CN108021181B - Reinforced notebook computer and heat dissipation system thereof - Google Patents
Reinforced notebook computer and heat dissipation system thereof Download PDFInfo
- Publication number
- CN108021181B CN108021181B CN201610929240.9A CN201610929240A CN108021181B CN 108021181 B CN108021181 B CN 108021181B CN 201610929240 A CN201610929240 A CN 201610929240A CN 108021181 B CN108021181 B CN 108021181B
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- China
- Prior art keywords
- heat conduction
- heat
- cpu
- display card
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 56
- 238000002955 isolation Methods 0.000 claims description 16
- 230000003014 reinforcing effect Effects 0.000 claims description 2
- 238000001816 cooling Methods 0.000 abstract description 6
- 230000005855 radiation Effects 0.000 abstract 2
- 238000010586 diagram Methods 0.000 description 9
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1615—Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function
- G06F1/1616—Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function with folding flat displays, e.g. laptop computers or notebooks having a clamshell configuration, with body parts pivoting to an open position around an axis parallel to the plane they define in closed position
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1656—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
- G06F1/1658—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories related to the mounting of internal components, e.g. disc drive or any other functional module
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- General Physics & Mathematics (AREA)
- Mathematical Physics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides a reinforced notebook computer and a heat dissipation system thereof. The heat dissipation system includes: the CPU heat dissipation module is designed into an air cooling mode, the independent display card heat dissipation module is designed into a fanless heat dissipation mode conducted to the shell, and the CPU heat dissipation module and the independent display card heat dissipation module are in heat conduction lap joint relation in structural relation. The invention can increase the heat radiation capacity of the reinforced notebook computer and meet the heat radiation requirement of the independent display card.
Description
Technical Field
The invention relates to the technical field of reinforced notebook computers, in particular to a reinforced notebook computer and a heat dissipation system thereof.
Background
In the special fields of military, public safety, petroleum exploration and the like, the common commercial notebook computer cannot meet the use conditions due to the relatively severe environmental conditions. In this context, the reinforcement of notebook computers has been developed. The reinforced notebook computer has the characteristics of water resistance, dust resistance and compact structure. The existing reinforced notebook computer usually dissipates heat generated by the computer by adopting a method of thickening a metal shell, and has small heat dissipation capacity.
Disclosure of Invention
The reinforced notebook computer and the heat dissipation system thereof provided by the invention can be compatible with an independent display card, and meet the heat dissipation requirement of the independent display card.
In a first aspect, the present invention provides a heat dissipation system for reinforcing a notebook computer, comprising: a shell fixed with a main board, an independent display card heat conduction module provided with a first groove, a CPU heat conduction block provided with a second groove, a CPU heat conduction module and a fan, wherein,
the shell comprises a bottom plate and a fan isolation groove, wherein the bottom plate is provided with the independent display card heat conduction module and the CPU heat conduction module;
the independent display card heat conduction module is contacted with the surface of the independent display card on the main board;
the CPU heat conducting block is arranged on the main board and is contacted with the surface of the CPU on the main board;
the CPU heat conduction module is embedded in the second groove of the CPU heat conduction block and extends outwards, one end of the CPU heat conduction module extends to the independent display card heat conduction module and is overlapped with the first groove, and the other end of the CPU heat conduction module extends to the fan isolation groove;
the fan is arranged in the fan isolation groove.
Optionally, the independent graphics card heat conduction module includes: the heat conduction plate, the independent display card heat conduction block, the first heat conduction pipe and the second heat conduction pipe, wherein,
the contact surface of the heat conducting plate and the bottom plate is provided with the first groove;
the contact surface of the heat conducting plate and the independent display card heat conducting block is embedded with the first heat conducting pipe and the second heat conducting pipe;
the independent display card heat conducting block is respectively contacted with the first heat conducting pipe and the second heat conducting pipe.
Optionally, the CPU thermal conduction module includes: the third heat conduction pipe and the radiating fin are placed in the fan isolation groove, the third heat conduction pipe is embedded in the second groove of the CPU heat conduction block and extends outwards, one end of the third heat conduction pipe extends to the independent display card heat conduction module and is overlapped with the first groove, and the other end of the third heat conduction pipe extends to the fan isolation groove and is connected with the radiating fin.
Optionally, the CPU thermal conductive module further includes: and the fourth heat conduction pipe and the third heat conduction pipe are embedded in the second groove of the CPU heat conduction block side by side, and the tail end of the fourth heat conduction pipe is connected with the radiating fin.
Optionally, the bottom plate is provided with radiating fins, and the radiating fins are covered with baffles with radiating holes.
In a second aspect, the present invention provides a reinforced notebook computer comprising: the heat dissipation system of the reinforced notebook computer and the independent display card are arranged on the main board.
According to the reinforced notebook computer and the heat dissipation system thereof, the independent display card heat dissipation module is compatible and integrated with the CPU heat dissipation module, the CPU heat dissipation module is designed into an air cooling mode, the independent display card heat dissipation module is designed into a fanless heat dissipation mode conducted to the shell, and the CPU heat dissipation module and the independent display card heat dissipation module have a heat conduction lap joint relation in structural relation.
Drawings
Fig. 1 is a schematic structural diagram of a reinforced notebook computer without a heat dissipation system according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a structure of a reinforced notebook computer with a heat dissipation system and a hidden bottom plate according to an embodiment of the invention;
FIG. 3 is a schematic diagram of a base plate with an independent graphics card heat conduction module and a CPU heat conduction module according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a CPU heat conducting block according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of a contact surface between an independent graphics card heat conduction module and a bottom plate according to an embodiment of the present invention;
FIG. 6 is a schematic diagram illustrating a contact surface between an independent graphics card and a heat conduction module of an independent graphics card according to an embodiment of the present invention;
fig. 7 is a schematic structural diagram of a CPU heat conduction module according to an embodiment of the present invention;
FIG. 8 is a schematic diagram of a heat dissipation fin according to an embodiment of the present invention;
fig. 9 is a schematic structural diagram of a baffle according to an embodiment of the present invention.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The embodiment of the invention provides a reinforced notebook computer and a heat dissipation system thereof, as shown in fig. 1, before the reinforced notebook computer is provided with the heat dissipation system, the reinforced notebook computer comprises: the shell 1, be fixed with mainboard 11 in the shell 1, there is CPU111 and independent display card 112 on the mainboard 11, the source of generating heat on the mainboard 11 is CPU111, the source of generating heat of independent display card 112 is GPU1121, still be equipped with a fan isolation groove 13 in the shell 1.
After the heat dissipation system is installed, as shown in fig. 2 and 3, in combination with fig. 1, the heat dissipation system includes: the device comprises a shell 1, an independent display card heat conduction module 2, a CPU heat conduction block 3, a CPU heat conduction module 4 and a fan 5, wherein the shell 1 comprises a bottom plate 12 and a fan isolation groove 13, the independent display card heat conduction module 2 and the CPU heat conduction module 4 are arranged on the bottom plate 12, the CPU heat conduction block 3 is arranged on a main board 11, and the independent display card heat conduction module 2 is contacted with the surface of an independent display card 112 on the main board 11 and is used for conducting heat generated by the independent display card 112; the CPU heat conducting block 3 is in contact with the surface of the CPU111 on the main board 11 and is used for conducting heat generated by the CPU 111; in order to facilitate heat conduction, a first groove 201 is formed in the independent display card heat conduction module 2; as shown in fig. 4, a second groove 301 is formed on the CPU heat conducting block 3, the CPU heat conducting module 4 is embedded in the second groove 301 of the CPU heat conducting block 3 and extends outwards, one end of the CPU heat conducting module extends to the independent graphics card heat conducting module 2 and is overlapped with the first groove 201, and the other end of the CPU heat conducting module extends to the fan isolation groove 13, so that heat conducted by the independent graphics card heat conducting module 2 and the CPU heat conducting block 3 can be conducted simultaneously; the fan 5 is installed in the fan isolation groove 13, and is used for accelerating heat dissipation of the CPU heat conduction module 4.
Optionally, as shown in fig. 5 and fig. 6, the independent graphics card heat conduction module 2 includes: the heat conducting plate 21, the independent display card heat conducting block 22, the first heat conducting pipe 23 and the second heat conducting pipe 24, wherein the first groove 201 is formed on the contact surface of the heat conducting plate 21 with the bottom plate 12, and the first heat conducting pipe 23 and the second heat conducting pipe 24 are embedded on the contact surface of the heat conducting plate 21 with the independent display card heat conducting block 22; the independent display card heat conducting block 22 is respectively contacted with the first heat conducting pipe 23 and the second heat conducting pipe 24.
Optionally, as shown in fig. 7, the CPU heat conducting module 4 includes: the third heat conduction pipe 41 and the cooling fin 42, the cooling fin 42 is placed in the fan isolation groove 13, the third heat conduction pipe 41 is embedded in the second groove 301 of the CPU heat conduction block 3 and extends outwards, one end of the third heat conduction pipe 41 extends to the independent display card heat conduction module 2 and is overlapped with the first groove 201, and the other end of the third heat conduction pipe extends to the fan isolation groove 13 and is connected with the cooling fin 42. In order to increase the heat conducting effect, the CPU heat conducting module 4 may further include a fourth heat conducting pipe 43, where the fourth heat conducting pipe 43 and the third heat conducting pipe 41 are embedded in the second groove 301 of the CPU heat conducting block 3 side by side, and the end of the fourth heat conducting pipe is connected to the heat sink 42.
Optionally, as shown in fig. 8, the bottom plate 12 is provided with a heat dissipation fin 121, which is beneficial to speeding up heat dissipation; as shown in fig. 9, in order to prevent the user from touching the heat dissipation fins 121 directly, and avoid scalding, the heat dissipation fins 121 are covered with a baffle plate 122 with heat dissipation holes.
According to the reinforced notebook computer and the heat dissipation system thereof provided by the embodiment of the invention, the independent display card heat dissipation module is compatible and integrated with the CPU heat dissipation module, the CPU heat dissipation module is designed into an air cooling mode, the independent display card heat dissipation module is designed into a fanless heat dissipation mode conducted to the shell, and in structural relation, the CPU heat dissipation module and the independent display card heat dissipation module have a heat conduction lap joint relationship, so that two heat dissipation paths of the independent display card are two, one heat dissipation path is conducted to the shell for natural heat dissipation, and the corresponding position of the shell is provided with heat dissipation fins; one is to perform forced convection heat dissipation by a fan through a CPU heat dissipation module. Compared with the prior art, the reinforced notebook computer and the heat dissipation system thereof provided by the embodiment of the invention can increase the heat dissipation capacity of the reinforced notebook computer and meet the heat dissipation requirement of an independent display card.
The foregoing is merely illustrative of the present invention, and the present invention is not limited thereto, and any changes or substitutions easily contemplated by those skilled in the art within the scope of the present invention should be included in the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope of the claims.
Claims (5)
1. A heat dissipation system for reinforcing a notebook computer, the heat dissipation system comprising: a shell fixed with a main board, an independent display card heat conduction module, a CPU heat conduction block, a CPU heat conduction module and a fan, wherein,
the shell comprises a bottom plate and a fan isolation groove, wherein the bottom plate is provided with the independent display card heat conduction module and the CPU heat conduction module;
the independent display card heat conduction module comprises a heat conduction plate, an independent display card heat conduction block, a first heat conduction pipe and a second heat conduction pipe, wherein the heat conduction plate is contacted with the bottom plate and the independent display card heat conduction block, a first groove is formed in the contact surface of the heat conduction plate and the bottom plate, the first heat conduction pipe and the second heat conduction pipe are embedded in the contact surface of the heat conduction plate and the independent display card heat conduction block, the independent display card heat conduction block is contacted with the first heat conduction pipe and the second heat conduction pipe respectively, and one side surface of the independent display card heat conduction block away from the heat conduction plate is contacted with the surface of the independent display card on the main plate;
the CPU heat conducting block is arranged on the main board, one side surface of the CPU heat conducting block, which is close to the main board, is contacted with the surface of the CPU on the main board, and a second groove is formed in one side surface of the CPU heat conducting block, which is far away from the main board;
the CPU heat conduction module is embedded in the second groove of the CPU heat conduction block and extends outwards, one end of the CPU heat conduction module extends to the independent display card heat conduction module and is embedded in the first groove, and the other end of the CPU heat conduction module extends to the fan isolation groove;
the fan is arranged in the fan isolation groove.
2. The heat dissipating system of claim 1, wherein the CPU heat conducting module comprises: the third heat conduction pipe and the radiating fin are placed in the fan isolation groove, the third heat conduction pipe is embedded in the second groove of the CPU heat conduction block and extends outwards, one end of the third heat conduction pipe extends to the independent display card heat conduction module and is overlapped with the first groove, and the other end of the third heat conduction pipe extends to the fan isolation groove and is connected with the radiating fin.
3. The heat dissipating system of claim 2, wherein the CPU heat conducting module further comprises: and the fourth heat conduction pipe and the third heat conduction pipe are embedded in the second groove of the CPU heat conduction block side by side, and the tail end of the fourth heat conduction pipe is connected with the radiating fin.
4. The system of claim 1, wherein the base plate has heat dissipating fins, and the heat dissipating fins are covered with a baffle plate having heat dissipating holes.
5. A reinforced notebook computer, characterized in that the reinforced notebook computer comprises the heat dissipation system of the reinforced notebook computer according to any one of claims 1 to 4 and an independent graphics card, the independent graphics card being mounted on the motherboard.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610929240.9A CN108021181B (en) | 2016-10-31 | 2016-10-31 | Reinforced notebook computer and heat dissipation system thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610929240.9A CN108021181B (en) | 2016-10-31 | 2016-10-31 | Reinforced notebook computer and heat dissipation system thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108021181A CN108021181A (en) | 2018-05-11 |
| CN108021181B true CN108021181B (en) | 2023-11-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610929240.9A Active CN108021181B (en) | 2016-10-31 | 2016-10-31 | Reinforced notebook computer and heat dissipation system thereof |
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| Country | Link |
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| CN (1) | CN108021181B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114035664B (en) * | 2021-10-26 | 2022-10-25 | 荣耀终端有限公司 | Heat dissipation system and equipment |
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| CN105807869A (en) * | 2015-05-25 | 2016-07-27 | 周奋豪 | Radiating structure and mounting structure for independent graphics card of computer |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN205353872U (en) * | 2016-01-31 | 2016-06-29 | 佛山市森隆网络科技有限公司 | Integration computer mainboard with solely show |
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| CN2842544Y (en) * | 2005-06-14 | 2006-11-29 | 广达电脑股份有限公司 | Electronic apparatus with rediating module |
| CN101520685A (en) * | 2009-04-17 | 2009-09-02 | 深圳市东维丰电子科技股份有限公司 | Carbon nanometer material radiating module |
| CN201716656U (en) * | 2010-08-02 | 2011-01-19 | 苏州聚力电机有限公司 | Multi-heat-source heat dissipation module structure |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN108021181A (en) | 2018-05-11 |
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Effective date of registration: 20230705 Address after: 518057 1701, Yanxiang science and technology building, 31 Gaoxin middle Fourth Road, Maling community, Yuehai street, Nanshan District, Shenzhen City, Guangdong Province Applicant after: Yanxiang smart IOT Technology Co.,Ltd. Address before: 518107 5th floor, No.1, Yanxiang Zhigu chuangxiangdi, No.11, Gaoxin Road, Guangming New District, Shenzhen City, Guangdong Province Applicant before: EVOC INTELLIGENT TECHNOLOGY Co.,Ltd. |
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