CN212649979U - Heat dissipation casing and intelligent gateway applying same - Google Patents

Abstract

The utility model discloses a heat dissipation casing and use intelligent gateway of this heat dissipation casing, this casing include casing and lower casing, go up the casing and detain locate down on the casing and with casing fixed connection down, go up and be equipped with a plurality ofly to the heat dissipation recess that caves in to corresponding inside heat source position on the casing, a plurality of heat dissipation recess are parallel and equidistant range, it is protruding to be equipped with at least one heat dissipation to correspond inside heat source position on the inside wall of casing down, the bellied top of heat dissipation supports to the inside heat source of neighbouring. This heat dissipation casing has increased heat radiating area through set up heat dissipation recess on last casing to through set up the heat dissipation arch on casing down, make heat source direct contact casing, the heat of being convenient for is effluvium fast, and this intelligent gateway when using this heat dissipation casing arranges the great power of heat dissipation capacity and core control panel in both ends about respectively, and power and last casing contact, core control panel and casing contact down have further improved the radiating efficiency, and the radiating effect is more excellent.

Description

Heat dissipation casing and intelligent gateway applying same

Technical Field

The utility model relates to a network equipment technical field, more specifically the intelligent gateway who relates to a heat dissipation casing and applied this heat dissipation casing that says so.

Background

At present, with the wide application of electronic devices, the problem of heat dissipation of devices becomes a key point of attention of people, and in many electronic products, hubs and other devices, a common heat dissipation mode is to conduct and disperse a heat source through a heat dissipation fin, and a fan can be added to realize heat convection so as to achieve the purpose of cooling the devices. However, outdoor equipment needs to have a waterproof and dustproof sealed cavity body due to the requirement of the working environment, so that the mode of heat convection cooling is difficult to realize, the problem of heat accumulation in the use process cannot be solved by the radiating fins, heat generated in the equipment with the sealed cavity body cannot be timely dissipated, the normal operation of the equipment is influenced, and meanwhile, the service life of an electric device in the equipment can also be influenced when the electric device works in an over-temperature environment for a long time.

Therefore, how to provide a heat dissipation housing with better heat dissipation effect is a problem that needs to be solved by those skilled in the art.

SUMMERY OF THE UTILITY MODEL

In view of this, the utility model provides a heat dissipation casing and applied this heat dissipation casing's intelligent gateway, this heat dissipation casing make inside heat source casing about can the direct contact through reasonable heat dissipation recess and heat dissipation arch that sets up, the heat in the seal chamber of being convenient for dispels fast, has solved current the unable heat convection that realizes of seal chamber body heat dissipation casing, and inside heat is piled up the problem that influences normal work of equipment and life.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

a heat-dissipating enclosure, comprising: go up casing and lower casing, it detains to establish to go up the casing down on the casing and with casing fixed connection down, it is equipped with a plurality ofly to the sunken heat dissipation recess of inside to correspond inside heat source position on the casing to go up, it is a plurality of parallel and equidistant range of heat dissipation recess, it is protruding to be equipped with at least one heat dissipation corresponding inside heat source position on the inside wall of casing down, the bellied top of heat dissipation supports to adjacent inside heat source.

Further, still be equipped with heat conduction silica gel layer on the inside wall of heat dissipation recess, the heat dissipation recess passes through heat conduction silica gel layer and inside heat source contact. The arrangement of the heat conduction silica gel layer further accelerates the heat conduction efficiency, so that the heat dissipation effect of the upper shell is better.

Furthermore, lifting lugs for being fixedly installed with an external structure are further arranged on the top of the upper shell and the outer walls of the two sides of the upper shell. The lifting lugs are specifically positioned at the positions flush with the back face of the upper shell, and the arrangement of the lifting lugs is mainly convenient for fixedly mounting the heat dissipation shell on a wall body or other fixed objects.

Preferably, the upper shell and the lower shell are both made of aluminum alloy. The upper shell and the lower shell are made of aluminum alloy materials with good heat conduction performance, and heat conduction efficiency can be improved.

On the other hand, the utility model also provides an intelligent gateway, which comprises the radiating shell, and a power supply, a gateway mainboard, a LoRa expansion board and a core control board which are packaged in the radiating shell;

the power with go up the casing contact, the gateway mainboard set up in the bottom of power, the loRa expansion board set up in the bottom of gateway mainboard, the core control board set up in the bottom of loRa expansion board and with the protruding contact of heat dissipation.

Specifically, the power supply, the gateway motherboard, the LoRa expansion board, and the core control board are arranged from top to bottom and electrically connected in sequence, so that the power supply and the core control board, which are main heat sources, are disposed at relatively far ends, and the purpose of dispersing the heat sources is achieved.

Further, the core control panel includes control panel body and main control chip, main control chip install in the bottom of control panel body, main control chip with the heat dissipation arch contact. The main control chip on the core control board is a main heat source and is in contact with the heat dissipation protrusion, so that heat can be conveniently and timely conducted out of the shell.

Furthermore, the intelligent gateway further comprises a plurality of indicator lights, the indicator lights are electrically connected with the core control board, and an indicator light display window is further arranged on the upper shell corresponding to the indicator lights. Under the condition that install the pilot lamp in intelligent gateway, in order to make the pilot lamp clearly show, the position that corresponds the pilot lamp on going up the casing is equipped with pilot lamp display window, and pilot lamp display window can be realized with transparent material to go up the casing outer wall around and carry out effectual sealed, avoid influencing the leakproofness of cavity.

According to the technical scheme, compared with the prior art, the utility model provides a heat dissipation casing and use intelligent gateway of this heat dissipation casing, this heat dissipation casing is through setting up the heat dissipation recess on last casing, heat radiating area has been increased, and through set up the heat dissipation arch on casing down, make heat source direct contact casing, the heat of being convenient for is effluvized fast, this intelligent gateway is when using this heat dissipation casing, arrange the great power of heat dissipation capacity and core control panel in both ends about respectively, power and last casing contact, core control panel and lower casing contact, the radiating efficiency has further been improved like this, the radiating effect is more excellent.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.

Fig. 1 is a schematic structural diagram of an upper housing of a heat dissipation housing provided by the present invention;

fig. 2 is a schematic structural diagram of a lower housing of a heat dissipation housing according to the present invention;

fig. 3 is a schematic structural diagram of the lower housing at another viewing angle according to the embodiment of the present invention;

fig. 4 is a schematic structural diagram of an intelligent gateway using the heat dissipation housing provided by the present invention;

fig. 5 is a schematic diagram of the positions of two main heat sources of the power supply and the core control board in the embodiment of the present invention.

In the figure, 1, go up the casing, 11, heat dissipation recess, 12, lug, 13, pilot lamp display window, 2, lower casing, 21, heat dissipation arch, 3, power, 4, gateway mainboard, 5, loRa expansion board, 6, core control panel, 61, control panel body, 62, main control chip, 7, pilot lamp, 8, power source, 9, network RJ45 interface.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1, fig. 2 and fig. 3, an embodiment of the present invention discloses a heat dissipation housing, including: go up casing 1 and casing 2 down, go up casing 1 and detain and locate casing 2 down on and with casing 2 fixed connection down, go up casing 1 and go up and be equipped with a plurality of heat dissipation grooves 11 to sunken inside corresponding inside heat source position, a plurality of heat dissipation grooves 11 are parallel and equidistant range, correspond inside heat source position on casing 2's the inside wall down and be equipped with at least one heat dissipation arch 21, the top of heat dissipation arch 21 supports to adjacent inside heat source.

Referring to fig. 1, the groove design (i.e., the heat dissipation groove) is added on the surface of the upper shell, so that the heat dissipation surface is enlarged; the aluminum alloy material with good heat conductivity is adopted for manufacturing, so that heat can be conducted better. The middle-upper casing of this embodiment adopts the aluminium material, and the difference in temperature of the internal and external surface of balance casing that can be fine is through surface in heat transfer to external environment, and the design of heat conduction silica gel layer can make heat conduction efficiency further improve, more is favorable to the heat that the inside heat source produced to spill fast.

In order to ensure that the heat dissipation area is as large as possible, a plurality of rows of heat dissipation grooves can be additionally arranged at the top of the upper shell corresponding to the internal heat source.

Preferably, the inner side wall of the heat dissipation groove 11 is further provided with a heat conduction silica gel layer, and the heat dissipation groove 11 is in contact with an internal heat source through the heat conduction silica gel layer.

Preferably, the top and two side outer walls of the upper shell 1 are further provided with lifting lugs 12 for fixedly mounting with an external structure. In this embodiment, four lifting lugs are arranged, the positions of the top of the upper shell, which are close to the two ends, are respectively provided with one, the positions of the two ends of the upper shell, which are close to the bottom, are respectively provided with one, and the four lifting lugs are all located on the same plane with the back surface of the upper shell, so that the upper shell can be conveniently fixed on a wall body or other fixed objects.

Referring to fig. 2 and 3, the lower casing is partially protruded corresponding to the internal heat source, so that the heat source can directly contact with the lower casing to directly transfer heat energy.

On the other hand, referring to fig. 4, the embodiment of the present invention further discloses an intelligent gateway, which includes the above heat dissipation enclosure, and a power supply 3, a gateway motherboard 4, a LoRa expansion board 5 and a core control board 6 packaged in the heat dissipation enclosure;

power 3 and the contact of last casing 1, gateway mainboard 4 sets up in power 3's bottom, and loRa expansion board 5 sets up in gateway mainboard 4's bottom, and core control board 6 sets up in loRa expansion board 5's bottom and with the contact of heat dissipation arch 21.

Specifically, the core control board 6 includes a control board body 61 and a main control chip 62, the main control chip 62 is mounted at the bottom of the control board body 61, and the main control chip 62 is in contact with the heat dissipation protrusion 21.

Specifically, the gateway motherboard 4 is provided with a power interface 8, the gateway motherboard 4 is electrically connected with the power supply 3 through the power interface 8, the gateway motherboard 4 is further provided with two network RJ45 interfaces 9, the LoRa expansion board 5 is provided with one network RJ45 interface 9, and the gateway motherboard 4, the LoRa expansion board 5 and the core control board 6 are electrically connected in sequence.

Preferably, the intelligent gateway further comprises a plurality of indicator lamps 7, the indicator lamps 7 are electrically connected with the core control board 6, and an indicator lamp display window 13 is further arranged on the upper shell 1 corresponding to the position of the indicator lamp 7. In this embodiment, three indicator lamps 7 are provided, and the indicator lamps 7 are used for indicating the operating condition of the intelligent gateway, and correspondingly, three indicator lamp display windows 13 are provided on the upper shell 1.

Referring to fig. 5, the positions of two main heat generating sources, a power supply 3 and a core control board 6, are shown, respectively, and the heat generating area of the power supply 3 is located on the upper surface of the power supply 3 shown in the figure; the main control chip is positioned on the bottom surface of the core control board 6.

The utility model discloses an intelligent gateway realizes quick radiating principle as follows:

1. reasonably planning internal layout and dispersing heat sources;

the main heat sources of the intelligent gateway are a power supply 3 and a main control chip 62 of a core control panel 6; the main heating sources are positioned on two relatively far sides by optimizing the layout, so that the purpose of dispersing the heat sources is achieved.

2. Optimizing a heat conduction path;

the position of the power supply close to the upper shell can be added with a heat-conducting silica gel layer, so that the heat of the power supply is directly transferred to the upper shell, a plurality of rows of heat-radiating grooves are arranged on the upper shell corresponding to the position of the power supply, so that the heat-radiating area can be increased, and the upper shell is made of aluminum, so that the temperature difference between the inner surface and the outer surface of the shell is well balanced, and the heat is transferred to the external environment through the outer surface; firstly, an internal heat source is directly contacted with the upper shell to shorten a heat transfer path and improve heat transfer efficiency, and secondly, the upper shell and the heat source can be contacted in a large area to improve heat energy transfer;

similarly, the main control chip of the core control panel is in direct contact with the lower shell through the heat dissipation protrusions, so that heat generated by the chip is directly dispersed on the lower shell, the heat is transferred to the outside of the shell by utilizing the characteristic of the metal material of the lower shell, and the purpose of heat dissipation is achieved by utilizing the external environment. Through the improved design of the structure and the reasonable arrangement of the internal devices, the problem that heat in the sealed cavity cannot be effectively dissipated is improved.

In summary, compared with the existing heat dissipation mechanism, the heat dissipation housing and the intelligent gateway using the same disclosed in this embodiment firstly change the heat exchange manner and replace convection with conduction. The material is changed, the heat transfer characteristic of the metal material is utilized, the heat dissipation bulge is arranged on the lower shell, and the heating source is directly contacted with the shell metal body, so that the heat transfer and the heat exchange are completed on the premise of not changing the sealing property of the cavity, and the heat is effectively transferred in the inner part of the closed cavity and the external environment; meanwhile, the radiating grooves are additionally formed in the surface of the upper shell, so that the radiating area is enlarged, heat is better transferred to the air, and the purposes of sealing and radiating are achieved.

The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (7)

1. A heat dissipation enclosure, comprising: go up casing (1) and casing (2) down, it detains to go up casing (1) and locates on casing (2) down and with casing (2) fixed connection down, it is equipped with a plurality of heat dissipation recess (11) to sunken inside to correspond inside heat source position on casing (1) to go up, and is a plurality of heat dissipation recess (11) are parallel and equidistant range, it is equipped with at least one heat dissipation arch (21) to correspond inside heat source position on the inside wall of casing (2) down, the top of heat dissipation arch (21) is supported to adjacent inside heat source.

2. The heat dissipation casing according to claim 1, wherein a heat conductive silicone layer is further disposed on an inner sidewall of the heat dissipation groove (11), and the heat dissipation groove (11) is in contact with an internal heat source through the heat conductive silicone layer.

3. The heat dissipation cabinet of claim 1, wherein the top and two outer walls of the upper casing (1) are further provided with lifting lugs (12) for fixing and mounting with an external structure.

4. The heat dissipating housing of claim 1 wherein the upper housing and the lower housing are made of aluminum alloy.

5. An intelligent gateway, comprising the heat dissipation chassis according to any one of claims 1 to 4, and a power supply (3), a gateway main board (4), a LoRa expansion board (5) and a core control board (6) which are packaged in the heat dissipation chassis;

power (3) with go up casing (1) contact, gateway mainboard (4) set up in the bottom of power (3), loRa expansion board (5) set up in the bottom of gateway mainboard (4), core control board (6) set up in the bottom of loRa expansion board (5) and with heat dissipation arch (21) contact.

6. The intelligent gateway according to claim 5, wherein the core control board (6) comprises a control board body (61) and a main control chip (62), the main control chip (62) is mounted at the bottom of the control board body (61), and the main control chip (62) is in contact with the heat dissipation protrusion (21).

7. The intelligent gateway according to claim 5, further comprising a plurality of indicator lamps (7), wherein the plurality of indicator lamps (7) are electrically connected to the core control board (6), and an indicator lamp display window (13) is further disposed on the upper housing (1) at a position corresponding to the indicator lamps (7).

Images