CN203241901U - Passive CPU radiating structure with heightening piece - Google Patents
Passive CPU radiating structure with heightening piece Download PDFInfo
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- CN203241901U CN203241901U CN 201320062143 CN201320062143U CN203241901U CN 203241901 U CN203241901 U CN 203241901U CN 201320062143 CN201320062143 CN 201320062143 CN 201320062143 U CN201320062143 U CN 201320062143U CN 203241901 U CN203241901 U CN 203241901U
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- heat pipe
- cpu
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- fixed
- groove
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Abstract
The utility model discloses a passive CPU radiating structure with a heightening piece, and relates to the technical field of CPU radiators. The radiating structure is arranged in a machine box and comprises at least one heat pipe and a radiating side plate. The heat pipe is provided with a first end and a second end which are in a flat shape. The first end of the heat pipe is fixed on a radiating side plate through a side plate small radiating block. The passive CPU radiating structure further comprises the heightening piece which is composed of a fixing plate, an arc heat pipe and a CPU radiating plate. The arc heat pipe is provided with a first end and a second end. The second end of the heat pipe and the first end of the arc heat pipe are both fixed in the fixing plate. The second end of the arc heat pipe is arranged in the CPU radiating plate which is fixed on a main plate. According to the passive CPU radiating structure, when the heat pipe is arranged, the problem that the heat pipe cannot be arranged because the position of an electronic element on the main plate is too high is solved, in addition, the passive CPU radiating structure can be configured with different main plates, and the position of the heat pipe can be conveniently adjusted.
Description
[technical field]
The utility model relates to cpu heat, and in particular, the utility model relates to a kind of CPU radiator structure with increasing part.
[background technology]
HTPC, it is the home theater computer, it is the home theater of taking on signal source and control with computing machine, namely various multimedia decoding playout softwares have been pre-installed for one one, can be used to the corresponding various audio/video medias of playing, and has a various interface, the PC that can use with digital audio equipment connections such as multiple display device such as televisor, projector, plasma display, audio decoder, note amplifiers.
Heat pipe (HeatPiPe) heat radiation is as the passive radiating mode of a kind of conventional noiselessness, application on the HTPC cabinet was very popular in recent years, in heat pipe (HeatPiPe) design, usually use the heat pipe of round tube shape structure, heat pipe is connected pyrotoxin CPU, this structure in use ubiquity following two kinds of problems, and the firstth, owing to the positions of electronic parts on the mainboard, size, just changeable, electronic component and heat pipe (HeatPiPe) often can occur and interfere; The secondth, the position of mainboard CPU is various, and the shape of heat pipe (HeatPiPe) is fixing, when regulating in the position that needs opposite heat tube (HeatPiPe), and inconvenience very.
[utility model content]
The purpose of this utility model is effectively to overcome the deficiency of above-mentioned technology, a kind of CPU radiator structure with increasing part is provided, this kind radiator structure is not when affecting radiating effect, the problem of having avoided the position inconvenience of heat pipe to regulate has also solved and has caused the problem that interferes with heat pipe because the mainboard Placement of Electronic Components in Electronic is changeable.
The technical solution of the utility model is to realize like this, a kind of passive type CPU radiator structure with increasing part, be installed on cabinet inside, it comprises at least one heat pipe and a side radiating plate-fin, described heat pipe has first end and the second end, and two ends all are flat, the first end of heat pipe is fixed on the side radiating plate-fin by the little radiating block of side plate, its improvements are: it also comprises increases part, this increases part by fixed head, arc heat pipe and CPU heat sink form, described arc heat pipe has first end and the second end, the second end of above-mentioned heat pipe and the first end of arc heat pipe all are fixed in the fixed head, the second end of this arc heat pipe is arranged in the CPU heat sink, and this CPU heat sink is fixed on the mainboard;
In the said structure, described fixed head is by fixedly top board and fixed base plate form, have fixed head first groove suitable with the second end section of described heat pipe on the described fixedly top board, have fixed head second groove suitable with the first end cross section of described arc heat pipe on the described fixed base plate, described fixedly top board is fixedly connected with fixed base plate by securing member, so that the surface of the surface of the second end of heat pipe and described fixed head the first groove floor and arc heat pipe first end connects, and so that the bottom surface of the first end surface of arc heat pipe and described fixed head the second groove connect;
In the said structure, have the CPU heat sink groove suitable with the second end section of described arc heat pipe on the described CPU heat sink, the second end of arc heat pipe is arranged in the CPU heat sink groove, described CPU heat sink is fixed on the mainboard by securing member, so that bottom surface and the mainboard upper surface of the second end surfaces of arc heat pipe and described CPU heat sink groove connect;
In the said structure, have first groove suitable with the first end cross section of described heat pipe on the little radiating block of described side plate, the first end of heat pipe is arranged in described the first groove, the little radiating block of described side plate is fixedly connected with described side radiating plate-fin by fixture, so that the outside surface of the first end of heat pipe contacts with the bottom surface of side radiating plate-fin inside surface and the first groove.
The beneficial effects of the utility model are: one, the utility model is equipped with one at the second end of heat pipe and increases part, this increases part by fixed head, arc heat pipe and CPU heat sink form, the arc heat pipe has first end and the second end, the second end of above-mentioned heat pipe and the first end of arc heat pipe all are fixed in the fixed head, the second end of this arc heat pipe is arranged in the CPU heat sink, and this CPU heat sink is fixed on the mainboard, by this kind structure, when the utility model is installed at heat pipe, can be owing to the position of electronic component on the mainboard be not too high, and cause the problem that heat pipe can not be installed, in addition, the position of heat pipe is fixed on the side radiating plate-fin, by increasing the effect of part, configure different arc heat pipes, then the configurable different mainboard of radiator structure of the present utility model, when the position of opposite heat tube is regulated, also more convenient; Two, the utility model is flat structure with the two ends design of heat pipe, so that heat pipe can directly contact with pyrotoxin and side radiating plate-fin, the derivation of heat will be utilized, simultaneously, also increase the contact area of heat pipe and pyrotoxin and side radiating plate-fin, improved radiating efficiency; Its three, it is simple in structure, and is easy to assembly, securing member connected mode, its convenient disassembly are adopted in the heat pipe two ends.
[description of drawings]
Fig. 1 is assembling schematic diagram of the present utility model;
Fig. 2 is exploded perspective view of the present utility model.
[embodiment]
The utility model will be further described below in conjunction with drawings and Examples.
With reference to shown in Figure 1, a kind of passive type CPU radiator structure with increasing part that the utility model discloses, this structure is installed on cabinet inside, comprise at least one heat pipe 10 and a side radiating plate-fin 20, in the present embodiment, have four heat pipes 10, heat pipe 10 has first end 101 and the second end 102, and two ends all are flat, the first end 101 of heat pipe is fixed on the side radiating plate-fin 20 by the little radiating block 30 of side plate, have first groove 301 suitable with first end 101 cross sections of described heat pipe on the little radiating block 30 of side plate, the first end 101 of heat pipe 10 is arranged in described the first groove 301, the little radiating block 30 of side plate is fixedly connected with described side radiating plate-fin 20 by screw, so that the outside surface of the first end 101 of heat pipe 10 contacts with the bottom surface of side radiating plate-fin 20 inside surfaces and the first groove 301, side radiating plate-fin 20 is as the part of cabinet, outside surface in side radiating plate-fin 20 is interval with some radiating fins 201, radiating fin 201 is vertically connected at side radiating plate-fin 20 outside surfaces, to be conducive to distributing of heat.
Further, this structure also comprises increases part 40, this is increased part and is comprised of fixed head 41, arc heat pipe 42 and CPU heat sink 43, arc heat pipe 42 also has first end 420 and the second end 421, the second end 102 of above-mentioned heat pipe 10 all is fixed in the fixed head 41 with the first end 420 of arc heat pipe 42, the second end 421 of this arc heat pipe 42 is arranged in the CPU heat sink 43, and this CPU heat sink 43 is fixed on the mainboard 50; In conjunction with Fig. 2, we are described further increasing part 40, increase the fixed head 41 of part 40 by fixedly top board 410 and fixed base plate 411 form, have fixed head first groove 4100 suitable with the second end 102 cross sections of described heat pipe 10 on the described fixedly top board 410, have fixed head second groove 4110 suitable with first end 420 cross sections of described arc heat pipe 42 on the described fixed base plate 411, described fixedly top board 410 is fixedly connected with fixed base plate 411 by bolt, so that the surface of the first end 420 of the surface of the second end 102 of heat pipe 10 and described fixed head the first groove 4100 bottom surfaces and arc heat pipe 42 connects, and so that the bottom surfaces of first end 420 surfaces of arc heat pipe 42 and described fixed head the second groove 4110 connect.
More specifically, have the CPU heat sink groove 430 suitable with the second end 421 cross sections of described arc heat pipe 42 on the CPU heat sink 43, the second end 421 of arc heat pipe 42 is arranged in the CPU heat sink groove 430, CPU heat sink 43 is screwed on the mainboard 50, so that the second end 421 surfaces of arc heat pipe 42 and bottom surface and mainboard 50 upper surfaces of described CPU heat sink groove 430 connect.This kind radiator structure of the present utility model so that the structure of dispelling the heat away from mainboard, plays better radiating effect, is flat structure with the design of the two ends of heat pipe, has increased the contact area of heat pipe and pyrotoxin and side radiating plate-fin, has improved radiating efficiency.And it is of paramount importance, when the utility model is installed at heat pipe 10, can be owing to the position of electronic component on the mainboard be not too high, and cause the problem that heat pipe 10 can not be installed, in addition, the position of heat pipe 10 is fixed on the side radiating plate-fin 20, by increasing the effect of part 40, configure different radians arc heat pipe 42, the configurable different mainboard of radiator structure of the present utility model then, when the position of opposite heat tube 10 is regulated, also more convenient.
Described above only is preferred embodiment of the present utility model, and above-mentioned specific embodiment is not to restriction of the present utility model.In technological thought category of the present utility model, various distortion and modification can appear, and the retouching that all those of ordinary skill in the art make according to above description, revise or be equal to replacement, all belong to the scope that the utility model is protected.
Claims (4)
1. one kind with the passive type CPU radiator structure of increasing part, be installed on cabinet inside, it comprises at least one heat pipe and a side radiating plate-fin, described heat pipe has first end and the second end, and two ends all are flat, the first end of heat pipe is fixed on the side radiating plate-fin by the little radiating block of side plate, it is characterized in that: it also comprises increases part, this increases part by fixed head, arc heat pipe and CPU heat sink form, described arc heat pipe has first end and the second end, the second end of above-mentioned heat pipe and the first end of arc heat pipe all are fixed in the fixed head, and the second end of this arc heat pipe is arranged in the CPU heat sink, and this CPU heat sink is fixed on the mainboard.
2. a kind of passive type CPU radiator structure with increasing part according to claim 1, it is characterized in that: described fixed head is by fixedly top board and fixed base plate form, have fixed head first groove suitable with the second end section of described heat pipe on the described fixedly top board, have fixed head second groove suitable with the first end cross section of described arc heat pipe on the described fixed base plate, described fixedly top board is fixedly connected with fixed base plate by securing member, so that the surface of the surface of the second end of heat pipe and described fixed head the first groove floor and arc heat pipe first end connects, and so that the bottom surface of the first end surface of arc heat pipe and described fixed head the second groove connect.
3. a kind of passive type CPU radiator structure with increasing part according to claim 1, it is characterized in that: have the CPU heat sink groove suitable with the second end section of described arc heat pipe on the described CPU heat sink, the second end of arc heat pipe is arranged in the CPU heat sink groove, described CPU heat sink is fixed on the mainboard by securing member, so that bottom surface and the mainboard upper surface of the second end surfaces of arc heat pipe and described CPU heat sink groove connect.
4. a kind of passive type CPU radiator structure with increasing part according to claim 1, it is characterized in that: have first groove suitable with the first end cross section of described heat pipe on the little radiating block of described side plate, the first end of heat pipe is arranged in described the first groove, the little radiating block of described side plate is fixedly connected with described side radiating plate-fin by fixture, so that the outside surface of the first end of heat pipe contacts with the bottom surface of side radiating plate-fin inside surface and the first groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320062143 CN203241901U (en) | 2013-02-04 | 2013-02-04 | Passive CPU radiating structure with heightening piece |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320062143 CN203241901U (en) | 2013-02-04 | 2013-02-04 | Passive CPU radiating structure with heightening piece |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203241901U true CN203241901U (en) | 2013-10-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320062143 Expired - Fee Related CN203241901U (en) | 2013-02-04 | 2013-02-04 | Passive CPU radiating structure with heightening piece |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104329890A (en) * | 2014-03-28 | 2015-02-04 | 海尔集团公司 | Heat conduction device and semiconductor refrigerator with heat conduction device |
| CN104329851A (en) * | 2014-08-29 | 2015-02-04 | 青岛海尔股份有限公司 | Semiconductor refrigeration refrigerator and manufacturing method thereof |
| CN104329854A (en) * | 2014-08-29 | 2015-02-04 | 青岛海尔股份有限公司 | Semiconductor refrigeration refrigerator and manufacturing method thereof |
| CN107613731A (en) * | 2017-09-22 | 2018-01-19 | 浙江大学 | Suitable for the on-plane surface flat hot pipe radiator structure of aero-space electronic equipment |
| EP3724563A4 (en) * | 2017-12-11 | 2021-01-27 | Global Cooling, Inc. | Independent auxiliary thermosiphon for inexpensively extending active cooling to additional freezer interior walls |
| US11412638B2 (en) * | 2020-12-01 | 2022-08-09 | Quanta Computer Inc. | Cooling for server with high-power CPU |
-
2013
- 2013-02-04 CN CN 201320062143 patent/CN203241901U/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104329890A (en) * | 2014-03-28 | 2015-02-04 | 海尔集团公司 | Heat conduction device and semiconductor refrigerator with heat conduction device |
| CN104329890B (en) * | 2014-03-28 | 2017-01-04 | 海尔集团公司 | Heat-transfer device and there is the semiconductor freezer of this heat-transfer device |
| CN104329851A (en) * | 2014-08-29 | 2015-02-04 | 青岛海尔股份有限公司 | Semiconductor refrigeration refrigerator and manufacturing method thereof |
| CN104329854A (en) * | 2014-08-29 | 2015-02-04 | 青岛海尔股份有限公司 | Semiconductor refrigeration refrigerator and manufacturing method thereof |
| CN104329854B (en) * | 2014-08-29 | 2017-01-11 | 青岛海尔股份有限公司 | Semiconductor refrigeration refrigerator and manufacturing method thereof |
| CN104329851B (en) * | 2014-08-29 | 2017-02-15 | 青岛海尔股份有限公司 | Semiconductor refrigeration refrigerator and manufacturing method thereof |
| CN107613731A (en) * | 2017-09-22 | 2018-01-19 | 浙江大学 | Suitable for the on-plane surface flat hot pipe radiator structure of aero-space electronic equipment |
| EP3724563A4 (en) * | 2017-12-11 | 2021-01-27 | Global Cooling, Inc. | Independent auxiliary thermosiphon for inexpensively extending active cooling to additional freezer interior walls |
| US11412638B2 (en) * | 2020-12-01 | 2022-08-09 | Quanta Computer Inc. | Cooling for server with high-power CPU |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131016 Termination date: 20160204 |
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| CF01 | Termination of patent right due to non-payment of annual fee |