CN210075875U - Radiating fin, radiating module and electronic equipment - Google Patents
Radiating fin, radiating module and electronic equipment Download PDFInfo
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- CN210075875U CN210075875U CN201920067086.8U CN201920067086U CN210075875U CN 210075875 U CN210075875 U CN 210075875U CN 201920067086 U CN201920067086 U CN 201920067086U CN 210075875 U CN210075875 U CN 210075875U
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- plate
- heat dissipation
- fin
- heating panel
- heat
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Abstract
The utility model discloses a radiating fin, including first heating panel, second heating panel and a plurality of fin unit, first heating panel and second heating panel set up relatively, and are a plurality of the fin unit is followed the extending direction of first heating panel and second heating panel connects gradually between first heating panel and the second heating panel, each be formed with the portion of bending on the fin unit respectively. Through the design, the utility model discloses a radiating fin's heat radiating area obviously increases, under the same service environment, has more efficient radiating effect. Additionally, the utility model also discloses a heat dissipation module and electronic equipment.
Description
Technical Field
The utility model relates to an electronic equipment heat dissipation technical field especially relates to a radiating fin, heat dissipation module and electronic equipment.
Background
In order to meet the light and thin requirements of a notebook computer, a chip structure inside the notebook computer is highly integrated, the high integration of the chip structure increases heating power, and the notebook computer needs low surface temperature and low noise, so that an efficient heat dissipation module is needed to meet the requirements; however, the heat dissipation fins of the conventional heat dissipation module are flat fins, and the heat dissipation performance of the conventional heat dissipation module cannot meet the increasingly high heat dissipation requirements. Moreover, the working medium in the heat pipe of the existing heat dissipation module is usually water, but the heat conductivity coefficient of water is not large, and the efficient heat dissipation of the heat dissipation module is also restricted.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a radiating fin has efficient heat dispersion.
Another object of the present invention is to provide a heat dissipation module having efficient heat dissipation performance.
Another object of the present invention is to provide an electronic apparatus, wherein the heat dissipation module has efficient heat dissipation performance.
In order to realize the above object, the utility model provides a radiating fin, including first heating panel, second heating panel and a plurality of fin unit, first heating panel and second heating panel set up relatively, and are a plurality of the fin unit is followed the extending direction of first heating panel and second heating panel connects gradually between first heating panel and the second heating panel, each be formed with the portion of bending on the fin unit respectively.
Preferably, the fin unit includes a first connecting plate, a second connecting plate, and a bent plate serving as the bent portion, one end of the first connecting plate is connected to the first heat dissipating plate, one end of the second connecting plate is connected to the second heat dissipating plate, one end of the bent plate is connected to the other end of the first connecting plate, and the other end of the bent plate is connected to the other end of the second connecting plate.
Preferably, the first heat dissipation plate and the second heat dissipation plate are parallel to each other, the first connection flat plate and the second connection flat plate are respectively and vertically connected to the first heat dissipation plate and the second heat dissipation plate, and two ends of the bent flat plate are respectively and vertically connected to the first heat dissipation plate and the second heat dissipation plate.
Preferably, a plurality of the fin units are arranged between the first heat dissipation plate and the second heat dissipation plate in the same orientation.
Preferably, the bent flat plates of the fin units are located on the same plane and are sequentially connected into a whole.
Preferably, a plurality of the fin units have the same structure and size.
Preferably, a plurality of the fin units are respectively formed by punching.
In order to achieve the above another object, the present invention provides a heat dissipation module, which includes heat dissipation fins and a heat pipe, wherein the heat dissipation fins are as described above, and one end of the heat pipe is connected to one of the first heat dissipation plate and the second heat dissipation plate.
Preferably, the heat pipe is internally provided with nonmagnetic Al2O3-H2And (4) O nanofluid.
In order to achieve the above another object, the present invention provides an electronic device including the heat dissipation module as described above.
Compared with the prior art, the radiating fin comprises a first radiating plate and a second radiating plate which are arranged oppositely and a plurality of fin units connected between the first radiating plate and the second radiating plate, wherein a bending part is formed on each fin unit; thereby make the utility model discloses a radiating fin's heat radiating area obviously increases, under the same service environment, has more efficient radiating effect.
Drawings
Fig. 1 is a schematic perspective view of a heat dissipation fin according to an embodiment of the present invention.
Fig. 2 is a front view of the heat dissipating fin shown in fig. 1.
Fig. 3 is a perspective view of a fin unit of the heat dissipating fin shown in fig. 1.
Fig. 4 is a schematic perspective view of a heat dissipation module according to an embodiment of the present invention.
Detailed Description
In order to explain the contents, structural features, and objects and effects of the present invention in detail, the following description is given in conjunction with the embodiments and the accompanying drawings.
Referring to fig. 1 to 3, the present invention discloses a heat dissipation fin 1, including a first heat dissipation plate 10, a second heat dissipation plate 20 and a plurality of fin units 30, the first heat dissipation plate 10 and the second heat dissipation plate 20 are disposed oppositely, the plurality of fin units 30 are sequentially connected between the first heat dissipation plate 10 and the second heat dissipation plate 20 along the extending direction of the first heat dissipation plate 10 and the second heat dissipation plate 20, and each fin unit 30 is formed with a bending portion. As a preferred embodiment, each fin unit 30 is separately manufactured and then connected between the first heat dissipation plate 10 and the second heat dissipation plate 20, preferably connected between the first heat dissipation plate 10 and the second heat dissipation plate 20 by welding, but not limited thereto; in other embodiments, the heat dissipation fin 1 may be integrally formed. It should be noted that the heat dissipating fin 1 of the present invention is not limited to include only the fin unit 30 described above.
The radiating fin 1 of the utility model comprises a first radiating plate 10 and a second radiating plate 20 which are arranged oppositely and a plurality of fin units 30 connected between the first radiating plate 10 and the second radiating plate 20, wherein a bending part is respectively formed on each fin unit 30; thereby make the utility model discloses a radiating area of radiating fin 1 obviously increases, under the same service environment, has more efficient radiating effect.
In some embodiments, the fin unit 30 includes a first connection plate 31, a second connection plate 32, and a bent plate 33 as a bent portion, one end of the first connection plate 31 is connected to the first heat dissipation plate 10, one end of the second connection plate 32 is connected to the second heat dissipation plate 20, one end of the bent plate 33 is connected to the other end of the first connection plate 31, and the other end of the bent plate 33 is connected to the other end of the second connection plate 32; through the design, when the fin unit 30 is manufactured in a split mode, only one flat plate needs to be bent at the middle part to form the bent flat plate 33, and the processing mode is simple and easy to achieve.
As a preferred embodiment, the first heat dissipation plate 10 and the second heat dissipation plate 20 are parallel to each other, the first connection plate 31 and the second connection plate 32 are vertically connected to the first heat dissipation plate 10 and the second heat dissipation plate 20, respectively, and both ends of the bent plate 33 are vertically connected to the first heat dissipation plate 10 and the second heat dissipation plate 20, respectively; but not limited thereto.
As a more preferred embodiment, a plurality of fin units 30 are disposed in the same orientation between the first heat dissipation plate 10 and the second heat dissipation plate 20; but not limited thereto. The term "in the same direction" as used herein means that each of the bent flat plates 33 is bent in the same direction with respect to the corresponding first connecting flat plate 31 or second connecting flat plate 32.
As a preferable scheme, the bent flat plates 33 of the plurality of fin units 30 are located on the same plane and are sequentially connected into a whole, so as to further enhance the heat dissipation effect of the heat dissipation fin 1 and enhance the overall stability of the heat dissipation fin 1; in a preferred example, each fin unit 30 is made of a split body, and the bent flat plates 33 of a plurality of fin units 30 are welded into a whole; of course, the plurality of fin units 30 may be integrally formed as a single fin array, or the heat dissipating fin 1 may be integrally formed as a whole.
In some embodiments, several fin units 30 have the same structure and dimensions; but not limited thereto.
In some embodiments, the plurality of fin units 30 are respectively formed by punching; but not limited thereto.
Referring to fig. 4, the present invention further discloses a heat dissipation module, which includes a heat dissipation fin 1 and a heat pipe 2, wherein the heat dissipation fin 1 is as described in the above embodiments, and one end of the heat pipe 2 is connected to one of the first heat dissipation plate 10 and the second heat dissipation plate 20.
In some embodiments, nonmagnetic Al is provided in the heat pipe 22O3-H2And (4) O nanofluid. Compare the working medium in traditional heat pipe and be water, the utility model discloses a non-magnetic Al2O3-H2The O nanofluid is used as a working medium of the heat pipe 2, so that the heat conduction capability is effectively improved, and the heat transferred from the heat dissipation fin 1 can be quickly transferred to a cold source (not shown).
Preferably, Al2O3The mass fraction of (A) is less than 1%, the radius of the nano-particles is less than 70nm, and the thermal conductivity is about 150W/m.K.
In addition, the utility model also provides an electronic device, which comprises the heat dissipation module of the embodiment; thereby make the utility model discloses electronic equipment can realize dispelling the heat fast, satisfies the requirement that surface temperature is not high, the noise is little.
The above disclosure is only a preferred embodiment of the present invention, and the function is to facilitate the understanding and implementation of the present invention, which is not to be construed as limiting the scope of the present invention, and therefore, the present invention is not limited to the claims.
Claims (10)
1. The utility model provides a radiating fin, its characterized in that includes first heating panel, second heating panel and a plurality of fin unit, first heating panel and second heating panel set up relatively, and is a plurality of the fin unit is followed the extending direction of first heating panel and second heating panel connects gradually between first heating panel and the second heating panel, each be formed with the portion of bending on the fin unit respectively.
2. The fin according to claim 1, wherein the fin unit includes a first connection plate, a second connection plate, and a bent plate as the bent portion, one end of the first connection plate is connected to the first heat dissipation plate, one end of the second connection plate is connected to the second heat dissipation plate, one end of the bent plate is connected to the other end of the first connection plate, and the other end of the bent plate is connected to the other end of the second connection plate.
3. The fin as claimed in claim 2, wherein the first heat dissipating plate and the second heat dissipating plate are parallel to each other, the first connection plate and the second connection plate are perpendicularly connected to the first heat dissipating plate and the second heat dissipating plate, respectively, and both ends of the bent plate are perpendicularly connected to the first heat dissipating plate and the second heat dissipating plate, respectively.
4. The fin according to claim 3, wherein a plurality of the fin units are disposed in the same orientation between the first heat dissipation plate and the second heat dissipation plate.
5. The fin according to claim 4, wherein the bent flat plates of the plurality of fin units are located on the same plane and are sequentially connected into a whole.
6. The fin according to any one of claims 1 to 5, wherein the plurality of fin units have the same structure and size.
7. The fin according to any one of claims 1 to 5, wherein a plurality of the fin units are respectively formed by punching.
8. A heat dissipation module comprising heat dissipation fins and a heat pipe, the heat dissipation fins being as defined in any one of claims 1 to 7, one end of the heat pipe being connected to one of the first heat dissipation plate and the second heat dissipation plate.
9. The heat dissipation module of claim 8, wherein the heat pipe comprises nonmagnetic Al disposed therein2O3-H2And (4) O nanofluid.
10. An electronic device comprising the heat dissipation module of claim 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920067086.8U CN210075875U (en) | 2019-01-15 | 2019-01-15 | Radiating fin, radiating module and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920067086.8U CN210075875U (en) | 2019-01-15 | 2019-01-15 | Radiating fin, radiating module and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210075875U true CN210075875U (en) | 2020-02-14 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920067086.8U Active CN210075875U (en) | 2019-01-15 | 2019-01-15 | Radiating fin, radiating module and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210075875U (en) |
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2019
- 2019-01-15 CN CN201920067086.8U patent/CN210075875U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210621 Address after: 330000 2 / F, building D, industrial park, 2999 Tianxiang Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee after: Nanchang Qinsheng Electronic Technology Co.,Ltd. Address before: 2 / F and 3 / F, No.2 factory building, Gongye North Road, Songshanhu high tech Industrial Development Zone, Dongguan City, Guangdong Province Patentee before: Dongguan Yuqin Communication Technology Co.,Ltd. |
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| TR01 | Transfer of patent right |