CN219457597U - Machine room energy consumption monitoring host for subway station - Google Patents
Machine room energy consumption monitoring host for subway station Download PDFInfo
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- CN219457597U CN219457597U CN202320459683.1U CN202320459683U CN219457597U CN 219457597 U CN219457597 U CN 219457597U CN 202320459683 U CN202320459683 U CN 202320459683U CN 219457597 U CN219457597 U CN 219457597U
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- chip
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- heat dissipation
- energy consumption
- machine room
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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Abstract
The utility model relates to a machine room energy consumption monitoring host for a subway station, which comprises a shell, a heat radiation assembly and an interface assembly, wherein the shell is arranged on the subway station, a module assembly and a chip assembly are arranged in the shell, the chip assembly comprises a first chip, a second chip and a third chip, the front surface of the shell is respectively provided with a first groove and a second groove at the corresponding positions of the first chip and the second chip, and the back surface of the shell is provided with a third groove at the corresponding position of the third chip; the heat dissipation assembly comprises a first heat dissipation fin, a second heat dissipation fin and a third heat dissipation fin, wherein the first heat dissipation fin is arranged in the first groove, the second heat dissipation fin is arranged in the second groove, the third heat dissipation fin is arranged in the third groove, and the heat dissipation assembly is used for dissipating heat of the chip assembly; the side of casing is provided with interface assembly, and interface assembly is used for supplying external equipment to insert. The radiating fins are placed through the grooves, so that the space of the host is reduced, and the radiating effect of the host is guaranteed.
Description
Technical Field
The application relates to the field of subway machine room energy consumption monitoring, in particular to a machine room energy consumption monitoring host for a subway station.
Background
Machine room, workplace and production unit of old hand and silk floss weaving industry; now referring to a computer study room; in the IT industry, a machine room is commonly referred to as telecommunications, network access, mobility, two-wire, electricity, government or business, etc., where servers are stored to provide IT services to users and employees. As a machine room, its physical environment is strictly controlled, and is mainly divided into several aspects: i.e. temperature, power supply, floor, fire protection system. Because the computer lab needs twenty-four hours uninterrupted duty, so the physical environment of computer lab need carry out the uninterrupted control of twenty-four hours to ensure that the equipment in the computer lab can be operated under qualified environment, ensure the safety of equipment. But the heat dissipation effect of the existing machine room energy consumption monitoring host is poor, and the monitoring operation is affected.
Disclosure of Invention
In view of the above problems, the application provides a machine room energy consumption monitoring host for a subway station, which is used for solving the technical problem that the heat dissipation effect of the machine room energy consumption monitoring host is poor.
In order to achieve the above object, the present inventors provide a machine room energy consumption monitoring host for a subway station, including a housing, a heat dissipation assembly, and an interface assembly, where the housing is mounted on the subway station, a module assembly and a chip assembly are mounted in the housing, the chip assembly includes a first chip, a second chip, and a third chip, a first groove and a second groove are respectively formed on the front surface of the housing at corresponding positions of the first chip and the second chip, and a third groove is formed on the back surface of the housing at a corresponding position of the third chip; the heat dissipation assembly comprises a first heat dissipation fin, a second heat dissipation fin and a third heat dissipation fin, wherein the first heat dissipation fin is arranged in the first groove, the second heat dissipation fin is arranged in the second groove, the third heat dissipation fin is arranged in the third groove, and the heat dissipation assembly is used for dissipating heat of the chip assembly; the side of casing is provided with interface assembly, and interface assembly is used for supplying external equipment to insert.
In some embodiments, the height of the fins is consistent with the depth of the grooves.
In some embodiments, the housing is mounted on the subway station by means of lugs.
In some embodiments, the front surface of the housing is further provided with an indicator light for indicating the state of the machine room energy consumption monitoring host.
In some embodiments, the interface assembly includes a power interface for connecting to an external power source.
In some embodiments, the interface assembly includes a 485 communication interface, an input of which is connected to the electricity meter and the water meter, and an ethernet interface for outputting data.
In some embodiments, a waterproof membrane is also provided on the 485 communication interface to prevent water from entering the 485 communication interface.
In some embodiments, the interface assembly further comprises a 5G antenna interface, the 5G antenna interface for connecting to an external antenna.
In some embodiments, the heat sink is integrally formed with the recess or the heat sink is removably attached to the recess.
In some embodiments, the housing includes, from top to bottom, an upper portion, a middle portion, and a lower portion, the upper portion and the middle portion being sealed by a first rubber ring, and the middle portion and the lower portion being sealed by a second rubber ring.
Compared with the prior art, the technical scheme is provided with a plurality of grooves for placing the radiating fins on the basis of being provided with a plurality of chips, and the radiating fins are devices for radiating heat of the easily-generated electronic elements in the power supply. Specifically, the front surface of the shell is provided with a first groove and a second groove at corresponding positions of the first chip and the second chip respectively, and the back surface of the shell is provided with a third groove at corresponding positions of the third chip. The radiating fins are placed through the grooves, so that the space of the host is reduced, and the radiating fins are guaranteed to be well contacted with the chip, so that the radiating effect of the host is guaranteed.
The foregoing summary is merely an overview of the present application, and is provided to enable one of ordinary skill in the art to make more clear the present application and to be practiced according to the teachings of the present application and to make more readily understood the above-described and other objects, features and advantages of the present application, as well as by reference to the following detailed description and accompanying drawings.
Drawings
The drawings are only for purposes of illustrating the principles, implementations, applications, features, and effects of the present application and are not to be construed as limiting the application.
In the drawings of the specification:
FIG. 1 is a schematic view of a housing according to an embodiment;
FIG. 2 is a rear view of FIG. 1;
FIG. 3 is a bottom view of FIG. 1;
fig. 4 is a schematic structural diagram of an energy consumption monitoring host in a machine room according to an embodiment;
FIG. 5 is a rear view of FIG. 4;
fig. 6 is a bottom view of fig. 4.
Reference numerals referred to in the above drawings are explained as follows:
1. the machine room energy consumption monitoring host;
11. a housing;
111. a front face;
1111. a first groove;
1112. a second groove;
1113. an indicator light;
112. a back surface;
1121. a third groove;
113. an upper part;
114. a middle part;
115. a lower part;
116. a first rubber ring;
117. a second rubber ring;
12. a heat dissipation assembly;
121. a first heat sink;
122. a second heat sink;
123. a third heat sink;
13. hanging lugs;
14. an interface assembly;
141. 485 communication interfaces;
142. an Ethernet interface;
143. a power interface;
144. a 5G antenna interface;
145. a waterproof membrane.
Detailed Description
In order to describe the possible application scenarios, technical principles, practical embodiments, and the like of the present application in detail, the following description is made with reference to the specific embodiments and the accompanying drawings. The embodiments described herein are only used to more clearly illustrate the technical solutions of the present application, and are therefore only used as examples and are not intended to limit the scope of protection of the present application.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the present application. The appearances of the phrase "in various places in the specification are not necessarily all referring to the same embodiment, nor are they particularly limited to independence or relevance from other embodiments. In principle, in the present application, as long as there is no technical contradiction or conflict, the technical features mentioned in the embodiments may be combined in any manner to form a corresponding implementable technical solution.
Unless defined otherwise, technical terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present application pertains; the use of related terms herein is for the description of specific embodiments only and is not intended to limit the present application.
In the description of the present application, the term "and/or" is a representation for describing a logical relationship between objects, which means that there may be three relationships, e.g., a and/or B, representing: there are three cases, a, B, and both a and B. In addition, the character "/" herein generally indicates that the front-to-back associated object is an "or" logical relationship.
In this application, terms such as "first" and "second" are used merely to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual number, order, or sequence of such entities or operations.
Without further limitation, the use of the terms "comprising," "including," "having," or other like terms in this application is intended to cover a non-exclusive inclusion, such that a process, method, or article of manufacture that comprises a list of elements does not include additional elements but may include other elements not expressly listed or inherent to such process, method, or article of manufacture.
As in the understanding of the "examination guideline," the expressions "greater than", "less than", "exceeding", and the like are understood to exclude the present number in this application; the expressions "above", "below", "within" and the like are understood to include this number. Furthermore, in the description of the embodiments of the present application, the meaning of "a plurality of" is two or more (including two), and similarly, the expression "a plurality of" is also to be understood as such, for example, "a plurality of groups", "a plurality of" and the like, unless specifically defined otherwise.
In the description of the embodiments of the present application, spatially relative terms such as "center," "longitudinal," "transverse," "length," "width," "thickness," "up," "down," "front," "back," "left," "right," "vertical," "horizontal," "vertical," "top," "bottom," "inner," "outer," "clockwise," "counter-clockwise," "axial," "radial," "circumferential," etc., are used herein as terms of orientation or positional relationship based on the specific embodiments or figures, and are merely for convenience of description of the specific embodiments of the present application or ease of understanding of the reader, and do not indicate or imply that the devices or components referred to must have a particular position, a particular orientation, or be configured or operated in a particular orientation, and therefore are not to be construed as limiting of the embodiments of the present application.
Unless specifically stated or limited otherwise, in the description of the embodiments of the present application, the terms "mounted," "connected," "affixed," "disposed," and the like are to be construed broadly. For example, the "connection" may be a fixed connection, a detachable connection, or an integral arrangement; the device can be mechanically connected, electrically connected and communicated; it can be directly connected or indirectly connected through an intermediate medium; which may be a communication between two elements or an interaction between two elements. The specific meanings of the above terms in the embodiments of the present application can be understood by those skilled in the art to which the present application pertains according to the specific circumstances.
Referring to fig. 1 to 6, the present embodiment relates to a machine room energy consumption monitoring host 1 for a subway station, including a housing 11, a heat dissipation assembly 12 and an interface assembly 14, wherein the housing 11 is mounted on the subway station, a module assembly and a chip assembly are mounted in the housing 11, the chip assembly includes a first chip, a second chip and a third chip, a front 111 of the housing 11 is respectively provided with a first groove 1111 and a second groove 1112 at corresponding positions of the first chip and the second chip, and a back 112 of the housing 11 is provided with a third groove 1121 at corresponding positions of the third chip; the heat dissipation component 12 includes a first heat dissipation fin 121, a second heat dissipation fin 122, and a third heat dissipation fin 123, wherein the first heat dissipation fin 121 is installed in the first groove 1111, the second heat dissipation fin 122 is installed in the second groove 1112, the third heat dissipation fin 123 is installed in the third groove 1121, and the heat dissipation component 12 is used for dissipating heat of the chip component; the side of the housing 11 is provided with an interface assembly 14, the interface assembly 14 being for access by external devices.
The machine room energy consumption monitoring host 1 is used for monitoring various energy consumption data in a subway, including equipment such as a shielding door, an elevator, illumination, an air conditioner and the like, collecting power consumption data of the equipment onto the monitoring host (edge computing equipment), analyzing and processing the power consumption data, and finally forming decoded and calculated data and displaying the decoded and calculated data in a server system.
The machine room energy consumption monitoring host 1 comprises a shell 11 and a heat dissipation assembly 12, and the shell 11 is installed on a subway station. In some embodiments, the housing 11 is provided with lugs 13 at both ends, and the housing 11 is mounted on the subway station through the lugs 13. The energy consumption monitoring host 1 of the machine room is convenient to install by arranging the hanging lugs 13. A module assembly and a chip assembly are provided in the housing 11, through which the machine room energy consumption monitoring host 1 processes various data. Wherein, the module subassembly includes (1) CI8X02 module: the module adopts a NXP i.MX8X (including i.MX8 QXP/8DXP/8DX series chip) CPU as a main chip, is provided with a 2GB/3GB/4GB LPDDR4 RAM memory and a 16GB/32GB/64GB eMMC5.1 ROM memory, and provides a one-core multi-screen electronic cabin solution such as high-performance voice, navigation, multimedia, graphic application, human-computer interface and the like, has rich peripheral interfaces, and meets project requirements. The UART, USB, RGMII, SDIO and SAI interfaces of the system application are installed on the system. (2) AG550Q module: the module is a vehicle-gauge wireless communication module developed based on a high-pass platform and used for realizing a 4/5G/V2X communication function, and a GNSS positioning function is realized by the module. The WIFI module AF50T can support 802.11ac/ax and is also mounted on the AG550Q module. (3) ps32k144hft0vllt module: and the NXP singlechip chip realizes the on-off time sequence control in the system.
Optionally, the chip assembly includes a first chip, a second chip and a third chip, where the first chip may be a 5G module chip, the second chip may be a core processor chip, and the third chip may be a power module processing chip, where the chip assembly includes a plurality of chips to improve processing efficiency, and meanwhile, a heat dissipation effect of the plurality of chips needs to be ensured. Therefore, the housing 11 is provided with grooves for placing the heat dissipation assembly 12 at the location of the chip assembly. Specifically, the front surface 111 of the housing 11 is provided with a first groove 1111 and a second groove 1112 at corresponding positions of the first chip and the second chip, respectively, and the back surface 112 of the housing 11 is provided with a third groove 1121 at corresponding position of the third chip. I.e. the first heat sink 121 corresponds to the first chip, the second heat sink 122 corresponds to the second chip, and the third heat sink 123 corresponds to the third recess 1121. The radiating fin is a device for radiating heat of an easily-generated electronic element in the power supply.
The interface component 14 is used for accessing an external device, accessing data through the external device, processing the data through the module component and the chip component in the housing 11, and finally outputting the data through the external device.
Compared with the prior art, the technical scheme is provided with a plurality of grooves for placing the radiating fins on the basis of being provided with a plurality of chips, and the radiating fins are devices for radiating heat of the easily-generated electronic elements in the power supply. Specifically, the front surface 111 of the housing 11 is provided with a first groove 1111 and a second groove 1112 at corresponding positions of the first chip and the second chip, respectively, and the back surface 112 of the housing 11 is provided with a third groove 1121 at corresponding position of the third chip. The radiating fins are placed through the grooves, so that the space of the host is reduced, and the radiating fins are guaranteed to be well contacted with the chip, so that the radiating effect of the host is guaranteed.
Optionally, according to some embodiments of the present application, the height of the fins is consistent with the depth of the grooves, as shown in fig. 4. The depth of the groove is required to ensure that the radiating fin can be contacted with the chip. Meanwhile, in order to make the housing 11 have a certain aesthetic property, the height of the heat sink is set to be uniform with the depth of the groove.
Optionally, as shown in fig. 1, the front 111 of the housing 11 is further provided with an indicator light 1113 according to some embodiments of the present application, where the indicator light 1113 is used to indicate the status of the machine room energy consumption monitoring host 1. In order to facilitate understanding of the state of the machine room energy consumption monitoring host 1, an indicator lamp 1113 is further disposed on the front 111 of the housing 11. Optionally, a plurality of indicator lights 1113 are provided, each indicator light 1113 corresponding to a state, for example: power on state, operating state, standby light, etc.
Optionally, according to some embodiments of the present application, as shown in fig. 3, the interface assembly 14 includes a power interface 143, the power interface 143 being for connecting to an external power source. The power supply is provided for the machine room energy consumption monitoring host 1 through an external power supply.
Optionally, as shown in fig. 3, the interface assembly 14 further includes a 485 communication interface 141 and an ethernet interface 142, where an input end of the 485 communication interface 141 is connected to an electricity meter and a water meter, and the ethernet interface 142 is used for outputting data.
485 communication interface 141 is connected with an ammeter and a water meter (for collecting water consumption), inputs original data, processes the original data through a module component and a chip component in shell 11, and outputs the processed data through Ethernet interface 142.
Optionally, as shown in fig. 6, a waterproof membrane 145 is further disposed on the 485 communication interface 141, where the waterproof membrane 145 is used to prevent water from entering the 485 communication interface 141, according to some embodiments of the present application.
In order to prevent water from entering when the communication interface is not in use, a waterproof membrane 145 is further provided at the 485 communication interface 141. The waterproof membrane 145 serves to prevent water from entering the 485 communication interface 141. The waterproof membrane 145 may be a rubber grommet.
Optionally, according to some embodiments of the present application, as shown in fig. 3, the interface assembly 14 further includes a 5G antenna interface 144,5G antenna interface 144 for connecting to an external antenna.
According to some embodiments of the present application, optionally, the heat sink is integrally formed with the recess, or the heat sink is detachably connected with the recess. In order to facilitate the installation of the radiating fins, the radiating fins and the grooves are integrally formed when the radiating fins and the grooves are arranged. In some embodiments, the heat sink is removably attached to the recess for facilitating subsequent replacement or cleaning of the heat sink or cleaning of the recess. Optionally, a clamping block is arranged at the bottom of the radiating fin, a clamping groove is arranged at the corresponding position of the groove on the convex block, and the radiating fin is connected with the clamping groove through the clamping block.
Optionally, as shown in fig. 3, according to some embodiments of the present application, the housing 11 includes, from top to bottom, an upper portion 113, a middle portion 114, and a lower portion 115, where the upper portion 113 and the middle portion 114 are sealed by a first rubber ring 116, and the middle portion 114 and the lower portion 115 are sealed by a second rubber ring 117.
In order to make the housing 11 better waterproof and sealing effect, the housing 11 is divided into an upper portion 113, a middle portion 114 and a lower portion 115 from top to bottom, the upper portion 113 and the middle portion 114 are sealed by a first rubber ring 116, and the middle portion 114 and the lower portion 115 are sealed by a second rubber ring 117. In some embodiments, the first rubber ring 116 and the second rubber ring 117 are integrally formed with the housing 11.
Compared with the prior art, the technical scheme is provided with a plurality of grooves for placing the radiating fins on the basis of being provided with a plurality of chips, and the radiating fins are devices for radiating heat of the easily-generated electronic elements in the power supply. Specifically, the front surface 111 of the housing 11 is provided with a first groove 1111 and a second groove 1112 at corresponding positions of the first chip and the second chip, respectively, and the back surface 112 of the housing 11 is provided with a third groove 1121 at corresponding position of the third chip. The radiating fins are placed through the grooves, so that the space of the host is reduced, and the radiating fins are guaranteed to be well contacted with the chip, so that the radiating effect of the host is guaranteed.
Finally, it should be noted that, although the foregoing embodiments have been described in the text and the accompanying drawings of the present application, the scope of the patent protection of the present application is not limited thereby. All technical schemes generated by replacing or modifying equivalent structures or equivalent flows based on the essential idea of the application and by utilizing the contents recorded in the text and the drawings of the application, and the technical schemes of the embodiments are directly or indirectly implemented in other related technical fields, and the like, are included in the patent protection scope of the application.
Claims (10)
1. A computer lab energy consumption monitoring host computer for subway station, its characterized in that includes:
the subway station comprises a shell, wherein the shell is arranged on the subway station, a module assembly and a chip assembly are arranged in the shell, the chip assembly comprises a first chip, a second chip and a third chip, a first groove and a second groove are respectively formed in the front surface of the shell at the corresponding positions of the first chip and the second chip, and a third groove is formed in the back surface of the shell at the corresponding position of the third chip;
the heat dissipation assembly comprises a first heat dissipation fin, a second heat dissipation fin and a third heat dissipation fin, wherein the first heat dissipation fin is installed in the first groove, the second heat dissipation fin is installed in the second groove, the third heat dissipation fin is installed in the third groove, and the heat dissipation assembly is used for dissipating heat of the chip assembly;
the interface component is arranged on the side face of the shell and is used for being accessed by external equipment.
2. The machine room energy consumption monitoring host for subway station of claim 1, wherein the height of the cooling fin is identical to the depth of the groove.
3. The machine room energy consumption monitoring host for subway stations according to claim 1, wherein the housing is mounted on a subway station by means of a hanger.
4. The machine room energy consumption monitoring host machine for subway stations according to claim 1, wherein the front face of the housing is further provided with an indicator light for indicating the state of the machine room energy consumption monitoring host machine.
5. The machine room energy consumption monitoring host for subway stations of claim 1, wherein the interface assembly comprises a power interface for connecting to an external power source.
6. The machine room energy consumption monitoring host for subway stations according to claim 1, wherein the interface assembly further comprises a 485 communication interface and an ethernet interface, an input end of the 485 communication interface is connected with an ammeter and a water meter, and the ethernet interface is used for outputting data.
7. The machine room energy consumption monitoring host for subway stations according to claim 6, wherein a waterproof film is further arranged on the 485 communication interface, and the waterproof film is used for preventing water from entering the 485 communication interface.
8. The machine room energy consumption monitoring host for subway stations of claim 1, wherein the interface assembly further comprises a 5G antenna interface, the 5G antenna interface for connecting an external antenna.
9. The machine room energy consumption monitoring host of claim 1, wherein the heat sink is integrally formed with the groove or the heat sink is detachably connected with the groove.
10. The machine room energy consumption monitoring host of claim 1, wherein the housing comprises an upper portion, a middle portion and a lower portion from top to bottom, the upper portion and the middle portion are sealed by a first rubber ring, and the middle portion and the lower portion are sealed by a second rubber ring.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202320459683.1U CN219457597U (en) | 2023-03-13 | 2023-03-13 | Machine room energy consumption monitoring host for subway station |
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CN202320459683.1U CN219457597U (en) | 2023-03-13 | 2023-03-13 | Machine room energy consumption monitoring host for subway station |
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CN202320459683.1U Active CN219457597U (en) | 2023-03-13 | 2023-03-13 | Machine room energy consumption monitoring host for subway station |
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