US20100314079A1

US20100314079A1 - Heat dissipation device

Info

Publication number: US20100314079A1
Application number: US12/766,316
Authority: US
Inventors: Ko-Ching LIAO
Original assignee: Individual
Current assignee: Individual
Priority date: 2009-06-15
Filing date: 2010-04-23
Publication date: 2010-12-16
Also published as: JP3160838U; TWM367568U

Abstract

A heat dissipation device includes a housing internally divided by a partition plate into an upper and a lower space; at least one heat pipe bank having a condensing section and a vaporizing section located above and below the partition plate, respectively; and a blower fan assembly located in the housing corresponding to the vaporizing section. The housing has a first air inlet and a first air outlet located above the partition plate, and outdoor air entering into the housing via the first air inlet to flow through and exchange heat with the condensing section before exiting the housing via the first air outlet; and a second air inlet and a second air outlet located below the partition plate, and indoor air entering into the housing via the second air inlet to flow through and exchange heat with the vaporizing section before exiting the housing via the second air outlet.

Description

TECHNICAL FIELD

The disclosure relates to a heat dissipation device, and more particularly to a heat dissipation device having at least one heat pipe bank to enable increased heat dissipation effect.

BACKGROUND

There is a plurality of electronic elements arranged in a telecommunication control chassis or cabinet, an electric control box or cabinet, an optic fiber exchange chassis or cabinet, a machine room, a control panel, or a machine room for digital electronics. These electronic elements and other related facilities produce a large amount of heat in the chassis, the cabinet, the machine room or the control panel during operation of the electronic elements and the related facilities. The produced heat must be dissipated into outdoor air with the help of some heat dissipation devices, so that the chassis, the cabinet, the machine room or the control panel and the electronic elements therein can be maintained at low temperature and good cleanness to keep working efficiently. For instance, a telecommunication chassis designed for use by telecommunication companies is a closed box to maintain a required cleanness therein. An air conditioning and cooling system is then provided to cool the heat produced by the electronic elements and other related facilities in the telecommunication chassis or to carry the produced heat to an environment outside the telecommunication chassis, so that the electronic elements and other related facilities can have a required low temperature to operate normally. However, the air conditioning and cooling system will consume a large quantity of energy. Please refer to FIG. 1. In a telecommunication machine room, electronic elements and other related facilities are arranged near a left side thereof while an air conditioning machine is provided at a right side thereof for cooling the electronic elements and the related facilities. As can be seen in FIG. 2, general electronic elements would produce heat having a temperature higher than 40° C., which results in a raised temperature about 35° C. in a telecommunication chassis and a raised temperature about 28° C. in a telecommunication cabinet. When the air conditioning machine in the telecommunication machine room operates, the temperature in the telecommunication machine room can be reduced to about 11° C. And, the air conditioning machine has a condensing temperature about 32° C. and a vaporizing temperature about 5° C.
To protect the chassis and cabinets for electric and other telecommunication devices against a very hot, salty, or other severe environment, the chassis and cabinets must be fully closed to be weather-resistant. Therefore, an air conditioning machine is used to cool down the environmental temperature inside the telecommunication chassis. The air conditioning machine has the disadvantage of high power consumption. During summer time, it is particularly difficult to dissipate the heat produced by the electronic elements and other related facilities and accumulated in the telecommunication chassis, which will have adverse influences on the reliability of the electronic elements and the related facilities.

SUMMARY

To overcome the problems in the conventional heat dissipating systems for chassis and/or cabinets for different electric devices, such as telecommunication control chassis and cabinets, an aspect of the embodiment provides a heat dissipation device, which includes a housing being internally divided by a partition plate into an upper and a lower space; at least one heat pipe bank having a condensing section and a vaporizing section located above and below the partition plate, respectively; and a blower fan assembly located in the housing corresponding to the vaporizing section. The housing has a first air inlet and a first air outlet located above the partition plate, and a second air inlet and a second air outlet located below the partition plate. Outdoor air can enter into the housing via the first air inlet to flow through and exchange heat with the condensing section and then exits the housing via the first air outlet to form an outdoor-air circulating path; and indoor air can enter into the housing via the second air inlet to flow through and exchange heat with the vaporizing section and then exits the housing via the second air outlet to form an indoor-air circulating path.
Another aspect of the embodiment provides a machine room with a heat dissipation device. The machine room is enclosed by walls and is internally provided with electronic elements or telecommunication facilities. The heat dissipation device is mounted inside the machine room on a wall thereof, and includes a housing internally divided by a partition plate into an upper space and a lower space and having first air inlet and outlet located above the partition plate as well as second air inlet and outlet located below the partition plate; at least one heat pipe bank arranged in the housing and having a condensing section and a vaporizing section located above and below the partition plate, respectively; and a blower fan assembly arranged in the housing corresponding to the vaporizing section. The first air inlet and outlet are located corresponding to the condensing section, while the second air inlet and outlet are located corresponding to the vaporizing section.

BRIEF DESCRIPTION OF THE DRAWINGS

The structure and the technical means adopted by the embodiment to achieve the above and other objects can be best understood by referring to the following detailed description of the embodiments and the accompanying drawings, wherein

FIG. 1 schematically shows a conventional system for dissipating heat from an electric device chassis;

FIG. 2 shows the temperature drop in an environment with the electric device chassis and the conventional heat dissipating system as shown in FIG. 1;

FIGS. 3A and 3B show a heat dissipation device according to a first embodiment;

FIGS. 4A and 4B show a heat dissipation device according to a second embodiment;

FIGS. 5A and 5B show a heat dissipation device according to a third embodiment;

FIG. 6 is a side sectional view illustrating an example of mounting the heat dissipation device of the embodiment indoors on an inner side of a wall;

FIG. 7 is a view showing an example of mounting the heat dissipation device of the embodiment inside a machine room;

FIG. 8 is a perspective view of the heat dissipation device according to an embodiment thereof;

FIG. 9 is a side sectional view of the heat dissipation device according to an embodiment thereof; and

FIG. 10 shows an example of mounting the heat dissipation device outdoors on an outer side of a wall.

DETAILED DESCRIPTION OF THE EMBODIMENTS

The embodiment will now be described with some embodiments thereof. For the purpose of easy to understand, elements that are the same in the embodiments are denoted by the same reference numerals.
Please refer to FIGS. 3A and 3B that show a heat dissipation device 10 according to a first embodiment. The heat dissipation device 10 includes a housing 11, a first partition plate 12, at least one heat pipe bank 13, and a blower fan assembly 14. The housing 11 is internally divided by the first partition plate 12 into an upper and a lower space. The heat pipe bank 13 has a condensing section 131 located above the first partition plate 12 and a vaporizing section 132 located below the first partition plate 12. In the illustrated first embodiment, there are provided with two heat pipe banks 13. In the embodiment, the heat pipe bank is formed by providing at least one heat pipe or a plurality of heat pipes on a plurality of radiating fins. The two heat pipe banks 13 are separately arranged at a left and a right portion in the housing 11. A fan 15 is arranged between the two heat pipe banks 13 and is located above the first partition plate 12 corresponding to the condensing sections 131 of the heat pipe banks 13. The housing 11 has a first air inlet 111 and a first air outlet 112 located above the partition plate 12 corresponding to the condensing sections 131. The blower fan assembly 14 is located in the housing 11 corresponding to the vaporizing sections 132 of the heat pipe banks 13. The housing has a second air inlet 113 and a second air outlet 114 provided at positions corresponding to the vaporizing sections 132 of the heat pipe banks 13. The second air inlet 113 and the second air outlet 114 can be located at the same side of the housing 11. Outdoor air enters into the housing 11 via the first air inlet 111 to flow through the condensing sections 131 of the heat pipe banks 13 and exits the housing 11 via the first air outlet 112 to form an outdoor-air circulating path. The fan 15 provides a force to drive the outdoor air through the outdoor-air circulating path. On the other hand, indoor air enters into the housing 11 via the second air inlet 113 to flow through the vaporizing sections 132 of the heat pipe banks 13 and exits the housing 11 via the second air outlet 114 to form an indoor-air circulating path. The blower fan assembly 14 provides a force to drive the indoor air through the indoor-air circulating path. An air passage 119 is formed in the housing behind the second air inlet 113 and between a second partition plate 133 below a bottom plate of the heat pipe banks 13 and a bottom plate 118 of the housing 11. The heat dissipation device 10 can be supported on a support 16, which is then fixedly mounted to a predetermined position, such as on a wall surface.
The blower fan assembly 14 includes two blower fans 141 and a motor 142. The two blower fans 141 are separately located at and connected to two opposite lateral ends of the motor 142, so that the motor 142 drives the two blower fans 141 to rotate.
FIGS. 4A and 4B show a heat dissipation device 10 according to a second embodiment. Since the heat dissipation device 10 in the second embodiment has a basic structure generally similar to that of the first embodiment shown in FIGS. 3A and 3B, detailed description of the parts that are the same in the two embodiments is omitted herein. The heat dissipation device 10 in the second embodiment includes a housing 11, a first partition plate 12, at least one heat pipe bank 13, a lower blower fan assembly 14, and an upper blower fan assembly 17. In the illustrated second embodiment, there is provided with only one heat pipe bank 13. In the embodiment, the heat pipe bank is formed by providing at least one heat pipe or a plurality of heat pipes on a plurality of radiating fins. The upper blower fan assembly 17 and the lower blower fan assembly 14 are arranged in the housing 11 in an upper portion and a lower portion thereof, respectively. The housing has a first air inlet 115 and a first air outlet 116 located above the first partition plate 12 corresponding to the condensing section 131 of the heat pipe bank 13. The first air inlet 115 and the first air outlet 116 are provided on the housing 11 at two different sides thereof. The upper blower fan assembly 17 is located in the housing 11 corresponding to the condensing section 131 of the heat pipe bank 13. On the other hand, a second air inlet 113 and a second air outlet 114 are provided on the housing 11 at positions corresponding to the vaporizing section 132 of the heat pipe bank 13. The second air inlet 113 and the second air outlet 114 can be arranged on the housing 11 at the same side thereof. An air passage 119 is formed in the housing 11 behind the second air inlet 113 and between a second partition plate 133 below a bottom plate of the heat pipe bank 13 and a bottom plate 118 of the housing 11. The lower blower fan assembly 14 is located in the housing 11 corresponding to the vaporizing section 132 of the heat pipe bank 13. Outdoor air enters into the housing 11 via the first air inlet 115 to flow through the condensing section 131 of the heat pipe bank 13 and exits the housing 11 via the first air outlet 116 to form an outdoor-air circulating path. The upper blower fan assembly 17 provides a force to drive the outdoor air through the outdoor-air circulating path. In an operable embodiment, the first air outlet 116 is located at a top of the housing 11. On the other hand, indoor air enters into the housing 11 via the second air inlet 113 to flow through the vaporizing section 132 of the heat pipe bank 13 and exits the housing 11 via the second air outlet 114 to form an indoor-air circulating path. The lower blower fan assembly 14 provides a force to drive the indoor air through the indoor-air circulating path. The heat dissipation device 10 can be supported on a support 16, which is then fixedly mounted to a predetermined position, such as on a wall surface.
The upper blower fan assembly 17 includes a motor 172 and an upper blower fan 171, and the motor 172 drives the upper blower fan 171 to rotate. The lower blower fan assembly 14 includes a motor 142 and an upper blower fan 141, and the motor 142 drives the upper blower fan 141 to rotate.
FIGS. 5A and 5B show a heat dissipation device 10 according to a third embodiment. The heat dissipation device 10 in the third embodiment has a basic structure similar to that in the second embodiment as shown in FIGS. 4A and 4B except for a first air outlet 117 that is provided on the housing 11 at a position opposite to the first air inlet 115. The upper blower fan assembly 17, the first air inlet 115, and the first air outlet 117 all are located corresponding to the condensing section 131 of the heat pipe bank 13. Outdoor air enters via the first air inlet 115 into the housing 11 to flow through the condensing section 131 of the heat pipe bank 13 and exits the housing 11 via the first air outlet 117.
FIG. 6 is a side sectional view illustrating an example of mounting a heat dissipation device 20 indoors on an inner side of a wall 22. As shown, the heat dissipation device 20 is supported on a support 21, which is then fixedly mounted to the wall 22. The heat dissipation device 20 can be any one of the embodiments illustrated in FIGS. 3A and 3B, 4A and 4B, and 5A and 5B. The heat dissipation device 20 includes a housing 21, a partition plate 22, at least one heat pipe bank 23, an upper blower fan assembly 26, and a lower blower fan assembly 27. The heat pipe bank 23 has a condensing section 231 and a vaporizing section 232. Via the lower blower fan assembly 27, hot indoor air enters the housing 21 via a second air inlet 24 to exchange heat with the vaporizing section 232 of the heat pipe bank 23 and then exits the housing 21 via a second air outlet 241. Meanwhile, the vaporizing section 232 transfers the absorbed heat to the condensing section 231. Cold outdoor air enters into the housing 21 via a first air inlet 251 to flow through the condensing section 231 and the upper blower fan assembly 26 and exits the housing 21 via a first air outlet 25 to dissipate into outdoor air and achieve the purpose of heat dissipation. As shown in FIG. 6, the first air outlet 25 communicates with the upper blower fan assembly 26 via a prolonged air duct 252.
FIG. 7 is a view showing an example of mounting a heat dissipation device 30 inside a machine room 301. During the operation thereof, electronic elements or communication chassis 304 in the machine room 301 produce heat. The heat dissipation device 30 can be installed inside the machine room 301. Hot air in the machine room 301 flows along an indoor-air circulating path A to pass through and accordingly, exchange heat with a vaporizing section in the heat dissipation device 30. The vaporizing section then transfers the absorbed heat to a condensing section in the heat dissipation device 30. The heat dissipation device 30 is provided with two air ducts 302 and 303. Air B outside the machine room 301 enters into the heat dissipation device 30 via the air duct 302 to exchange heat with the condensing section and then exits the heat dissipation device 30 via the air duct 303 to dissipate into outdoor air C to achieve the purpose of dissipating heat.
FIG. 8 is a perspective view of a heat dissipation device 10 according to an embodiment thereof. As shown, the heat dissipation device 10 illustrated in FIG. 8 includes a housing 11, a first air inlet 111 and a first air outlet 112 corresponding to a condensing section in the housing 11, and a second air inlet 113 and a second air outlet 114 corresponding to a vaporizing section in the housing 11. The housing 11 is further internally provided with one or more heat pipe banks (not shown in FIG. 8). Each of the heat pipe banks has a condensing section and a vaporizing section. In the embodiment, a heat-pipe type heat exchanger with ultrahigh heat-transfer rate is employed. That is, the heat pipe banks utilize the cold energy of outdoor air to reduce the heat energy of indoor air and can therefore decrease the power consumed by an air conditioning system.
FIG. 9 is a side sectional view of a heat dissipation device 40 according to an embodiment thereof. The heat dissipation device 40 includes a housing 44 having a first air inlet 441 and a first air outlet 442 as well as a second air inlet 443 and a second air outlet 444. The heat dissipation device 40 further includes a heat pipe bank 41 having a condensing section 411 and a vaporizing section 412, an upper blower fan assembly 42 located corresponding to the condensing section 411, and a lower blower fan assembly 43 located corresponding to the vaporizing section 412. The first air inlet 441 and the first air outlet 442 are located corresponding to the condensing section 411, and the second air inlet 443 and the second air outlet 444 are located corresponding to the vaporizing section 412. When it is desired to dissipate heat, the lower blower fan assembly 43 is started to rotate, bringing indoor air to flow through the second air inlet 443 and exchange heat with the vaporizing section 412 of the heat pipe bank 41 before exiting the housing 44 via the second air outlet 444. Meanwhile, the vaporizing section 412 of the heat pipe bank 41 transfers the absorbed heat to the condensing section 411; and outdoor air is induced by the upper blower fan assembly 42 into the housing 44 via the first air inlet 441 to exchange heat with the condensing section 411 before exiting the housing 44 via the first air outlet 442 to dissipate heat into ambient air.
FIG. 10 shows an example of mounting a heat dissipation device 60 of the embodiment outdoors on an outer side of a wall. The whole heat dissipation device 60 is mounted on an outer side of a wall 61. An upper half of the heat dissipation device 60 is internally provided with a condensing section while a lower half of the heat dissipation device 60 is internally provided with a vaporizing section. Outdoor air flows through and exchanges heat with the condensing section and then exits the device 60, so that heat is dissipated into ambient air when the outdoor air circulates through the heat dissipation device 60. The vaporizing section is connected to air ducts 62 to enable heat exchange with indoor air. Indoor air flows through and exchanges heat with the vaporizing section, so that heat carried by the indoor air is absorbed by the vaporizing section when the indoor air circulates through the heat dissipation device 60. The heat dissipation device 60 can be quickly mounted and dismounted outdoors because a user does not need to invisibly mount the whole heat dissipation device in a wall. Thus, the installation of the heat dissipation device 60 is simplified.
In conclusion, the heat dissipation device according to the embodiment enables reduced power consumption and increased heat dissipation effect and is therefore practical for use.
The embodiment has been described with some embodiments thereof and it is understood that many changes and modifications in the described embodiments can be carried out without departing from the scope and the spirit of the embodiment that is intended to be limited only by the appended claims.

Claims

1. A heat dissipation device, comprising:

a housing;

a first partition plate for internally dividing the housing into an upper space and a lower space, so that a first air inlet and a first air outlet provided on the housing are located above the first partition plate;

at least one heat pipe bank having a condensing section and a vaporizing section, the condensing section being arranged above the first partition plate, and the vaporizing section being arranged below the first partition plate; and

a blower fan assembly being arranged in the housing corresponding to the vaporizing section;

wherein the first air inlet and the first air outlet are located corresponding to the condensing section, and the housing further has a second air inlet and a second air outlet provided thereon corresponding to the vaporizing section.

2. The heat dissipation device as claimed in claim 1, wherein the heat pipe bank is formed by providing at least one heat pipe or a plurality of heat pipes on a plurality of radiating fins.

3. The heat dissipation device as claimed in claim 1, wherein two heat pipe banks are provided in the housing to separately located at a left and a right side thereof, and a fan being further provided between the two heat pipe banks and located above the first partition plate corresponding to the condensing section.

4. The heat dissipation device as claimed in claim 1, wherein the second air inlet and the second air outlet corresponding to the vaporizing section are located at the same side of the housing.

5. The heat dissipation device as claimed in claim 1, wherein an air passage is formed in the housing behind the second air inlet to locate between a second partition plate below a bottom of the heat pipe bank and a bottom plate of the housing.

6. The heat dissipation device as claimed in claim 1, wherein the blower fan assembly includes two blower fans and a motor, the two blower fans being separately located at and connected to two opposite ends of the motor, and the motor driving the two blower fans to rotate.

7. The heat dissipation device as claimed in claim 1, wherein a fan is further provided in the housing corresponding to the condensing section, and the first air inlet and the first air outlet corresponding to the condensing section are located on the housing at different sides thereof.

8. The heat dissipation device as claimed in claim 1, wherein the housing is mounted indoors, and the blower fan assembly and the first air outlet communicate with an outdoor environment via a prolonged air duct.

9. The heat dissipation device as claimed in claim 1, wherein the housing is mounted indoors, and the first air inlet and the first air outlet communicate with an outdoor environment via an air duct each.

10. The heat dissipation device as claimed in claim 1, wherein the housing is mounted outdoors on an outer side of a wall, and the lower space in the housing having the vaporizing section located therein communicates with an indoor environment via two air ducts to enable hot indoor air to exchange heat with the vaporizing section.