M367568 五、新型說明： 【新型所屬之技術領域】 本創作係關於一種散熱裝置’特別是關於一種散熱襄置及具 備有散熱裝置的電子零件模組箱、機房。 【先前技術】 電信控制箱(櫃)或電器控制箱(櫃)或光纖交換箱(櫃）、機房或 控制盤或數位電子機料等，目时許彡電子树，設備因 發電所產生的熱量大，故需要-些散熱設備_散熱，保持在低 溫且保持良好清淨度。而舉例如中華電信的電鋪即是密閉以保 持清淨度’再扣㈣冷卻裝置進行冷卻電鋪_電子元件及 設備所散發蜂的’或將熱量㈣電信料界，畴持電子 元件及設備的溫度能在低溫下·且正常地運作，但也較耗#。M367568 V. New description: [New technical field] This creation is about a heat dissipating device, especially for a heat dissipating device and an electronic component module box and a machine room with a heat dissipating device. [Prior Art] Telecommunication control box (cabinet) or electrical control box (cabinet) or fiber optic switch box (cabinet), computer room or control panel or digital electronic equipment, etc., the current electronic tree, the heat generated by the equipment due to power generation Large, so need some - heat dissipation equipment _ heat dissipation, keep at low temperatures and maintain good cleanliness. For example, Chunghwa Telecom's electric shop is sealed to maintain cleanliness' re-deduction (four) cooling device for cooling electric shop _ electronic components and equipment to emit bees' or heat (four) telecommunications material sector, domain holding electronic components and equipment The temperature can operate at low temperatures and normally, but it is also more expensive.
如第1騎示，在電信_左邊設置有電子元件及設備，而右邊 叹置空調機對電子元件及設備進行冷卻。如第2 _示，一般電 ^件產生熱度約4(TC，機箱内部約坑，機樞内部約抓，當 =部的=調機運作可將溫度降至ut ’而空咖冷凝溫度 約32 C，蒸發溫度約5°C。 境’皆僅能以賴方式轉持耐候性， 箱内之環境溫度，耗能是其缺點， 電器箱(櫃)或電信箱等内部若、w 度高’鹽度高及其他惡劣環 然後辅以空調機冷卻電信 且有時因夏天溫度高，電信箱 M367568 内的電子元件及設備散熱不易，就會影響可靠度。 【新型内容】 本創作之主要目的是提供—種可減少減而可提升散熱效果 的散熱裝置及具财雜裝置㈣子轉模組箱、機房。 本創作之-實補是提供―種具備錄絲置的電子零件模 組箱’該電子料難勒部具有—電子元件或一電信設備及一 疋件’及-散絲置，包括有至少—熱管或―管排，該熱管或管 排具有冷凝部與-蒸發部，該熱管或該管排設置於該元件上， 使該蒸發雜於該元件下方，該冷凝部位於該元件上方，該蒸發 部的兩端侧下方分別設有一導流元件。 該電子零件模組箱為-電信控制箱(櫃）、—電器控制箱(概）、 一光纖交換箱(櫃）、或一控制盤。 該元件為-板子，該元件具有—上表面與—下表面該元件 下表面且位於該·料_分職有—第—導流板與一第二導 流板，使該第-_板_第二導流板和電子零件池箱之箱壁 形成一第一風道與一第二風道。 本創作之另—魏健備魏紐置的機房，包括至少一屬 子零件模組箱，設置於該機勒部，該電子零件模組箱具有一胥 子讀或-電信設備及—元件；—散錄置，包括註少一 或一管排，該熱管或管排具有—冷凝部與—蒸發部，該执管❹ 官排設置於械_L，蝴亀_物，該冷凝獅 M367568 _ 於該元件上方，該蒸發部的兩端側下方分別設有一導流元件；及 一空調機，設置於該機房内部一特定位置。該機房為一光纖交換 機房或一數位電子機房。 本創作之又一實施例是一種具備有散熱裝置的機房，該機房 具有-牆壁，該機房内部設置有一電子元件或一電信設備；及至 -少一散熱裝置，設置於該牆壁上，該散熱裝置包括有一蒸發部與 -冷凝部’該冷凝部位於牆壁外侧，而該級部位於該牆壁内侧。 鲁該冷凝部一侧設有一空調機。該機房為一光纖交換機房或一數位 電子機房。 本創作之-實施例是-種散熱裝置，包括—密閉容器；一散 熱裝置，包括有至少-歸或—管排，該鮮或管排具有一冷凝 部與-蒸發部，該歸或騎排之冷凝部設置於該賴容器内， 而該蒸發部位於該細容器外側；及，溫槽，具有—恒溫液體， 提供進出該密閉容器。雞溫槽連接—冷賴。 本創作之再—實_是—種具備有散熱裝置的機房該機房 二機房内部設置有一電子元件或一電信設備;及至 -Γ 又置於軸壁上’該散熱裝置包括有—蒸發部與 :部’該冷凝雜於牆料侧，而該蒸發部錄雜壁 =冷嫩有_$繼，物裝⑽：_機殼，該機 下方冷凝部蒸發部’設於該機殼内部且位於該冷凝部 設於卞機r ’設於該機殼⑽且位於贿發部下卜冷凝部， 部且位於該風扇下方風道，形成於該蒸發部、 M367568 , 風扇兩做該散絲置之冷凝部與該風躺。該空調機設有至少 一入風口位於該冷凝部兩側，㈣空調機設#至少__出風口位於 該冷凝。P下方。該機房為一光纖交換機房或一數位電子機房。 、 【實施方式】 請參閱第3、4、5、6a、6b圖為本創作具備有散熱裝置的電 子零件模組箱之剖面側視示意圖、立體透視圖、立體圖及散熱装 ♦置示_ ’如第3 _示，本創作具備有散熱裝置的電子零件模 組箱包括-電子零件模組箱1G及—散熱裝置Μ，該電子零件模組 箱10内部具有至少_電子元件或至少_電錢備U及一元件 22 °遠電子零件模組箱1〇為一電信控制箱(樞）、一電器控制箱 (櫃）、-域交換箱(櫃）、控麵或會產生熱量的等效裝置或結 構。由於電子元件或電信設備u在工作時會產生熱量，因此需要 鲁2熱裝置20協助散熱。如第4圖所*，該散熱裝置2〇包括有至 ^絲或至少一管排21’該熱管或管排21具有-冷凝部211與 ^發部212 ’該熱管或該管排21設置於該元件22上，使該蒸發 部位於該元件22下方，該冷凝部211位於該元件u上:， =蒸發部扣的兩端分別設有一導流元件加，該導流元件犯 &供導引氣體流動，使流經該蒸發部212。 如第5圖所示，-實施例顯示該散熱裝置2〇設置於該電信箱 頂端箱壁m。該電子零件模組箱1〇可為電信箱。因此，更換該 電信箱頂端箱壁101，方便該散熱裝置20拆裝維修。 M367568 - 如第6a、6b圖所示，該散熱裝置20係可模組化。該元件22 之-實施例係為-板子，亦可為電信箱的頂端箱壁1〇1，方便將散 熱裝置20製作成模組，直接可拆裝更換電信箱的頂端箱壁1〇1， 降低需要重製的成本。該元件22具有-上表面221與一下表面 222 ’位於該蒸發部212兩端侧下方分別設有一第一導流板214與 一第二導流板215’使該第一導流板214與該第二導流板215和電 子零件模組箱ίο之箱壁形成一第一風道217與一第二風道218， ❿ 使知可導引亂體流動，並於該蒸發部212進行熱交換。其中該第 導流板214與該第二導流板215上設有多數孔洞216，提供氣體 於電子元件或電子設備或電子箱間流通 該散熱裝置2〇位於該電 子元件或電信設備11上方。 再如第4圖所示，為協助散熱，該熱管或管排21上設有多數 散熱鰭片23，及/或該散熱裝置20設置有至少一風扇24。當然本 創作可於該冷凝部211之一侧或二侧設有一風扇25。且/或於該蒸 聲發部212之一側或二侧設有一風扇26，如此可有效増加對流。 請參閱第7圖為本創作具備有散熱裝置的機房之示意圖，本 創作具備有散熱裝置的機房30與至少一電子零件模組箱4〇設置 於該機房30内部’該電子零件模組箱40具有至少一電子元件或 至少一電信設備41及一元件422 ; —散熱裝置42，包括有至少一 熱官或至少一管排421 ’該熱管或管排421具有一冷凝部423與一 蒸發部424，該熱管或該管排421設置於該元件422上，使該蒸發 部424位於該元件422下方，該冷凝部423位於該元件422上方， M367568For example, on the first ride, electronic components and equipment are placed on the left side of the telecommunications, and the air conditioner on the right side cools the electronic components and equipment. As shown in the second _, the general electrical component generates a heat of about 4 (TC, the inside of the chassis is about pit, the inside of the armature is about to catch, when the = part of the = machine operation can reduce the temperature to ut 'and the empty coffee condensation temperature is about 32 C, the evaporating temperature is about 5 ° C. The environment can only be used to maintain the weather resistance by the way, the ambient temperature inside the box, energy consumption is its shortcoming, the internal electrical box (cabinet) or telecom box, if high w High salinity and other harsh rings are then supplemented by air conditioners to cool telecommunications and sometimes due to high summer temperatures, electronic components and equipment in the telecom box M367568 are not easy to dissipate heat, which will affect reliability. [New content] The main purpose of this creation is Providing a heat-dissipating device capable of reducing the heat-dissipating effect and improving the heat-dissipating effect, and having a miscellaneous device (4) a sub-module box and a machine room. The creation of the creation is to provide a type of electronic component module box with a recording wire. The electronic material has an electronic component or a telecommunication device and a component and a filament, including at least a heat pipe or a tube row, the heat pipe or the tube row having a condensation portion and an evaporation portion, the heat pipe or the heat pipe a tube row is disposed on the component to cause the evaporation to be mixed Below the component, the condensation portion is located above the component, and a flow guiding element is respectively disposed at the lower end sides of the evaporation portion. The electronic component module box is a telecommunications control box (cabinet), an electrical control box (general), and a a fiber-optic exchange box (cabinet), or a control panel. The component is a board having an upper surface and a lower surface of the lower surface of the component and located at the material_derivative-first deflector and a first The second deflector is configured to form a first air duct and a second air duct in the box wall of the first-board_second deflector and the electronic component pool box. The other part of the creation is the machine room of Wei Jianbei Wei New Zealand. The utility model comprises at least one sub-assembly module box, which is arranged on the machine part, the electronic component module box has a dice reading or-telecom equipment and components, and a distraction device, including one or one tube row. The heat pipe or the tube row has a condensing portion and an evaporation portion, and the tube arranging unit is disposed on the _L, the condensing lion, the condensed lion M367568 _ above the element, and the lower end sides of the evaporation portion respectively A flow guiding element is disposed; and an air conditioner is disposed at a specific position inside the machine room. The machine room is a fiber switch room or a digital computer room. Another embodiment of the present invention is a machine room having a heat dissipation device, the machine room has a wall, and an electronic component or a telecommunication device is disposed inside the machine room; A heat dissipating device is disposed on the wall, the heat dissipating device includes an evaporation portion and a condensation portion. The condensation portion is located outside the wall, and the step portion is located inside the wall. An air conditioner is disposed on one side of the condensation portion. The machine room is a fiber switch room or a digital electronic room. The present invention is an embodiment of a heat sink comprising: a closed container; a heat sink comprising at least a return or a tube row, the fresh or tube row having a a condensation portion and an evaporation portion, the condensation portion of the return or riding row is disposed in the container, and the evaporation portion is located outside the thin container; and the warming chamber has a constant temperature liquid to provide access to the sealed container. Chicken trough connection - cold Lai. The creation of the creation - the actual _ is - a machine room with a heat sink. The computer room is equipped with an electronic component or a telecommunication device; and the Γ Γ is placed on the shaft wall. The heat sink includes an evaporation section and: The 'the condensation is mixed on the side of the wall material, and the evaporation part is recorded on the wall = cold and has _$ followed by the object (10): _ the casing, the condensation portion of the lower part of the machine is located inside the casing and located at The condensing portion is disposed at the casing (10) and located at the condensing portion of the bribe portion, and is located at the lower air duct of the fan, and is formed in the evaporation portion, M367568, and the fan is used as the condensing portion of the filament. Lie with the wind. The air conditioner is provided with at least one air inlet located on both sides of the condensation portion, and (4) the air conditioner is located at least __ the air outlet is located in the condensation. Below P. The equipment room is a fiber switch room or a digital electronic room. [Embodiment] Please refer to Figures 3, 4, 5, 6a, and 6b for a cross-sectional side view, perspective view, perspective view, and heat dissipation display of the electronic component module box with the heat sink. As shown in the third figure, the electronic component module box having the heat sink device includes an electronic component module box 1G and a heat sink device, and the electronic component module box 10 has at least _ electronic components or at least _ electric money U and a component 22 ° far electronic component module box 1 is a telecommunications control box (hub), an electrical control box (cabinet), - domain switching box (cabinet), control surface or equivalent device that generates heat Or structure. Since the electronic component or the telecommunication device u generates heat during operation, the Lu 2 thermal device 20 is required to assist in heat dissipation. As shown in FIG. 4, the heat sink 2 includes a wire or at least one tube row 21'. The heat pipe or tube row 21 has a condensation portion 211 and a heat generating portion 212. The heat pipe or the tube row 21 is disposed on The element 22 is disposed such that the evaporation portion is located below the element 22, and the condensation portion 211 is located on the element u:, = two ends of the evaporation portion buckle are respectively provided with a flow guiding element, and the flow guiding element is guilty and directed The gas is introduced to flow through the evaporation portion 212. As shown in Fig. 5, the embodiment shows that the heat sink 2 is disposed on the top wall m of the telecommunications box. The electronic component module box 1 can be a telecommunications box. Therefore, the top box wall 101 of the telecommunications box is replaced to facilitate the disassembly and assembly of the heat sink 20. M367568 - As shown in Figures 6a and 6b, the heat sink 20 can be modularized. The embodiment of the component 22 is a board, and can also be a top box wall 1〇1 of the telecommunications box, so that the heat sink 20 can be made into a module, and the top box wall 1〇1 of the telecommunications box can be directly replaced and replaced. Reduce the cost of rework. The element 22 has an upper surface 221 and a lower surface 222 ′. A first baffle 214 and a second baffle 215 ′ are respectively disposed below the two ends of the evaporation portion 212 to make the first baffle 214 The second baffle 215 and the wall of the electronic component module ίο form a first air passage 217 and a second air passage 218, so that the flow can be guided and the heat exchange can be performed at the evaporation portion 212. . The plurality of holes 216 are formed in the first baffle 214 and the second baffle 215 to provide gas between the electronic components or the electronic device or the electronic box. The heat sink 2 is located above the electronic component or the telecommunication device 11. As shown in Fig. 4, in order to assist heat dissipation, a plurality of heat dissipation fins 23 are disposed on the heat pipe or tube row 21, and/or the heat sink 20 is provided with at least one fan 24. Of course, the present invention can be provided with a fan 25 on one or both sides of the condensation portion 211. And/or a fan 26 is provided on one side or both sides of the steaming portion 212, so that convection can be effectively performed. Please refer to FIG. 7 for a schematic diagram of a machine room having a heat dissipating device. The machine room 30 having a heat dissipating device and at least one electronic component module box 4 are disposed inside the machine room 30. The electronic component module box 40 Having at least one electronic component or at least one telecommunication device 41 and an element 422; a heat sink 42 comprising at least one heat officer or at least one tube row 421 'The heat pipe or tube row 421 has a condensation portion 423 and an evaporation portion 424 The heat pipe or the tube row 421 is disposed on the element 422 such that the evaporation portion 424 is located below the element 422, and the condensation portion 423 is located above the element 422, M367568
該蒸發部424的兩端分別設有一導流元件425 ;及至少一空調機 31，設置於該機房30内部一特定位置。其中該電子零件模組箱 為一電信控制箱(櫃）、一電器控制箱(櫃）、一光纖交換箱(概）、一 控制盤。如外界溫度高於機房30内溫度，且溫度高於一般預設溫 度，則啟動空調機31將該機房30内的溫度降低，以維持電子元 件或電信設備41的正常運作。如機房3〇内溫度高於外界則散 熱裝置42可將機房3〇内的溫度傳遞至外界散熱。該機房為一 光纖交換機房或一數位電子機房。 其它結構如第4圖示，在此不予贅述。 請參閲第8、9圖為本創作具備有散熱裝置的機房之剖面示意 圖及散熱裝置示_，本創作具備有散熱裝·_ Μ具有一牆 壁51 ’該機房50内部設置有至少一電子元件或至少一電信設備 52，及至少-散熱裝置53，設置於該_ 51上，該散熱裝置％ 包括有—蒸發部531與—冷凝部532，該冷凝部您位於牆壁Μ 外侧’而該蒸發部531位於該牆㈣内側，如此藉由熱管原理可 將有尚溫機房5〇内的熱量傳遞至低溫外界。該蒸發部531與該冷 凝。Ρ 532係由多數熱管所組成，且該蒸發部划與該冷凝部您 外側分別設有-風扇533。或於該冷凝部532 一侧設有一空調機 534，輔助散熱。即如外界 - ，皿度同於機房50内溫度，則啟動空調 機534將該散熱裝置53 々錢邵532的溫度降低，使散熱裝置53 可以運作錄。狀_ 5 ㈣便散， ㈣译P增裝空調機亦可降低機房50内 m然⑶該蒸發部531與該冷凝部532設有多數散熱鰭 M367568 •片535也有助於散熱。該機房3〇為-光纖交換機房或一數位電子 機房。 青參閱第ίο圖為本創作散熱裝置之示意圖，本創作散熱裝置 包括-密閉容器6G 散熱裝置6卜包括有至少—熱管或一管排 .62 ’該熱管或管排62具有-冷凝部621與-蒸發部622，該熱管 或該管排62之冷凝部621設置於該_容器⑽内，碰蒸發部 622位於該密閉容器6〇外侧且位於該電信箱或機房内部；及一怪 •溫槽63 ’具有一怪溫液體63卜提供進出該密閉容器60。該恒溫 槽631連接一冷涞機64，以便提供適當液體631溫度。該怪溫液 體631為水或其它等效的液體均可。 為增加散熱，該蒸發部622與該冷凝部621設有多數散熱鰭 片3或該散熱裝置61設置有至少一風扇624,也可協助散熱。 或於該蒸發部622之一侧或二側設有一風扇624，辅助散熱。 該密閉容器60具有一入口 632與一出口 633分別與該恆溫槽 ‘ 63連通。該密閉容器6〇與該怪溫槽&間設有一第一閥034與一 第二閩635，可控制液體進出，進而控制溫度。 清參閲第11縣本鑛具備有散絲置的财之剖面示意 圖，本創作機房之散熱裝置70具有一牆壁71，該機房7〇内部設 置有至少一電子元件或至少一電信設備(圖中未示）；及至少一散熱 裝置72，設置於該牆壁71上，該散熱裝置72包括有一蒸發部π! 與冷凝部722，該冷凝部722位於踏壁71外侧，而該蒸發部721 位於該牆壁71内側，其中該冷凝部722設有一空調裝置乃，該空 M367568 * 調裝置73包括一機殼731 ’該機殼731結合於該冷凝部722 ; — 蒸發部732 ’設於該機殼731内部且位於該冷凝部722下方；一風 扇733，設於該機殼73i内部且位於該蒸發部7幻下方；一冷凝部 734 ’設於該機殼731内部且位於該風扇733下方；一風道735， • 形成於該蒸發部732、風扇733兩侧及經該散熱裝置π之冷凝部 722與該風扇733。亦即該散熱裝置72之冷凝部722可裝設一空 調機73的冷卻裝置。該空調機73設有至少一入風口 736位於該 φ 冷凝部734兩侧，而該空調機73設有至少一出風口 737位於該冷 凝部734下方。該機房30為一光纖交換機房或一數位電子機房。 該蒸發部721與該冷凝部722係由多數熱管所組成。該蒸發 部732上方設有至少一風扇738，輔助氣體流動。 請參閱第12a、12b圖為本創作散熱裝置之示意圖，本創作散 熱裝置80包括有一殼體81、一隔板82、至少一熱管或一管排83、 一渦流扇84 ’該殼體81以該隔板82區隔上下兩空間，而該熱管 Φ 或管排83具有一冷凝部831與一蒸發部832，讓該冷凝部831位 於該隔板82上方，該蒸發部832位於該隔板82下方。所以該散 熱裝置80设置於電信箱或機房時’以隔板82為基準，該冷凝部 831位於外界’而該蒸發部832位於該電信箱或機房内。本實施例 是設置有二個熱管或管排83，本創作所有熱管與管排的結構定義 包括至少一熱管或多數熱管設置於多數鰭片上，形成熱管管排。 因此，該殼體81内分別左右各設置一個熱管管排83,而於兩熱管 管排83間設置有一風扇85,且位於該隔板82上方，該冷凝部831 M367568 側的位置該设體81具有一入風口 811與一出風口 812位於該隔 板82上方，該冷凝部831侧。該渦流扇84係位於該殼體81内且 於該蒸發部832側。相對於該蒸發部832侧之殼體81具有一入風 口 813與一出風口 814,該入風口 813與該出風口 814可位於該殼 體81同侧。因此，該散熱裝置80可進行熱傳遞。該散熱裝置80 可使用一支架86固定於特定位置如牆壁等。 該渦流扇84包括有二風扇841與一馬達科2，該馬達842兩Each of the two ends of the evaporation unit 424 is provided with a flow guiding element 425; and at least one air conditioner 31 is disposed at a specific position inside the machine room 30. The electronic component module box is a telecommunication control box (cabinet), an electrical control box (cabinet), a fiber optic switching box (general), and a control panel. If the outside temperature is higher than the temperature in the machine room 30 and the temperature is higher than the normal preset temperature, the air conditioner 31 is activated to lower the temperature in the machine room 30 to maintain the normal operation of the electronic component or the telecommunication device 41. If the temperature inside the machine room is higher than the outside, the heat sink 42 can transfer the temperature inside the machine room to the outside world. The equipment room is a fiber switch room or a digital electronic room. Other structures are as shown in FIG. 4 and will not be described herein. Please refer to Figures 8 and 9 for a schematic view of the machine room with heat sink and heat sink display _. This creation has a heat sink _ Μ Μ has a wall 51 'The inside of the machine room 50 is provided with at least one electronic component Or at least one telecommunication device 52, and at least a heat sink 53, disposed on the _51, the heat sink % includes an evaporation portion 531 and a condensation portion 532, the condensation portion is located outside the wall ' and the evaporation portion 531 is located inside the wall (4), so that the heat in the 5 〇 room can be transferred to the low temperature outside by the heat pipe principle. The evaporation portion 531 is condensed. The 532 532 is composed of a plurality of heat pipes, and the evaporation portion is provided with a fan 533 respectively on the outside of the condensation portion. Or an air conditioner 534 is disposed on the side of the condensation portion 532 to assist in heat dissipation. That is, if the outside temperature is the same as the temperature in the machine room 50, the air conditioner 534 is started to lower the temperature of the heat sink 53 and the heat sink 53 can be operated. The shape _ 5 (4) is scattered, (4) The P-added air conditioner can also reduce the inside of the machine room 50. (3) The evaporation portion 531 and the condensation portion 532 are provided with a plurality of heat-dissipating fins M367568. The sheet 535 also contributes to heat dissipation. The computer room is a fiber-optic switch room or a digital electronic room. See the figure ίο for a schematic diagram of the heat sink of the present invention. The heat sink of the present invention comprises a sealed container 6G. The heat sink 6 includes at least a heat pipe or a tube row 62. The heat pipe or tube row 62 has a condensation portion 621 and - an evaporation portion 622, the condensation portion 621 of the heat pipe or the tube row 62 is disposed in the container (10), the collision evaporation portion 622 is located outside the sealed container 6〇 and is located inside the telecommunications box or the machine room; and a strange temperature tank 63' has a strange temperature liquid 63 provided to enter and exit the closed container 60. The thermostat 631 is connected to a cold heading machine 64 to provide a suitable liquid 631 temperature. The strange temperature liquid 631 can be water or other equivalent liquid. In order to increase heat dissipation, the evaporation portion 622 and the condensation portion 621 are provided with a plurality of heat dissipation fins 3 or the heat dissipation device 61 is provided with at least one fan 624 to assist in heat dissipation. Or a fan 624 is provided on one side or both sides of the evaporation portion 622 to assist heat dissipation. The hermetic container 60 has an inlet 632 and an outlet 633 that communicate with the thermostatic chamber '63, respectively. A first valve 034 and a second weir 635 are disposed between the sealed container 6 and the weir tank, and the liquid can be controlled to enter and exit, thereby controlling the temperature. For the reference to the eleventh county mine, there is a schematic diagram of the financial section of the mine. The heat sink 70 of the creation machine room has a wall 71. The machine room 7 is internally provided with at least one electronic component or at least one telecommunication device (in the figure) And at least one heat sink 72 is disposed on the wall 71. The heat sink 72 includes an evaporation portion π! and a condensation portion 722 located outside the step wall 71, and the evaporation portion 721 is located at the wall 71 The inside of the wall 71, wherein the condensation portion 722 is provided with an air conditioning device, the air M367568 * adjustment device 73 includes a casing 731 'the casing 731 is coupled to the condensation portion 722; - the evaporation portion 732 ' is disposed in the casing 731 Internally located below the condensing portion 722; a fan 733 is disposed inside the casing 73i and located below the evaporation portion 7; a condensation portion 734' is disposed inside the casing 731 and under the fan 733; The channel 735, • is formed on the evaporation portion 732, the fan 733, and the condensation portion 722 passing through the heat sink π and the fan 733. That is, the condensing portion 722 of the heat sink 72 can be provided with a cooling device of the air conditioner 73. The air conditioner (73) is provided with at least one air inlet 736 on both sides of the φ condensing portion 734, and the air conditioner (73) is provided with at least one air outlet 737 located below the condensing portion 734. The equipment room 30 is a fiber switch room or a digital electronic room. The evaporation portion 721 and the condensation portion 722 are composed of a plurality of heat pipes. Above the evaporation portion 732, at least one fan 738 is provided to assist the flow of the gas. Please refer to FIGS. 12a and 12b for a schematic diagram of the heat sink device. The heat sink 80 includes a housing 81, a partition 82, at least one heat pipe or a tube row 83, and a vortex fan 84. The partition plate 82 is partitioned from the upper and lower spaces, and the heat pipe Φ or the tube row 83 has a condensation portion 831 and an evaporation portion 832, and the condensation portion 831 is located above the partition plate 82, and the evaporation portion 832 is located at the partition plate 82. Below. Therefore, when the heat dissipating device 80 is installed in the telecommunications box or the machine room, 'the partitioning portion 82 is located on the outside, and the evaporating portion 832 is located in the telecommunications box or the machine room. In this embodiment, two heat pipes or tube rows 83 are provided. The structure definition of all heat pipes and tube rows in the present invention includes at least one heat pipe or a plurality of heat pipes disposed on a plurality of fins to form a heat pipe row. Therefore, a heat pipe row 83 is disposed on each of the left and right sides of the casing 81, and a fan 85 is disposed between the heat pipe rows 83 and located above the partition plate 82. The condenser 81 is located at the side of the M367568 side. An air inlet 811 and an air outlet 812 are located above the partition 82, and the condensation portion 831 side. The vortex fan 84 is located inside the casing 81 and on the side of the evaporation portion 832. The housing 81 on the side of the evaporating portion 832 has an air inlet 813 and an air outlet 814. The air inlet 813 and the air outlet 814 can be located on the same side of the housing 81. Therefore, the heat sink 80 can perform heat transfer. The heat sink 80 can be fixed to a specific location such as a wall or the like using a bracket 86. The vortex fan 84 includes two fans 841 and a motor unit 2, and the motor 842 has two
侧別連接-風扇84卜使該馬達842驅動二風扇轉⑷動。 請參閱第13a、13b為本創作散熱裝置之再一實施例示意圖， 本創作散絲置基本結構㈣12a、12b 不_之處在於： 該渦机扇87為一馬達871與一風扇872，使該馬達μ驅動該風 扇872轉動。 «月參閱第Ha、圖為本創作散熱裝置之又一實施例示意 圖，本創作散熱裝置基本結構如第13a、说圖所示，不相同之處 在；該殼體81之冷凝部831侧設置有—渴流扇们，且相對於該 冷凝相1側之殼體81具有一入風口 815，及冷凝部如相對另 侧之喊體81具有一出風口 。 圖研參Μ 15圖為本_散錄置魏於牆壁之實施例示意 圖，該散熱裝置9〇利用差牟… & 支架1固疋於牆壁92上，該散熱裝置90 ^官_ 93具有一冷凝部931與—蒸發部啦，室内％ 931 1 Γ、Γ藉该散熱裝置9〇之蒸發部932將熱量傳遞至冷凝部 <風、％帶至外界95。室内循環亦可藉風扇97帶動。 M367568 - 請參閱第16圖為摘作散絲置安餅機_之實施例示意 圖’該散熱裝置100可安裝於機房1〇1㈣，藉由該内部的氣體 循環流動A、經過該散熱裝置励之蒸發部1〇2，而將熱量傳遞至 該散熱裝置100之冷凝部103，再送至外界，以達到散熱之目的。 - 、综上所述’本創作電子零件模組箱、機房之散熱裝置可達到 減少耗能*可提升散熱效果，4實符合專利要件，纽法提出申 請。 【圖式簡單說明】 第1圖為習知電器箱之散熱示意圖。 第2圖為習知電器箱之降溫示意圖。 第3圖為補作賤魏錄置_子科她箱.面侧視示 意圖。 第4®為本韻錄歸置的好零倾_之域透視圖。 •第5圖為本創作具備有散熱裝置的電子零件模组箱之立體圖。 第如、6b圖為本創作具備有散熱裝置的電子零件模組箱之散熱裝 置示意圖。 第7圖為本創作具财散熱裝置的财之示意圖。 第8圖為本創作具财麵裝置的射之剖面示意圖。 第9圖為本創作具備有散熱裝置的機房之散熱裝置示意圖。 第10圖為本創作散熱裝置之示意圖。 第11圖為本創作具備有散錄置的機房之剖面示意圖。 12 M367568 第12a、12b圖為本創作散熱裝置之示意圖。 第13a、13b圖為本創作散熱裝置之再一實施例示意圖。 第14a、14b圖為本創作散熱裝置之又一實施例示意圖。 第15圖為本創作散熱裝置安裝於牆壁之實施例示意圖。 第16圖為本創作散熱裝置安裝於機房内之實施例示意圖。 【主要元件符號說明】 電子零件模組箱1〇 電子元件或電信設備11 熱管或管排21 蒸發部212 第一導流板214 孔洞216 第二風道218 上表面221 散熱鰭片23 風扇25 機房30 電子零件模組箱40 散熱裝置42 元件422 蒸發部424 電信箱頂端箱壁101 散熱裝置20 冷凝部211 導流元件213 第二導流板215 第一風道217 元件22 下表面222 風扇24 風扇26 空調機31 電子元件或電信設備41 熱管或一管排421 冷凝部423 導流元件425 13 M367568 機房50 牆壁51 電子元件或電信設備52 散熱裝置53 蒸發部531 冷凝部532 風扇533 空調機534 . 散熱鰭片535 密閉容器60 散熱裝置61 熱管或管排62 冷凝部621 蒸發部622 φ 散熱鰭片623 風扇624 恆溫槽63 恆溫液體631 入口 632 出口 633 第一閥634 第二閥635 冷凍機64 機房70 牆壁71 散熱裝置72 蒸發部721 冷凝部722 ‘ 空調裝置73 機殼731 蒸發部732 風扇733 冷凝部734 風道735 入風口 736 出風口 737 風扇738 散熱裝置80 殼體81 入風口 811 出風口 812 入風口 813 出風口 814 入風口 815 14 M367568The side connection-fan 84 causes the motor 842 to drive the two fans to rotate (4). Please refer to FIGS. 13a and 13b as a schematic diagram of still another embodiment of the heat sink of the present invention. The basic structure (4) 12a, 12b of the present invention is not: the vortex fan 87 is a motor 871 and a fan 872, so that The motor μ drives the fan 872 to rotate. «Monthly referring to the Ha, the figure is a schematic diagram of another embodiment of the heat sink of the present invention. The basic structure of the heat sink of the present invention is as shown in the 13th and the drawings, and the difference is in the side of the condensation portion 831 of the casing 81. There is a thirsty fan, and the housing 81 on the side of the condensed phase 1 has an air inlet 815, and the condensing portion has an air outlet such as the opposite side of the body 81. Fig. 15 is a schematic view of an embodiment of the scatter recording of the wall, the heat sink 9 is utilizing the difference... & the bracket 1 is fixed to the wall 92, and the heat sink 90 has a The condensing portion 931 and the evaporation portion, the indoor portion 931 1 Γ, and the evaporation portion 932 of the heat sink 9 将 transfer heat to the condensing portion < wind, % to the outside 95. The indoor circulation can also be driven by a fan 97. M367568 - Please refer to Fig. 16 for a schematic diagram of an embodiment of a loose-wired cake machine. The heat-dissipating device 100 can be installed in the machine room 1〇1 (4), and the internal gas circulation flow A, through the heat-dissipating device The evaporation portion 1〇2 transfers heat to the condensation portion 103 of the heat dissipation device 100 and then to the outside to achieve heat dissipation. - In summary, the heat sink of the electronic component module box and the machine room can reduce the energy consumption* and improve the heat dissipation effect. 4 It is in line with the patent requirements, and Newfa has applied for it. [Simple description of the diagram] Figure 1 is a schematic diagram of the heat dissipation of the conventional electrical box. Figure 2 is a schematic diagram of the cooling of the conventional electrical box. The third picture shows the supplementary 贱 录 录 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The 4th® is a perspective view of the good zero tilt of the rhyme book. • Figure 5 is a perspective view of an electronic component module box with a heat sink. For example, Figure 6b is a schematic diagram of a heat dissipating device for an electronic component module box having a heat sink. The seventh picture is a schematic diagram of the wealth of the creation of a wealthy heat sink. Figure 8 is a schematic cross-sectional view of the creation of a financial device. Figure 9 is a schematic diagram of the heat sink of the machine room with the heat sink. Figure 10 is a schematic view of the heat sink of the present invention. Figure 11 is a schematic cross-sectional view of a machine room with a discrete recording. 12 M367568 The 12th and 12thth drawings are schematic diagrams of the heat sink of the creation. 13a and 13b are schematic views of still another embodiment of the heat sink of the present invention. 14a and 14b are schematic views of still another embodiment of the heat sink of the present invention. Fig. 15 is a schematic view showing an embodiment in which the heat sink of the present invention is mounted on a wall. Figure 16 is a schematic view showing an embodiment of the heat sink of the present invention installed in a machine room. [Main component symbol description] Electronic component module box 1〇Electronic component or telecommunication equipment 11 Heat pipe or tube row 21 Evaporation part 212 First deflector 214 Hole 216 Second air duct 218 Upper surface 221 Heat sink fin 23 Fan 25 Machine room 30 Electronic parts module box 40 Heat sink 42 Element 422 Evaporation part 424 Telecommunication box top box wall 101 Heat sink 20 Condensation part 211 Flow element 213 Second baffle 215 First air duct 217 Element 22 Lower surface 222 Fan 24 Fan 26 Air conditioner 31 Electronic components or telecommunication equipment 41 Heat pipe or a pipe 421 Condensing section 423 Guide element 425 13 M367568 Room 50 Wall 51 Electronic component or telecommunication equipment 52 Heat sink 53 Evaporation part 531 Condensing part 532 Fan 533 Air conditioner 534 . Heat sink fin 535 Closed container 60 Heat sink 61 Heat pipe or tube row 62 Condensation part 621 Evaporation part 622 φ Heat sink fin 623 Fan 624 Thermostatic bath 63 Constant temperature liquid 631 Entrance 632 Exit 633 First valve 634 Second valve 635 Freezer 64 Room 70 Wall 71 Heat sink 72 Evaporation unit 721 Condensation unit 722 'Air conditioner 73 Enclosure 732 Evaporator 732 Fan 733 Condensation 734 Air duct 735 Air inlet 736 air outlet 737 fan 738 heat sink 80 housing 81 air inlet 811 air outlet 812 air inlet 813 air outlet 814 air inlet 815 14 M367568
出風口 817 隔板82 冷凝部831 渦流扇84 馬達842 支架86 馬達871 散熱裝置90 牆壁92 冷凝部931 室内94 風扇96 散熱裝置100 氣體循環流動A 熱管或管排83 蒸發部832 風扇841 風扇85 渦流扇87 風扇872 支架91 熱管或管排93 蒸發部932 外界95 風扇97 機房101Air outlet 817 Separator 82 Condensation part 831 Eddy fan 84 Motor 842 Bracket 86 Motor 871 Heat sink 90 Wall 92 Condensation part 931 Indoor 94 Fan 96 Heat sink 100 Gas circulation flow A Heat pipe or tube row 83 Evaporation part 832 Fan 841 Fan 85 Vortex Fan 87 Fan 872 Bracket 91 Heat pipe or tube row 93 Evaporation part 932 Outside 95 Fan 97 Room 101