CN220205943U - Bathroom air conditioner - Google Patents

Abstract

The application relates to the technical field of air conditioning and discloses a bathroom air conditioner, which comprises a box body, an air duct assembly, a heat exchanger and a semiconductor refrigeration module, wherein the box body is provided with a containing space; the air duct assembly is used for limiting a refrigerating air duct in the accommodating space; the heat exchanger is arranged in the refrigerating air duct, the semiconductor refrigerating module is arranged in the accommodating space, and the cold end of the semiconductor refrigerating module is in heat transfer connection with the heat exchanger. By using the bathroom air conditioner disclosed by the application, the refrigerating effect on the bathroom environment can be improved.

Description

Bathroom air conditioner

Technical Field

The present application relates to the field of air conditioning technology, for example, to a bathroom air conditioner.

Background

The bathroom environment is relatively closed, and is easy to smolder in use in hot summer, so that the bathroom environment is also important for refrigeration.

The utility model discloses a bathroom heater that can refrigerate among the related art, including shell and ballast, the surface of shell is equipped with the display screen, and one side of display screen is equipped with the scavenger fan, and the opposite side of display screen is equipped with the light board, and one side of light board is equipped with the air outlet, and the internal surface of air outlet is equipped with anion generator, and one side of ballast is equipped with the roller motor that takes a breath, and the opposite side of ballast is equipped with heating end exchange port, and the top of heating end exchange port is equipped with the heating pipe, and the below of heating end exchange port is equipped with semiconductor refrigerating plant. The refrigerating bathroom heater is provided with a heating end exchange port, a semiconductor refrigerating device and an anion generator, can realize the requirements on the refrigeration and heating of the bathroom environment, and can remove peculiar smell and fresh air for blown cold air and hot air.

In the process of implementing the embodiments of the present disclosure, it is found that at least the following problems exist in the related art:

the air in the refrigerating bathroom heater directly flows through the semiconductor refrigerating device when the refrigerating bathroom heater is used for refrigerating, the heat exchange effect of the air and the semiconductor refrigerating device is poor, and the refrigerating effect of the refrigerating bathroom heater is required to be improved.

It should be noted that the information disclosed in the foregoing background section is only for enhancing understanding of the background of the present application and thus may include information that does not form the prior art that is already known to those of ordinary skill in the art.

Disclosure of Invention

The following presents a simplified summary in order to provide a basic understanding of some aspects of the disclosed embodiments. This summary is not an extensive overview, and is intended to neither identify key/critical elements nor delineate the scope of such embodiments, but is intended as a prelude to the more detailed description that follows.

The embodiment of the disclosure provides a bathroom air conditioner to improve the refrigerating effect on a bathroom environment.

In some embodiments, the bathroom air conditioner includes a housing, an air duct assembly, a heat exchanger, and a semiconductor refrigeration module, wherein the housing is configured with an accommodation space; the air duct assembly is used for limiting a refrigerating air duct in the accommodating space; the heat exchanger is arranged in the refrigerating air duct, the semiconductor refrigerating module is arranged in the accommodating space, and the cold end of the semiconductor refrigerating module is in heat transfer connection with the heat exchanger.

In some embodiments, the heat exchanger includes a plurality of heat pipes, an evaporation section of the plurality of heat pipes is located in the cooling air duct, and a condensation section abuts against a cold end of the semiconductor cooling module.

In some embodiments, the heat exchanger further includes a plurality of heat dissipation fins disposed on the heat pipe for increasing a heat exchange area of the heat pipe.

In some embodiments, the plurality of heat pipes are gravity-fed heat pipes, each heat pipe having a condensing section that is higher than an evaporating section.

In some embodiments, the heat pipe includes a first pipe section and a second pipe section, the first pipe section being disposed vertically and the second pipe section being disposed laterally.

In some embodiments, the air duct assembly further defines an air exhaust duct in the accommodating space, the bathroom air conditioner further comprises a radiator, the radiator is disposed in the air exhaust duct, and the hot end of the semiconductor refrigeration module is in heat transfer connection with the radiator.

In some embodiments, the bathroom air conditioner further comprises an air supply fan and an air exhaust fan, wherein the air supply fan is arranged in the refrigeration air duct and is used for driving indoor air to flow through the heat exchanger; the exhaust fan is arranged in the exhaust air duct and used for driving indoor air to flow through the radiator.

In some embodiments, the bathroom air conditioner further comprises a PTC heating module disposed in the cooling air duct.

In some embodiments, the hot side of the semiconductor refrigeration module faces the exhaust air duct and the cold side faces the refrigeration duct.

In some embodiments, the semiconductor refrigeration module is disposed laterally, and the refrigeration air duct is located below the exhaust air duct.

In some embodiments, the semiconductor refrigeration module is disposed vertically, and the refrigeration air duct is located on one side of the exhaust air duct.

The bathroom air conditioner provided by the embodiment of the disclosure can realize the following technical effects:

the semiconductor refrigeration module is used as a cold energy source of the bathroom air conditioner, and devices such as a compressor, a condenser and the like are not required to be arranged, so that the structure of the bathroom air conditioner is simplified, and the cost of the bathroom air conditioner is reduced; the refrigerating capacity of the semiconductor refrigerating module is transferred to the air flowing through the refrigerating air duct through the heat exchanger, so that the heat exchange efficiency is high, and the refrigerating effect of the bathroom air conditioner is good.

The foregoing general description and the following description are exemplary and explanatory only and are not restrictive of the application.

Drawings

One or more embodiments are illustrated by way of example and not limitation in the figures of the accompanying drawings, in which like references indicate similar elements, and in which like reference numerals refer to similar elements, and in which:

fig. 1 is a schematic view of a bathroom air conditioner according to an embodiment of the present disclosure;

FIG. 2 is a schematic cross-sectional view of a bathroom air conditioner according to an embodiment of the present disclosure;

fig. 3 is a schematic structural diagram of a semiconductor refrigeration module and a heat pipe of a bathroom air conditioner according to an embodiment of the present disclosure;

FIG. 4 is a schematic view of another bathroom air conditioner provided in an embodiment of the present disclosure;

FIG. 5 is a schematic cross-sectional view of another bathroom air conditioner provided by an embodiment of the present disclosure;

fig. 6 is a schematic structural view of another bathroom air conditioner provided in an embodiment of the present disclosure.

Reference numerals:

100: a case; 200: an air duct assembly; 210: a refrigerating air duct; 220: an exhaust air duct; 300: a heat exchanger; 310: a heat pipe; 311: a first pipe section; 312: a second pipe section; 320: a heat exchange fin; 400: a semiconductor refrigeration module; 510: a heat sink; 520: an air supply fan; 530: an exhaust fan; 540: a PTC heating module; 610: a first electronic control box; 620: and the second electric control box.

Detailed Description

So that the manner in which the features and techniques of the disclosed embodiments can be understood in more detail, a more particular description of the embodiments of the disclosure, briefly summarized below, may be had by reference to the appended drawings, which are not intended to be limiting of the embodiments of the disclosure. In the following description of the technology, for purposes of explanation, numerous details are set forth in order to provide a thorough understanding of the disclosed embodiments. However, one or more embodiments may still be practiced without these details. In other instances, well-known structures and devices may be shown simplified in order to simplify the drawing.

The terms first, second and the like in the description and in the claims of the embodiments of the disclosure and in the above-described figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate in order to describe embodiments of the present disclosure. Furthermore, the terms "comprise" and "have," as well as any variations thereof, are intended to cover a non-exclusive inclusion.

In the embodiments of the present disclosure, the terms "upper", "lower", "inner", "middle", "outer", "front", "rear", and the like indicate an azimuth or a positional relationship based on that shown in the drawings. These terms are used primarily to better describe embodiments of the present disclosure and embodiments thereof and are not intended to limit the indicated device, element, or component to a particular orientation or to be constructed and operated in a particular orientation. Also, some of the terms described above may be used to indicate other meanings in addition to orientation or positional relationships, for example, the term "upper" may also be used to indicate some sort of attachment or connection in some cases. The specific meaning of these terms in the embodiments of the present disclosure will be understood by those of ordinary skill in the art in view of the specific circumstances.

In addition, the terms "disposed," "connected," "secured" and "affixed" are to be construed broadly. For example, "connected" may be in a fixed connection, a removable connection, or a unitary construction; may be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements, or components. The specific meaning of the above terms in the embodiments of the present disclosure may be understood by those of ordinary skill in the art according to specific circumstances.

The term "plurality" means two or more, unless otherwise indicated.

In the embodiment of the present disclosure, the character "/" indicates that the front and rear objects are an or relationship. For example, A/B represents: a or B.

The term "and/or" is an associative relationship that describes an object, meaning that there may be three relationships. For example, a and/or B, represent: a or B, or, A and B.

It should be noted that, without conflict, the embodiments of the present disclosure and features of the embodiments may be combined with each other.

The bathroom environment is relatively closed, and is easy to smolder in use in hot summer, so that the bathroom environment is also important for refrigeration. The utility model discloses a bathroom heater that can refrigerate among the related art, including shell and ballast, the surface of shell is equipped with the display screen, and one side of display screen is equipped with the scavenger fan, and the opposite side of display screen is equipped with the light board, and one side of light board is equipped with the air outlet, and the internal surface of air outlet is equipped with anion generator, and one side of ballast is equipped with the roller motor that takes a breath, and the opposite side of ballast is equipped with heating end exchange port, and the top of heating end exchange port is equipped with the heating pipe, and the below of heating end exchange port is equipped with semiconductor refrigerating plant. The refrigerating bathroom heater is provided with a heating end exchange port, a semiconductor refrigerating device and an anion generator, can realize the requirements on the refrigeration and heating of the bathroom environment, and can remove peculiar smell and fresh air for blown cold air and hot air. The related art has a problem that air flows through the semiconductor refrigeration device to perform the heat exchanger, and the heat exchange area of the semiconductor refrigeration device is small, so that the heat exchange effect of the air and the semiconductor refrigeration device is poor.

The embodiment of the disclosure provides a bathroom air conditioner, the cold end heat transfer of semiconductor refrigeration module is connected in the heat exchanger, exchanges heat with air through the heat exchanger, can provide the heat transfer effect to improve the refrigeration effect of bathroom air conditioner.

Referring to fig. 1 to 6, the embodiment of the present disclosure provides a bathroom air conditioner, including a cabinet 100, an air duct assembly 200, a heat exchanger 300, and a semiconductor refrigeration module 400, wherein the cabinet 100 is configured with a receiving space; the air duct assembly 200 defines a refrigerating air duct 210 in the accommodating space; the heat exchanger 300 is arranged in the refrigerating air duct 210, the semiconductor refrigerating module 400 is arranged in the accommodating space, and the cold end of the semiconductor refrigerating module 400 is in heat transfer connection with the heat exchanger 300.

In an embodiment of the disclosure, a bathroom air conditioner includes a housing including a top plate, a bottom plate, and a plurality of side plates, the top plate, the bottom plate, and the plurality of side plates enclosing a receiving space.

The air duct assembly 200 includes a plurality of partitions that enclose a cooling air duct 210 within the receiving space. The heat exchanger 300 is disposed in the cooling air duct 210, and air enters the cooling air duct 210 and flows through the heat exchanger 300 to exchange heat with the heat exchanger 300, and is blown out from the cooling air duct 210 after the temperature is reduced. The semiconductor refrigeration module 400 is disposed in the accommodating space and is used for generating cold. The semiconductor refrigeration module 400 has a cold side and a hot side due to the semiconductor refrigeration mechanism. The cold end of the semiconductor refrigeration module 400 is transferred to the heat exchanger 300 to provide cold to the heat exchanger 300. From the point of view of molecular thermal motion, thermal motion energy of gas molecules is transferred to the heat exchanger 300 and then to the cold end of the semiconductor refrigeration module 400 through the heat exchanger 300. For ease of understanding and ease of description, it is also recognized that the cooling capacity of the semiconductor refrigeration module 400 is transferred to the air flowing through the heat exchanger 300 via the heat exchanger 300.

By using the bathroom air conditioner provided by the embodiment of the disclosure, the semiconductor refrigeration module 400 is used as a cold energy source of the bathroom air conditioner, and devices such as a compressor, a condenser and the like are not required to be arranged, so that the structure of the bathroom air conditioner is simplified, and the cost of the bathroom air conditioner is reduced; the cooling capacity of the semiconductor refrigeration module 400 is transferred to the air flowing through the cooling air duct 210 through the heat exchanger 300, and the heat exchange efficiency is high, and the cooling effect of the bathroom air conditioner is good.

Optionally, the heat exchanger 300 includes a plurality of heat pipes 310, an evaporation section of the plurality of heat pipes 310 is located in the cooling air duct 210, and a condensation section abuts against a cold end of the semiconductor cooling module 400.

The heat pipe 310 is a heat transfer element with high heat conduction performance, and the heat pipe 310 is provided with a totally-enclosed shell, and the shell is filled with a refrigerant. The heat transfer is realized through the gas-liquid two-phase circulation of the refrigerant. Specifically, the heat pipe 310 has a condensation section and an evaporation section, the evaporation section of the heat pipe 310 is located in the cooling air duct 210, and the condensation section abuts against the cold end of the semiconductor cooling module 400. Inside the heat pipe 310, the liquid refrigerant flows to the evaporation stage, and then absorbs heat by evaporation in the evaporation stage, thereby reducing the temperature of the air flowing through the heating duct. The evaporated gaseous refrigerant returns to the condensing section under the action of the density difference of the gas-liquid two-phase refrigerant or the action of capillary force, and is condensed and released at the condensing end. The heat pipe 310 continuously transfers the cooling capacity generated by the semiconductor refrigeration module 400 to the refrigeration air duct 210 through the gas-liquid two-phase change of the cooling medium and the circulation flow at the evaporation section and the condensation end. The heat exchanger 300 includes a plurality of heat pipes 310, the plurality of heat pipes 310 having a large heat exchange area and high heat conduction efficiency, so that the cooling capacity generated by the semiconductor refrigeration module 400 can be efficiently transferred into the refrigeration wind tunnel 210,

optionally, the plurality of heat pipes 310 are gravity fed heat pipes 310, with the condensing section of each heat pipe 310 being higher than the evaporating section.

The heat pipe 310 is in the form of a gravity heat pipe 310, and the circulation flow of the refrigerant is self-driven by the density difference of the gas phase and the liquid phase of the refrigerant. The bathroom air conditioner is installed with its position and up-down direction fixed so that the condensing section of the single heat pipe 310 is higher than the evaporating section thereof in the bathroom air conditioner in a use state. I.e., the cold side of the semiconductor refrigeration module 400 is above the refrigeration wind tunnel 210. The liquid refrigerant in the heat pipe 310 flows to the evaporation section and exchanges heat with the refrigerant air in the cooling air duct 210. The temperature of the air is reduced and the liquid refrigerant absorbs heat and evaporates into a gaseous refrigerant. The gaseous refrigerant moves upward under buoyancy to the refrigerant section of the heat pipe 310. The gaseous refrigerant is condensed into a liquid state after the heat release of the evaporation section, and then flows to the evaporation section under the action of gravity. With such arrangement, the gas-liquid two-phase refrigerant flows orderly, and the heat pipe 310 has higher heat conduction efficiency.

Optionally, the heat exchanger 300 further includes a plurality of heat dissipation fins disposed on the heat pipe 310 for increasing the heat exchange area of the heat pipe 310.

The heat dissipation fins are provided with a plurality of mounting holes, and the plurality of heat pipes 310 are correspondingly penetrated in the plurality of mounting holes one by one. The plurality of heat pipes 310 can be integrated by the heat radiating fins, and the heat exchanger 300 can be manufactured and assembled with such an arrangement. The heat radiating fins may also increase the effective heat exchange area of the heat pipe 310, thereby improving the heat exchange efficiency of the heat exchanger 300. The cooling fin can further improve the refrigerating effect of the bathroom air conditioner.

Optionally, a heat dissipation fin is disposed at the evaporation section of the heat pipe 310.

The evaporation section of the heat pipe 310 performs heat exchange by means of heat convection, so that the heat exchange effect of the heat exchanger 300 can be improved by providing the heat dissipation fins at the evaporation section. While the condensing section of the heat pipe 310 performs heat exchange by heat conduction, the heat exchange fin 320 is not required.

Alternatively, the heat pipe 310 includes a first pipe section 311 and a second pipe section 312, the first pipe section 311 being disposed vertically and the second pipe section 312 being disposed laterally.

The first pipe section 311 arranged vertically is a pipe section which exchanges more heat with air, and is also a main channel for rising the gaseous refrigerant and falling the liquid refrigerant. The second tube segment 312 is a tube segment that exchanges more heat with the semiconductor refrigeration module 400. The first pipe section 311 is vertically arranged, which is beneficial for the refrigerant in the heat pipe 310 to fully circulate under the action of the cold-hot density difference; the second pipe section 312 is laterally disposed, so that the contact area between the heat pipe 310 and the semiconductor refrigeration module 400 can be increased, thereby improving the heat exchange efficiency between the heat exchanger 300 and the semiconductor refrigeration module 400.

Alternatively, the cross-sectional dimension of the first tube section 311 is smaller in the height direction than in the width direction.

The second tube section 312 of the heat pipe 310 is a flat tube, so that the contact area between the heat pipe 310 and the semiconductor refrigeration module 400 can be further increased, and the heat exchange efficiency between the heat pipe 310 and the semiconductor refrigeration module 400 can be improved.

Optionally, the second tube segment 312 is disposed at an angle greater than or equal to three percent from horizontal.

The liquid refrigerant flows from the second tube segment 312 of the heat pipe 310 to the first tube segment 311 of the heat pipe 310, and the second tube segment 312 of the heat pipe 310 is obliquely arranged, which is beneficial to the flow of the liquid refrigerant. This can improve the circulation efficiency of the refrigerant in the heat pipe 310.

Optionally, the cold end of the semiconductor refrigeration module 400 is tilted.

This allows for adaptation to the inclined second tube section 312 of the heat pipe 310, so that the first tube section 311 of the heat pipe 310 can remain in a vertical arrangement.

Optionally, the lengths of the first tube sections 311 of the plurality of heat pipes 310 are the same.

In the case where the cold ends of the semiconductor refrigeration modules 400 are disposed obliquely and the second tube sections 312 of the heat pipes 310 are disposed obliquely, the bottom ends of the plurality of heat pipes 310 are staggered. If the bottom plate of the cooling duct 210 is a plane, the bottom ends of the plurality of heat pipes 310 are gradually increased or gradually decreased in distance from the bottom plate of the cooling duct 210. The bottom end of the heat pipe 310 is the location where the refrigerant evaporates most. With such arrangement, the bottom ends of the plurality of heat pipes 310 may be staggered in the windward direction, thereby improving the heat exchange efficiency of the heat exchanger 300 with air.

Optionally, the air duct assembly 200 further defines an air exhaust duct 220 in the accommodating space, the bathroom air conditioner further includes a radiator 510, the radiator 510 is disposed on the air exhaust duct 220, and the hot end of the semiconductor refrigeration module 400 is in heat-transfer connection with the radiator 510.

The bathroom air conditioner is used in a bathroom environment, and the exhaust air duct 220 is arranged to exhaust indoor dirty and humid air, so that the comfort of the bathroom environment is improved. With the semiconductor refrigeration module 400, heat is inevitably generated while refrigerating. If the heat cannot be discharged in time, not only the cooling of the semiconductor cooling module 400 cannot be continuously performed, but also the semiconductor cooling module 400 may be damaged. Accordingly, the duct assembly 200 further defines an exhaust duct 220 in the receiving space for taking away heat emitted from the semiconductor refrigeration module 400 by the flowing air. Specifically, the bathroom air conditioner further comprises a radiator 510, the radiator 510 is disposed in the exhaust air duct 220, and the hot end of the semiconductor refrigeration module is in heat transfer connection with the radiator 510. The heat emitted from the semiconductor refrigeration module 400 is taken away by the air flowing through the air discharge duct 220 through the heat sink 510. By adopting the arrangement mode, the refrigeration of the semiconductor refrigeration module 400 can be continuously carried out, and the phenomenon that the semiconductor refrigeration module 400 cannot work or is damaged due to the fact that the temperature of a hot end is too high is avoided.

Optionally, the hot side of the semiconductor refrigeration module 400 faces the exhaust air duct and the cold side faces the refrigeration duct 210.

The hot end of the semiconductor refrigeration module 400 faces the exhaust air duct and the cold end faces the refrigeration air duct 210, and the semiconductor refrigeration module 400 plays a certain role in segmentation. By adopting the arrangement mode, the space utilization rate of the bathroom air conditioner can be improved.

Optionally, the semiconductor refrigeration module 400 is disposed laterally, and the refrigeration duct 210 is located below the exhaust duct.

With this arrangement, the heat pipe 310 and the heat sink 510 are conveniently mounted.

Alternatively, the semiconductor refrigeration module 400 is disposed vertically, and the refrigeration duct 210 is located at one side of the exhaust duct.

With such an arrangement, the thickness of the bathroom air conditioner can be reduced. In the case that the semiconductor refrigeration module 400 is vertically disposed, the heat pipe 310 may take other forms such as a capillary heat pipe 310, or may take the form of a gravity assisted heat pipe 310. In the case where the heat pipe 310 is still a gravity heat pipe 310, the heat pipe 310 includes a first pipe section 311 disposed vertically and a second pipe section 312 disposed laterally. At least a portion of the second tube segment 312 is in contact with the cold end of the semiconductor refrigeration module 400, and the second tube segment 312 extends into the refrigeration air duct 210. In this case, the lengths of the first tube sections 311 of the plurality of heat pipes 310 are different, so that the second tube sections 312 of the plurality of heat pipes 310 can be uniformly distributed in the cooling duct 210.

Optionally, the bathroom air conditioner further comprises a PTC heating module disposed in the cooling air duct 210.

When heating using the bathroom air conditioner is required, the semiconductor refrigeration module 400 heats the bathroom air conditioner with relatively low heat efficiency. A PTC heating module is thus provided in the cooling duct 210 for increasing the temperature of air flowing through the cooling duct 210. The PTC heating module comprises a PTC heating element, which is also called as a PTC heater, and consists of a PTC ceramic heating element and an aluminum tube. The PTC heater has the advantages of small thermal resistance, quick heating, stable temperature and low energy consumption. The PTC ceramic material has a characteristic that the resistance of the PTC material increases with increasing temperature, which determines that the PTC heater heats up rapidly when the temperature is low under a constant voltage. And the resistance value becomes larger after the temperature is increased, the current becomes smaller, and the energy consumed by the PTC becomes smaller, so that the temperature can be kept relatively constant, and the electric energy is saved relatively. The PTC heating module is arranged in the cold air duct 210, so that the heating function of the bathroom air conditioner can be realized, the PTC heating module can keep a relatively constant temperature, and the use safety is high.

Optionally, the bathroom air conditioner further includes an air supply fan 520 and an air exhaust fan 530, wherein the air supply fan 520 is disposed in the cooling air duct 210 and is used for driving indoor air to flow through the heat exchanger 300; the exhaust fan 530 is disposed in the exhaust duct 220, and is used for driving indoor air to flow through the radiator 510.

In the case of the bathroom air conditioner operating in the cooling mode, the exhaust fan 530 and the supply fan 520 are simultaneously operated, the supply fan 520 drives the indoor air to flow through the heat exchanger 300 and back to the room, and the exhaust fan 530 drives the air to flow through the radiator 510 and exhaust the air to the outdoor environment. By this way, the cooling of the bathroom air conditioner can be continuously performed and the indoor temperature is continuously lowered.

In the case of the bathroom air conditioner operating in the heating mode, the air discharge fan 530 stops rotating, and the air supply fan 520 rotates, driving air to flow through the PTC heating module and blow to the indoor environment.

In the case that the bathroom air conditioner operates in the air discharge mode, the air discharge fan 530 rotates, the air supply fan 520 stops rotating, and air of the indoor environment flows to the outdoor environment through the air discharge duct 220.

Optionally, the bathroom air conditioner further includes a first electronic control box 610, and a computer board is disposed in the first electronic control box 610, and the computer board is close to the cooling air duct 210.

By adopting the arrangement form, the computer board is favorably cooled, so that the running stability of the bathroom air conditioner can be improved.

Optionally, the bathroom air conditioner further includes a second electric control box 620 and a terminal, wherein the second electric control box 620 is disposed outside the accommodating space, and the terminal is disposed on the second electric control box 620.

The first electronic control box 610 is disposed in the accommodating space of the box 100, i.e. is located in the box 100. The computer board does not need to be frequently disassembled or wired, and the computer can be better protected by being arranged in the first box body 100. The second electronic control box 620 is disposed outside the accommodating space, and is used for setting a connection terminal and other components that need to be frequently plugged and disassembled. Since the second electronic control box 620 is located outside the case 100, the operation of components such as the connection terminal is easier.

Optionally, the first electronic control box 610 is located in the accommodating space and is close to the first side wall, and the second electronic control box 620 is detachably connected to the outer side of the first side wall.

The computer board is disposed in the first electronic control box 610, and the connection terminal is disposed in the second electronic control box 620. The components in the first electronic control box 610 need to be electrically connected with the components in the second electronic control box 620. Thus, the first electronic control box 610 is adjacent to the inner wall of the first sidewall and the second electronic control box 620 is adjacent to the outer wall of the first sidewall. The components in the first electronic control box 610 and the components in the second electronic control box 620 need only span the first side wall of the case 100 for physical connection. With such arrangement, the physical connection between the components in the first electronic control box 610 and the components in the second electronic control box 620 is facilitated, and the bathroom air conditioner can be more compact.

The above description and the drawings illustrate embodiments of the disclosure sufficiently to enable those skilled in the art to practice them. Other embodiments may include structural and other modifications. The embodiments represent only possible variations. Individual components and functions are optional unless explicitly required, and the sequence of operations may vary. Portions and features of some embodiments may be included in, or substituted for, those of others. The embodiments of the present disclosure are not limited to the structures that have been described above and shown in the drawings, and various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims (10)

1. A bathroom air conditioner, comprising:

the box body is provided with an accommodating space;

the air duct assembly is used for limiting a refrigerating air duct in the accommodating space;

the heat exchanger is arranged in the refrigerating air duct,

the semiconductor refrigeration module is arranged in the accommodating space, and the cold end of the semiconductor refrigeration module is in heat transfer connection with the heat exchanger.

2. The bathroom air conditioner of claim 1, wherein the heat exchanger comprises:

the evaporation sections of the heat pipes are positioned in the refrigerating air duct, and the condensation sections are abutted to the cold ends of the semiconductor refrigerating modules.

3. The bathroom air conditioner of claim 2, wherein the heat exchanger further comprises:

the heat dissipation fins are arranged on the heat pipe and used for increasing the heat exchange area of the heat pipe.

4. The bathroom air conditioner of claim 2, wherein,

the plurality of heat pipes are gravity-equalizing heat pipes, and the condensation section of each heat pipe is higher than the evaporation section.

5. The bathroom air conditioner of claim 4, wherein,

the heat pipe comprises a first pipe section and a second pipe section, wherein the first pipe section is vertically arranged, and the second pipe section is transversely arranged.

6. The bathroom air conditioner according to any one of claims 1 to 5, wherein,

the air duct component also defines an exhaust air duct in the accommodating space,

the bathroom air conditioner further includes:

and the radiator is arranged in the exhaust air duct, and the hot end of the semiconductor refrigeration module is in heat transfer connection with the radiator.

7. The bathroom air conditioner of claim 6, further comprising:

the air supply fan is arranged in the refrigerating air duct and used for driving indoor air to flow through the heat exchanger;

the exhaust fan is arranged in the exhaust air duct and used for driving indoor air to flow through the radiator.

8. The bathroom air conditioner of claim 6, further comprising:

the PTC heating module is arranged in the refrigerating air duct.

9. The bathroom air conditioner of claim 6, wherein,

the hot end of the semiconductor refrigeration module faces the exhaust air duct, and the cold end faces the refrigeration duct.

10. The bathroom air conditioner of claim 8, wherein,

the semiconductor refrigeration module is transversely arranged, and the refrigeration air duct is positioned below the air exhaust air duct; or alternatively, the first and second heat exchangers may be,

the semiconductor refrigerating module is vertically arranged, and the refrigerating air duct is positioned on one side of the air exhaust air duct.