CN108021181A - Reinforced notebook computer computer and its cooling system - Google Patents
Reinforced notebook computer computer and its cooling system Download PDFInfo
- Publication number
- CN108021181A CN108021181A CN201610929240.9A CN201610929240A CN108021181A CN 108021181 A CN108021181 A CN 108021181A CN 201610929240 A CN201610929240 A CN 201610929240A CN 108021181 A CN108021181 A CN 108021181A
- Authority
- CN
- China
- Prior art keywords
- heat
- display card
- independent display
- cpu
- conducting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 23
- 230000017525 heat dissipation Effects 0.000 claims abstract description 14
- 238000002955 isolation Methods 0.000 claims description 16
- 230000005855 radiation Effects 0.000 abstract description 17
- 230000010354 integration Effects 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 8
- 210000004556 brain Anatomy 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1615—Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function
- G06F1/1616—Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function with folding flat displays, e.g. laptop computers or notebooks having a clamshell configuration, with body parts pivoting to an open position around an axis parallel to the plane they define in closed position
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1656—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
- G06F1/1658—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories related to the mounting of internal components, e.g. disc drive or any other functional module
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- General Physics & Mathematics (AREA)
- Mathematical Physics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention provides a kind of reinforced notebook computer computer and its cooling system.The cooling system includes：It is fixed with the housing of mainboard, is provided with the independent display card heat conduction module of the first groove, the CPU heat-conducting blocks for being provided with the second groove, CPU heat conduction module and fan, the independent display card heat conduction module does compatible integration with the CPU heat conduction module, CPU heat radiation modules are designed to air-cooled pattern, independent display card heat radiation module is designed to the fan-free radiating mode conducted to housing, and CPU heat radiation modules have the relation of heat transfer overlap joint with independent display card heat radiation module in structural relation.The present invention can increase the heat dissipation capacity of reinforced notebook computer computer, meet the radiating requirements of independent display card.
Description
Technical field
The present invention relates to reinforced notebook computer computer technology field, more particularly to a kind of reinforced notebook computer computer and its heat dissipation system
System.
Background technology
In special dimensions such as military affairs, public safety, oil explorations, due to environmental condition rather harsh, common commercial pen
Remember that this computer can not meet use condition.In this background, reinforced notebook computer computer comes into being.Reinforced notebook computer computer
Feature is water proof and dust proof, compact-sized.Existing reinforced notebook computer computer usually through using thicken metal shell method come pair
The heat that computer produces radiates, and heat dissipation capacity is small, since independent display card power consumption is larger, not easy heat radiation, thus it is existing plus
Gu the cooling system of laptop can not meet the radiating requirements of independent display card.
The content of the invention
Reinforced notebook computer computer and its cooling system provided by the invention, can compatible independent display card, meet independent display card
Radiating requirements.
In a first aspect, the present invention provides a kind of cooling system of reinforced notebook computer computer, including：It is fixed with the shell of mainboard
Body, be provided with the independent display card heat conduction module of the first groove, the CPU heat-conducting blocks for being provided with the second groove, CPU heat conduction module and fan,
Wherein,
The housing includes bottom plate and fan isolation channel, and the bottom plate is provided with the independent display card heat conduction module and described
CPU heat conduction modules；
The independent display card heat conduction module is in contact with the surface of the independent display card on the mainboard；
The CPU heat-conducting blocks are installed on the mainboard, are in contact with the surface of the CPU on the mainboard；
The CPU heat conduction module is embedded in the second groove of the CPU heat-conducting blocks and stretches out, and one end extends to described
Independent display card heat conduction module is simultaneously overlapped with first groove, and the other end extends to the fan isolation channel；
The fan is installed in the fan isolation channel.
Alternatively, the independent display card heat conduction module, including：Heat-conducting plate, independent display card heat-conducting block, the first heat conducting pipe and
Two heat conducting pipes, wherein,
The heat-conducting plate on the contact surface of the bottom plate with being provided with first groove；
The heat-conducting plate on the contact surface of the independent display card heat-conducting block with being embedded with first heat conducting pipe and the second heat conduction
Pipe；
The independent display card heat-conducting block is contacted with first heat conducting pipe and the second heat conducting pipe respectively.
Alternatively, the CPU heat conduction module, including：3rd heat conducting pipe and heat sink, the heat sink are placed on the wind
Fan in isolation channel, the 3rd heat conducting pipe is embedded in the second groove of the CPU heat-conducting blocks and stretches out, and one end extends to institute
State independent display card heat conduction module and overlapped with first groove, the other end extends to the fan isolation channel and the heat sink
Connection.
Alternatively, the CPU heat conduction module, further includes：4th heat conducting pipe, the 4th heat conducting pipe and the 3rd heat conduction
Tube side-by-side is embedded in the second groove of the CPU heat-conducting blocks, and the heat sink is connected in its end.
Alternatively, the bottom plate carries radiating fin, and the radiating fin overlying cover strip has the baffle of heat emission hole.
Second aspect, the present invention provide a kind of reinforced notebook computer computer, including：The heat dissipation system of above-mentioned reinforced notebook computer computer
System and independent display card, the independent display card are installed on the mainboard.
Reinforced notebook computer computer and its cooling system provided by the invention, independent display card heat radiation module and CPU heat radiation modules
Compatible integration is done, CPU heat radiation modules are designed to air-cooled pattern, and independent display card heat radiation module is designed to conduct to housing fan-free
Radiating mode, CPU heat radiation modules have the relation of heat transfer overlap joint with independent display card heat radiation module in structural relation, with existing skill
Art is compared, and can increase the heat dissipation capacity of reinforced notebook computer computer, meets the radiating requirements of independent display card.
Brief description of the drawings
Fig. 1 is the structure diagram that the reinforced notebook computer computer that one embodiment of the invention provides does not install cooling system；
Fig. 2 is that the reinforced notebook computer computer that one embodiment of the invention provides installs cooling system and hides the structure for the plate that breaks off the base
Schematic diagram；
Fig. 3 is the bottom plate for being provided with independent display card heat conduction module and CPU heat conduction modules that one embodiment of the invention provides
Structure diagram；
Fig. 4 is the structure diagram for the CPU heat-conducting blocks that one embodiment of the invention provides；
Fig. 5 is the structure diagram of the contact surface of the independent display card heat conduction module that one embodiment of the invention provides and bottom plate；
Fig. 6 is the structural representation of the contact surface of the independent display card heat conduction module that one embodiment of the invention provides and independent display card
Figure；
Fig. 7 is the structure diagram for the CPU heat conduction modules that one embodiment of the invention provides；
Fig. 8 is the structure diagram for the radiating fin that one embodiment of the invention provides；
Fig. 9 is the structure diagram for the baffle that one embodiment of the invention provides.
Embodiment
To make the purpose, technical scheme and advantage of the embodiment of the present invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, the technical solution in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is only
Only it is part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, ordinary skill
Personnel's all other embodiments obtained without making creative work, belong to the scope of protection of the invention.
The embodiment of the present invention provides a kind of reinforced notebook computer computer and its cooling system, as shown in Figure 1, reinforced notebook computer is electric
Before brain installation cooling system, including：Housing 1, is fixed with mainboard 11 in the housing 1, have on the mainboard 11 CPU111 and
Independent display card 112, the pyrotoxin on the mainboard 11 is CPU111, and the pyrotoxin of the independent display card 112 is GPU1121, institute
State and a fan isolation channel 13 is additionally provided with housing 1.
After cooling system is installed, as shown in Figures 2 and 3, with reference to Fig. 1, the cooling system includes：Housing 1, independence
Video card heat conduction module 2, CPU heat-conducting blocks 3, CPU heat conduction module 4 and fan 5, wherein, the housing 1 includes bottom plate 12 and the wind
Isolation channel 13 is fanned, the independent display card heat conduction module 2 and the CPU heat conduction module 4 are installed on the bottom plate 12, the CPU
Heat-conducting block 3 is installed on the mainboard 11, the independent display card heat conduction module 2 and the independent display card 112 on the mainboard 11
Surface is in contact, the heat produced for conducting the independent display card 112；On the CPU heat-conducting blocks 3 and the mainboard 11
The surface of CPU111 is in contact, the heat produced for conducting the CPU111；In order to facilitate heat conduction, led in the independent display card
The first groove 201 is provided with thermal module 2；As shown in figure 4, the second groove 301, the CPU are provided with the CPU heat-conducting blocks 3
Heat conduction module 4 is embedded in the second groove 301 of the CPU heat-conducting blocks 3 and stretches out, and one end extends to the independent display card and leads
Thermal module 2 is simultaneously overlapped with first groove 201, and the other end extends to the fan isolation channel 13, can be conducted at the same time described
Independent display card heat conduction module 2 is conducted through the heat come with the CPU heat-conducting blocks 3；The fan 5 is installed on the fan isolation channel
In 13, for accelerating the heat dissipation of the CPU heat conduction module 4.
Alternatively, as shown in Figure 5 and Figure 6, the independent display card heat conduction module 2, including：Heat-conducting plate 21, independent display card are led
Heat block 22, the first heat conducting pipe 23 and the second heat conducting pipe 24, wherein, opened on the contact surface with the bottom plate 12 of the heat-conducting plate 21
There is first groove 201, described first is embedded with the contact surface with the independent display card heat-conducting block 22 of the heat-conducting plate 21
23 and second heat conducting pipe 24 of heat conducting pipe；The independent display card heat-conducting block 22 respectively with 23 and second heat conducting pipe of the first heat conducting pipe
24 contacts.
Alternatively, as shown in fig. 7, the CPU heat conduction module 4, including：3rd heat conducting pipe 41 and heat sink 42, it is described to dissipate
Backing 42 is placed in the fan isolation channel 13, and the 3rd heat conducting pipe 41 is embedded in the second groove of the CPU heat-conducting blocks 3
In 301 and stretch out, one end extends to the independent display card heat conduction module 2 and overlapped with first groove 201, the other end
The fan isolation channel 13 is extended to be connected with the heat sink 42.In order to increase heat-conducting effect, the CPU heat conduction module 4 can
To increase by the 4th heat conducting pipe 43, the 4th heat conducting pipe 43 is embedded in the CPU heat-conducting blocks 3 side by side with the 3rd heat conducting pipe 41
In second groove 301, the heat sink 42 is connected in its end.
Alternatively, as shown in figure 8, the bottom plate 12 carries radiating fin 121, be conducive to accelerate heat dissipation；As shown in figure 9,
User directly touches the radiating fin 121 in order to prevent, avoids scalding, and the 121 overlying cover strip of radiating fin has heat dissipation
The baffle 122 in hole.
Reinforced notebook computer computer and its cooling system provided in an embodiment of the present invention, independent display card heat radiation module are dissipated with CPU
Thermal module does compatible integration, and CPU heat radiation modules are designed to air-cooled pattern, and independent display card heat radiation module is designed to what is conducted to housing
Fan-free radiating mode, CPU heat radiation modules have the relation of heat transfer overlap joint with independent display card heat radiation module in structural relation, because
The heat dissipation path of this independent display card has two, and one is conduction natural heat dissipation to housing, and housing relevant position is designed with heat dissipation
Fin；One is to carry out forced convection heat dissipation by fan by CPU heat radiation modules.Compared with prior art, the present invention is implemented
Reinforced notebook computer computer and its cooling system that example provides can increase the heat dissipation capacity of reinforced notebook computer computer, meet independent aobvious
The radiating requirements of card.
The above description is merely a specific embodiment, but protection scope of the present invention is not limited thereto, any
Those familiar with the art the invention discloses technical scope in, the change or replacement that can readily occur in, all should
It is included within the scope of the present invention.Therefore, protection scope of the present invention should be subject to scope of the claims.
Claims (6)
1. a kind of cooling system of reinforced notebook computer computer, it is characterised in that the cooling system includes：It is fixed with the shell of mainboard
Body, be provided with the independent display card heat conduction module of the first groove, the CPU heat-conducting blocks for being provided with the second groove, CPU heat conduction module and fan,
Wherein,
The housing includes bottom plate and fan isolation channel, and the bottom plate is provided with the independent display card heat conduction module and the CPU
Heat conduction module；
The independent display card heat conduction module is in contact with the surface of the independent display card on the mainboard；
The CPU heat-conducting blocks are installed on the mainboard, are in contact with the surface of the CPU on the mainboard；
The CPU heat conduction module is embedded in the second groove of the CPU heat-conducting blocks and stretches out, and one end extends to the independence
Video card heat conduction module is simultaneously overlapped with first groove, and the other end extends to the fan isolation channel；
The fan is installed in the fan isolation channel.
2. the cooling system of reinforced notebook computer computer according to claim 1, it is characterised in that the independent display card heat conduction
Module, including：Heat-conducting plate, independent display card heat-conducting block, the first heat conducting pipe and the second heat conducting pipe, wherein,
The heat-conducting plate on the contact surface of the bottom plate with being provided with first groove；
The heat-conducting plate on the contact surface of the independent display card heat-conducting block with being embedded with first heat conducting pipe and the second heat conducting pipe；
The independent display card heat-conducting block is contacted with first heat conducting pipe and the second heat conducting pipe respectively.
3. the cooling system of reinforced notebook computer computer according to claim 1, it is characterised in that the CPU heat conduction module,
Including：3rd heat conducting pipe and heat sink, the heat sink are placed in the fan isolation channel, and the 3rd heat conducting pipe is embedded in institute
State in the second groove of CPU heat-conducting blocks and stretch out, one end extends to the independent display card heat conduction module and with described first
Groove overlaps, and the other end extends to the fan isolation channel and is connected with the heat sink.
4. the cooling system of reinforced notebook computer computer according to claim 3, it is characterised in that the CPU heat conduction module,
Further include：It is second recessed to be embedded in the CPU heat-conducting blocks for 4th heat conducting pipe, the 4th heat conducting pipe and the 3rd heat conduction tube side-by-side
In groove, the heat sink is connected in its end.
5. the cooling system of reinforced notebook computer computer according to claim 1, it is characterised in that the bottom plate is with heat dissipation
Fin, the radiating fin overlying cover strip have the baffle of heat emission hole.
6. a kind of reinforced notebook computer computer, it is characterised in that the reinforced notebook computer computer is included as appointed in claim 1 to 5
The cooling system and independent display card of reinforced notebook computer computer described in one, the independent display card are installed on the mainboard.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610929240.9A CN108021181B (en) | 2016-10-31 | 2016-10-31 | Reinforced notebook computer and heat dissipation system thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610929240.9A CN108021181B (en) | 2016-10-31 | 2016-10-31 | Reinforced notebook computer and heat dissipation system thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108021181A true CN108021181A (en) | 2018-05-11 |
| CN108021181B CN108021181B (en) | 2023-11-24 |
Family
ID=62070417
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610929240.9A Active CN108021181B (en) | 2016-10-31 | 2016-10-31 | Reinforced notebook computer and heat dissipation system thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108021181B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114035664A (en) * | 2021-10-26 | 2022-02-11 | 荣耀终端有限公司 | Heat dissipation system and equipment |
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| CN205353872U (en) * | 2016-01-31 | 2016-06-29 | 佛山市森隆网络科技有限公司 | Integration computer mainboard with solely show |
| CN105807869A (en) * | 2015-05-25 | 2016-07-27 | 周奋豪 | Radiating structure and mounting structure for independent graphics card of computer |
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2016
- 2016-10-31 CN CN201610929240.9A patent/CN108021181B/en active Active
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|---|---|---|---|---|
| CN2842544Y (en) * | 2005-06-14 | 2006-11-29 | 广达电脑股份有限公司 | Electronic apparatus with rediating module |
| CN101520685A (en) * | 2009-04-17 | 2009-09-02 | 深圳市东维丰电子科技股份有限公司 | Carbon nanometer material radiating module |
| CN201716656U (en) * | 2010-08-02 | 2011-01-19 | 苏州聚力电机有限公司 | Multi-heat-source heat dissipation module structure |
| CN201788443U (en) * | 2010-08-24 | 2011-04-06 | 联达科技(厦门)有限公司 | Independent display card expanding device of mini notebook PC |
| CN102421273A (en) * | 2010-09-27 | 2012-04-18 | 富瑞精密组件（昆山）有限公司 | Cooling device and electronic device using same |
| CN102883580A (en) * | 2011-07-13 | 2013-01-16 | 鸿富锦精密工业（深圳）有限公司 | Radiator combination |
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| CN114035664A (en) * | 2021-10-26 | 2022-02-11 | 荣耀终端有限公司 | Heat dissipation system and equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108021181B (en) | 2023-11-24 |
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Effective date of registration: 20230705 Address after: 518057 1701, Yanxiang science and technology building, 31 Gaoxin middle Fourth Road, Maling community, Yuehai street, Nanshan District, Shenzhen City, Guangdong Province Applicant after: Yanxiang smart IOT Technology Co.,Ltd. Address before: 518107 5th floor, No.1, Yanxiang Zhigu chuangxiangdi, No.11, Gaoxin Road, Guangming New District, Shenzhen City, Guangdong Province Applicant before: EVOC INTELLIGENT TECHNOLOGY Co.,Ltd. |
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