CN219246039U

CN219246039U - Heat radiation structure of computer central processing unit

Info

Publication number: CN219246039U
Application number: CN202320284728.6U
Authority: CN
Inventors: 仇家丽; 刘骐瑞
Original assignee: Shanghai Yunuolai Electronic Technology Co ltd
Current assignee: Shanghai Kuanke Technology Co ltd
Priority date: 2023-02-22
Filing date: 2023-02-22
Publication date: 2023-06-23
Anticipated expiration: 2033-02-22

Abstract

The utility model relates to the technical field of computer heat dissipation structures, and discloses a heat dissipation structure of a computer central processing unit, which comprises the following components: the heat-conducting plate is fixed at the upper end of the heat-conducting plate, a fixing frame is fixed at the outer walls of four corners of the heat-conducting plate, a fixing bolt is arranged at the other end of the fixing frame in a penetrating mode, and a flange is connected with the outer wall of the upper end of the heat-conducting plate; the drain pipe is connected to the outer wall of the flange on one side, the other side of the flange is connected with a liquid inlet pipe, and the middle parts of the drain pipe and the liquid inlet pipe are connected with telescopic hoses. The heat radiation structure of the computer central processing unit is provided with the telescopic flexible hose with the telescopic structure, so that the arrangement positions of the heat radiation fins can be reasonably arranged according to the space of the case, the space requirement on the installation position of the case central processing unit is smaller, and when the space of the installation position of the case central processing unit is insufficient, the heat radiation structure can be installed elsewhere, and the applicability of the central processing unit to different installation environments is better.

Description

Heat radiation structure of computer central processing unit

Technical Field

The utility model relates to the technical field of computer heat dissipation structures, in particular to a heat dissipation structure of a computer central processing unit.

Background

The CPU, which is the final execution unit for information processing and program operation, is used as the operation and control core of computer system in the age of large-scale integrated circuit. When the central processing unit is electrified, a large amount of accumulated heat is generated due to the fact that part of electric energy is converted into heat energy, and when the central processing unit is overheated, the processing capacity of the central processing unit is seriously affected, and even the central processing unit is damaged.

Through looking for, there is the heat abstractor of a computer central processing unit that publication number is CN217767381U, including the mainboard, the top of mainboard is provided with the central processing unit body for the instrument appears the slippage skew easily when solving the installation to make the instrument strike on the mainboard, cause the problem of equipment damage, this practical heat radiation structure is fixed on the heat absorption structure, and the space requirement to central processing unit installation department is higher, leads to unable installation easily because of the space is not enough, or causes adverse effect to radiating efficiency, and for this reason, we propose a computer central processing unit's heat radiation structure.

Disclosure of Invention

The present utility model is directed to a heat dissipation structure of a computer cpu, so as to solve the above-mentioned problems in the prior art.

In order to achieve the above purpose, the present utility model provides the following technical solutions: a heat dissipation structure of a computer central processing unit, comprising:

the heat-conducting plate is fixed at the upper end of the heat-conducting plate, a fixing frame is fixed at the outer walls of four corners of the heat-conducting plate, a fixing bolt is arranged at the other end of the fixing frame in a penetrating mode, and a flange is connected with the outer wall of the upper end of the heat-conducting plate;

the drain pipe, it is connected in one side the outer wall of flange, the opposite side of flange is connected with the feed liquor pipe, the middle part of drain pipe and feed liquor pipe all is connected with flexible hose, the other end of feed liquor pipe is equipped with the liquid pump, the other end of liquid pump is connected with the heat transfer pipe of S-shaped, and the other end of heat transfer pipe is connected in the one end of drain pipe, the outer wall of heat transfer pipe is fixed with heat radiation fin, the fan unit is installed through the bolt to the outer wall of one side of heat radiation fin.

Preferably, the fixing frame and the fixing bolts are symmetrically arranged on the central axis of the heat absorption plate, the heat conduction plate is tightly attached to the heat absorption plate, and the heat conduction plate is communicated with the liquid outlet pipe and the liquid inlet pipe through flanges.

Preferably, the heat exchange tube is connected with the liquid outlet tube and the liquid inlet tube in a communicating way through a liquid pump and a telescopic hose, the heat radiation fins are uniformly distributed at equal intervals along the outer wall of the heat exchange tube, and the heat radiation fins and the heat exchange tube are connected with the heat conducting plate in a telescopic way through the telescopic hose.

Preferably, the outer wall of the lower end of the heat absorbing plate is coated with heat conduction silicone grease, an isolating film is laid on the outer wall of the heat conduction silicone grease, and one end of the isolating film is connected with an easy-to-tear strip.

Preferably, the isolating film forms a sealing structure between the heat absorbing plate and the heat conducting silicone grease, and the isolating film and the heat absorbing plate form adhesive connection.

Preferably, the pipe clamp is all installed to the outer wall of drain pipe and feed liquor pipe, the rear end outer wall of pipe clamp is fixed with the inserted bar, the other end of inserted bar is fixed with hemispherical fixture block.

Preferably, the pipe clamp is connected with the liquid outlet pipe and the liquid inlet pipe in a clamping way, and the inserting rod and the clamping block are symmetrically arranged on the central axis of the pipe clamp.

Compared with the prior art, the utility model has the beneficial effects that:

the heat radiation structure of the computer central processing unit is provided with the telescopic flexible hose with the telescopic structure, so that the arrangement positions of the heat radiation fins can be reasonably arranged according to the space of the case, the space requirement on the installation position of the case central processing unit is smaller, and when the space of the installation position of the case central processing unit is insufficient, the heat radiation structure can be installed elsewhere, and the applicability of the central processing unit to different installation environments is better.

Drawings

FIG. 1 is a schematic view of a combined state front view structure of the present utility model;

FIG. 2 is a schematic view of a heat absorbing plate and a heat conducting plate according to a front view of the present utility model;

FIG. 3 is a schematic view showing the structure of the heat absorbing plate and the heat conducting plate in a partially inverted view;

fig. 4 is an enlarged schematic view of the pipe clamp portion of the present utility model.

In the figure: 1. a heat absorbing plate; 2. a heat conductive plate; 3. a flange; 4. a fixing frame; 5. a fixing bolt; 6. a liquid outlet pipe; 7. a liquid inlet pipe; 8. a flexible hose; 9. a liquid pump; 10. a heat exchange tube; 11. a heat radiation fin; 12. a fan group; 13. heat conductive silicone grease; 14. a separation film; 15. an easy-to-tear strip; 16. a pipe clamp; 17. a rod; 18. and (5) clamping blocks.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

The utility model provides a heat dissipation structure of a computer CPU by improving the structure, referring to FIGS. 1-2, comprising: the heat-absorbing plate 1, the upper end of the heat-absorbing plate 1 is fixed with the heat-conducting plate 2 with a hollow structure, the heat-conducting plate 2 is tightly attached to the heat-absorbing plate 1, the fixing frames 4 are fixed on the outer walls of four corners of the heat-absorbing plate 1, the fixing bolts 5 are arranged at the other ends of the fixing frames 4 in a penetrating mode, the fixing frames 4 and the fixing bolts 5 are symmetrically arranged on the central axis of the heat-absorbing plate 1, the fixing frames 4 and the fixing bolts 5 are convenient for fixing the heat-absorbing plate 1 and the heat-conducting plate 2, the heat-absorbing plate 1 and the heat-conducting plate 2 can be tightly pressed on the surface of the central processing unit, the contact area is increased, and the stability of a contact surface is improved; the outer wall of the upper end of the heat-conducting plate 2 is connected with a flange 3, one side outer wall of the flange 3 is connected with a liquid outlet pipe 6, the other side of the flange 3 is connected with a liquid inlet pipe 7, the heat-conducting plate 2 is communicated with the liquid outlet pipe 6 and the liquid inlet pipe 7 through the flange 3, and the flange 3 is convenient for disassembling and assembling the liquid outlet pipe 6 and the liquid inlet pipe 7 and is easy to install and use; the middle parts of the liquid outlet pipe 6 and the liquid inlet pipe 7 are respectively connected with a telescopic hose 8, the other end of the liquid inlet pipe 7 is provided with a liquid pump 9, the other end of the liquid pump 9 is connected with an S-shaped heat exchange pipe 10, the other end of the heat exchange pipe 10 is connected with one end of the liquid outlet pipe 6, the heat exchange pipe 10 is communicated with the liquid outlet pipe 6 and the liquid inlet pipe 7 through the liquid pump 9 and the telescopic hose 8, the outer walls of the heat exchange pipes 10 are fixedly provided with radiating fins 11, the radiating fins 11 are uniformly distributed along the outer walls of the heat exchange pipe 10 at equal intervals, the radiating fins 11 and the heat exchange pipe 10 are in telescopic connection with the heat conducting plate 2 through the telescopic hose 8, the arranged radiating fins 11 are used for radiating heat conducted by the central processing unit, and the arrangement positions of the radiating fins 11 can be reasonably arranged according to the space of a chassis, so that the installation of the radiating structure is influenced by the insufficient space at the installation position of the central processing unit of the chassis and the radiating heat of the radiating structure is prevented; the fan set 12 is installed on the outer wall of one side of the radiating fins 11 through bolts, and the fan set 12 is used for increasing the air flow rate at the radiating fins 11 and improving the radiating efficiency of the radiating fins 11 to the external environment.

Referring to fig. 3, a heat dissipation structure of a computer cpu includes: the outer wall of the lower end of the heat absorption plate 1 is coated with heat conduction silicone grease 13, the outer wall of the heat conduction silicone grease 13 is paved with an isolation film 14, the isolation film 14 forms a sealing structure through the heat absorption plate 1 and the heat conduction silicone grease 13, the isolation film 14 and the heat absorption plate 1 form adhesive connection, the arranged heat conduction silicone grease 13 is uniformly coated on the lower end surface of the heat absorption plate 1 and is used for filling gaps of contact surfaces of the heat absorption plate 1 and a central processing unit, the influence of air in the gaps on heat conduction efficiency is reduced, and when the heat conduction silicone grease is not used, the heat conduction silicone grease 13 is coated and protected through the isolation film 14, so that the heat absorption plate is convenient to transport and move; one end of the isolating film 14 is connected with a tearing strip 15, and the tearing strip 15 is convenient for an operator to tear the isolating film 14 off the heat absorbing plate 1, so that the isolating film is easy to use.

Referring to fig. 1 and 4, a heat dissipation structure of a computer cpu includes: pipe clamp 16 is all installed to the outer wall of drain pipe 6 and feed liquor pipe 7, constitute the block between pipe clamp 16 and drain pipe 6 and the feed liquor pipe 7 and be connected, the rear end outer wall of pipe clamp 16 is fixed with inserted bar 17, the other end of inserted bar 17 is fixed with hemispherical fixture block 18, and inserted bar 17 and fixture block 18 set up with the axis position symmetry of pipe clamp 16, the pipe clamp 16 of setting is used for fixing drain pipe 6 and feed liquor pipe 7, make it can not rock because of the flow of intraductal coolant liquid at quick-witted incasement, prevent that feed liquor pipe 7 and drain pipe 6 from leading to breaking with quick-witted incasement wall friction, play better firm effect.

Working principle: for the heat radiation structure of the computer central processing unit, firstly, a staff tears off the isolating film 14 on the heat absorption plate 1 through the easy tearing strip 15, the heat absorption plate 1 is conveniently fixed in contact with the surface of the central processing unit through the heat conduction silicone grease 13, then the heat absorption plate 1 is fixedly arranged at the mounting position of the computer central processing unit through the fixing frame 4 by using the fixing bolts 5, the lower surface of the heat absorption plate 1 is tightly attached to the upper surface of the central processing unit through the heat conduction silicone grease 13, the air at a gap is reduced, so that the heat conduction efficiency is prevented from being influenced by the air, then the staff connects the liquid inlet pipe 7 and the liquid outlet pipe 6 on the heat conduction plate 2 of the hollow structure through the flange 3, the middle parts of the liquid outlet pipe 6 and the liquid inlet pipe 7 are connected with the telescopic flexible pipes 8, the telescopic pipes can be adjusted according to the mounting positions of the heat dissipation fins 11, then cooling liquid is injected into the liquid through the liquid outlet pipe 6 or the liquid inlet pipe 7, the cooling liquid flows in the liquid outlet pipe 6, the heat exchange pipe 10, the telescopic flexible pipes 8 and the liquid inlet pipe 7 through the pumping pipe 9, the heat of the heat wrapped up by the heat dissipation fins 11 and the fan set 12, the purpose of rapidly cooling the central processing unit is achieved, finally, the liquid inlet pipe 7 and the liquid outlet pipe 6 can be easily inserted into the case through the fixing pipe 17 and the heat dissipation pipe 17, the heat dissipation pipe 17 can be easily fixed in the case and the case through the fixing pipe 17, and the fixing pipe 17.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A heat dissipation structure for a computer central processing unit, comprising:

the heat absorption plate (1), the upper end of the heat absorption plate (1) is fixed with a heat conduction plate (2) with a hollow structure, the four corner outer walls of the heat absorption plate (1) are fixed with a fixing frame (4), the other end of the fixing frame (4) is provided with a fixing bolt (5) in a penetrating way, and the outer wall of the upper end of the heat conduction plate (2) is connected with a flange (3);

drain pipe (6), it is connected in one side the outer wall of flange (3), the opposite side of flange (3) is connected with feed liquor pipe (7), the middle part of drain pipe (6) and feed liquor pipe (7) all is connected with flexible hose (8), the other end of feed liquor pipe (7) is equipped with liquid pump (9), the other end of liquid pump (9) is connected with heat exchange tube (10) of S-shaped, and the other end of heat exchange tube (10) is connected in the one end of drain pipe (6), the outer wall of heat exchange tube (10) is fixed with radiator fin (11), fan unit (12) are installed through the bolt to the outer wall of one side of radiator fin (11).

2. The heat dissipation structure of a computer central processing unit according to claim 1, wherein: the fixing frame (4) and the fixing bolts (5) are symmetrically arranged on the central axis of the heat absorbing plate (1), the heat conducting plate (2) is tightly attached to the heat absorbing plate (1), and the heat conducting plate (2) is communicated with the liquid outlet pipe (6) and the liquid inlet pipe (7) through the flange (3).

3. The heat dissipation structure of a computer central processing unit according to claim 1, wherein: the heat exchange tube (10) is communicated with the liquid outlet tube (6) and the liquid inlet tube (7) through the liquid pump (9) and the telescopic hose (8), the heat radiation fins (11) are uniformly distributed at equal intervals along the outer wall of the heat exchange tube (10), and the heat radiation fins (11) and the heat exchange tube (10) are in telescopic connection with the heat conduction plate (2) through the telescopic hose (8).

4. The heat dissipation structure of a computer central processing unit according to claim 1, wherein: the heat absorber is characterized in that the outer wall of the lower end of the heat absorber plate (1) is coated with heat conduction silicone grease (13), an isolating film (14) is laid on the outer wall of the heat conduction silicone grease (13), and one end of the isolating film (14) is connected with an easy-to-tear strip (15).

5. The heat dissipation structure of a computer central processing unit according to claim 4, wherein: the isolating film (14) forms a sealing structure between the heat absorbing plate (1) and the heat conducting silicone grease (13), and the isolating film (14) and the heat absorbing plate (1) form adhesive connection.

6. The heat dissipation structure of a computer central processing unit according to claim 1, wherein: pipe clamp (16) are all installed to the outer wall of drain pipe (6) and feed liquor pipe (7), the rear end outer wall of pipe clamp (16) is fixed with inserted bar (17), the other end of inserted bar (17) is fixed with hemispherical fixture block (18).

7. The heat dissipation structure of a computer central processing unit according to claim 6, wherein: the pipe clamp (16) is connected with the liquid outlet pipe (6) and the liquid inlet pipe (7) in a clamping mode, and the inserting rod (17) and the clamping block (18) are symmetrically arranged on the central axis of the pipe clamp (16).