CN105310358A - Constant-temperature and constant-humidity historical relic showcase with solid fan and semiconductor coupled - Google Patents
Constant-temperature and constant-humidity historical relic showcase with solid fan and semiconductor coupled Download PDFInfo
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- CN105310358A CN105310358A CN201510811961.5A CN201510811961A CN105310358A CN 105310358 A CN105310358 A CN 105310358A CN 201510811961 A CN201510811961 A CN 201510811961A CN 105310358 A CN105310358 A CN 105310358A
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- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47F—SPECIAL FURNITURE, FITTINGS, OR ACCESSORIES FOR SHOPS, STOREHOUSES, BARS, RESTAURANTS OR THE LIKE; PAYING COUNTERS
- A47F3/00—Show cases or show cabinets
- A47F3/001—Devices for lighting, humidifying, heating, ventilation
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Cold Air Circulating Systems And Constructional Details In Refrigerators (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The invention discloses a constant-temperature and constant-humidity historical relic showcase with a solid fan and a semiconductor coupled. The constant-temperature and constant-humidity historical relic showcase comprises a showcase body, a constant-temperature and constant-humidity unit and a gas conveying unit. The gas conveying unit is used for circulating gas in the showcase body and constant-temperature and constant-humidity gas generated by the constant-temperature and constant-humidity unit. The gas conveying unit comprises a wind pipe through which the showcase body and the constant-temperature and constant-humidity unit are connected, the first solid fan providing gas circulation power, and a drive power supply. Accelerated flowing of gas is achieved through the solid fan and ion wind by means of the gas conveying device, power can be provided for gas conveying, the problems that traditional mechanical draught fans are high in noise, vibration and energy consumption are solved, and the constant-temperature and constant-humidity historical relic showcase has the advantages of being low in energy consumption, free of noise and vibration, convenient to control, and the like.
Description
Technical field
The present invention relates to constant temperature and humidity control technology, particularly the old showcase of one solid-state fan couple semiconductor constant temperature and humidity historical relic.
Background technology
Historical relic storage, preservation and displaying need specific air ambient to be damaged to prevent it, and wherein temperature and humidity is the key factor affecting cultural relic conservation.Therefore be starved of and temperature and humidity regulation is carried out to the old showcase of historical relic.
Point out in the exhibition of cultural relics and Conservation environment of large space area at document " design of museum's constant temperature and humidity historical relic environmental control system " Zhong Jiang state beam, adopt freeze drying type constant temperature and humidity system comparatively reasonable, it designs Daliang City's museum system, handpiece Water Chilling Units is adopted to provide chilled water to realize the refrigerated dehumidification in air-treatment unit implementation space to air-treatment unit, the processes such as warming and humidifying, by switch board, humiture is controlled, the air of process is transported to each showcase by airduct.This technology adopts conventional vapor-compression refrigeration modes, refrigerating capacity is large, be well positioned to meet the temperature adjusting and dehumidifying function of large space, but its unit volume is large, quality is large, compressor and conveying fan can produce vibration and noise, need design machine room separately to place unit, and need to arrange complicated controller to the Temperature and Humidity Control of each showcase end, cost is improved, the simultaneously movement of showcase not easily realizes, thus adopt in the wet adjustment of heat in large-scale system and carrying out large space comparatively suitable.
Application number is propose a kind of fine work Storage Cabinets in the patent document of ZL201110443214.2, its by being provided with humidification module in the canyon of Storage Cabinets, refrigeration module, heating module, refrigeration unit realize to air heat and wet treatment, it adopts the evaporimeter of refrigeration unit to realize refrigeration, adopt electrical heating and water tank to realize heating and humidification, carry out Cemented filling by the air of blower fan to process.Because it processes single cultural relic cabinet; the small volume of system; and but the blower fan achieving power-off protection its refrigeration unit and conveying is all placed near cabinet; also vibration and noise can be produced; and adopting that the electrical heating efficiency of heating surface is lower, energy consumption increases, system mechanical component too much adds weight and is not easy to cabinet and moves.
Application number is propose new solutions for refrigeration in the patent document of ZL201410317617.6 to process the old exhibition space of historical relic, this patent adopts semiconductor thermoelectric module as cooling module, the heat and wet treatment of air is realized by semiconductor chilling plate and heater, humidifier etc., because semiconductor chilling plate volume is little, quality is light, fine to the control of microenvironment, and the equipment in the object process of microenvironment humidity regulation that completes does not need to add water, the few pipe design of Reduction by Drainage, system is simple.But for ensureing that the semiconductor chilling plate cold and hot end of cooling piece that is operated in normally and efficiently needs to arrange radiator, prior art many employings mechanical fans realizes, mechanical fans also can produce vibration and noise, and efficiency, air quantity are single wayward, power consumption is comparatively large, and the blower fan of induction system also exists the problem of vibrating noise.
In summary it can be seen, the historical relic constant temperature and humidity system of steam compression type refrigeration is adopted to be applicable to large scale system, more weak to the control treatment ability of single old showcase, the large weight of volume is large, and complex structure, not easily moves, there is the problem of vibrating noise simultaneously, although adopt the constant temperature and humidity system volume of semiconductor refrigerating technology and quality to reduce, also there is the problem of vibration and noise, system effectiveness need to improve.
Summary of the invention
The invention provides the old showcase of a kind of solid-state fan couple semiconductor constant temperature and humidity historical relic, have that structure is simple, volume is little, friction and noise, be convenient to advantage that is mobile, low energy consumption.
The old showcase of a kind of solid-state fan couple semiconductor constant temperature and humidity historical relic, comprise cabinet, constant temperature and humidity unit and gas transmission unit, the constant temperature and humidity gas that described gas transmission unit produces for gas in the cabinet that circulates and constant temperature and humidity unit, described gas transmission unit comprises the airduct connecting cabinet and constant temperature and humidity unit, provides first of gas circulation power the solid-state fan and driving power.
Air delivery device of the present invention adopts solid-state fan to the power providing gas to circulate, and solid-state fan is that the gas flow of ions utilizing corona discharge to produce realizes circulating of air in pipeline; Described solid-state fan multiplely can regulate and improve air quantity by arranging, and multiple solid-state fan serial or parallel connections provide the driving force of gas in airduct pipeline, and airduct is being connected to form gas flow loop with constant temperature and humidity device and cabinet.
Solid-state fan is different from traditional mechanical fans, the efficiency of solid-state fan and air quantity can be subject to structural parameters as heat-transfer surface, spacing, and the impact of the heat flux of supply voltage and heat-transfer surface, the heat flux of radiating surface also can have an impact to the efficiency of semiconductor refrigerating element simultaneously, therefore there is optimum parameter can run in the best condition to make whole semiconductor thermostatic and temperature constant humidity system, and meet different environmental working condition demands by adjustment parameter.
Constant temperature and humidity device is for the treatment of the gas from cabinet, and after having regulated temperature and humidity, circulation passes into cabinet again, and its circulation power is provided by the first solid-state fan.Constant temperature and humidity device carrys out the temperature and humidity of adjustments of gas by arranging attemperating unit and humidity conditioner.
Preferably, described first solid-state fan comprises: both ends open and the colelctor electrode cylinder be connected with airduct and coordinate the first sparking electrode forming ion wind with colelctor electrode cylinder with the one end being arranged on colelctor electrode cylinder.Colelctor electrode cylinder can dock with airduct easily, and colelctor electrode tube inner chamber produces ion wind, effectively drives airflow.
Described first sparking electrode is the wire sparking electrode across colelctor electrode cylinder one end open.The design of wire sparking electrode, processing simply, can reduce the electrode number needing to arrange simultaneously, be easy to fixing, can save design time and cost.
Described first sparking electrode is the pin shaped electric discharging electrodes across colelctor electrode cylinder one end open, and the syringe needle sensing colelctor electrode cylinder of pin shaped electric discharging electrodes is interior and direction is parallel with the central shaft of colelctor electrode cylinder.The sparking electrode of needle-like due to radius of curvature be easy to make less, discharge inception voltage can be lower, is easier to realize corona discharge, simultaneously needle electrode by adjustment pin towards the control better realizing flowing to the ion wind flow produced.
In order to improve the air quantity of single first solid-state fan, described pin shaped electric discharging electrodes is multiple to being placed with along colelctor electrode barrel dliameter, and the syringe needle of all pin shaped electric discharging electrodes all points in colelctor electrode cylinder and direction is parallel with the central shaft of colelctor electrode cylinder.
In order to reduce the volume of device further, avoid producing noise and vibration, preferably, described constant temperature and humidity unit comprises: to circulate the air heat and wet treatment room be communicated with, the radiating module being arranged on the semiconductor refrigerating element on air heat and wet treatment room and being arranged on semiconductor refrigerating element with cabinet.
Semiconductor refrigerating element adopts laminated structure usually, i.e. semiconductor chilling plate, semiconductor refrigerating produces refrigeration based on pyroelectric effect thus realizes temperature and humidity and controls, under refrigerated dehumidification operating mode, make cooling module be semiconductor cold junction in side, air heat and wet treatment space by the access way controlling semiconductor refrigerating element and power supply, cold junction temperature realizes carrying out cool-down dehumidification lower than air dew point; Then the connection by changing cooling module and power supply makes electric current flow counterflow through, at this moment cooling module is semiconductor hot junction in side, air heat and wet treatment space, hot-side temperature is high to be heated surrounding space, realizes controlling the further adjustment of the temperature of space air.
Air heat and wet treatment space can adopt the mode of freeze drying to carry out humid control, by semiconductor cooling cold junction and heat and wet treatment space air heat-exchange, when cold junction temperature is lower than air dew point temperature, water in air is condensed into liquid state and removes from air, the air of low temperature and low humidity is obtained in the wet space of heat, passing through the control to the supply voltage of the enter heat and wet treatment space first solid-state fan, change conveying air velocity, the untreated air of different air quantity is provided, the air dehumidified in these untreated air and air heat and wet treatment space mixes and reaches required relative humidity, the process of the humidity of implementation space and control.
The present invention adopts the mode of semiconductor refrigerating to realize constant temperature and humidity function, because it uses pyroelectric technology to cause the problem of environmental pollution without the need to cold-producing medium does not have refrigrant leakage, and volume is little, movement-less part.
Described semiconductor refrigerating element can adopt single stage thermoelectric to pile or Multi-stage heat pile form.It is higher that single stage thermoelectric piles the cryogenic temperature that can reach, and because moisture removal is subject to the minimum temperature that thermoelectric pile can realize, in order to meet the demand that high humidity load condition and lower temperature control, can adopt the form of Multi-stage heat pile.Preferably, described semiconductor refrigerating element adopts Multi-stage heat pile.
In order to reduce the volume of device further, avoid producing noise and vibration, described radiating module adopts the second solid-state fan.Solid-state fan is that the gas flow of ions produced based on corona discharge realizes semiconductor hot junction cooling heat dissipation, makes semiconductor refrigerating element can efficient quiet stable work.
Solid-state fan is adopted to dispel the heat to the hot junction of semiconductor refrigerating element or cold junction, because its ion wind using corona discharge to be formed cools hot junction and instead of traditional mechanical fans, decrease the noise brought due to mechanical fans, secondly the problem of mechanical fans owing to there being rotary part can there is operational reliability, and there is not stability and reliability that rotary part well improves heat radiation in solid-state fan, and solid-state fan due to its electric current its operate power very little low, so overcome the high problem of mechanical fans energy consumption, it is much little that the volume of solid-state fan compares mechanical fans, be convenient to the miniaturization of equipment, and solid-state fan to form design form by discharge electrode and colelctor electrode various, go for multi-form radiating surface, compare its design freedom of mechanical fans high.
Conveniently manufacture and improve refrigeration, described second solid-state fan comprises power supply and the cooperatively interact discharge electrode and colelctor electrode that produce corona wind, electrode framework is used for fixing discharge electrode, wire for connecting power supply, by discharge electrode is fixed on above colelctor electrode or the difference of left and right sides position realize various flows to the cold and hot end face of wind to semiconductor dispel the heat.Preferably, described second solid-state fan comprises the collector plate and the second sparking electrode that cooperatively interact and produce corona wind, described collector plate comprises the substrate and some fins being fixed on substrate backside semiconductor cooling module side that to recline with the surface of semiconductor refrigerating element and install, fin extends with being substantially parallel to each other in the vertical, form the ion wind passage extended longitudinally between adjacent fins, described second sparking electrode by fixed mount install be distributed in collector plate periphery and discharge end and ion wind passage positioned opposite.Described collector plate is metal fin plate.
Preferably, each fin is made up of the fin post be longitudinally intervally arranged, the ion wind passage that the fin post one_to_one corresponding of adjacent fins makes the gap-forming between fin post extend in the horizontal.Owing to adopting pin fin (fin post), outside surrounding air can from surrounding admission passage, and can better cool semiconductor, the coefficient of heat transfer is higher, makes the coefficient of heat transfer of pin fin higher.
Preferably, described second sparking electrode is wire, to be positioned at above ion wind passage and parallel with ion wind passage.The design of wire discharge electrode, processing simply, can reduce the electrode number needing to arrange simultaneously, be easy to fixing, can save design time and cost.Top take substrate as bottom surface, away from the position of substrate.Second sparking electrode is tinsel or stainless steel wire.
Preferably, described second sparking electrode is needle-like.The sparking electrode of needle-like due to radius of curvature be easy to make less, discharge inception voltage can be lower, is easier to realize corona discharge, simultaneously needle electrode by adjustment pin towards the control better realizing flowing to the ion wind flow produced.
In order to improve air quantity and radiating effect, preferably, described fin is made up of the fin post be longitudinally intervally arranged, the interval of adjacent fins is relative one by one respectively, the ion wind passage that all relative gap-formings extend in the horizontal, second sparking electrode is arranged in the top of the crossover location of vertical and horizontal ion wind passage, on the cubical center line that the fin post that namely the second sparking electrode is arranged in surrounding is formed and syringe needle towards ion wind passage.
Preferably, every bar ion wind passage to there being multiple second sparking electrode, these second sparking electrodes are positioned at above ion wind passage, along the distribution of ion wind channel-length direction and syringe needle towards ion wind passage.Sparking electrode is positioned at above ion wind passage, and arrangement of electrodes can cover whole heat radiation plane, and the ion wind of generation by blowing to required heat radiation plane on the upside of passage, will can make wind speed everywhere even, can better realize the heat radiation to whole flat board.
Preferably, described second sparking electrode be positioned at ion wind channel end and syringe needle towards ion wind passage, all second sparking electrodes be positioned at the same side of collector plate and syringe needle towards identical.Sparking electrode is arranged in ion wind channel end, not only can reduce the height of ion wind device, also reduces the interference of the ion wind produced between adjacent electrode in passage simultaneously, and ion wind wind direction can be made to be controlled better.
Simultaneously whole system is owing to adopting above-mentioned technology can the volume of reduction equipment and weight greatly, and compare conventional vapor formula compressibility structure simpler, be easy to movement and the carrying of old showcase, design form is also more various.
Beneficial effect of the present invention:
Air delivery device of the present invention adopts solid-state fan to realize gas by ion wind and accelerates flowing, power can be provided for gas transmission, overcome the problem that the noise of traditional mechanical fan and vibration and energy consumption are high, there is low energy consumption, noiselessness and vibration and be convenient to the advantages such as control.
Accompanying drawing explanation
Fig. 1 is the system architecture schematic diagram of the old showcase of embodiment 1.
Fig. 2 is the perspective view of solid-state fan for dispelling the heat of embodiment 1.
Fig. 3 is the perspective view of the solid-state fan of the air delivery device of embodiment 1.
Fig. 4 is the structural representation of the semiconductor heat-dissipating sheet of embodiment 1.
Fig. 5 is the perspective view of solid-state fan for dispelling the heat of embodiment 2.
Fig. 6 is the perspective view of solid-state fan for dispelling the heat of embodiment 3.
Fig. 7 is the perspective view of solid-state fan for dispelling the heat of embodiment 4.
Fig. 8 is the perspective view of solid-state fan for dispelling the heat of embodiment 5.
Fig. 9 is the perspective view of solid-state fan for dispelling the heat of embodiment 6.
Figure 10 is the perspective view of the solid-state fan of the air delivery device of embodiment 7.
Figure 11 is the perspective view of the solid-state fan of the air delivery device of embodiment 8.
Figure 12 is the perspective view of solid-state fan for dispelling the heat of embodiment 9.
Detailed description of the invention
Below in conjunction with example, the present invention is further detailed explanation, but embodiments of the present invention are not limited thereto.
Embodiment 1
As shown in Figure 1, the old showcase of solid-state fan couple semiconductor constant temperature and humidity historical relic of the present embodiment includes air heat and wet treatment space, semiconductor refrigerating element, the old exhibition cabinet composition of the solid-state fan heat sink in semiconductor refrigerating hot junction, air delivery device and historical relic.Solid-state fan heat sink utilizes corona wind to realize the object to the cooling of semiconductor hot-side heat dissipation, and air delivery device adopts ion wind to produce air-flow thus the power providing gas to flow realizes air delivery function.
Specifically comprise: air heat and wet treatment space 1, solid-state fans drive power supply 2, wire 3, electrode framework 4, sparking electrode 5, collector plate 6, semiconductor refrigerating element 7, airduct 8, solid-state fan 9 and cabinet 10.The heat abstractor of solid-state fan structure is installed in the face, hot junction of semiconductor refrigerating element 7, semiconductor refrigerating element 7 is fixed on the wall in air heat and wet treatment space 1, heat and wet treatment is carried out to air in space, by semiconductor refrigerating element 7 cold junction and heat and wet treatment space 1 air heat-exchange, when cold junction temperature is lower than air dew point temperature, water in air is condensed into liquid state and removes from air, obtain the air of low temperature and low humidity, by to the control of supply voltage of sparking electrode of solid-state fan 9 entering heat and wet treatment space 1, change conveying air velocity, the untreated air of different air quantity is provided, these untreated air mix with the air of the low temperature and low humidity dehumidified and reach required relative humidity, the process of the humidity of implementation space and control, the both sides in described air heat and wet treatment space 1 are carried by the circulation realized the air of constant temperature and humidity process that is connected of the old exhibition cabinet 10 of solid-state fan 9 and airduct 8 and historical relic.
As shown in Figure 2, the heat abstractor of solid-state fan structure comprises the driving power 2 of solid-state fan, wire 3, electrode framework 4, sparking electrode 5 and collector plate 6, sparking electrode 5 adopts tinsel or stainless steel wire 11, be connected on driving power 2 positive pole by wire 3, collector plate 6 is connected on the negative pole of driving power 2 by wire 3 as colelctor electrode.Line-board-like discharge type that in the present embodiment, solid-state fan adopts, tinsel or stainless steel wire 11 are fixed on the electrode framework 4 above collector plate 6, and the ion wind of formation blows to collector plate 6 above plate.
Collector plate 6 comprises the substrate 61 and some fins 62 be fixed in substrate 61 that to recline with the surface of semiconductor refrigerating element 7 and install, the fin 61 of the present embodiment adopts tabular fin, tabular fin extends with being substantially parallel to each other in the vertical, form the ion wind passage 63 extended longitudinally between adjacent flat plate-shaped fins, tinsel or stainless steel wire 11 to be positioned at above ion wind passage 63 and parallel with ion wind passage 63.Electrode framework 4 for the two ends of fixing metal silk thread or stainless steel wire 11, the electrode framework 4 that acrylic board assembling is formed.
As shown in Figure 3, the solid-state fan 9 of the present embodiment comprises colelctor electrode cylinder 13, metal needle 1201, electrode framework 401, wire 301 and driving power 2, in the present embodiment, sparking electrode is metal needle 1201, is fixed on electrode framework 401 and is connected with driving power 2 positive pole by wire 301, and colelctor electrode cylinder 13 is connected by wire 301 with driving power 2 negative pole, thus forming solid-state fan, whole solid-state fan and airduct 8 adopt Flange joint.Installation quantity and the position of solid-state fan 9 can adjust as required, and the present embodiment is respectively equipped with solid-state fan 9 to provide the driving force of gas at the air inlet of air heat and wet treatment space 1 and cabinet 10 and gas outlet.
According to the difference of the size of system, the demand of air quantity is different, and the factors such as the difference of the resistance of ducting, the number of aforesaid solid-state fan 9 can adopt multiple, and multiple solid-state fan can be connected on airduct 8, also can be connected with airduct 8 after parallel connection again.
As shown in Figure 4, semiconductor refrigerating element 7 structure that the present embodiment uses adopts single stage thermoelectric heap form.Primary structure comprises P-N junction 14, metal connecting sheet 15 and fixed ceramic plate 16.
The ion wind that the heat abstractor of the solid-state fan structure of the present embodiment and solid-state fan 9 all adopt positive corona discharge to be formed, the ion wind that negative corona produces contains the ozone of larger concentration due to it, and the oxidisability of ozone is unfavorable for that therefore the storage of historical relic needs to avoid, so all adopt positive corona discharge in native system.
Embodiment 2
The old showcase of solid-state fan couple semiconductor constant temperature and humidity historical relic of the present embodiment is except the structure of the solid-state fan for dispelling the heat, and all the other structures are all identical with embodiment 1.
As shown in Figure 5, the heat abstractor of the solid-state fan structure of the present embodiment is pin-plank frame, the sparking electrode 12 of the needle-like of array distribution is fixed on the electrode framework 4 of the top of collector plate 6 as solid-state fan discharge electrode, along ion wind passage 63 length direction distribution and syringe needle towards ion wind passage 63.The sparking electrode 12 of needle-like is metal needle or metal bur needle.The sparking electrode 12 of needle-like is connected on driving power 2 positive pole by wire 3, and collector plate 6 is connected on the negative pole of driving power 2 as colelctor electrode by wire 3, and the ion wind of formation blows to collector plate 6 from top.
Embodiment 3
The old showcase of solid-state fan couple semiconductor constant temperature and humidity historical relic of the present embodiment is except the structure of the solid-state fan for dispelling the heat, and all the other structures are all identical with embodiment 1.
As shown in Figure 6, the discharge type of the heat abstractor of the solid-state fan structure of the present embodiment adopts pin-board-like, the sparking electrode 12 of needle-like be positioned at ion wind passage 63 end and syringe needle towards ion wind passage 63, the sparking electrode 12 of all needle-like be positioned at the same side of collector plate 6 and syringe needle towards identical.The sparking electrode 12 of needle-like is metal needle or metal bur needle.The sparking electrode 12 of needle-like is connected on driving power 2 positive pole by wire 3, collector plate 6 is connected on the negative pole of driving power 2 as colelctor electrode by wire 3, obtains by above-mentioned layout the cold hot-side heat dissipation that ion wind that the side inflow of collector plate 6 one shown in arrow opposite side in figure flows out comes semiconductor refrigerating element 7.
Embodiment 4
The old showcase of solid-state fan couple semiconductor constant temperature and humidity historical relic of the present embodiment is except the structure of the solid-state fan for dispelling the heat, and all the other structures are all identical with embodiment 1.
As shown in Figure 7, the fin post 64 that fin 62 in the present embodiment is arranged for consecutive intervals, ion wind passage 63 is all formed at vertical and horizontal, above the ion wind passage 63 of longitudinal direction, be provided with the sparking electrode 11 of wire, the sparking electrode 11 of wire extends longitudinally on electrode framework along ion wind passage and is fixed.
Embodiment 5
The old showcase of solid-state fan couple semiconductor constant temperature and humidity historical relic of the present embodiment is except the structure of the solid-state fan for dispelling the heat, and all the other structures are all identical with embodiment 4.
As shown in Figure 8, sparking electrode in the present embodiment adopts the sparking electrode 12 of needle-like, the sparking electrode 12 of needle-like is positioned at the top of the crossover location of vertical and horizontal ion wind passage, along the distribution of ion wind passage 63 length direction and syringe needle towards ion wind passage 63.The sparking electrode 12 of needle-like is metal needle or metal bur needle.
Embodiment 6
The old showcase of solid-state fan couple semiconductor constant temperature and humidity historical relic of the present embodiment is except the structure of the solid-state fan for dispelling the heat, and all the other structures are all identical with embodiment 1.
As shown in Figure 9, in the present embodiment, the sparking electrode 12 of needle-like be positioned at ion wind passage 63 end and syringe needle towards ion wind passage 63, every bar ion wind lead to 63 only one end be provided with the sparking electrode 12 of needle-like, the sparking electrode 12 of the needle-like corresponding to adjacent ions wind passage 63 is arranged in collector plate 6 both sides.Said structure makes collector plate both sides all be provided with spaced apart sparking electrode 12, thus can produce the contrary ion wind of both direction, and refrigeration is better.
Embodiment 7
The old showcase of solid-state fan couple semiconductor constant temperature and humidity historical relic of the present embodiment is except the structure of solid-state fan 9, and all the other structures are all identical with embodiment 1.
As shown in Figure 10, solid-state fan 9 in the present embodiment adopts multiple pin shaped electric discharging electrodes as discharge electrode, the multi-electrode group that very multiple metal needle (pin shaped electric discharging electrodes) 1201 of discharging arrangement is formed is fixed on electrode framework 401, then be connected with solid-state fans drive power supply 2 positive pole by wire 301, colelctor electrode cylinder 13 is connected to form solid-state fan by wire 301 and power supply 2 negative pole, and whole solid-state fan and airduct 8 adopt Flange joint.
Embodiment 8
The old showcase of solid-state fan couple semiconductor constant temperature and humidity historical relic of the present embodiment is except the structure of solid-state fan 9, and all the other structures are all identical with embodiment 1.
As shown in figure 11, solid-state fan 9 in the present embodiment adopts line-cartridge type discharge mode, in figure, solid-state fan discharges very tinsel or stainless steel wire 1101, tinsel or stainless steel wire 1101 are fixed on electrode framework 401, then be connected with solid-state fans drive power supply 2 positive pole by wire 301, colelctor electrode cylinder 13 is connected to form solid-state fan by wire 301 and power supply 2 negative pole, and whole solid-state fan and airduct 8 adopt Flange joint.
Embodiment 9
The old showcase of solid-state fan couple semiconductor constant temperature and humidity historical relic of the present embodiment is except semiconductor refrigerating element 7, and all the other structures are all identical with embodiment 1.
As shown in figure 12, semiconductor refrigerating element 7 adopts Multi-stage heat pile form, comprises P-N junction 14, metal connecting sheet 15, fixed ceramic plate 16, thermal insulation layer 17, temperature equalization plate 18 and electric connecting sheet 19.
Claims (10)
1. the old showcase of solid-state fan couple semiconductor constant temperature and humidity historical relic, comprise cabinet, constant temperature and humidity unit and gas transmission unit, the constant temperature and humidity gas that described gas transmission unit produces for gas in the cabinet that circulates and constant temperature and humidity unit, it is characterized in that, described gas transmission unit comprises the airduct connecting cabinet and constant temperature and humidity unit, provides first of gas circulation power the solid-state fan and driving power.
2. the old showcase of solid-state fan couple semiconductor constant temperature and humidity historical relic as claimed in claim 1, it is characterized in that, described first solid-state fan comprises: both ends open and the colelctor electrode cylinder be connected with airduct and coordinate the first sparking electrode forming ion wind with colelctor electrode cylinder with the one end being arranged on colelctor electrode cylinder.
3. the old showcase of solid-state fan couple semiconductor constant temperature and humidity historical relic as claimed in claim 2, is characterized in that, described first sparking electrode is the wire sparking electrode across colelctor electrode cylinder one end open.
4. the old showcase of solid-state fan couple semiconductor constant temperature and humidity historical relic as claimed in claim 2, it is characterized in that, described first sparking electrode is the pin shaped electric discharging electrodes across colelctor electrode cylinder one end open, and the syringe needle sensing colelctor electrode cylinder of pin shaped electric discharging electrodes is interior and direction is parallel with the central shaft of colelctor electrode cylinder.
5. the old showcase of solid-state fan couple semiconductor constant temperature and humidity historical relic as described in claim as arbitrary in Claims 1 to 4, it is characterized in that, described constant temperature and humidity unit comprises: to circulate the air heat and wet treatment room be communicated with, the radiating module being arranged on the semiconductor refrigerating element on air heat and wet treatment room and being arranged on semiconductor refrigerating element with cabinet, described radiating module adopts the second solid-state fan.
6. the old showcase of solid-state fan couple semiconductor constant temperature and humidity historical relic as claimed in claim 5, it is characterized in that, described second solid-state fan comprises the collector plate and the second sparking electrode that cooperatively interact and produce corona wind, described collector plate comprises the substrate and some fins being fixed on substrate backside semiconductor cooling module side that to recline with the surface of semiconductor refrigerating element and install, fin extends with being substantially parallel to each other in the vertical, the ion wind passage extended longitudinally is formed between adjacent fins, described second sparking electrode by fixed mount install be distributed in collector plate periphery and discharge end and ion wind passage positioned opposite.
7. the old showcase of solid-state fan couple semiconductor constant temperature and humidity historical relic as claimed in claim 6, it is characterized in that, each fin is made up of the fin post be longitudinally intervally arranged, the ion wind passage that the fin post one_to_one corresponding of adjacent fins makes the gap-forming between fin post extend in the horizontal.
8. the old showcase of solid-state fan couple semiconductor constant temperature and humidity historical relic as claimed in claims 6 or 7, it is characterized in that, described second sparking electrode is wire, to be positioned at above ion wind passage and parallel with ion wind passage.
9. the old showcase of solid-state fan couple semiconductor constant temperature and humidity historical relic as claimed in claims 6 or 7, it is characterized in that, described second sparking electrode is needle-like.
10. the old showcase of solid-state fan couple semiconductor constant temperature and humidity historical relic as claimed in claim 9, it is characterized in that, every bar ion wind passage to there being multiple second sparking electrode, these second sparking electrodes are positioned at above ion wind passage, along the distribution of ion wind channel-length direction and syringe needle towards ion wind passage.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510811961.5A CN105310358B (en) | 2015-11-20 | 2015-11-20 | A kind of old showcase of solid-state fan couple semiconductor constant temperature and humidity historical relic |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510811961.5A CN105310358B (en) | 2015-11-20 | 2015-11-20 | A kind of old showcase of solid-state fan couple semiconductor constant temperature and humidity historical relic |
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| Publication Number | Publication Date |
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| CN105310358A true CN105310358A (en) | 2016-02-10 |
| CN105310358B CN105310358B (en) | 2019-09-20 |
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| CN105597932A (en) * | 2016-02-18 | 2016-05-25 | 北京中和锦程科技有限公司 | Corona wind air purifying device |
| CN106621699A (en) * | 2017-01-17 | 2017-05-10 | 浙江省博物馆 | Air cleaning system for small cultural relic environment by coupling solid-state fan with adsorbing purification |
| CN106731471A (en) * | 2017-01-17 | 2017-05-31 | 浙江大学 | A kind of medium-and-large-sized air cleaning system of solid-state fan Coupling Adsorption purification |
| CN106949573A (en) * | 2017-03-31 | 2017-07-14 | 浙江大学 | A kind of solution dehumidification device of solid-state fan coupling |
| CN107062704A (en) * | 2017-03-31 | 2017-08-18 | 浙江大学 | A kind of air-cooled absorber of solid-state fan coupling |
| CN109542151A (en) * | 2018-12-18 | 2019-03-29 | 中国电子科技集团公司第十六研究所 | A kind of ring control equipment and control method |
| CN109616919A (en) * | 2018-12-12 | 2019-04-12 | 云南电网有限责任公司电力科学研究院 | A kind of radiator and application method applied to Medium Voltage Switchgear |
| CN110285555A (en) * | 2019-07-02 | 2019-09-27 | 珠海格力电器股份有限公司 | Control cabinet, heat dissipation method and air conditioner |
| CN112229094A (en) * | 2020-09-27 | 2021-01-15 | 华中科技大学 | Constant temperature air circulation system |
| CN112932193A (en) * | 2021-03-08 | 2021-06-11 | 浙江省博物馆 | Historical relic showcase air current distributor |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105597932A (en) * | 2016-02-18 | 2016-05-25 | 北京中和锦程科技有限公司 | Corona wind air purifying device |
| CN106621699A (en) * | 2017-01-17 | 2017-05-10 | 浙江省博物馆 | Air cleaning system for small cultural relic environment by coupling solid-state fan with adsorbing purification |
| CN106731471A (en) * | 2017-01-17 | 2017-05-31 | 浙江大学 | A kind of medium-and-large-sized air cleaning system of solid-state fan Coupling Adsorption purification |
| CN106731471B (en) * | 2017-01-17 | 2023-03-17 | 浙江大学 | Medium-large air purification system with solid-state fan coupled adsorption purification |
| CN106949573B (en) * | 2017-03-31 | 2019-09-20 | 浙江大学 | A kind of solution dehumidification device of solid-state fan coupling |
| CN106949573A (en) * | 2017-03-31 | 2017-07-14 | 浙江大学 | A kind of solution dehumidification device of solid-state fan coupling |
| CN107062704A (en) * | 2017-03-31 | 2017-08-18 | 浙江大学 | A kind of air-cooled absorber of solid-state fan coupling |
| CN109616919A (en) * | 2018-12-12 | 2019-04-12 | 云南电网有限责任公司电力科学研究院 | A kind of radiator and application method applied to Medium Voltage Switchgear |
| CN109542151A (en) * | 2018-12-18 | 2019-03-29 | 中国电子科技集团公司第十六研究所 | A kind of ring control equipment and control method |
| CN110285555A (en) * | 2019-07-02 | 2019-09-27 | 珠海格力电器股份有限公司 | Control cabinet, heat dissipation method and air conditioner |
| CN112229094A (en) * | 2020-09-27 | 2021-01-15 | 华中科技大学 | Constant temperature air circulation system |
| CN112229094B (en) * | 2020-09-27 | 2021-09-07 | 华中科技大学 | Constant temperature air circulation system |
| CN112932193A (en) * | 2021-03-08 | 2021-06-11 | 浙江省博物馆 | Historical relic showcase air current distributor |
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