CN221653013U - Electronic device and heat dissipation module thereof - Google Patents
Electronic device and heat dissipation module thereof Download PDFInfo
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- CN221653013U CN221653013U CN202322676521.6U CN202322676521U CN221653013U CN 221653013 U CN221653013 U CN 221653013U CN 202322676521 U CN202322676521 U CN 202322676521U CN 221653013 U CN221653013 U CN 221653013U
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- 230000017525 heat dissipation Effects 0.000 title abstract description 46
- 238000010438 heat treatment Methods 0.000 claims abstract description 10
- 230000005855 radiation Effects 0.000 claims description 23
- 238000010521 absorption reaction Methods 0.000 claims description 9
- 230000000694 effects Effects 0.000 abstract description 5
- 239000000178 monomer Substances 0.000 description 2
- 230000000191 radiation effect Effects 0.000 description 2
- 238000007664 blowing Methods 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
An electronic device and a heat dissipation module thereof, the electronic device includes: the electronic device body and the heat dissipation module. The electronic device body comprises a circuit board and a heating component arranged on the circuit board; the heat dissipation module comprises a heat conduction block and at least a heat pipe, wherein the heat conduction block is provided with a plurality of side edges surrounding each other, the heat pipe is attached to at least one of the plurality of side edges, and the heat conduction block is attached to the heating component. Therefore, the effect that the height is not increased after the bonding is achieved, and the thin type requirement of the current electronic device is met.
Description
Technical Field
The present application relates to a heat sink, and more particularly, to a thinned electronic device and a heat dissipation module thereof.
Background
Regarding the heat sink, the heat sink is used for dissipating heat of a heat generating component in an electronic device (such as a notebook computer, a tablet computer or an intelligent mobile phone).
The conventional radiator comprises a heat conducting block, a heat pipe, a heat radiation fin structure and a heat radiation fan, wherein the heat conducting block is connected with the heating component in an attached mode, two ends of the heat pipe are respectively connected with the heat conducting block and the heat radiation fin structure in an attached mode, so that heat from the heating component is transferred to the heat radiation fin structure through the heat pipe, and finally the heat radiation fin structure is blown by the heat radiation fan, and therefore heat radiation is completed.
However, the heat pipes of the conventional heat sink are attached to the top heat conducting surface of the heat conducting block, so that the height is increased, and the requirement of thinning the current electronic device is met. In detail, the heat conducting block has a top heat conducting surface and a bottom heat conducting surface opposite to each other, the bottom heat conducting surface is attached to the heating component, and one end of the heat pipe is attached to the top heat conducting surface, so that the height of the heat radiator is at least the height of the heat conducting block plus the height of the heat pipe, which is really unfavorable for the thinning of the current electronic device.
Therefore, how to overcome the above-mentioned drawbacks of the prior art is a big problem to be solved by the present inventors.
Disclosure of utility model
The application aims to provide an electronic device and a heat dissipation module thereof, wherein the height of a heat pipe attached with a heat conducting block is still only the height of the heat conducting block, so that the electronic device has the effects of not increasing the height and meeting the thinning requirement of the current electronic device.
In order to achieve the above object, the present application provides a heat dissipation module, comprising: a heat conducting block having a plurality of sides surrounding each other; and at least one heat pipe attached to at least one of the plurality of sides.
In one embodiment, the heat pipe further comprises a heat radiation fin set, the heat pipe is provided with a heat absorption section and a first heat release section, the heat absorption section is attached to at least one of the plurality of sides, and the first heat release section is attached to the heat radiation fin set.
In one embodiment, the heat dissipation device further comprises a fan, the fan and the heat dissipation fin set are arranged side by side, and the first heat dissipation section corresponds to the fan.
In one embodiment, the heat pipe further comprises another heat radiation fin set, the heat pipe further comprises a second heat radiation section, the heat absorption section is connected between the first heat radiation section and the second heat radiation section, and the second heat radiation section is attached to the other heat radiation fin set.
In one embodiment, the heat dissipation device further comprises two fans, the two fans are respectively arranged side by side with the radiating fin group and the other radiating fin group, and the first heat dissipation section and the second heat dissipation section respectively correspond to the two fans to surround.
In one embodiment, the heat pipes are arranged in two, and the plurality of sides comprise at least one first side and at least one second side, and the two heat pipes are respectively attached to the at least one first side and the at least one second side.
In one embodiment, the first side and the second side are provided as one and three or as two, respectively.
In one embodiment, the heat sink further comprises a heat sink group, the heat sink group has a top surface and a bottom surface opposite to each other, each heat pipe has a heat absorbing section and a first heat releasing section connected to each other, the heat absorbing sections of the two heat pipes are respectively attached to at least one first side and at least one second side, and the first heat releasing sections of the two heat pipes are respectively attached to the top surface and the bottom surface or are both attached to one of the top surface and the bottom surface.
In an embodiment, the heat pipe further includes a fan, the fan and the heat dissipation fin set are disposed side by side, and the first heat dissipation section of each heat pipe is surrounded by the fan.
In one embodiment, the heat pipe further comprises another heat dissipation fin set, each heat pipe further comprises a second heat dissipation section, the heat absorption section is connected between the first heat dissipation section and the second heat dissipation section, and the second heat dissipation sections of the two heat pipes are respectively attached to the top surface and the bottom surface of the other heat dissipation fin set or are attached to one of the top surface and the bottom surface of the other heat dissipation fin set.
In one embodiment, the heat pipe further comprises two fans, the two fans are respectively arranged side by side with the radiating fin group and the other radiating fin group, and the first heat release section and the second heat release section of each heat pipe are respectively surrounded by the two fans.
The application further provides an electronic device, comprising: the electronic device body comprises a circuit board and a heating component arranged on the circuit board; and the heat dissipation module is used for attaching the heat conduction block to the heating component.
Compared with the prior art, the application has the following effects: by attaching the heat pipe to the side of the heat conducting block (i.e. the thickness side of the heat conducting block), the height of the attached heat pipe will not be increased, and thus the requirement of thinning the electronic device is met.
Drawings
Fig. 1 is a schematic plan view of a first embodiment of an electronic device according to the present application.
Fig. 2 is a schematic perspective view of a first embodiment of the electronic device of the present application.
Fig. 3 is a schematic perspective view of a second embodiment of the electronic device in a top view.
Fig. 4 is a schematic bottom view of a second embodiment of the electronic device according to the present application.
Reference numerals illustrate:
100, an electronic device;
1, an electronic device body;
11, a circuit board;
111, avoiding a gap;
12, a heating component;
2, a heat dissipation module;
21: a heat conduction block;
211, a first side;
212 a second side;
215 top thermal conductive surface;
216, bottom heat conducting surface;
22a,22b heat pipes;
221 a first heat release section;
222 a second heat release section;
225, a heat absorption section;
23, radiating fin group;
231 top surface;
232, the bottom surface;
24, a fan;
241, an air outlet.
Detailed Description
The detailed description and technical content of the present application are as follows with reference to the accompanying drawings, the drawings are, however, to be regarded as illustrative in nature and not as restrictive.
The application provides an electronic device and a heat dissipation module thereof, as shown in fig. 1, the heat dissipation module 2 is used for providing heat dissipation for a heating component 12 in the electronic device 100. Fig. 1 to 2 show a first embodiment of the present application, and fig. 3 to 4 show a second embodiment of the present application.
As shown in fig. 1 to 2, a first embodiment of an electronic device 100 of the present application includes: the electronic device body 1 and the heat dissipation module 2.
The electronic device body 1 includes a housing (not shown) and a circuit board 11 disposed in the housing. The circuit board 11 is provided with a heat generating component 12.
The heat dissipation module 2 includes a heat conduction block 21 and a heat pipe 22a. The heat conducting block 21 is attached to the heat generating component 12 and has a plurality of sides surrounding each other, and the sides include at least one first side 211 and at least one second side 212, for example, may include one first side 211 and three second sides 212 as shown, may include two first sides 211 and two second sides 212 not shown, or may include three first sides 211 and one second side 212 not shown, which is not limited in this aspect of the application.
It should be noted that, the heat conducting block 21 is a block having a thickness, the heat conducting block 21 has the plurality of sides, and the top heat conducting surface 215 and the bottom heat conducting surface 216 (see fig. 4) opposite to each other at intervals, and the sides are the thickness of the heat conducting block 21 and are circumferentially connected between the periphery of the top heat conducting surface 215 and the periphery of the bottom heat conducting surface 216. The heat conducting block 21 is attached to the heat generating component 12 by its bottom heat conducting surface 216.
The heat pipe 22a is attached to at least one of the sides, and is attached to the first side 211, i.e. the thickness side of the heat conducting block 21. It should be noted that the attached heat pipe 22a is flush with or lower than the height of the heat conducting block 21; the heat pipe 22a may be a flat pipe throughout, or may be made flat only at the portion to be attached, and in this embodiment, a flat pipe throughout is taken as an example.
Therefore, the heat pipe 22a is attached to the first side 211 of the heat conducting block 21, which is a thickness side, but not to the top heat conducting surface 215 of the heat conducting block 21, so that the height is not increased (the height of the heat pipe 22a attached to the heat conducting block 21 is still only the height of the heat conducting block 21), thereby meeting the requirement of thinning the present electronic device 100.
In addition, the heat dissipating module 2 of the present application further includes at least one heat dissipating fin set 23 and at least one fan 24, for example, one heat dissipating fin set 23 and one fan 24 (not shown), or two heat dissipating fin sets 23 and two fans 24 as shown, which is not limited in the present application. Wherein the heat sink fin group 23 has a top surface 231 and a bottom surface 232 (see fig. 4) spaced apart from each other; fan 24 is a vortex fan.
Taking a heat dissipation fin set 23 and a fan 24 as an example, the circuit board 11 is provided with an avoidance gap 111, the fan 24 is fixed on the circuit board 11 corresponding to the avoidance gap 111 and has two air outlets 241, and the fan 24 is arranged in the avoidance gap 111 to reduce the protruding amplitude of the fan 24 protruding from the circuit board 11 as much as possible. The heat dissipation fin group 23 and the fan 24 are arranged side by side, and the heat dissipation fin group 23 is correspondingly positioned at the two air outlets 241, the fan 24 is approximately just positioned in the avoidance gap 111, and the heat dissipation fin group 23 protrudes out of the rectangular range of the circuit board 11; it should be noted that, the heat dissipation fin set 23 may be a monolithic structure (not shown), or may be a monolithic structure as shown and have two heat dissipation fin set monomers (not labeled with reference numerals), and the two heat dissipation fin set monomers are respectively configured corresponding to the two air outlets 241. The heat pipe 22a has a heat absorbing section 225 and a first heat releasing section 221 connected to each other, the heat absorbing section 225 is attached to the first side 211, and the first heat releasing section 221 is attached to the top surface 231 of the heat dissipating fin set 23 and surrounds the fan 24 in an L shape; the heat absorbing section 225 is used for absorbing heat of the heat conducting block 21, and the heat releasing section (such as the first heat releasing section 221) is used for transferring the absorbed heat to the heat dissipating fin set 23, and then the fan 24 is used for blowing air to the heat dissipating fin set 23 to achieve the heat dissipating effect.
It should be noted that, the heat dissipating fin set 23 and the fan 24 have a height difference therebetween, and the first heat dissipating section 221 is located in the height difference and is not higher than the fan 24, so that the height is not increased.
Taking two heat dissipation fin groups 23 (which may also be referred to as a heat dissipation fin group 23 and another heat dissipation fin group 23, and the two heat dissipation fin groups are identical to each other) and two fans 24 as examples, the circuit board 11 is also provided with two avoidance notches 111, and each fan 24 is fixed to the circuit board 11 corresponding to each avoidance notch 111 and has two air outlets 241. Each heat dissipation fin group 23 and each fan 24 are arranged side by side, and each heat dissipation fin group 23 is correspondingly positioned at two air outlets 241. The heat pipe 22a further has a second heat release section 222, the heat absorption section 225 is connected between the first heat release section 221 and the second heat release section 222, and the first heat release section 221 and the second heat release section 222 are respectively attached to the top surfaces 231 of the two heat dissipation fin groups 23 and respectively surround the two fans 24 in an L shape. The heat radiation effect of the two fin groups 23 and the two fans 24 is superior to the heat radiation effect of the aforementioned only one fin group 23 and one fan 24.
As shown in fig. 3 to 4, a second embodiment of the electronic device 100 according to the present application is shown. The second embodiment is substantially identical to the first embodiment described above, with the difference that only the second embodiment has two heat pipes 22a, 22b at the same time.
The heat absorbing sections 225 of the two heat pipes 22a, 22b are respectively attached to the at least one first side 211 and the at least one second side 212. As shown, the heat absorbing section 225 of the heat pipe 22a is attached to one first side 211, and the heat absorbing section 225 of the heat pipe 22b is attached to three second sides 212 at the same time, but not limited thereto.
In the second embodiment, the fin group 23 and the fan 24 may be one (not shown) or two (as shown).
Taking one heat sink fin set 23 and one fan 24 as an example, the first heat release sections 221 of the two heat pipes 22a and 22b may be respectively attached to the top surface 231 and the bottom surface 232 of the heat sink fin set 23 as shown in the drawing, or may be attached to the top surface 231 (not shown) or the bottom surface 232 simultaneously side by side, and all of them are L-shaped and surround corresponding to the periphery of the fan 24.
Taking two fin sets 23 and two fans 24 as an example, the second heat-releasing sections 222 of the two heat pipes 22a, 22b may be respectively attached to the top surface 231 and the bottom surface 232 of the fin set 23 as shown in the drawing, or may be attached to the top surface 231 (not shown) or the bottom surface 232 (not shown) side by side at the same time, and all of them are L-shaped and surround corresponding to the periphery of the fans 24.
Therefore, since the second embodiment uses two heat pipes 22a, 22b to transfer heat at the same time and is attached to the first side 211 and the second side 212, respectively, the heat dissipation effect of the second embodiment is better than that of the first embodiment.
In summary, the electronic device and the heat dissipation module thereof according to the present application can achieve the expected purpose and solve the drawbacks of the prior art.
The foregoing description is only illustrative of the preferred embodiments of the present application and is not to be construed as limiting the scope of the application, as all changes which come within the meaning and range of equivalency of the description and drawings are intended to be embraced therein.
Claims (7)
1. A heat dissipating module, comprising:
The heat conducting block is a block body with a thickness, and is provided with a plurality of side edges surrounding each other, a top heat conducting surface and a bottom heat conducting surface which are opposite to each other at intervals, wherein the plurality of side edges are the thickness of the heat conducting block, and the plurality of side edges are connected between the periphery of the top heat conducting surface and the periphery of the bottom heat conducting surface in a surrounding manner;
At least one heat pipe attached to at least two of the plurality of sides;
The heat pipe is provided with a heat absorption section and a first heat release section which are connected with each other, the heat absorption section is attached to at least two of the plurality of sides, and the first heat release section is attached to the heat radiation fin group; and
The heat pipe is provided with a first heat radiation section, a second heat radiation section and a heat absorption section, wherein the heat radiation section is connected between the first heat radiation section and the second heat radiation section, and the second heat radiation section is attached to the other heat radiation fin group.
2. The heat dissipating module of claim 1 further comprising two fans disposed side by side with each other with said set of heat dissipating fins and said other set of heat dissipating fins, respectively, said first heat dissipating section and said second heat dissipating section surrounding each of said two fans.
3. The heat dissipating module of claim 1, wherein the plurality of heat pipes is two, the plurality of sides comprises at least two first sides and at least two second sides, and two of the heat pipes are respectively attached to the at least two first sides and the at least two second sides.
4. The heat dissipating module of claim 3, wherein said set of heat dissipating fins has a top surface and a bottom surface opposite to each other, said heat absorbing sections of two of said heat pipes are respectively attached to said at least two first sides and said at least two second sides, said first heat releasing sections of two of said heat pipes are respectively attached to said top surface and said bottom surface or to one of said top surface and said bottom surface.
5. The heat dissipating module of claim 4, wherein said second heat dissipating sections of two of said heat pipes are respectively attached to said top surface and said bottom surface of said other set of heat dissipating fins or to one of said top surface and said bottom surface of said other set of heat dissipating fins.
6. The heat dissipating module of claim 5, further comprising two fans disposed side by side with each other with said set of heat dissipating fins and said set of other heat dissipating fins, respectively, said first heat dissipating section and said second heat dissipating section of each heat pipe being surrounded by said two fans, respectively.
7. An electronic device, comprising:
The body of the electronic device is provided with a plurality of electronic devices, comprises a circuit board and a heating component arranged on the circuit board; and
The heat dissipating module of any one of claims 1 to 6, the thermally conductive block being attached to the heat generating component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322676521.6U CN221653013U (en) | 2023-10-07 | 2023-10-07 | Electronic device and heat dissipation module thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322676521.6U CN221653013U (en) | 2023-10-07 | 2023-10-07 | Electronic device and heat dissipation module thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221653013U true CN221653013U (en) | 2024-09-03 |
Family
ID=92518012
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322676521.6U Active CN221653013U (en) | 2023-10-07 | 2023-10-07 | Electronic device and heat dissipation module thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221653013U (en) |
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2023
- 2023-10-07 CN CN202322676521.6U patent/CN221653013U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |