CN221228070U

CN221228070U - Heat abstractor of embedded hardware equipment

Info

Publication number: CN221228070U
Application number: CN202322628414.6U
Authority: CN
Inventors: 王中山
Original assignee: Quanai Technology Shanghai Co ltd
Current assignee: Quanai Technology Shanghai Co ltd
Priority date: 2023-09-26
Filing date: 2023-09-26
Publication date: 2024-06-25
Anticipated expiration: 2033-09-26

Abstract

The utility model relates to the field of heat dissipation devices, in particular to a heat dissipation device of embedded hardware equipment, which comprises a first heat conduction sheet and a second heat conduction sheet, wherein a water pump is fixedly arranged above the first heat conduction sheet, a fixing frame is fixedly arranged on the outer side of the water pump, a supporting frame is fixedly arranged on the outer side surface of the fixing frame, a heat dissipation component is fixedly arranged on the upper surface of the fixing frame, the heat dissipation component comprises a heat dissipation fan, T-shaped pipes and the second heat conduction pipe, the second heat conduction pipe is fixedly arranged between the two T-shaped pipes, and the T-shaped pipes are fixedly arranged on the inner side surface of the supporting frame. According to the utility model, the installation area of the heat dissipation device can be reduced by reducing the volume of the heat dissipation device so as to prevent the heat dissipation device from shielding the upper part of the circuit board, the circuit board is convenient to maintain, the heat dissipation rate of the embedded hardware is accelerated by water cooling heat dissipation, the heat dissipation effect is improved, and meanwhile, the heat dissipation device is convenient to dissipate heat of a plurality of embedded hardware on the same circuit board.

Description

Heat abstractor of embedded hardware equipment

Technical Field

The utility model relates to the field of heat dissipation devices, in particular to a heat dissipation device of embedded hardware equipment.

Background

Embedded processors are becoming more and more widespread in everyday use, all devices with digital interfaces, such as watches, microwave ovens, video recorders, automobiles, etc., are using embedded, and as the power consumption of the embedded devices increases, the requirements for heat sinks will also increase.

The bulletin number is: CN209980175U, the disclosed "a heat abstractor of embedded hardware equipment", including embedded hardware equipment body, the bottom fixedly connected with connecting plate of embedded hardware equipment body, the opening has all been seted up to the bottom of connecting plate and the bottom of embedded hardware equipment body, the equal fixedly connected with movable block in left side and the right side of connecting plate bottom, the inboard of movable block has the bottom through round pin axle swing joint, the inside of embedded hardware equipment body is provided with embedded system motherboard. The heat dissipation device of the embedded hardware equipment solves the problems that the existing embedded hardware equipment is poor in heat dissipation effect, and the embedded processor can generate a large amount of heat when in use, so that the embedded hardware equipment can cause dissolution and damage of the internal embedded processor after long-time use, and the hardware equipment is damaged;

When the circuit board is maintained, the whole heat dissipating device needs to be disassembled, and the heat dissipating device conducts heat through the extending sheets, so that the heat dissipating effect is lower, and the heat dissipating effect is inconvenient to dissipate heat of a plurality of embedded hardware on the same circuit board.

Disclosure of utility model

In order to overcome the technical problems, the utility model aims to provide the heat dissipating device of the embedded hardware equipment, wherein the first heat conducting fin is adhered to the hardware through the heat conducting glue, the water pump is operated to drive the cooling liquid to flow, heat is transferred to the fins, the heat dissipating fan is operated to accelerate the heat dissipating rate of the surfaces of the fins, and then the cooled cooling liquid is pumped into the first heat conducting pipe again, so that the installation area of the heat dissipating device can be reduced by reducing the volume of the heat dissipating device to avoid shielding the upper part of a circuit board, the circuit board is convenient to maintain, the heat dissipating rate of the embedded hardware is accelerated through water cooling and the heat dissipating effect is improved, the rectangular pipe is respectively connected with the second three-way pipe and the third three-way pipe through hoses, and the cooling liquid is injected into the rectangular pipe, so that when the cooling liquid circularly flows, part of the cooling liquid flows through the second heat conducting fin, and the heat absorbed by the cooling liquid is led out, and the heat dissipating device is convenient to dissipate a plurality of embedded hardware on the same circuit board.

The aim of the utility model can be achieved by the following technical scheme:

The utility model provides a heat abstractor of embedded hardware equipment, includes a conducting strip and No. two conducting strips, a conducting strip top is fixed and is equipped with the water pump, water pump outside fixed mounting has the mount, mount outside fixed surface installs the support frame, fixed surface is equipped with radiator unit on the mount, radiator unit includes radiator fan, T type pipe and No. two conducting strips, no. two conducting strips fixed mounting is between two T type pipes, T type pipe fixed mounting is in the inboard surface of support frame.

The method is further characterized in that: the upper surface of the first heat conducting fin is fixedly embedded with two first heat conducting pipes, two ends of each first heat conducting pipe are fixedly provided with a first three-way pipe, and the upper end of each first three-way pipe is fixedly provided with a second three-way pipe.

The method is further characterized in that: the water inlet end and the water outlet end of the water pump are fixedly provided with water pipes, and the other end of the second three-way pipe is connected with one water pipe through a hose.

The method is further characterized in that: the other end of the second three-way pipe is connected with one end of a T-shaped pipe through a hose, the other end of the T-shaped pipe is fixedly provided with a third three-way pipe, and one end of the third three-way pipe is connected with the other water pipe through a hose.

The method is further characterized in that: the movable sleeve of No. three-way pipe other end is equipped with No. two sealed covers, radiator fan fixed mounting is in the mount upper surface, and a plurality of No. two heat conduction pipe outside surface fixed mounting have the fin.

The method is further characterized in that: bolts are movably embedded in the surfaces of the two sides of the fixing frame, penetrate through the fixing frame and are connected with the first heat conducting fin in a screwing mode.

The method is further characterized in that: two No. three heat conduction pipes are fixedly embedded in the upper surface of the No. two heat conduction sheets, two No. four three-way pipes are fixedly connected to two ends of each No. three heat conduction pipe, right-angle pipes are fixedly arranged at one ends of each No. four three-way pipe, and two right-angle pipes are respectively connected with one No. two three-way pipes and one No. three-way pipe through hoses.

The utility model has the beneficial effects that:

1. The fixing frame and the first heat conducting fin are quickly detached and installed through the bolts, so that the heat radiating device is convenient to detach, and parts of the heat radiating device are convenient to replace.

2. Bonding a heat conducting strip and hardware through the heat conduction glue, the water pump moves, it flows to drive the coolant liquid, the coolant liquid flows to a plurality of No. two heat conduction pipes inside, transfer the fin with heat, radiator fan moves, drive the air flow, accelerate the radiating rate on fin surface, then by the coolant liquid of cooling from another T type pipe discharge, it is inside to be pumped into a heat conduction pipe again by the water pump through No. three siphunculus, thereby can reduce heat abstractor's volume, reduce its installation area, in order to avoid it to shelter from the circuit board top, the circuit board of being convenient for maintains, and through water-cooling heat dissipation, accelerate the radiating rate of embedded hardware, improve the radiating effect.

3. When radiating a plurality of hardware, take off sealed lid and No. two sealed covers, be connected with a No. two tee bend and No. three-way pipe respectively with the right-angle pipe through the hose to pour into the coolant into its inside, when making coolant circulation flow, partial coolant flow through No. two conducting strips, derive its absorptive heat, thereby make heat abstractor be convenient for dispel the heat to a plurality of embedded hardware on the same circuit board.

Drawings

The utility model is further described below with reference to the accompanying drawings.

FIG. 1 is a schematic view of the overall structure of the present utility model;

Fig. 2 is a schematic diagram of the connection structure of the first and second heat conductive sheets of the present utility model;

FIG. 3 is a schematic view showing a partial cross-sectional structure of a first heat conductive sheet and a second heat conductive sheet according to the present utility model;

FIG. 4 is a schematic view showing a split structure of a first heat conducting fin and a heat dissipating assembly according to the present utility model;

Fig. 5 is a schematic view of a portion of a heat dissipating assembly according to the present utility model.

In the figure: 1. a first heat conductive sheet; 101. a first heat conduction pipe; 102. a first three-way pipe; 103. a second three-way pipe; 104. a first sealing cover; 2. a water pump; 201. a fixing frame; 202. a support frame; 203. a water pipe; 204. a bolt; 3. a heat dissipation assembly; 301. a heat radiation fan; 302. a T-shaped tube; 303. a second heat pipe; 304. a fin; 305. a third three-way pipe; 4. a second heat conductive sheet; 401. a third heat pipe; 402. a fourth three-way pipe; 403. a right angle tube.

Detailed Description

The technical solutions of the embodiments of the present utility model will be clearly and completely described below in conjunction with the embodiments of the present utility model, and it is apparent that the described embodiments are only some embodiments of the present utility model, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-5, a heat dissipating device for an embedded hardware device includes a first heat conducting fin 1 and a second heat conducting fin 4, a water pump 2 is fixedly disposed above the first heat conducting fin 1, a fixing frame 201 is fixedly mounted on the outer side of the water pump 2, bolts 204 are movably embedded in and mounted on two side surfaces of the fixing frame 201, the bolts 204 penetrate through the fixing frame 201 and are screwed with the first heat conducting fin 1, the fixing frame 201 and the first heat conducting fin 1 are quickly detached and mounted through the bolts 204, the heat dissipating device is convenient to detach, parts of the heat dissipating device are convenient to replace, a supporting frame 202 is fixedly mounted on the outer side surface of the fixing frame 201, a heat dissipating component 3 is fixedly disposed on the upper surface of the fixing frame 201, the heat dissipating component 3 includes a heat dissipating fan 301, a T-shaped tube 302 and a second heat conducting tube 303, the second heat conducting tube 303 is fixedly mounted between the two T-shaped tubes 302, and the T-shaped tube 302 is fixedly mounted on the inner side surface of the supporting frame 202.

The upper surface of the first heat conducting fin 1 is fixedly embedded with two first heat conducting pipes 101, two ends of each first heat conducting pipe 101 are fixedly provided with a first three-way pipe 102, and the upper end of each first three-way pipe 102 is fixedly provided with a second three-way pipe 103; a first sealing cover 104 is movably sleeved at one end of the second three-way pipe 103, one end of the second three-way pipe 103 is blocked by the first sealing cover 104, liquid leakage of the second three-way pipe 103 when the second three-way pipe 103 is not connected with the second heat conducting fin 4 is prevented, a water pipe 203 is fixedly arranged at the water inlet end and the water outlet end of the water pump 2, the other end of the second three-way pipe 103 is connected with the water pipe 203 through a hose, and the water pump 2 enables cooling liquid in the pipeline to circularly flow; the other end of the second three-way pipe 103 is connected with one end of a T-shaped pipe 302 through a hose, the lower end of the other T-shaped pipe 302 is provided with a third three-way pipe 305, one end of the third three-way pipe 305 is connected with the other water pipe 203 through a hose, the first heat conducting fin 1 is adhered to hardware through heat conducting glue, the water pump 2 operates to drive cooling liquid to flow through the first heat conducting pipe 101, heat conducted by the first heat conducting fin 1 is taken away, then the cooling liquid enters the inside of the T-shaped pipe 302 through the hose and is dispersed into a plurality of second heat conducting pipes 303, the heat is transferred to fins 304, then cooled cooling liquid is discharged from the other T-shaped pipe 302 and pumped into the inside of the first heat conducting pipe 101 again through the third three-way pipe 305, so that the installation area of the cooling device can be reduced through reducing the volume of the cooling device, the circuit board is prevented from being blocked, the circuit board is convenient to maintain, the cooling rate of embedded hardware is accelerated through water cooling and the cooling effect is improved; the movable cover in the other end of the third three-way pipe 305 is provided with a second sealing cover, the heat dissipation fan 301 is fixedly arranged on the upper surface of the fixed frame 201, the outer side surfaces of the second heat conduction pipes 303 are fixedly provided with fins 304, the heat dissipation fan 301 runs to drive air to flow, and the heat dissipation rate of the surfaces of the fins 304 is accelerated.

The upper surface of the second heat conducting fin 4 is fixedly embedded with two third heat conducting pipes 401, two ends of each third heat conducting pipe 401 are fixedly connected with a fourth heat conducting pipe 402, one end of each fourth heat conducting pipe 402 is fixedly provided with a right-angle pipe 403, each right-angle pipe 403 is respectively connected with one second heat conducting pipe 103 and one third heat conducting pipe 305 through a hose, when a plurality of pieces of hardware are subjected to heat dissipation, the first sealing cover 104 and the second sealing cover are taken down, each right-angle pipe 403 is respectively connected with one second heat conducting pipe 103 and one third heat conducting pipe 305 through hoses, cooling liquid is injected into each right-angle pipe, when the cooling liquid circularly flows, part of cooling liquid flows through the second heat conducting fin 4, heat absorbed by the cooling liquid is guided out, and therefore the heat dissipation device is convenient for dissipating heat of a plurality of embedded pieces of hardware on the same circuit board.

Working principle: during the use, dismantle and install mount 201 and conducting strip 1 through bolt 204 fast, make heat abstractor convenient to detach, be convenient for change heat abstractor's part simultaneously, first sealed lid 104 is with No. two three-way pipe 103 one end plugs up, prevent not with No. two three-way pipe 103 weeping when conducting strip 4 are connected, bond conducting strip 1 and hardware through the heat conduction glue, water pump 2 moves, drive the coolant liquid and flow, the coolant liquid flows from conducting strip 101, heat conducting strip 1 conduction's heat is taken away, then enter into a T type pipe 302 inside through the hose, disperse inside a plurality of No. two conducting strips 303, with heat transfer to fin 304, radiator fan 301 operation, drive the air flow, accelerate the rate of heat dissipation on fin 304 surface, then the coolant liquid that is cooled is discharged from another T type pipe 302, be pumped into inside first conducting strip 101 again by water pump 2, thereby can reduce its installation area, so as to avoid its shelter from circuit board top, and be convenient for maintain through the water-cooling pipe 101, and through the water cooling rate of heat dissipation, take away the heat dissipation device is carried out to a plurality of heat dissipation pipes 103, the heat dissipation device is carried out to the inside the heat dissipation device through the hose, the heat dissipation device is led out to the heat dissipation device is carried out to the heat pipe 304, the heat dissipation device is cooled down through the heat pipe is cooled down, and the heat is passed through a plurality of heat dissipation device is cooled down, and is passed through the other T type pipe 302, thereby, the heat dissipation device is cooled down, and the heat is passed through the heat pipe is cooled down, and is passed through, thereby, and circuit board is cooled down, and is passed down by heat has been reduced.

In the description of the present specification, the descriptions of the terms "one embodiment," "example," "specific example," and the like, mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The foregoing is merely illustrative and explanatory of the utility model, as various modifications and additions may be made to the particular embodiments described, or in a similar manner, by those skilled in the art, without departing from the scope of the utility model or exceeding the scope of the utility model as defined in the claims.

Claims

1. The utility model provides a heat abstractor of embedded hardware equipment, its characterized in that includes conducting strip (1) and conducting strip No. two (4), conducting strip (1) top is fixed and is equipped with water pump (2), water pump (2) outside fixed mounting has mount (201), mount (201) outside fixed surface installs support frame (202), fixed surface is equipped with radiator unit (3) on mount (201), radiator unit (3) include radiator fan (301), T type pipe (302) and No. two conducting tubes (303), no. two conducting tubes (303) fixed mounting are between two T type pipes (302), T type pipe (302) fixed mounting is in support frame (202) medial surface.

2. The heat dissipation device of an embedded hardware device according to claim 1, wherein two first heat conduction pipes (101) are fixedly embedded and installed on the upper surface of the first heat conduction sheet (1), a first three-way pipe (102) is fixedly installed at two ends of each first heat conduction pipe (101), and a second three-way pipe (103) is fixedly installed at the upper end of each first three-way pipe (102).

3. The heat dissipating device of an embedded hardware device according to claim 2, wherein a first sealing cover (104) is movably sleeved at one end of the second three-way pipe (103), water pipes (203) are fixedly installed at both the water inlet end and the water outlet end of the water pump (2), and one other end of the second three-way pipe (103) is connected with one water pipe (203) through a hose.

4. A heat dissipating device for an embedded hardware device according to claim 3, wherein the other end of the second tee (103) is connected to one end of a T-shaped pipe (302) through a hose, the lower end of the other T-shaped pipe (302) is fixedly provided with a third tee (305), and one end of the third tee (305) is connected to the other water pipe (203) through a hose.

5. The heat dissipating device for an embedded hardware device according to claim 4, wherein a second sealing cover is movably sleeved at the other end of the third tee pipe (305), the heat dissipating fan (301) is fixedly mounted on the upper surface of the fixing frame (201), and fins (304) are fixedly mounted on the outer side surfaces of the plurality of second heat conducting pipes (303).

6. The heat dissipating device of an embedded hardware device according to claim 1, wherein bolts (204) are movably embedded in the surfaces of both sides of the fixing frame (201), and the bolts (204) penetrate through the fixing frame (201) and are screwed with the first heat conducting strip (1).

7. The heat dissipating device for an embedded hardware device according to claim 4, wherein two third heat conducting pipes (401) are fixedly embedded in the upper surface of the second heat conducting fin (4), two fourth three pipes (402) are fixedly connected to two ends of each third heat conducting pipe (401), a right angle pipe (403) is fixedly installed at one end of each fourth three pipe (402), and the two right angle pipes (403) are respectively connected with one second three pipe (103) and one third three pipe (305) through hoses.