-08-01 | Quanta Comp Inc | Cooling apparatus |
-
2020
- 2020-09-27 CN CN202011035549.6A patent/CN112328051B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202421984U (en) * | 2011-12-24 | 2012-09-05 | 淅川县电业局 | Heat radiation device for central processing unit of computer |
| CN108762443A (en) * | 2018-05-24 | 2018-11-06 | 郑州云海信息技术有限公司 | A kind of T-type radiator applied to computer |
Non-Patent Citations (1)
| Title |
|---|
| 热管式聚光光伏冷却集热装置的应用研究;陈海飞，等;可再生能源;全文 * |
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| Publication number | Publication date |
|---|---|
| CN112328051A (en) | 2021-02-05 |
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